KR100659447B1 - 반도체 칩, 반도체 장치, 반도체 장치의 제조 방법 및전자기기 - Google Patents

반도체 칩, 반도체 장치, 반도체 장치의 제조 방법 및전자기기 Download PDF

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KR100659447B1
KR100659447B1 KR1020050024407A KR20050024407A KR100659447B1 KR 100659447 B1 KR100659447 B1 KR 100659447B1 KR 1020050024407 A KR1020050024407 A KR 1020050024407A KR 20050024407 A KR20050024407 A KR 20050024407A KR 100659447 B1 KR100659447 B1 KR 100659447B1
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conductive layer
semiconductor device
semiconductor chip
auxiliary
contact
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KR20060044669A (ko
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히데오 이마이
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세이코 엡슨 가부시키가이샤
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    • E—FIXED CONSTRUCTIONS
    • E03—WATER SUPPLY; SEWERAGE
    • E03F—SEWERS; CESSPOOLS
    • E03F5/00—Sewerage structures
    • E03F5/10—Collecting-tanks; Equalising-tanks for regulating the run-off; Laying-up basins
    • E03F5/105—Accessories, e.g. flow regulators or cleaning devices
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    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F3/00—Biological treatment of water, waste water, or sewage
    • E—FIXED CONSTRUCTIONS
    • E02—HYDRAULIC ENGINEERING; FOUNDATIONS; SOIL SHIFTING
    • E02B—HYDRAULIC ENGINEERING
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    • H01L2924/151—Die mounting substrate
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

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  • Engineering & Computer Science (AREA)
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KR1020050024407A 2004-03-26 2005-03-24 반도체 칩, 반도체 장치, 반도체 장치의 제조 방법 및전자기기 Expired - Fee Related KR100659447B1 (ko)

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JP4750586B2 (ja) * 2006-02-28 2011-08-17 住友電工デバイス・イノベーション株式会社 半導体装置および電子装置並びにその製造方法
JP5520425B2 (ja) * 2009-01-10 2014-06-11 宛伶 兪 半導体部材のメタルバンプと密封を形成する方法
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CN103107156B (zh) * 2011-11-11 2016-02-10 讯忆科技股份有限公司 晶圆焊垫的凸块结构及其制造方法
JP2013140902A (ja) * 2012-01-06 2013-07-18 Enrei Yu 半導体パッケージ及びその製造方法
JP6057521B2 (ja) * 2012-03-05 2017-01-11 デクセリアルズ株式会社 異方性導電材料を用いた接続方法及び異方性導電接合体
JP6333624B2 (ja) * 2013-05-22 2018-05-30 積水化学工業株式会社 接続構造体
US9331033B1 (en) * 2014-12-23 2016-05-03 Sunasic Technologies Inc. Method for forming stacked metal contact in electrical communication with aluminum wiring in semiconductor wafer of integrated circuit
CN105826206B (zh) * 2015-01-05 2018-07-24 旭景科技股份有限公司 用于形成堆栈金属接点与半导体晶圆内铝线电连通的方法

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