CN1674242A - 半导体芯片、半导体装置、半导体装置的制造方法 - Google Patents

半导体芯片、半导体装置、半导体装置的制造方法 Download PDF

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Publication number
CN1674242A
CN1674242A CNA2005100590688A CN200510059068A CN1674242A CN 1674242 A CN1674242 A CN 1674242A CN A2005100590688 A CNA2005100590688 A CN A2005100590688A CN 200510059068 A CN200510059068 A CN 200510059068A CN 1674242 A CN1674242 A CN 1674242A
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conductive layer
semiconductor device
semiconductor chip
auxiliary
conductive
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CNA2005100590688A
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Chinese (zh)
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今井英生
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Seiko Epson Corp
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Seiko Epson Corp
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Publication of CN1674242A publication Critical patent/CN1674242A/zh
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    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
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    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
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    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
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    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

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  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
CNA2005100590688A 2004-03-26 2005-03-22 半导体芯片、半导体装置、半导体装置的制造方法 Pending CN1674242A (zh)

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CN102074511A (zh) * 2009-11-13 2011-05-25 三星电子株式会社 倒装芯片封装件和制造该倒装芯片封装件的方法
CN103107156A (zh) * 2011-11-11 2013-05-15 讯忆科技股份有限公司 晶圆焊垫的凸块结构及其制造方法
CN105826206A (zh) * 2015-01-05 2016-08-03 旭景科技股份有限公司 用于形成堆栈金属接点与半导体晶圆内铝线电连通的方法
CN104145329B (zh) * 2012-03-05 2017-04-12 迪睿合电子材料有限公司 使用各向异性导电材料的连接方法及各向异性导电接合体

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JP2005191541A (ja) * 2003-12-05 2005-07-14 Seiko Epson Corp 半導体装置、半導体チップ、半導体装置の製造方法及び電子機器
JP4750586B2 (ja) * 2006-02-28 2011-08-17 住友電工デバイス・イノベーション株式会社 半導体装置および電子装置並びにその製造方法
JP5520425B2 (ja) * 2009-01-10 2014-06-11 宛伶 兪 半導体部材のメタルバンプと密封を形成する方法
JP2013140902A (ja) * 2012-01-06 2013-07-18 Enrei Yu 半導体パッケージ及びその製造方法
JP6333624B2 (ja) * 2013-05-22 2018-05-30 積水化学工業株式会社 接続構造体
US9331033B1 (en) * 2014-12-23 2016-05-03 Sunasic Technologies Inc. Method for forming stacked metal contact in electrical communication with aluminum wiring in semiconductor wafer of integrated circuit

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JPS63128734A (ja) * 1986-11-19 1988-06-01 Seiko Epson Corp 半導体装置
JP2000286299A (ja) * 1999-03-30 2000-10-13 Matsushita Electric Ind Co Ltd 半導体装置の接続方法
JP3348681B2 (ja) * 1999-04-08 2002-11-20 日本電気株式会社 集積回路の端子構造
JP3968554B2 (ja) * 2000-05-01 2007-08-29 セイコーエプソン株式会社 バンプの形成方法及び半導体装置の製造方法
JP2003282616A (ja) * 2002-03-20 2003-10-03 Seiko Epson Corp バンプの形成方法及び半導体装置の製造方法
JP2003282615A (ja) * 2002-03-20 2003-10-03 Seiko Epson Corp バンプの構造、バンプの形成方法、半導体装置およびその製造方法並びに電子機器

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102074511A (zh) * 2009-11-13 2011-05-25 三星电子株式会社 倒装芯片封装件和制造该倒装芯片封装件的方法
CN103107156A (zh) * 2011-11-11 2013-05-15 讯忆科技股份有限公司 晶圆焊垫的凸块结构及其制造方法
CN103107156B (zh) * 2011-11-11 2016-02-10 讯忆科技股份有限公司 晶圆焊垫的凸块结构及其制造方法
CN104145329B (zh) * 2012-03-05 2017-04-12 迪睿合电子材料有限公司 使用各向异性导电材料的连接方法及各向异性导电接合体
CN105826206A (zh) * 2015-01-05 2016-08-03 旭景科技股份有限公司 用于形成堆栈金属接点与半导体晶圆内铝线电连通的方法
CN105826206B (zh) * 2015-01-05 2018-07-24 旭景科技股份有限公司 用于形成堆栈金属接点与半导体晶圆内铝线电连通的方法

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