JP2005311293A5 - - Google Patents

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Publication number
JP2005311293A5
JP2005311293A5 JP2004319480A JP2004319480A JP2005311293A5 JP 2005311293 A5 JP2005311293 A5 JP 2005311293A5 JP 2004319480 A JP2004319480 A JP 2004319480A JP 2004319480 A JP2004319480 A JP 2004319480A JP 2005311293 A5 JP2005311293 A5 JP 2005311293A5
Authority
JP
Japan
Prior art keywords
conductive layer
external connection
connection electrode
semiconductor device
bump
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004319480A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005311293A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2004319480A priority Critical patent/JP2005311293A/ja
Priority claimed from JP2004319480A external-priority patent/JP2005311293A/ja
Priority to TW094105056A priority patent/TWI257676B/zh
Priority to US11/064,596 priority patent/US20050212130A1/en
Priority to CNA2005100590688A priority patent/CN1674242A/zh
Priority to KR1020050024407A priority patent/KR100659447B1/ko
Publication of JP2005311293A publication Critical patent/JP2005311293A/ja
Publication of JP2005311293A5 publication Critical patent/JP2005311293A5/ja
Pending legal-status Critical Current

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JP2004319480A 2004-03-26 2004-11-02 半導体チップ、半導体装置、半導体装置の製造方法及び電子機器 Pending JP2005311293A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2004319480A JP2005311293A (ja) 2004-03-26 2004-11-02 半導体チップ、半導体装置、半導体装置の製造方法及び電子機器
TW094105056A TWI257676B (en) 2004-03-26 2005-02-21 Semiconductor chip, semiconductor device, method for producing semiconductor device, and electronic equipment
US11/064,596 US20050212130A1 (en) 2004-03-26 2005-02-24 Semiconductor chip, semiconductor device, method for producing semiconductor device, and electronic equipment
CNA2005100590688A CN1674242A (zh) 2004-03-26 2005-03-22 半导体芯片、半导体装置、半导体装置的制造方法
KR1020050024407A KR100659447B1 (ko) 2004-03-26 2005-03-24 반도체 칩, 반도체 장치, 반도체 장치의 제조 방법 및전자기기

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004091171 2004-03-26
JP2004319480A JP2005311293A (ja) 2004-03-26 2004-11-02 半導体チップ、半導体装置、半導体装置の製造方法及び電子機器

Publications (2)

Publication Number Publication Date
JP2005311293A JP2005311293A (ja) 2005-11-04
JP2005311293A5 true JP2005311293A5 (enExample) 2006-05-25

Family

ID=34988814

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004319480A Pending JP2005311293A (ja) 2004-03-26 2004-11-02 半導体チップ、半導体装置、半導体装置の製造方法及び電子機器

Country Status (5)

Country Link
US (1) US20050212130A1 (enExample)
JP (1) JP2005311293A (enExample)
KR (1) KR100659447B1 (enExample)
CN (1) CN1674242A (enExample)
TW (1) TWI257676B (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005191541A (ja) * 2003-12-05 2005-07-14 Seiko Epson Corp 半導体装置、半導体チップ、半導体装置の製造方法及び電子機器
JP4750586B2 (ja) * 2006-02-28 2011-08-17 住友電工デバイス・イノベーション株式会社 半導体装置および電子装置並びにその製造方法
JP5520425B2 (ja) * 2009-01-10 2014-06-11 宛伶 兪 半導体部材のメタルバンプと密封を形成する方法
KR20110052880A (ko) * 2009-11-13 2011-05-19 삼성전자주식회사 플립 칩 패키지 및 그의 제조 방법
CN103107156B (zh) * 2011-11-11 2016-02-10 讯忆科技股份有限公司 晶圆焊垫的凸块结构及其制造方法
JP2013140902A (ja) * 2012-01-06 2013-07-18 Enrei Yu 半導体パッケージ及びその製造方法
JP6057521B2 (ja) * 2012-03-05 2017-01-11 デクセリアルズ株式会社 異方性導電材料を用いた接続方法及び異方性導電接合体
JP6333624B2 (ja) * 2013-05-22 2018-05-30 積水化学工業株式会社 接続構造体
US9331033B1 (en) * 2014-12-23 2016-05-03 Sunasic Technologies Inc. Method for forming stacked metal contact in electrical communication with aluminum wiring in semiconductor wafer of integrated circuit
CN105826206B (zh) * 2015-01-05 2018-07-24 旭景科技股份有限公司 用于形成堆栈金属接点与半导体晶圆内铝线电连通的方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63128734A (ja) * 1986-11-19 1988-06-01 Seiko Epson Corp 半導体装置
JP2000286299A (ja) * 1999-03-30 2000-10-13 Matsushita Electric Ind Co Ltd 半導体装置の接続方法
JP3348681B2 (ja) * 1999-04-08 2002-11-20 日本電気株式会社 集積回路の端子構造
JP3968554B2 (ja) * 2000-05-01 2007-08-29 セイコーエプソン株式会社 バンプの形成方法及び半導体装置の製造方法
JP2003282616A (ja) * 2002-03-20 2003-10-03 Seiko Epson Corp バンプの形成方法及び半導体装置の製造方法
JP2003282615A (ja) * 2002-03-20 2003-10-03 Seiko Epson Corp バンプの構造、バンプの形成方法、半導体装置およびその製造方法並びに電子機器

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