JP5042623B2 - 半導体デバイス - Google Patents

半導体デバイス Download PDF

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Publication number
JP5042623B2
JP5042623B2 JP2006513085A JP2006513085A JP5042623B2 JP 5042623 B2 JP5042623 B2 JP 5042623B2 JP 2006513085 A JP2006513085 A JP 2006513085A JP 2006513085 A JP2006513085 A JP 2006513085A JP 5042623 B2 JP5042623 B2 JP 5042623B2
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layer
conductive
conductive layer
circuit devices
circuit device
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JP2006513085A
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Japanese (ja)
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JP2006523964A5 (enExample
JP2006523964A (ja
Inventor
リール、ジョージ
ジャオ、ジエ−ホア
アール． プラック、エドワード
ジェイ． ウェンゼル、ロバート
ディ． ソーヤー、ブライアン
ジー． ワンター、デイビッド
アラン マングラム、マーク
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NXP USA Inc
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NXP USA Inc
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

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US6921975B2 (en) 2005-07-26
US20080142960A1 (en) 2008-06-19
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US20040207077A1 (en) 2004-10-21
KR20110043788A (ko) 2011-04-27
KR101165580B1 (ko) 2012-07-23
KR101215283B1 (ko) 2012-12-26
CN1774802A (zh) 2006-05-17
KR101142314B1 (ko) 2012-05-17
EP1618606A4 (en) 2011-07-27
US8072062B2 (en) 2011-12-06
US7361987B2 (en) 2008-04-22
EP1618606A2 (en) 2006-01-25
JP2006523964A (ja) 2006-10-19
CN100413065C (zh) 2008-08-20
WO2004095514A2 (en) 2004-11-04
WO2004095514A3 (en) 2005-08-18
KR20050123169A (ko) 2005-12-29

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