JP2009176978A5 - - Google Patents

Download PDF

Info

Publication number
JP2009176978A5
JP2009176978A5 JP2008014441A JP2008014441A JP2009176978A5 JP 2009176978 A5 JP2009176978 A5 JP 2009176978A5 JP 2008014441 A JP2008014441 A JP 2008014441A JP 2008014441 A JP2008014441 A JP 2008014441A JP 2009176978 A5 JP2009176978 A5 JP 2009176978A5
Authority
JP
Japan
Prior art keywords
semiconductor chip
semiconductor
semiconductor device
circuit portion
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008014441A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009176978A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2008014441A priority Critical patent/JP2009176978A/ja
Priority claimed from JP2008014441A external-priority patent/JP2009176978A/ja
Priority to US12/357,516 priority patent/US20090206466A1/en
Publication of JP2009176978A publication Critical patent/JP2009176978A/ja
Publication of JP2009176978A5 publication Critical patent/JP2009176978A5/ja
Pending legal-status Critical Current

Links

JP2008014441A 2008-01-25 2008-01-25 半導体装置 Pending JP2009176978A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2008014441A JP2009176978A (ja) 2008-01-25 2008-01-25 半導体装置
US12/357,516 US20090206466A1 (en) 2008-01-25 2009-01-22 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008014441A JP2009176978A (ja) 2008-01-25 2008-01-25 半導体装置

Publications (2)

Publication Number Publication Date
JP2009176978A JP2009176978A (ja) 2009-08-06
JP2009176978A5 true JP2009176978A5 (enExample) 2011-01-27

Family

ID=40954336

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008014441A Pending JP2009176978A (ja) 2008-01-25 2008-01-25 半導体装置

Country Status (2)

Country Link
US (1) US20090206466A1 (enExample)
JP (1) JP2009176978A (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103545226B (zh) * 2012-07-09 2016-01-13 万国半导体(开曼)股份有限公司 一种晶圆级半导体器件及其封装方法
TWI470688B (zh) * 2012-07-18 2015-01-21 Alpha & Omega Semiconductor Cayman Ltd 晶圓級半導體裝置及其封裝方法
US8846452B2 (en) 2012-08-21 2014-09-30 Infineon Technologies Ag Semiconductor device package and methods of packaging thereof
US9209131B2 (en) * 2014-01-21 2015-12-08 Qualcomm Incorporated Toroid inductor in redistribution layers (RDL) of an integrated device
CN107768317A (zh) * 2016-08-18 2018-03-06 苏州迈瑞微电子有限公司 一种低剖面多芯片封装结构及其制造方法
CN109761186A (zh) * 2018-12-29 2019-05-17 华进半导体封装先导技术研发中心有限公司 一种薄型三维集成封装方法及结构
CN109795976A (zh) * 2018-12-29 2019-05-24 华进半导体封装先导技术研发中心有限公司 超薄型三维集成封装方法及结构
CN111048503A (zh) * 2019-12-27 2020-04-21 华天科技（昆山）电子有限公司 一种内埋芯片的扇出型封装方法以及封装结构

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02229454A (ja) * 1989-03-02 1990-09-12 Nippon Soken Inc 半導体装置
JP3526731B2 (ja) * 1997-10-08 2004-05-17 沖電気工業株式会社 半導体装置およびその製造方法
JP2001144213A (ja) * 1999-11-16 2001-05-25 Hitachi Ltd 半導体装置の製造方法および半導体装置
JP2004214258A (ja) * 2002-12-27 2004-07-29 Renesas Technology Corp 半導体モジュール
TWI278947B (en) * 2004-01-13 2007-04-11 Samsung Electronics Co Ltd A multi-chip package, a semiconductor device used therein and manufacturing method thereof
JP2006054310A (ja) * 2004-08-11 2006-02-23 Matsushita Electric Ind Co Ltd 半導体装置およびその製造方法
JP2006210402A (ja) * 2005-01-25 2006-08-10 Matsushita Electric Ind Co Ltd 半導体装置

Similar Documents

Publication Publication Date Title
US9147585B2 (en) Method for fabricating a plurality of semiconductor devices
CN101252096B (zh) 芯片封装结构以及其制作方法
CN102237281B (zh) 半导体器件及其制造方法
CN104051334B (zh) 半导体封装和封装半导体装置的方法
US20130026657A1 (en) Semiconductor package and method of fabricating the same
JP2008078596A5 (enExample)
JP2009176978A5 (enExample)
JP2009044160A5 (enExample)
CN110112106A (zh) 芯片封装模块及包含该芯片封装模块的电路板结构
CN104733413A (zh) 一种mosfet封装结构
CN105845638B (zh) 电子封装结构
JP2012004505A5 (enExample)
US20100123236A1 (en) Semiconductor package having adhesive layer and method of manufacturing the same
JP5358089B2 (ja) 半導体装置
TWI541965B (zh) 半導體封裝件及其製法
CN116798993A (zh) 封装结构及其形成方法
US20040227238A1 (en) Electronic device and method of manufacturing the same, circuit board, and electronic instrument
CN204927275U (zh) 一种低成本的硅基模块的封装结构
JP2011119481A5 (enExample)
CN104733403A (zh) 晶圆级封装结构及制作方法
CN1312763C (zh) 芯片埋入式半导体元件封装结构
CN105977233A (zh) 芯片封装结构及其制造方法
CN102683298A (zh) 无承载板的封装件及其制法
JP2010153491A5 (ja) 電子装置及びその製造方法、並びに半導体装置
TWI816063B (zh) 半導體裝置及製造方法