JP2005311293A - 半導体チップ、半導体装置、半導体装置の製造方法及び電子機器 - Google Patents

半導体チップ、半導体装置、半導体装置の製造方法及び電子機器 Download PDF

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JP2005311293A
JP2005311293A JP2004319480A JP2004319480A JP2005311293A JP 2005311293 A JP2005311293 A JP 2005311293A JP 2004319480 A JP2004319480 A JP 2004319480A JP 2004319480 A JP2004319480 A JP 2004319480A JP 2005311293 A JP2005311293 A JP 2005311293A
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Prior art keywords
conductive layer
semiconductor device
conductive
semiconductor chip
auxiliary
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JP2004319480A
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Japanese (ja)
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JP2005311293A5 (enExample
Inventor
Hideo Imai
英生 今井
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Seiko Epson Corp
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Seiko Epson Corp
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Priority to JP2004319480A priority Critical patent/JP2005311293A/ja
Priority to TW094105056A priority patent/TWI257676B/zh
Priority to US11/064,596 priority patent/US20050212130A1/en
Priority to CNA2005100590688A priority patent/CN1674242A/zh
Priority to KR1020050024407A priority patent/KR100659447B1/ko
Publication of JP2005311293A publication Critical patent/JP2005311293A/ja
Publication of JP2005311293A5 publication Critical patent/JP2005311293A5/ja
Pending legal-status Critical Current

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    • E—FIXED CONSTRUCTIONS
    • E03—WATER SUPPLY; SEWERAGE
    • E03F—SEWERS; CESSPOOLS
    • E03F5/00—Sewerage structures
    • E03F5/10—Collecting-tanks; Equalising-tanks for regulating the run-off; Laying-up basins
    • E03F5/105—Accessories, e.g. flow regulators or cleaning devices
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    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F3/00—Biological treatment of water, waste water, or sewage
    • E—FIXED CONSTRUCTIONS
    • E02—HYDRAULIC ENGINEERING; FOUNDATIONS; SOIL SHIFTING
    • E02B—HYDRAULIC ENGINEERING
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    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
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    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

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JP2004319480A 2004-03-26 2004-11-02 半導体チップ、半導体装置、半導体装置の製造方法及び電子機器 Pending JP2005311293A (ja)

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TW094105056A TWI257676B (en) 2004-03-26 2005-02-21 Semiconductor chip, semiconductor device, method for producing semiconductor device, and electronic equipment
US11/064,596 US20050212130A1 (en) 2004-03-26 2005-02-24 Semiconductor chip, semiconductor device, method for producing semiconductor device, and electronic equipment
CNA2005100590688A CN1674242A (zh) 2004-03-26 2005-03-22 半导体芯片、半导体装置、半导体装置的制造方法
KR1020050024407A KR100659447B1 (ko) 2004-03-26 2005-03-24 반도체 칩, 반도체 장치, 반도체 장치의 제조 방법 및전자기기

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JP2010161322A (ja) * 2009-01-10 2010-07-22 Enrei Yu 半導体部材のメタルバンプと密封を形成する方法
JP2013140902A (ja) * 2012-01-06 2013-07-18 Enrei Yu 半導体パッケージ及びその製造方法
WO2013133116A1 (ja) * 2012-03-05 2013-09-12 デクセリアルズ株式会社 異方性導電材料を用いた接続方法及び異方性導電接合体
JP2015005741A (ja) * 2013-05-22 2015-01-08 積水化学工業株式会社 接続構造体

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JP2005191541A (ja) * 2003-12-05 2005-07-14 Seiko Epson Corp 半導体装置、半導体チップ、半導体装置の製造方法及び電子機器
JP4750586B2 (ja) * 2006-02-28 2011-08-17 住友電工デバイス・イノベーション株式会社 半導体装置および電子装置並びにその製造方法
KR20110052880A (ko) * 2009-11-13 2011-05-19 삼성전자주식회사 플립 칩 패키지 및 그의 제조 방법
CN103107156B (zh) * 2011-11-11 2016-02-10 讯忆科技股份有限公司 晶圆焊垫的凸块结构及其制造方法
US9331033B1 (en) * 2014-12-23 2016-05-03 Sunasic Technologies Inc. Method for forming stacked metal contact in electrical communication with aluminum wiring in semiconductor wafer of integrated circuit
CN105826206B (zh) * 2015-01-05 2018-07-24 旭景科技股份有限公司 用于形成堆栈金属接点与半导体晶圆内铝线电连通的方法

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Publication number Priority date Publication date Assignee Title
JP2010161322A (ja) * 2009-01-10 2010-07-22 Enrei Yu 半導体部材のメタルバンプと密封を形成する方法
JP2013140902A (ja) * 2012-01-06 2013-07-18 Enrei Yu 半導体パッケージ及びその製造方法
WO2013133116A1 (ja) * 2012-03-05 2013-09-12 デクセリアルズ株式会社 異方性導電材料を用いた接続方法及び異方性導電接合体
JP2013183118A (ja) * 2012-03-05 2013-09-12 Dexerials Corp 異方性導電材料を用いた接続方法及び異方性導電接合体
KR20140138822A (ko) * 2012-03-05 2014-12-04 데쿠세리아루즈 가부시키가이샤 이방성 도전 재료를 사용한 접속 방법 및 이방성 도전 접합체
KR101994507B1 (ko) 2012-03-05 2019-06-28 데쿠세리아루즈 가부시키가이샤 이방성 도전 재료를 사용한 접속 방법 및 이방성 도전 접합체
JP2015005741A (ja) * 2013-05-22 2015-01-08 積水化学工業株式会社 接続構造体

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