JP2006063092A5 - - Google Patents
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- JP2006063092A5 JP2006063092A5 JP2004237719A JP2004237719A JP2006063092A5 JP 2006063092 A5 JP2006063092 A5 JP 2006063092A5 JP 2004237719 A JP2004237719 A JP 2004237719A JP 2004237719 A JP2004237719 A JP 2004237719A JP 2006063092 A5 JP2006063092 A5 JP 2006063092A5
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- Prior art keywords
- meth
- acrylic acid
- group
- alkyl ester
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000203 mixture Substances 0.000 claims description 24
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 19
- 229920001296 polysiloxane Polymers 0.000 claims description 16
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 15
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 claims description 10
- 125000000217 alkyl group Chemical group 0.000 claims description 10
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 claims description 10
- 239000004593 Epoxy Substances 0.000 claims description 9
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 9
- 150000002148 esters Chemical class 0.000 claims description 9
- 229910000077 silane Inorganic materials 0.000 claims description 9
- 125000003396 thiol group Chemical group [H]S* 0.000 claims description 9
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical group CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 claims description 8
- 150000003961 organosilicon compounds Chemical class 0.000 claims description 7
- 239000002318 adhesion promoter Substances 0.000 claims description 5
- 125000005388 dimethylhydrogensiloxy group Chemical group 0.000 claims description 5
- 125000005907 alkyl ester group Chemical group 0.000 claims description 3
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims 1
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 51
- 239000000178 monomer Substances 0.000 description 20
- 229920002554 vinyl polymer Polymers 0.000 description 16
- 238000006243 chemical reaction Methods 0.000 description 15
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 14
- -1 polysiloxane Polymers 0.000 description 11
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 10
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 10
- 229910052710 silicon Inorganic materials 0.000 description 10
- 239000010703 silicon Substances 0.000 description 10
- 229920001577 copolymer Polymers 0.000 description 8
- INTFCWANRCGCRZ-UHFFFAOYSA-N 3-tris(dimethylsilyloxy)silylpropyl 2-methylprop-2-enoate Chemical compound C[SiH](C)O[Si](O[SiH](C)C)(O[SiH](C)C)CCCOC(=O)C(C)=C INTFCWANRCGCRZ-UHFFFAOYSA-N 0.000 description 5
- 125000005370 alkoxysilyl group Chemical group 0.000 description 5
- 125000004432 carbon atom Chemical group C* 0.000 description 5
- 125000003700 epoxy group Chemical group 0.000 description 5
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 5
- 239000011259 mixed solution Substances 0.000 description 5
- 239000007870 radical polymerization initiator Substances 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 4
- 238000007334 copolymerization reaction Methods 0.000 description 4
- 239000003999 initiator Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 239000007983 Tris buffer Substances 0.000 description 3
- 125000001931 aliphatic group Chemical group 0.000 description 3
- 238000001723 curing Methods 0.000 description 3
- 150000002430 hydrocarbons Chemical group 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- BEQREZLERZKZQU-UHFFFAOYSA-N tris(dimethylsilyloxy)silane Chemical compound C[SiH](C)O[SiH](O[SiH](C)C)O[SiH](C)C BEQREZLERZKZQU-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 239000012986 chain transfer agent Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 2
- SHZIWNPUGXLXDT-UHFFFAOYSA-N ethyl hexanoate Chemical compound CCCCCC(=O)OCC SHZIWNPUGXLXDT-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- OPOGSUPDESSLJJ-UHFFFAOYSA-N 1-butoxybutane;oxolane Chemical compound C1CCOC1.CCCCOCCCC OPOGSUPDESSLJJ-UHFFFAOYSA-N 0.000 description 1
- AVTLBBWTUPQRAY-UHFFFAOYSA-N 2-(2-cyanobutan-2-yldiazenyl)-2-methylbutanenitrile Chemical compound CCC(C)(C#N)N=NC(C)(CC)C#N AVTLBBWTUPQRAY-UHFFFAOYSA-N 0.000 description 1
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 1
- PTTPXKJBFFKCEK-UHFFFAOYSA-N 2-Methyl-4-heptanone Chemical compound CC(C)CC(=O)CC(C)C PTTPXKJBFFKCEK-UHFFFAOYSA-N 0.000 description 1
- WYGWHHGCAGTUCH-UHFFFAOYSA-N 2-[(2-cyano-4-methylpentan-2-yl)diazenyl]-2,4-dimethylpentanenitrile Chemical compound CC(C)CC(C)(C#N)N=NC(C)(C#N)CC(C)C WYGWHHGCAGTUCH-UHFFFAOYSA-N 0.000 description 1
- KSLSOBUAIFEGLT-UHFFFAOYSA-N 2-phenylbut-3-yn-2-ol Chemical compound C#CC(O)(C)C1=CC=CC=C1 KSLSOBUAIFEGLT-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- YIVJZNGAASQVEM-UHFFFAOYSA-N Lauroyl peroxide Chemical compound CCCCCCCCCCCC(=O)OOC(=O)CCCCCCCCCCC YIVJZNGAASQVEM-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- KXKVLQRXCPHEJC-UHFFFAOYSA-N acetic acid trimethyl ester Natural products COC(C)=O KXKVLQRXCPHEJC-UHFFFAOYSA-N 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- 125000003342 alkenyl group Chemical group 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 239000007809 chemical reaction catalyst Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 1
- RCNRJBWHLARWRP-UHFFFAOYSA-N ethenyl-[ethenyl(dimethyl)silyl]oxy-dimethylsilane;platinum Chemical compound [Pt].C=C[Si](C)(C)O[Si](C)(C)C=C RCNRJBWHLARWRP-UHFFFAOYSA-N 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 238000006459 hydrosilylation reaction Methods 0.000 description 1
- GJRQTCIYDGXPES-UHFFFAOYSA-N iso-butyl acetate Natural products CC(C)COC(C)=O GJRQTCIYDGXPES-UHFFFAOYSA-N 0.000 description 1
- FGKJLKRYENPLQH-UHFFFAOYSA-M isocaproate Chemical compound CC(C)CCC([O-])=O FGKJLKRYENPLQH-UHFFFAOYSA-M 0.000 description 1
- OQAGVSWESNCJJT-UHFFFAOYSA-N isovaleric acid methyl ester Natural products COC(=O)CC(C)C OQAGVSWESNCJJT-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- 210000000056 organ Anatomy 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 125000005504 styryl group Chemical group 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- GJBRNHKUVLOCEB-UHFFFAOYSA-N tert-butyl benzenecarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC=C1 GJBRNHKUVLOCEB-UHFFFAOYSA-N 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Priority Applications (10)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004237719A JP2006063092A (ja) | 2004-07-29 | 2004-08-17 | 硬化性オルガノポリシロキサン組成物、その硬化方法、光半導体装置および接着促進剤 |
| CN2005800256553A CN1993427B (zh) | 2004-07-29 | 2005-07-28 | 可固化的有机基聚硅氧烷组合物、其固化方法、半导体器件和粘合促进剂 |
| EP05768714A EP1781741B1 (en) | 2004-07-29 | 2005-07-28 | Curable organopolysiloxane composition, method of curing thereof, semiconductor device, and adhesion promoter |
| DE602005009373T DE602005009373D1 (de) | 2004-07-29 | 2005-07-28 | Härtbare organopolysiloxanzusammensetzung, härtungsverfahren dafür, halbleitervorrichtung und haftvermittler |
| AT05768714T ATE406414T1 (de) | 2004-07-29 | 2005-07-28 | Härtbare organopolysiloxanzusammensetzung, härtungsverfahren dafür, halbleitervorrichtung und haftvermittler |
| US11/572,660 US7842755B2 (en) | 2004-07-29 | 2005-07-28 | Curable organopolysiloxane composition, method of curing thereof, semiconductor device, and adhesion promoter |
| KR1020077005020A KR101278456B1 (ko) | 2004-07-29 | 2005-07-28 | 경화성 오가노폴리실록산 조성물, 이의 경화방법, 반도체장치 및 접착 촉진제 |
| PCT/JP2005/014354 WO2006011676A1 (en) | 2004-07-29 | 2005-07-28 | Curable organopolysiloxane composition, method of curing thereof, semiconductor device, and adhesion promoter |
| TW094125996A TWI388628B (zh) | 2004-07-29 | 2005-07-29 | 可固化之有機聚矽氧烷組合物，其固化方法，半導體元件及黏合促進劑 |
| US12/888,050 US8063143B2 (en) | 2004-07-29 | 2010-09-22 | Curable organopolysiloxane composition, method of curing thereof, semiconductor device, and adhesion promotor |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004222072 | 2004-07-29 | ||
| JP2004237719A JP2006063092A (ja) | 2004-07-29 | 2004-08-17 | 硬化性オルガノポリシロキサン組成物、その硬化方法、光半導体装置および接着促進剤 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2006063092A JP2006063092A (ja) | 2006-03-09 |
| JP2006063092A5 true JP2006063092A5 (enExample) | 2007-09-20 |
Family
ID=35149469
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004237719A Pending JP2006063092A (ja) | 2004-07-29 | 2004-08-17 | 硬化性オルガノポリシロキサン組成物、その硬化方法、光半導体装置および接着促進剤 |
Country Status (9)
| Country | Link |
|---|---|
| US (2) | US7842755B2 (enExample) |
| EP (1) | EP1781741B1 (enExample) |
| JP (1) | JP2006063092A (enExample) |
| KR (1) | KR101278456B1 (enExample) |
| CN (1) | CN1993427B (enExample) |
| AT (1) | ATE406414T1 (enExample) |
| DE (1) | DE602005009373D1 (enExample) |
| TW (1) | TWI388628B (enExample) |
| WO (1) | WO2006011676A1 (enExample) |
Families Citing this family (72)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102005036520A1 (de) * | 2005-04-26 | 2006-11-09 | Osram Opto Semiconductors Gmbh | Optisches Bauteil, optoelektronisches Bauelement mit dem Bauteil und dessen Herstellung |
| JP4931366B2 (ja) | 2005-04-27 | 2012-05-16 | 東レ・ダウコーニング株式会社 | 硬化性シリコーン組成物および電子部品 |
| JP5247979B2 (ja) * | 2005-06-01 | 2013-07-24 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | 透明な硬化物を与えるポリオルガノシロキサン組成物 |
| JP4628270B2 (ja) * | 2006-01-20 | 2011-02-09 | 信越化学工業株式会社 | 熱硬化性組成物 |
| JP4820184B2 (ja) * | 2006-02-20 | 2011-11-24 | シチズン電子株式会社 | 発光装置とその製造方法 |
| JP5207591B2 (ja) | 2006-02-23 | 2013-06-12 | 東レ・ダウコーニング株式会社 | 半導体装置の製造方法および半導体装置 |
| US20070212556A1 (en) | 2006-03-07 | 2007-09-13 | Musa Osama M | Curable materials containing siloxane |
| JP4789663B2 (ja) * | 2006-03-17 | 2011-10-12 | 信越化学工業株式会社 | 熱硬化性組成物及び該組成物から得られる層を備えたフィルム |
| JP5060074B2 (ja) * | 2006-05-11 | 2012-10-31 | 東レ・ダウコーニング株式会社 | 接着促進剤、硬化性オルガノポリシロキサン組成物、および半導体装置 |
| JP5202822B2 (ja) * | 2006-06-23 | 2013-06-05 | 東レ・ダウコーニング株式会社 | 硬化性オルガノポリシロキサン組成物および半導体装置 |
| JP5148088B2 (ja) * | 2006-08-25 | 2013-02-20 | 東レ・ダウコーニング株式会社 | 硬化性オルガノポリシロキサン組成物および半導体装置 |
| JP5285846B2 (ja) | 2006-09-11 | 2013-09-11 | 東レ・ダウコーニング株式会社 | 硬化性シリコーン組成物および電子部品 |
| JP2008201971A (ja) * | 2007-02-22 | 2008-09-04 | Shin Etsu Chem Co Ltd | 繊維強化複合材料用液状付加硬化性シリコーン組成物、繊維強化シリコーン複合材料およびその製造方法 |
| JP2008222828A (ja) * | 2007-03-12 | 2008-09-25 | Momentive Performance Materials Japan Kk | 凸レンズ形成用シリコーンゴム組成物及びそれを用いた光半導体装置 |
| JP2011516626A (ja) * | 2008-03-04 | 2011-05-26 | ダウ・コーニング・コーポレイション | シリコーン組成物、シリコーン接着剤、被覆基板及び積層基板 |
| JP5000566B2 (ja) * | 2008-03-27 | 2012-08-15 | 信越化学工業株式会社 | 硬化性シリコーンゴム組成物、およびそれを封止材料として用いた光半導体装置 |
| JP5579371B2 (ja) * | 2008-04-23 | 2014-08-27 | 東レ・ダウコーニング株式会社 | 含ケイ素ポリマー、及び硬化性ポリマー組成物 |
| JP5469874B2 (ja) * | 2008-09-05 | 2014-04-16 | 東レ・ダウコーニング株式会社 | 硬化性オルガノポリシロキサン組成物、光半導体素子封止剤および光半導体装置 |
| WO2010050625A1 (en) * | 2008-10-31 | 2010-05-06 | Dow Corning Toray Co., Ltd. | Curable organopolysiloxane composition, optical semiconductor element sealant, and optical semiconductor device |
| JP5732187B2 (ja) * | 2009-01-22 | 2015-06-10 | 新日鉄住金化学株式会社 | 硬化物の製造方法 |
| WO2010098285A1 (ja) * | 2009-02-24 | 2010-09-02 | 積水化学工業株式会社 | 光半導体装置用封止剤及びそれを用いた光半導体装置 |
| TWI492339B (zh) * | 2009-06-01 | 2015-07-11 | 信越化學工業股份有限公司 | A dam material composition for a bottom layer filler material for a multilayer semiconductor device, and a manufacturing method of a multilayer semiconductor device using the dam material composition |
| JP5231472B2 (ja) * | 2010-03-15 | 2013-07-10 | 信越化学工業株式会社 | 発光ダイオード用付加硬化型シリコーン樹脂組成物 |
| KR101274418B1 (ko) * | 2010-06-24 | 2013-06-17 | 세키스이가가쿠 고교가부시키가이샤 | 광 반도체 장치용 밀봉제 및 이를 이용한 광 반도체 장치 |
| KR20130033924A (ko) * | 2010-07-27 | 2013-04-04 | 가부시키가이샤 아데카 | 반도체 봉지용 경화성 조성물 |
| JP2012121950A (ja) * | 2010-12-07 | 2012-06-28 | Shin-Etsu Chemical Co Ltd | 硬化性シリコーン組成物及びシリコーン樹脂硬化物 |
| JP5553018B2 (ja) * | 2010-12-16 | 2014-07-16 | 信越化学工業株式会社 | 硬化性オルガノポリシロキサン組成物、光学素子封止材及び光学素子 |
| JP5522111B2 (ja) | 2011-04-08 | 2014-06-18 | 信越化学工業株式会社 | シリコーン樹脂組成物及び当該組成物を使用した光半導体装置 |
| JP5893874B2 (ja) | 2011-09-02 | 2016-03-23 | 信越化学工業株式会社 | 光半導体装置 |
| KR101927979B1 (ko) * | 2011-10-25 | 2018-12-11 | 가부시키가이샤 아데카 | 광경화성 수지조성물 및 신규 실록산 화합물 |
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-
2004
- 2004-08-17 JP JP2004237719A patent/JP2006063092A/ja active Pending
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- 2005-07-28 CN CN2005800256553A patent/CN1993427B/zh not_active Expired - Fee Related
- 2005-07-28 EP EP05768714A patent/EP1781741B1/en not_active Expired - Lifetime
- 2005-07-28 WO PCT/JP2005/014354 patent/WO2006011676A1/en not_active Ceased
- 2005-07-28 KR KR1020077005020A patent/KR101278456B1/ko not_active Expired - Fee Related
- 2005-07-28 DE DE602005009373T patent/DE602005009373D1/de not_active Expired - Lifetime
- 2005-07-28 US US11/572,660 patent/US7842755B2/en not_active Expired - Fee Related
- 2005-07-28 AT AT05768714T patent/ATE406414T1/de not_active IP Right Cessation
- 2005-07-29 TW TW094125996A patent/TWI388628B/zh not_active IP Right Cessation
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- 2010-09-22 US US12/888,050 patent/US8063143B2/en not_active Expired - Fee Related
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