FI118158B
(sv)
*
|
1999-10-15 |
2007-07-31 |
Asm Int |
Förfarande för modifiering av utgångsämneskemikalierna i en ALD-prosess
|
FI117944B
(fi)
|
1999-10-15 |
2007-04-30 |
Asm Int |
Menetelmä siirtymämetallinitridiohutkalvojen kasvattamiseksi
|
FI119941B
(fi)
*
|
1999-10-15 |
2009-05-15 |
Asm Int |
Menetelmä nanolaminaattien valmistamiseksi
|
FI100409B
(fi)
*
|
1994-11-28 |
1997-11-28 |
Asm Int |
Menetelmä ja laitteisto ohutkalvojen valmistamiseksi
|
US6342277B1
(en)
|
1996-08-16 |
2002-01-29 |
Licensee For Microelectronics: Asm America, Inc. |
Sequential chemical vapor deposition
|
US5862223A
(en)
|
1996-07-24 |
1999-01-19 |
Walker Asset Management Limited Partnership |
Method and apparatus for a cryptographically-assisted commercial network system designed to facilitate and support expert-based commerce
|
US6071572A
(en)
*
|
1996-10-15 |
2000-06-06 |
Applied Materials, Inc. |
Forming tin thin films using remote activated specie generation
|
FI972874A0
(fi)
*
|
1997-07-04 |
1997-07-04 |
Mikrokemia Oy |
Foerfarande och anordning foer framstaellning av tunnfilmer
|
US6204194B1
(en)
*
|
1998-01-16 |
2001-03-20 |
F.T.L. Co., Ltd. |
Method and apparatus for producing a semiconductor device
|
TW489827U
(en)
*
|
1998-04-09 |
2002-06-01 |
Kobe Steel Ltd |
Apparatus for high-temperature and high-pressure treatment of semiconductor substrates
|
NL1009171C2
(nl)
|
1998-05-14 |
1999-12-10 |
Asm Int |
Waferrek voorzien van een gasverdeelinrichting.
|
US20060219157A1
(en)
*
|
2001-06-28 |
2006-10-05 |
Antti Rahtu |
Oxide films containing titanium
|
US6974766B1
(en)
*
|
1998-10-01 |
2005-12-13 |
Applied Materials, Inc. |
In situ deposition of a low κ dielectric layer, barrier layer, etch stop, and anti-reflective coating for damascene application
|
WO2000047404A1
(en)
*
|
1999-02-12 |
2000-08-17 |
Gelest, Inc. |
Chemical vapor deposition of tungsten nitride
|
TW432488B
(en)
*
|
1999-04-12 |
2001-05-01 |
Mosel Vitelic Inc |
Reaction facility for forming film and method of air intake
|
KR100347379B1
(ko)
*
|
1999-05-01 |
2002-08-07 |
주식회사 피케이엘 |
복수매 기판의 박막 증착 공정이 가능한 원자층 증착장치
|
NL1012004C2
(nl)
|
1999-05-07 |
2000-11-13 |
Asm Int |
Werkwijze voor het verplaatsen van wafers alsmede ring.
|
FI118342B
(fi)
|
1999-05-10 |
2007-10-15 |
Asm Int |
Laite ohutkalvojen valmistamiseksi
|
DE60035948T2
(de)
*
|
1999-06-19 |
2008-05-15 |
Asm Genitech Korea Ltd. |
Chemischer abscheidungsreaktor und dessen verwendung für die abscheidung eines dünnen films
|
US6391785B1
(en)
*
|
1999-08-24 |
2002-05-21 |
Interuniversitair Microelektronica Centrum (Imec) |
Method for bottomless deposition of barrier layers in integrated circuit metallization schemes
|
US6511539B1
(en)
*
|
1999-09-08 |
2003-01-28 |
Asm America, Inc. |
Apparatus and method for growth of a thin film
|
US6727169B1
(en)
*
|
1999-10-15 |
2004-04-27 |
Asm International, N.V. |
Method of making conformal lining layers for damascene metallization
|
US6475276B1
(en)
*
|
1999-10-15 |
2002-11-05 |
Asm Microchemistry Oy |
Production of elemental thin films using a boron-containing reducing agent
|
US6902763B1
(en)
|
1999-10-15 |
2005-06-07 |
Asm International N.V. |
Method for depositing nanolaminate thin films on sensitive surfaces
|
FI118804B
(fi)
*
|
1999-12-03 |
2008-03-31 |
Asm Int |
Menetelmä oksidikalvojen kasvattamiseksi
|
US6503330B1
(en)
|
1999-12-22 |
2003-01-07 |
Genus, Inc. |
Apparatus and method to achieve continuous interface and ultrathin film during atomic layer deposition
|
FI118343B
(fi)
|
1999-12-28 |
2007-10-15 |
Asm Int |
Laite ohutkalvojen valmistamiseksi
|
US6551399B1
(en)
|
2000-01-10 |
2003-04-22 |
Genus Inc. |
Fully integrated process for MIM capacitors using atomic layer deposition
|
FI117979B
(fi)
*
|
2000-04-14 |
2007-05-15 |
Asm Int |
Menetelmä oksidiohutkalvojen valmistamiseksi
|
US7494927B2
(en)
*
|
2000-05-15 |
2009-02-24 |
Asm International N.V. |
Method of growing electrical conductors
|
TW508658B
(en)
|
2000-05-15 |
2002-11-01 |
Asm Microchemistry Oy |
Process for producing integrated circuits
|
US6679951B2
(en)
|
2000-05-15 |
2004-01-20 |
Asm Intenational N.V. |
Metal anneal with oxidation prevention
|
US6482733B2
(en)
|
2000-05-15 |
2002-11-19 |
Asm Microchemistry Oy |
Protective layers prior to alternating layer deposition
|
US6878628B2
(en)
|
2000-05-15 |
2005-04-12 |
Asm International Nv |
In situ reduction of copper oxide prior to silicon carbide deposition
|
US6759325B2
(en)
|
2000-05-15 |
2004-07-06 |
Asm Microchemistry Oy |
Sealing porous structures
|
EP2293322A1
(en)
*
|
2000-06-08 |
2011-03-09 |
Genitech, Inc. |
Method for forming a metal nitride layer
|
US6620723B1
(en)
*
|
2000-06-27 |
2003-09-16 |
Applied Materials, Inc. |
Formation of boride barrier layers using chemisorption techniques
|
US6551929B1
(en)
*
|
2000-06-28 |
2003-04-22 |
Applied Materials, Inc. |
Bifurcated deposition process for depositing refractory metal layers employing atomic layer deposition and chemical vapor deposition techniques
|
US7964505B2
(en)
*
|
2005-01-19 |
2011-06-21 |
Applied Materials, Inc. |
Atomic layer deposition of tungsten materials
|
US6936538B2
(en)
|
2001-07-16 |
2005-08-30 |
Applied Materials, Inc. |
Method and apparatus for depositing tungsten after surface treatment to improve film characteristics
|
US7732327B2
(en)
|
2000-06-28 |
2010-06-08 |
Applied Materials, Inc. |
Vapor deposition of tungsten materials
|
US7101795B1
(en)
*
|
2000-06-28 |
2006-09-05 |
Applied Materials, Inc. |
Method and apparatus for depositing refractory metal layers employing sequential deposition techniques to form a nucleation layer
|
US7405158B2
(en)
|
2000-06-28 |
2008-07-29 |
Applied Materials, Inc. |
Methods for depositing tungsten layers employing atomic layer deposition techniques
|
US6585823B1
(en)
*
|
2000-07-07 |
2003-07-01 |
Asm International, N.V. |
Atomic layer deposition
|
US6592942B1
(en)
|
2000-07-07 |
2003-07-15 |
Asm International N.V. |
Method for vapour deposition of a film onto a substrate
|
US6617173B1
(en)
|
2000-10-11 |
2003-09-09 |
Genus, Inc. |
Integration of ferromagnetic films with ultrathin insulating film using atomic layer deposition
|
US20030190424A1
(en)
*
|
2000-10-20 |
2003-10-09 |
Ofer Sneh |
Process for tungsten silicide atomic layer deposition
|
US9255329B2
(en)
|
2000-12-06 |
2016-02-09 |
Novellus Systems, Inc. |
Modulated ion-induced atomic layer deposition (MII-ALD)
|
US6905547B1
(en)
*
|
2000-12-21 |
2005-06-14 |
Genus, Inc. |
Method and apparatus for flexible atomic layer deposition
|
US6765178B2
(en)
|
2000-12-29 |
2004-07-20 |
Applied Materials, Inc. |
Chamber for uniform substrate heating
|
US20020083897A1
(en)
*
|
2000-12-29 |
2002-07-04 |
Applied Materials, Inc. |
Full glass substrate deposition in plasma enhanced chemical vapor deposition
|
US6825447B2
(en)
|
2000-12-29 |
2004-11-30 |
Applied Materials, Inc. |
Apparatus and method for uniform substrate heating and contaminate collection
|
US6998579B2
(en)
|
2000-12-29 |
2006-02-14 |
Applied Materials, Inc. |
Chamber for uniform substrate heating
|
US6811814B2
(en)
|
2001-01-16 |
2004-11-02 |
Applied Materials, Inc. |
Method for growing thin films by catalytic enhancement
|
US20020127336A1
(en)
*
|
2001-01-16 |
2002-09-12 |
Applied Materials, Inc. |
Method for growing thin films by catalytic enhancement
|
TW556004B
(en)
*
|
2001-01-31 |
2003-10-01 |
Planar Systems Inc |
Methods and apparatus for the production of optical filters
|
US6951804B2
(en)
*
|
2001-02-02 |
2005-10-04 |
Applied Materials, Inc. |
Formation of a tantalum-nitride layer
|
EP1421607A2
(en)
*
|
2001-02-12 |
2004-05-26 |
ASM America, Inc. |
Improved process for deposition of semiconductor films
|
US6660126B2
(en)
|
2001-03-02 |
2003-12-09 |
Applied Materials, Inc. |
Lid assembly for a processing system to facilitate sequential deposition techniques
|
US6878206B2
(en)
|
2001-07-16 |
2005-04-12 |
Applied Materials, Inc. |
Lid assembly for a processing system to facilitate sequential deposition techniques
|
US7491634B2
(en)
|
2006-04-28 |
2009-02-17 |
Asm International N.V. |
Methods for forming roughened surfaces and applications thereof
|
US7563715B2
(en)
|
2005-12-05 |
2009-07-21 |
Asm International N.V. |
Method of producing thin films
|
US9139906B2
(en)
*
|
2001-03-06 |
2015-09-22 |
Asm America, Inc. |
Doping with ALD technology
|
US6939579B2
(en)
*
|
2001-03-07 |
2005-09-06 |
Asm International N.V. |
ALD reactor and method with controlled wall temperature
|
US6734020B2
(en)
|
2001-03-07 |
2004-05-11 |
Applied Materials, Inc. |
Valve control system for atomic layer deposition chamber
|
FI109770B
(fi)
|
2001-03-16 |
2002-10-15 |
Asm Microchemistry Oy |
Menetelmä metallinitridiohutkalvojen valmistamiseksi
|
US6627268B1
(en)
|
2001-05-03 |
2003-09-30 |
Novellus Systems, Inc. |
Sequential ion, UV, and electron induced chemical vapor deposition
|
US6596643B2
(en)
*
|
2001-05-07 |
2003-07-22 |
Applied Materials, Inc. |
CVD TiSiN barrier for copper integration
|
US6759081B2
(en)
*
|
2001-05-11 |
2004-07-06 |
Asm International, N.V. |
Method of depositing thin films for magnetic heads
|
US7037574B2
(en)
|
2001-05-23 |
2006-05-02 |
Veeco Instruments, Inc. |
Atomic layer deposition for fabricating thin films
|
US6849545B2
(en)
|
2001-06-20 |
2005-02-01 |
Applied Materials, Inc. |
System and method to form a composite film stack utilizing sequential deposition techniques
|
US20070009658A1
(en)
*
|
2001-07-13 |
2007-01-11 |
Yoo Jong H |
Pulse nucleation enhanced nucleation technique for improved step coverage and better gap fill for WCVD process
|
US7211144B2
(en)
*
|
2001-07-13 |
2007-05-01 |
Applied Materials, Inc. |
Pulsed nucleation deposition of tungsten layers
|
US20030198754A1
(en)
*
|
2001-07-16 |
2003-10-23 |
Ming Xi |
Aluminum oxide chamber and process
|
WO2003030224A2
(en)
|
2001-07-25 |
2003-04-10 |
Applied Materials, Inc. |
Barrier formation using novel sputter-deposition method
|
US20080268635A1
(en)
*
|
2001-07-25 |
2008-10-30 |
Sang-Ho Yu |
Process for forming cobalt and cobalt silicide materials in copper contact applications
|
US8110489B2
(en)
*
|
2001-07-25 |
2012-02-07 |
Applied Materials, Inc. |
Process for forming cobalt-containing materials
|
US9051641B2
(en)
*
|
2001-07-25 |
2015-06-09 |
Applied Materials, Inc. |
Cobalt deposition on barrier surfaces
|
US20030029715A1
(en)
*
|
2001-07-25 |
2003-02-13 |
Applied Materials, Inc. |
An Apparatus For Annealing Substrates In Physical Vapor Deposition Systems
|
US20090004850A1
(en)
*
|
2001-07-25 |
2009-01-01 |
Seshadri Ganguli |
Process for forming cobalt and cobalt silicide materials in tungsten contact applications
|
US7085616B2
(en)
*
|
2001-07-27 |
2006-08-01 |
Applied Materials, Inc. |
Atomic layer deposition apparatus
|
JP4921652B2
(ja)
*
|
2001-08-03 |
2012-04-25 |
エイエスエム インターナショナル エヌ.ヴェー. |
イットリウム酸化物およびランタン酸化物薄膜を堆積する方法
|
EP1421606A4
(en)
*
|
2001-08-06 |
2008-03-05 |
Genitech Co Ltd |
PLASMA ACTIVE ATOMIC LAYER (PEALD) DEPOSITION APPARATUS AND METHOD OF FORMING THIN FILM USING SAID APPARATUS
|
US6718126B2
(en)
|
2001-09-14 |
2004-04-06 |
Applied Materials, Inc. |
Apparatus and method for vaporizing solid precursor for CVD or atomic layer deposition
|
WO2003025243A2
(en)
*
|
2001-09-14 |
2003-03-27 |
Asm International N.V. |
Metal nitride deposition by ald using gettering reactant
|
US6936906B2
(en)
|
2001-09-26 |
2005-08-30 |
Applied Materials, Inc. |
Integration of barrier layer and seed layer
|
US20030059538A1
(en)
*
|
2001-09-26 |
2003-03-27 |
Applied Materials, Inc. |
Integration of barrier layer and seed layer
|
US7049226B2
(en)
*
|
2001-09-26 |
2006-05-23 |
Applied Materials, Inc. |
Integration of ALD tantalum nitride for copper metallization
|
US7780785B2
(en)
*
|
2001-10-26 |
2010-08-24 |
Applied Materials, Inc. |
Gas delivery apparatus for atomic layer deposition
|
US6916398B2
(en)
|
2001-10-26 |
2005-07-12 |
Applied Materials, Inc. |
Gas delivery apparatus and method for atomic layer deposition
|
US6902624B2
(en)
*
|
2001-10-29 |
2005-06-07 |
Genus, Inc. |
Massively parallel atomic layer deposition/chemical vapor deposition system
|
KR100760291B1
(ko)
*
|
2001-11-08 |
2007-09-19 |
에이에스엠지니텍코리아 주식회사 |
박막 형성 방법
|
US6773507B2
(en)
*
|
2001-12-06 |
2004-08-10 |
Applied Materials, Inc. |
Apparatus and method for fast-cycle atomic layer deposition
|
US7081271B2
(en)
|
2001-12-07 |
2006-07-25 |
Applied Materials, Inc. |
Cyclical deposition of refractory metal silicon nitride
|
US6729824B2
(en)
|
2001-12-14 |
2004-05-04 |
Applied Materials, Inc. |
Dual robot processing system
|
CN1643179B
(zh)
*
|
2002-01-17 |
2010-05-26 |
松德沃技术公司 |
Ald装置和方法
|
AU2003238853A1
(en)
|
2002-01-25 |
2003-09-02 |
Applied Materials, Inc. |
Apparatus for cyclical deposition of thin films
|
US6911391B2
(en)
*
|
2002-01-26 |
2005-06-28 |
Applied Materials, Inc. |
Integration of titanium and titanium nitride layers
|
US6866746B2
(en)
*
|
2002-01-26 |
2005-03-15 |
Applied Materials, Inc. |
Clamshell and small volume chamber with fixed substrate support
|
US6998014B2
(en)
|
2002-01-26 |
2006-02-14 |
Applied Materials, Inc. |
Apparatus and method for plasma assisted deposition
|
US6827978B2
(en)
*
|
2002-02-11 |
2004-12-07 |
Applied Materials, Inc. |
Deposition of tungsten films
|
US6833161B2
(en)
*
|
2002-02-26 |
2004-12-21 |
Applied Materials, Inc. |
Cyclical deposition of tungsten nitride for metal oxide gate electrode
|
US6972267B2
(en)
|
2002-03-04 |
2005-12-06 |
Applied Materials, Inc. |
Sequential deposition of tantalum nitride using a tantalum-containing precursor and a nitrogen-containing precursor
|
EP1485513A2
(en)
*
|
2002-03-08 |
2004-12-15 |
Sundew Technologies, LLC |
Ald method and apparatus
|
US7104578B2
(en)
*
|
2002-03-15 |
2006-09-12 |
Asm International N.V. |
Two level end effector
|
JP4873820B2
(ja)
*
|
2002-04-01 |
2012-02-08 |
株式会社エフティーエル |
半導体装置の製造装置
|
US7439191B2
(en)
*
|
2002-04-05 |
2008-10-21 |
Applied Materials, Inc. |
Deposition of silicon layers for active matrix liquid crystal display (AMLCD) applications
|
US6720027B2
(en)
|
2002-04-08 |
2004-04-13 |
Applied Materials, Inc. |
Cyclical deposition of a variable content titanium silicon nitride layer
|
US6846516B2
(en)
*
|
2002-04-08 |
2005-01-25 |
Applied Materials, Inc. |
Multiple precursor cyclical deposition system
|
US6875271B2
(en)
|
2002-04-09 |
2005-04-05 |
Applied Materials, Inc. |
Simultaneous cyclical deposition in different processing regions
|
US20030194825A1
(en)
*
|
2002-04-10 |
2003-10-16 |
Kam Law |
Deposition of gate metallization for active matrix liquid crystal display (AMLCD) applications
|
US6869838B2
(en)
*
|
2002-04-09 |
2005-03-22 |
Applied Materials, Inc. |
Deposition of passivation layers for active matrix liquid crystal display (AMLCD) applications
|
US7279432B2
(en)
*
|
2002-04-16 |
2007-10-09 |
Applied Materials, Inc. |
System and method for forming an integrated barrier layer
|
US7041335B2
(en)
*
|
2002-06-04 |
2006-05-09 |
Applied Materials, Inc. |
Titanium tantalum nitride silicide layer
|
US6838125B2
(en)
*
|
2002-07-10 |
2005-01-04 |
Applied Materials, Inc. |
Method of film deposition using activated precursor gases
|
US20040013803A1
(en)
*
|
2002-07-16 |
2004-01-22 |
Applied Materials, Inc. |
Formation of titanium nitride films using a cyclical deposition process
|
US6955211B2
(en)
|
2002-07-17 |
2005-10-18 |
Applied Materials, Inc. |
Method and apparatus for gas temperature control in a semiconductor processing system
|
US7186385B2
(en)
*
|
2002-07-17 |
2007-03-06 |
Applied Materials, Inc. |
Apparatus for providing gas to a processing chamber
|
US7066194B2
(en)
*
|
2002-07-19 |
2006-06-27 |
Applied Materials, Inc. |
Valve design and configuration for fast delivery system
|
US6772072B2
(en)
|
2002-07-22 |
2004-08-03 |
Applied Materials, Inc. |
Method and apparatus for monitoring solid precursor delivery
|
US6915592B2
(en)
|
2002-07-29 |
2005-07-12 |
Applied Materials, Inc. |
Method and apparatus for generating gas to a processing chamber
|
US7186630B2
(en)
*
|
2002-08-14 |
2007-03-06 |
Asm America, Inc. |
Deposition of amorphous silicon-containing films
|
US20040071878A1
(en)
*
|
2002-08-15 |
2004-04-15 |
Interuniversitair Microelektronica Centrum (Imec Vzw) |
Surface preparation using plasma for ALD Films
|
US6821563B2
(en)
|
2002-10-02 |
2004-11-23 |
Applied Materials, Inc. |
Gas distribution system for cyclical layer deposition
|
US20040065255A1
(en)
*
|
2002-10-02 |
2004-04-08 |
Applied Materials, Inc. |
Cyclical layer deposition system
|
US20040069227A1
(en)
*
|
2002-10-09 |
2004-04-15 |
Applied Materials, Inc. |
Processing chamber configured for uniform gas flow
|
US6905737B2
(en)
*
|
2002-10-11 |
2005-06-14 |
Applied Materials, Inc. |
Method of delivering activated species for rapid cyclical deposition
|
EP1420080A3
(en)
|
2002-11-14 |
2005-11-09 |
Applied Materials, Inc. |
Apparatus and method for hybrid chemical deposition processes
|
US20040142558A1
(en)
*
|
2002-12-05 |
2004-07-22 |
Granneman Ernst H. A. |
Apparatus and method for atomic layer deposition on substrates
|
US7262133B2
(en)
|
2003-01-07 |
2007-08-28 |
Applied Materials, Inc. |
Enhancement of copper line reliability using thin ALD tan film to cap the copper line
|
US7244683B2
(en)
*
|
2003-01-07 |
2007-07-17 |
Applied Materials, Inc. |
Integration of ALD/CVD barriers with porous low k materials
|
US6994319B2
(en)
*
|
2003-01-29 |
2006-02-07 |
Applied Materials, Inc. |
Membrane gas valve for pulsing a gas
|
US6868859B2
(en)
*
|
2003-01-29 |
2005-03-22 |
Applied Materials, Inc. |
Rotary gas valve for pulsing a gas
|
US20040177813A1
(en)
|
2003-03-12 |
2004-09-16 |
Applied Materials, Inc. |
Substrate support lift mechanism
|
US7342984B1
(en)
|
2003-04-03 |
2008-03-11 |
Zilog, Inc. |
Counting clock cycles over the duration of a first character and using a remainder value to determine when to sample a bit of a second character
|
US20040198069A1
(en)
|
2003-04-04 |
2004-10-07 |
Applied Materials, Inc. |
Method for hafnium nitride deposition
|
US7601223B2
(en)
|
2003-04-29 |
2009-10-13 |
Asm International N.V. |
Showerhead assembly and ALD methods
|
US7537662B2
(en)
|
2003-04-29 |
2009-05-26 |
Asm International N.V. |
Method and apparatus for depositing thin films on a surface
|
JP2007523994A
(ja)
|
2003-06-18 |
2007-08-23 |
アプライド マテリアルズ インコーポレイテッド |
バリヤ物質の原子層堆積
|
US20100129548A1
(en)
*
|
2003-06-27 |
2010-05-27 |
Sundew Technologies, Llc |
Ald apparatus and method
|
WO2005003406A2
(en)
*
|
2003-06-27 |
2005-01-13 |
Sundew Technologies, Llc |
Apparatus and method for chemical source vapor pressure control
|
US7067407B2
(en)
*
|
2003-08-04 |
2006-06-27 |
Asm International, N.V. |
Method of growing electrical conductors
|
US7181132B2
(en)
|
2003-08-20 |
2007-02-20 |
Asm International N.V. |
Method and system for loading substrate supports into a substrate holder
|
US6818517B1
(en)
|
2003-08-29 |
2004-11-16 |
Asm International N.V. |
Methods of depositing two or more layers on a substrate in situ
|
US20050067103A1
(en)
*
|
2003-09-26 |
2005-03-31 |
Applied Materials, Inc. |
Interferometer endpoint monitoring device
|
WO2005042160A2
(en)
*
|
2003-10-29 |
2005-05-12 |
Asm America, Inc. |
Reaction system for growing a thin film
|
US20050095859A1
(en)
*
|
2003-11-03 |
2005-05-05 |
Applied Materials, Inc. |
Precursor delivery system with rate control
|
US7071118B2
(en)
*
|
2003-11-12 |
2006-07-04 |
Veeco Instruments, Inc. |
Method and apparatus for fabricating a conformal thin film on a substrate
|
KR100527108B1
(ko)
*
|
2003-11-28 |
2005-11-09 |
한국전자통신연구원 |
반도체 광소자의 제작 방법
|
US20050210455A1
(en)
*
|
2004-03-18 |
2005-09-22 |
International Business Machines Corporation |
Method for generating an executable workflow code from an unstructured cyclic process model
|
US7405143B2
(en)
*
|
2004-03-25 |
2008-07-29 |
Asm International N.V. |
Method for fabricating a seed layer
|
US20050252449A1
(en)
*
|
2004-05-12 |
2005-11-17 |
Nguyen Son T |
Control of gas flow and delivery to suppress the formation of particles in an MOCVD/ALD system
|
US8323754B2
(en)
*
|
2004-05-21 |
2012-12-04 |
Applied Materials, Inc. |
Stabilization of high-k dielectric materials
|
US20060153995A1
(en)
*
|
2004-05-21 |
2006-07-13 |
Applied Materials, Inc. |
Method for fabricating a dielectric stack
|
US8119210B2
(en)
*
|
2004-05-21 |
2012-02-21 |
Applied Materials, Inc. |
Formation of a silicon oxynitride layer on a high-k dielectric material
|
US20060019033A1
(en)
*
|
2004-05-21 |
2006-01-26 |
Applied Materials, Inc. |
Plasma treatment of hafnium-containing materials
|
US20060062917A1
(en)
*
|
2004-05-21 |
2006-03-23 |
Shankar Muthukrishnan |
Vapor deposition of hafnium silicate materials with tris(dimethylamino)silane
|
US8202575B2
(en)
*
|
2004-06-28 |
2012-06-19 |
Cambridge Nanotech, Inc. |
Vapor deposition systems and methods
|
US7845309B2
(en)
*
|
2004-07-13 |
2010-12-07 |
Nordson Corporation |
Ultra high speed uniform plasma processing system
|
US20060019493A1
(en)
*
|
2004-07-15 |
2006-01-26 |
Li Wei M |
Methods of metallization for microelectronic devices utilizing metal oxide
|
US7429402B2
(en)
*
|
2004-12-10 |
2008-09-30 |
Applied Materials, Inc. |
Ruthenium as an underlayer for tungsten film deposition
|
JP2006176826A
(ja)
*
|
2004-12-22 |
2006-07-06 |
Canon Anelva Corp |
薄膜処理装置
|
US7687383B2
(en)
*
|
2005-02-04 |
2010-03-30 |
Asm America, Inc. |
Methods of depositing electrically active doped crystalline Si-containing films
|
US20060177601A1
(en)
*
|
2005-02-10 |
2006-08-10 |
Hyung-Sang Park |
Method of forming a ruthenium thin film using a plasma enhanced atomic layer deposition apparatus and the method thereof
|
US8025922B2
(en)
|
2005-03-15 |
2011-09-27 |
Asm International N.V. |
Enhanced deposition of noble metals
|
US7608549B2
(en)
*
|
2005-03-15 |
2009-10-27 |
Asm America, Inc. |
Method of forming non-conformal layers
|
US7666773B2
(en)
*
|
2005-03-15 |
2010-02-23 |
Asm International N.V. |
Selective deposition of noble metal thin films
|
CN100595974C
(zh)
*
|
2005-03-30 |
2010-03-24 |
松下电器产业株式会社 |
传输线
|
KR101272321B1
(ko)
*
|
2005-05-09 |
2013-06-07 |
한국에이에스엠지니텍 주식회사 |
복수의 기체 유입구를 가지는 원자층 증착 장치의 반응기
|
US20060272577A1
(en)
*
|
2005-06-03 |
2006-12-07 |
Ming Mao |
Method and apparatus for decreasing deposition time of a thin film
|
US20070014919A1
(en)
*
|
2005-07-15 |
2007-01-18 |
Jani Hamalainen |
Atomic layer deposition of noble metal oxides
|
US20070020890A1
(en)
*
|
2005-07-19 |
2007-01-25 |
Applied Materials, Inc. |
Method and apparatus for semiconductor processing
|
US20070049043A1
(en)
*
|
2005-08-23 |
2007-03-01 |
Applied Materials, Inc. |
Nitrogen profile engineering in HI-K nitridation for device performance enhancement and reliability improvement
|
US7402534B2
(en)
*
|
2005-08-26 |
2008-07-22 |
Applied Materials, Inc. |
Pretreatment processes within a batch ALD reactor
|
US20070054048A1
(en)
*
|
2005-09-07 |
2007-03-08 |
Suvi Haukka |
Extended deposition range by hot spots
|
US20070065578A1
(en)
*
|
2005-09-21 |
2007-03-22 |
Applied Materials, Inc. |
Treatment processes for a batch ALD reactor
|
US7464917B2
(en)
*
|
2005-10-07 |
2008-12-16 |
Appiled Materials, Inc. |
Ampoule splash guard apparatus
|
US8993055B2
(en)
|
2005-10-27 |
2015-03-31 |
Asm International N.V. |
Enhanced thin film deposition
|
US20070099422A1
(en)
*
|
2005-10-28 |
2007-05-03 |
Kapila Wijekoon |
Process for electroless copper deposition
|
US20070119371A1
(en)
*
|
2005-11-04 |
2007-05-31 |
Paul Ma |
Apparatus and process for plasma-enhanced atomic layer deposition
|
US20070264427A1
(en)
*
|
2005-12-21 |
2007-11-15 |
Asm Japan K.K. |
Thin film formation by atomic layer growth and chemical vapor deposition
|
JP2009521801A
(ja)
*
|
2005-12-22 |
2009-06-04 |
エーエスエム アメリカ インコーポレイテッド |
ドープされた半導体物質のエピタキシャル堆積
|
US7713584B2
(en)
*
|
2005-12-22 |
2010-05-11 |
Asm International N.V. |
Process for producing oxide films
|
KR101379015B1
(ko)
|
2006-02-15 |
2014-03-28 |
한국에이에스엠지니텍 주식회사 |
플라즈마 원자층 증착법을 이용한 루테늄 막 증착 방법 및고밀도 루테늄 층
|
EP1840940B8
(de)
*
|
2006-03-28 |
2014-11-26 |
Thallner, Erich, Dipl.-Ing. |
Vorrichtung und Verfahren zum Beschichten eines mikro- und/oder nanostrukturierten Struktursubstrats
|
US20070252299A1
(en)
*
|
2006-04-27 |
2007-11-01 |
Applied Materials, Inc. |
Synchronization of precursor pulsing and wafer rotation
|
US20070259111A1
(en)
*
|
2006-05-05 |
2007-11-08 |
Singh Kaushal K |
Method and apparatus for photo-excitation of chemicals for atomic layer deposition of dielectric film
|
US7798096B2
(en)
*
|
2006-05-05 |
2010-09-21 |
Applied Materials, Inc. |
Plasma, UV and ion/neutral assisted ALD or CVD in a batch tool
|
US8278176B2
(en)
|
2006-06-07 |
2012-10-02 |
Asm America, Inc. |
Selective epitaxial formation of semiconductor films
|
US7795160B2
(en)
*
|
2006-07-21 |
2010-09-14 |
Asm America Inc. |
ALD of metal silicate films
|
US7435484B2
(en)
*
|
2006-09-01 |
2008-10-14 |
Asm Japan K.K. |
Ruthenium thin film-formed structure
|
US7871678B1
(en)
|
2006-09-12 |
2011-01-18 |
Novellus Systems, Inc. |
Method of increasing the reactivity of a precursor in a cyclic deposition process
|
US8053372B1
(en)
|
2006-09-12 |
2011-11-08 |
Novellus Systems, Inc. |
Method of reducing plasma stabilization time in a cyclic deposition process
|
US7976898B2
(en)
|
2006-09-20 |
2011-07-12 |
Asm Genitech Korea Ltd. |
Atomic layer deposition apparatus
|
JP2010506408A
(ja)
|
2006-10-05 |
2010-02-25 |
エーエスエム アメリカ インコーポレイテッド |
金属シリケート膜のald
|
US7521379B2
(en)
*
|
2006-10-09 |
2009-04-21 |
Applied Materials, Inc. |
Deposition and densification process for titanium nitride barrier layers
|
US8268409B2
(en)
*
|
2006-10-25 |
2012-09-18 |
Asm America, Inc. |
Plasma-enhanced deposition of metal carbide films
|
US8795771B2
(en)
*
|
2006-10-27 |
2014-08-05 |
Sean T. Barry |
ALD of metal-containing films using cyclopentadienyl compounds
|
US20080176149A1
(en)
*
|
2006-10-30 |
2008-07-24 |
Applied Materials, Inc. |
Endpoint detection for photomask etching
|
US20080099436A1
(en)
*
|
2006-10-30 |
2008-05-01 |
Michael Grimbergen |
Endpoint detection for photomask etching
|
US7775508B2
(en)
*
|
2006-10-31 |
2010-08-17 |
Applied Materials, Inc. |
Ampoule for liquid draw and vapor draw with a continuous level sensor
|
US7727864B2
(en)
|
2006-11-01 |
2010-06-01 |
Asm America, Inc. |
Controlled composition using plasma-enhanced atomic layer deposition
|
US7611751B2
(en)
*
|
2006-11-01 |
2009-11-03 |
Asm America, Inc. |
Vapor deposition of metal carbide films
|
US20080124484A1
(en)
*
|
2006-11-08 |
2008-05-29 |
Asm Japan K.K. |
Method of forming ru film and metal wiring structure
|
KR101355638B1
(ko)
*
|
2006-11-09 |
2014-01-29 |
한국에이에스엠지니텍 주식회사 |
원자층 증착 장치
|
US7598170B2
(en)
|
2007-01-26 |
2009-10-06 |
Asm America, Inc. |
Plasma-enhanced ALD of tantalum nitride films
|
US7595270B2
(en)
*
|
2007-01-26 |
2009-09-29 |
Asm America, Inc. |
Passivated stoichiometric metal nitride films
|
US8821637B2
(en)
*
|
2007-01-29 |
2014-09-02 |
Applied Materials, Inc. |
Temperature controlled lid assembly for tungsten nitride deposition
|
JP5474278B2
(ja)
*
|
2007-02-22 |
2014-04-16 |
ピーエスフォー ルクスコ エスエイアールエル |
超臨界プロセス用バッチ式成膜装置及び半導体装置の製造方法
|
US20080241384A1
(en)
*
|
2007-04-02 |
2008-10-02 |
Asm Genitech Korea Ltd. |
Lateral flow deposition apparatus and method of depositing film by using the apparatus
|
US7713874B2
(en)
*
|
2007-05-02 |
2010-05-11 |
Asm America, Inc. |
Periodic plasma annealing in an ALD-type process
|
US7638170B2
(en)
|
2007-06-21 |
2009-12-29 |
Asm International N.V. |
Low resistivity metal carbonitride thin film deposition by atomic layer deposition
|
US8017182B2
(en)
*
|
2007-06-21 |
2011-09-13 |
Asm International N.V. |
Method for depositing thin films by mixed pulsed CVD and ALD
|
US20090035946A1
(en)
*
|
2007-07-31 |
2009-02-05 |
Asm International N.V. |
In situ deposition of different metal-containing films using cyclopentadienyl metal precursors
|
KR20090018290A
(ko)
*
|
2007-08-17 |
2009-02-20 |
에이에스엠지니텍코리아 주식회사 |
증착 장치
|
US7759199B2
(en)
*
|
2007-09-19 |
2010-07-20 |
Asm America, Inc. |
Stressor for engineered strain on channel
|
US20090087339A1
(en)
*
|
2007-09-28 |
2009-04-02 |
Asm Japan K.K. |
METHOD FOR FORMING RUTHENIUM COMPLEX FILM USING Beta-DIKETONE-COORDINATED RUTHENIUM PRECURSOR
|
KR101544198B1
(ko)
|
2007-10-17 |
2015-08-12 |
한국에이에스엠지니텍 주식회사 |
루테늄 막 형성 방법
|
US7939447B2
(en)
*
|
2007-10-26 |
2011-05-10 |
Asm America, Inc. |
Inhibitors for selective deposition of silicon containing films
|
US8282735B2
(en)
|
2007-11-27 |
2012-10-09 |
Asm Genitech Korea Ltd. |
Atomic layer deposition apparatus
|
US7655564B2
(en)
*
|
2007-12-12 |
2010-02-02 |
Asm Japan, K.K. |
Method for forming Ta-Ru liner layer for Cu wiring
|
KR20090067505A
(ko)
*
|
2007-12-21 |
2009-06-25 |
에이에스엠지니텍코리아 주식회사 |
루테늄막 증착 방법
|
US7655543B2
(en)
*
|
2007-12-21 |
2010-02-02 |
Asm America, Inc. |
Separate injection of reactive species in selective formation of films
|
US7799674B2
(en)
*
|
2008-02-19 |
2010-09-21 |
Asm Japan K.K. |
Ruthenium alloy film for copper interconnects
|
US8545936B2
(en)
|
2008-03-28 |
2013-10-01 |
Asm International N.V. |
Methods for forming carbon nanotubes
|
JP5551681B2
(ja)
*
|
2008-04-16 |
2014-07-16 |
エーエスエム アメリカ インコーポレイテッド |
アルミニウム炭化水素化合物を使用する金属炭化物膜の原子層堆積
|
US8383525B2
(en)
*
|
2008-04-25 |
2013-02-26 |
Asm America, Inc. |
Plasma-enhanced deposition process for forming a metal oxide thin film and related structures
|
KR101436564B1
(ko)
*
|
2008-05-07 |
2014-09-02 |
한국에이에스엠지니텍 주식회사 |
비정질 실리콘 박막 형성 방법
|
US7666474B2
(en)
|
2008-05-07 |
2010-02-23 |
Asm America, Inc. |
Plasma-enhanced pulsed deposition of metal carbide films
|
US8084104B2
(en)
*
|
2008-08-29 |
2011-12-27 |
Asm Japan K.K. |
Atomic composition controlled ruthenium alloy film formed by plasma-enhanced atomic layer deposition
|
US8491967B2
(en)
*
|
2008-09-08 |
2013-07-23 |
Applied Materials, Inc. |
In-situ chamber treatment and deposition process
|
US20100062149A1
(en)
|
2008-09-08 |
2010-03-11 |
Applied Materials, Inc. |
Method for tuning a deposition rate during an atomic layer deposition process
|
US8133555B2
(en)
|
2008-10-14 |
2012-03-13 |
Asm Japan K.K. |
Method for forming metal film by ALD using beta-diketone metal complex
|
US20100098851A1
(en)
*
|
2008-10-20 |
2010-04-22 |
Varian Semiconductor Equipment Associates, Inc. |
Techniques for atomic layer deposition
|
US8146896B2
(en)
*
|
2008-10-31 |
2012-04-03 |
Applied Materials, Inc. |
Chemical precursor ampoule for vapor deposition processes
|
US9328417B2
(en)
*
|
2008-11-01 |
2016-05-03 |
Ultratech, Inc. |
System and method for thin film deposition
|
US10378106B2
(en)
|
2008-11-14 |
2019-08-13 |
Asm Ip Holding B.V. |
Method of forming insulation film by modified PEALD
|
US20100136313A1
(en)
*
|
2008-12-01 |
2010-06-03 |
Asm Japan K.K. |
Process for forming high resistivity thin metallic film
|
US9379011B2
(en)
|
2008-12-19 |
2016-06-28 |
Asm International N.V. |
Methods for depositing nickel films and for making nickel silicide and nickel germanide
|
US7927942B2
(en)
|
2008-12-19 |
2011-04-19 |
Asm International N.V. |
Selective silicide process
|
US9394608B2
(en)
|
2009-04-06 |
2016-07-19 |
Asm America, Inc. |
Semiconductor processing reactor and components thereof
|
US8486191B2
(en)
*
|
2009-04-07 |
2013-07-16 |
Asm America, Inc. |
Substrate reactor with adjustable injectors for mixing gases within reaction chamber
|
US20110020546A1
(en)
*
|
2009-05-15 |
2011-01-27 |
Asm International N.V. |
Low Temperature ALD of Noble Metals
|
KR101536257B1
(ko)
*
|
2009-07-22 |
2015-07-13 |
한국에이에스엠지니텍 주식회사 |
수평 흐름 증착 장치 및 이를 이용한 증착 방법
|
US8329569B2
(en)
*
|
2009-07-31 |
2012-12-11 |
Asm America, Inc. |
Deposition of ruthenium or ruthenium dioxide
|
US8802201B2
(en)
|
2009-08-14 |
2014-08-12 |
Asm America, Inc. |
Systems and methods for thin-film deposition of metal oxides using excited nitrogen-oxygen species
|
JP5809152B2
(ja)
|
2009-10-20 |
2015-11-10 |
エーエスエム インターナショナル エヌ.ヴェー.Asm International N.V. |
誘電体膜をパッシベーションする方法
|
US8367528B2
(en)
*
|
2009-11-17 |
2013-02-05 |
Asm America, Inc. |
Cyclical epitaxial deposition and etch
|
US20110293830A1
(en)
|
2010-02-25 |
2011-12-01 |
Timo Hatanpaa |
Precursors and methods for atomic layer deposition of transition metal oxides
|
CN103025915B
(zh)
|
2010-06-08 |
2015-08-05 |
哈佛大学校长及研究员协会 |
低温合成二氧化硅
|
US8778204B2
(en)
|
2010-10-29 |
2014-07-15 |
Applied Materials, Inc. |
Methods for reducing photoresist interference when monitoring a target layer in a plasma process
|
US8747964B2
(en)
|
2010-11-04 |
2014-06-10 |
Novellus Systems, Inc. |
Ion-induced atomic layer deposition of tantalum
|
US8871617B2
(en)
|
2011-04-22 |
2014-10-28 |
Asm Ip Holding B.V. |
Deposition and reduction of mixed metal oxide thin films
|
US8809170B2
(en)
|
2011-05-19 |
2014-08-19 |
Asm America Inc. |
High throughput cyclical epitaxial deposition and etch process
|
US9312155B2
(en)
|
2011-06-06 |
2016-04-12 |
Asm Japan K.K. |
High-throughput semiconductor-processing apparatus equipped with multiple dual-chamber modules
|
JP5878813B2
(ja)
*
|
2011-06-21 |
2016-03-08 |
東京エレクトロン株式会社 |
バッチ式処理装置
|
US10364496B2
(en)
|
2011-06-27 |
2019-07-30 |
Asm Ip Holding B.V. |
Dual section module having shared and unshared mass flow controllers
|
US10854498B2
(en)
|
2011-07-15 |
2020-12-01 |
Asm Ip Holding B.V. |
Wafer-supporting device and method for producing same
|
US20130023129A1
(en)
|
2011-07-20 |
2013-01-24 |
Asm America, Inc. |
Pressure transmitter for a semiconductor processing environment
|
US9062375B2
(en)
|
2011-08-17 |
2015-06-23 |
Asm Genitech Korea Ltd. |
Lateral flow atomic layer deposition apparatus and atomic layer deposition method using the same
|
US9062390B2
(en)
|
2011-09-12 |
2015-06-23 |
Asm International N.V. |
Crystalline strontium titanate and methods of forming the same
|
US8961804B2
(en)
|
2011-10-25 |
2015-02-24 |
Applied Materials, Inc. |
Etch rate detection for photomask etching
|
US9017481B1
(en)
|
2011-10-28 |
2015-04-28 |
Asm America, Inc. |
Process feed management for semiconductor substrate processing
|
US8808559B2
(en)
|
2011-11-22 |
2014-08-19 |
Applied Materials, Inc. |
Etch rate detection for reflective multi-material layers etching
|
US8900469B2
(en)
|
2011-12-19 |
2014-12-02 |
Applied Materials, Inc. |
Etch rate detection for anti-reflective coating layer and absorber layer etching
|
US9659799B2
(en)
|
2012-08-28 |
2017-05-23 |
Asm Ip Holding B.V. |
Systems and methods for dynamic semiconductor process scheduling
|
US9021985B2
(en)
|
2012-09-12 |
2015-05-05 |
Asm Ip Holdings B.V. |
Process gas management for an inductively-coupled plasma deposition reactor
|
US10714315B2
(en)
|
2012-10-12 |
2020-07-14 |
Asm Ip Holdings B.V. |
Semiconductor reaction chamber showerhead
|
US9805939B2
(en)
|
2012-10-12 |
2017-10-31 |
Applied Materials, Inc. |
Dual endpoint detection for advanced phase shift and binary photomasks
|
US20140116336A1
(en)
*
|
2012-10-26 |
2014-05-01 |
Applied Materials, Inc. |
Substrate process chamber exhaust
|
US8778574B2
(en)
|
2012-11-30 |
2014-07-15 |
Applied Materials, Inc. |
Method for etching EUV material layers utilized to form a photomask
|
US9175389B2
(en)
*
|
2012-12-21 |
2015-11-03 |
Intermolecular, Inc. |
ALD process window combinatorial screening tool
|
US20160376700A1
(en)
|
2013-02-01 |
2016-12-29 |
Asm Ip Holding B.V. |
System for treatment of deposition reactor
|
US9484191B2
(en)
|
2013-03-08 |
2016-11-01 |
Asm Ip Holding B.V. |
Pulsed remote plasma method and system
|
US9589770B2
(en)
|
2013-03-08 |
2017-03-07 |
Asm Ip Holding B.V. |
Method and systems for in-situ formation of intermediate reactive species
|
US9412602B2
(en)
|
2013-03-13 |
2016-08-09 |
Asm Ip Holding B.V. |
Deposition of smooth metal nitride films
|
US8846550B1
(en)
|
2013-03-14 |
2014-09-30 |
Asm Ip Holding B.V. |
Silane or borane treatment of metal thin films
|
US8841182B1
(en)
|
2013-03-14 |
2014-09-23 |
Asm Ip Holding B.V. |
Silane and borane treatments for titanium carbide films
|
JP6134191B2
(ja)
|
2013-04-07 |
2017-05-24 |
村川 惠美 |
回転型セミバッチald装置
|
US9240412B2
(en)
|
2013-09-27 |
2016-01-19 |
Asm Ip Holding B.V. |
Semiconductor structure and device and methods of forming same using selective epitaxial process
|
US9394609B2
(en)
|
2014-02-13 |
2016-07-19 |
Asm Ip Holding B.V. |
Atomic layer deposition of aluminum fluoride thin films
|
US10683571B2
(en)
|
2014-02-25 |
2020-06-16 |
Asm Ip Holding B.V. |
Gas supply manifold and method of supplying gases to chamber using same
|
US10167557B2
(en)
|
2014-03-18 |
2019-01-01 |
Asm Ip Holding B.V. |
Gas distribution system, reactor including the system, and methods of using the same
|
US11015245B2
(en)
|
2014-03-19 |
2021-05-25 |
Asm Ip Holding B.V. |
Gas-phase reactor and system having exhaust plenum and components thereof
|
US10643925B2
(en)
|
2014-04-17 |
2020-05-05 |
Asm Ip Holding B.V. |
Fluorine-containing conductive films
|
US10858737B2
(en)
|
2014-07-28 |
2020-12-08 |
Asm Ip Holding B.V. |
Showerhead assembly and components thereof
|
US9890456B2
(en)
|
2014-08-21 |
2018-02-13 |
Asm Ip Holding B.V. |
Method and system for in situ formation of gas-phase compounds
|
US10941490B2
(en)
|
2014-10-07 |
2021-03-09 |
Asm Ip Holding B.V. |
Multiple temperature range susceptor, assembly, reactor and system including the susceptor, and methods of using the same
|
US9657845B2
(en)
|
2014-10-07 |
2017-05-23 |
Asm Ip Holding B.V. |
Variable conductance gas distribution apparatus and method
|
US10002936B2
(en)
|
2014-10-23 |
2018-06-19 |
Asm Ip Holding B.V. |
Titanium aluminum and tantalum aluminum thin films
|
KR102263121B1
(ko)
|
2014-12-22 |
2021-06-09 |
에이에스엠 아이피 홀딩 비.브이. |
반도체 소자 및 그 제조 방법
|
US10529542B2
(en)
|
2015-03-11 |
2020-01-07 |
Asm Ip Holdings B.V. |
Cross-flow reactor and method
|
US10276355B2
(en)
|
2015-03-12 |
2019-04-30 |
Asm Ip Holding B.V. |
Multi-zone reactor, system including the reactor, and method of using the same
|
US10458018B2
(en)
|
2015-06-26 |
2019-10-29 |
Asm Ip Holding B.V. |
Structures including metal carbide material, devices including the structures, and methods of forming same
|
US10600673B2
(en)
|
2015-07-07 |
2020-03-24 |
Asm Ip Holding B.V. |
Magnetic susceptor to baseplate seal
|
US10083836B2
(en)
|
2015-07-24 |
2018-09-25 |
Asm Ip Holding B.V. |
Formation of boron-doped titanium metal films with high work function
|
KR101760316B1
(ko)
*
|
2015-09-11 |
2017-07-21 |
주식회사 유진테크 |
기판처리장치
|
US9960072B2
(en)
|
2015-09-29 |
2018-05-01 |
Asm Ip Holding B.V. |
Variable adjustment for precise matching of multiple chamber cavity housings
|
US9607842B1
(en)
|
2015-10-02 |
2017-03-28 |
Asm Ip Holding B.V. |
Methods of forming metal silicides
|
US9941425B2
(en)
|
2015-10-16 |
2018-04-10 |
Asm Ip Holdings B.V. |
Photoactive devices and materials
|
US10211308B2
(en)
|
2015-10-21 |
2019-02-19 |
Asm Ip Holding B.V. |
NbMC layers
|
US10322384B2
(en)
|
2015-11-09 |
2019-06-18 |
Asm Ip Holding B.V. |
Counter flow mixer for process chamber
|
US9786491B2
(en)
|
2015-11-12 |
2017-10-10 |
Asm Ip Holding B.V. |
Formation of SiOCN thin films
|
US9786492B2
(en)
|
2015-11-12 |
2017-10-10 |
Asm Ip Holding B.V. |
Formation of SiOCN thin films
|
US11139308B2
(en)
|
2015-12-29 |
2021-10-05 |
Asm Ip Holding B.V. |
Atomic layer deposition of III-V compounds to form V-NAND devices
|
US10468251B2
(en)
|
2016-02-19 |
2019-11-05 |
Asm Ip Holding B.V. |
Method for forming spacers using silicon nitride film for spacer-defined multiple patterning
|
US10529554B2
(en)
|
2016-02-19 |
2020-01-07 |
Asm Ip Holding B.V. |
Method for forming silicon nitride film selectively on sidewalls or flat surfaces of trenches
|
US10501866B2
(en)
|
2016-03-09 |
2019-12-10 |
Asm Ip Holding B.V. |
Gas distribution apparatus for improved film uniformity in an epitaxial system
|
US10343920B2
(en)
|
2016-03-18 |
2019-07-09 |
Asm Ip Holding B.V. |
Aligned carbon nanotubes
|
US9892913B2
(en)
|
2016-03-24 |
2018-02-13 |
Asm Ip Holding B.V. |
Radial and thickness control via biased multi-port injection settings
|
US10865475B2
(en)
|
2016-04-21 |
2020-12-15 |
Asm Ip Holding B.V. |
Deposition of metal borides and silicides
|
US10190213B2
(en)
|
2016-04-21 |
2019-01-29 |
Asm Ip Holding B.V. |
Deposition of metal borides
|
US10367080B2
(en)
|
2016-05-02 |
2019-07-30 |
Asm Ip Holding B.V. |
Method of forming a germanium oxynitride film
|
US10032628B2
(en)
|
2016-05-02 |
2018-07-24 |
Asm Ip Holding B.V. |
Source/drain performance through conformal solid state doping
|
KR102378021B1
(ko)
|
2016-05-06 |
2022-03-23 |
에이에스엠 아이피 홀딩 비.브이. |
SiOC 박막의 형성
|
KR102592471B1
(ko)
|
2016-05-17 |
2023-10-20 |
에이에스엠 아이피 홀딩 비.브이. |
금속 배선 형성 방법 및 이를 이용한 반도체 장치의 제조 방법
|
US11453943B2
(en)
|
2016-05-25 |
2022-09-27 |
Asm Ip Holding B.V. |
Method for forming carbon-containing silicon/metal oxide or nitride film by ALD using silicon precursor and hydrocarbon precursor
|
US10388509B2
(en)
|
2016-06-28 |
2019-08-20 |
Asm Ip Holding B.V. |
Formation of epitaxial layers via dislocation filtering
|
US9859151B1
(en)
|
2016-07-08 |
2018-01-02 |
Asm Ip Holding B.V. |
Selective film deposition method to form air gaps
|
US10612137B2
(en)
|
2016-07-08 |
2020-04-07 |
Asm Ip Holdings B.V. |
Organic reactants for atomic layer deposition
|
US10714385B2
(en)
|
2016-07-19 |
2020-07-14 |
Asm Ip Holding B.V. |
Selective deposition of tungsten
|
KR102354490B1
(ko)
|
2016-07-27 |
2022-01-21 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 방법
|
US9812320B1
(en)
|
2016-07-28 |
2017-11-07 |
Asm Ip Holding B.V. |
Method and apparatus for filling a gap
|
US9887082B1
(en)
|
2016-07-28 |
2018-02-06 |
Asm Ip Holding B.V. |
Method and apparatus for filling a gap
|
KR102532607B1
(ko)
|
2016-07-28 |
2023-05-15 |
에이에스엠 아이피 홀딩 비.브이. |
기판 가공 장치 및 그 동작 방법
|
US10395919B2
(en)
|
2016-07-28 |
2019-08-27 |
Asm Ip Holding B.V. |
Method and apparatus for filling a gap
|
US10410943B2
(en)
|
2016-10-13 |
2019-09-10 |
Asm Ip Holding B.V. |
Method for passivating a surface of a semiconductor and related systems
|
US10643826B2
(en)
|
2016-10-26 |
2020-05-05 |
Asm Ip Holdings B.V. |
Methods for thermally calibrating reaction chambers
|
US11532757B2
(en)
|
2016-10-27 |
2022-12-20 |
Asm Ip Holding B.V. |
Deposition of charge trapping layers
|
US10714350B2
(en)
|
2016-11-01 |
2020-07-14 |
ASM IP Holdings, B.V. |
Methods for forming a transition metal niobium nitride film on a substrate by atomic layer deposition and related semiconductor device structures
|
US10435790B2
(en)
|
2016-11-01 |
2019-10-08 |
Asm Ip Holding B.V. |
Method of subatmospheric plasma-enhanced ALD using capacitively coupled electrodes with narrow gap
|
US10643904B2
(en)
|
2016-11-01 |
2020-05-05 |
Asm Ip Holdings B.V. |
Methods for forming a semiconductor device and related semiconductor device structures
|
US10229833B2
(en)
|
2016-11-01 |
2019-03-12 |
Asm Ip Holding B.V. |
Methods for forming a transition metal nitride film on a substrate by atomic layer deposition and related semiconductor device structures
|
US10134757B2
(en)
|
2016-11-07 |
2018-11-20 |
Asm Ip Holding B.V. |
Method of processing a substrate and a device manufactured by using the method
|
KR102546317B1
(ko)
|
2016-11-15 |
2023-06-21 |
에이에스엠 아이피 홀딩 비.브이. |
기체 공급 유닛 및 이를 포함하는 기판 처리 장치
|
US10340135B2
(en)
|
2016-11-28 |
2019-07-02 |
Asm Ip Holding B.V. |
Method of topologically restricted plasma-enhanced cyclic deposition of silicon or metal nitride
|
US10186420B2
(en)
|
2016-11-29 |
2019-01-22 |
Asm Ip Holding B.V. |
Formation of silicon-containing thin films
|
US10947640B1
(en)
*
|
2016-12-02 |
2021-03-16 |
Svagos Technik, Inc. |
CVD reactor chamber with resistive heating for silicon carbide deposition
|
KR20180068582A
(ko)
|
2016-12-14 |
2018-06-22 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치
|
US11447861B2
(en)
*
|
2016-12-15 |
2022-09-20 |
Asm Ip Holding B.V. |
Sequential infiltration synthesis apparatus and a method of forming a patterned structure
|
US11581186B2
(en)
|
2016-12-15 |
2023-02-14 |
Asm Ip Holding B.V. |
Sequential infiltration synthesis apparatus
|
KR102700194B1
(ko)
|
2016-12-19 |
2024-08-28 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치
|
US10269558B2
(en)
|
2016-12-22 |
2019-04-23 |
Asm Ip Holding B.V. |
Method of forming a structure on a substrate
|
US10867788B2
(en)
|
2016-12-28 |
2020-12-15 |
Asm Ip Holding B.V. |
Method of forming a structure on a substrate
|
US11390950B2
(en)
|
2017-01-10 |
2022-07-19 |
Asm Ip Holding B.V. |
Reactor system and method to reduce residue buildup during a film deposition process
|
US10655221B2
(en)
|
2017-02-09 |
2020-05-19 |
Asm Ip Holding B.V. |
Method for depositing oxide film by thermal ALD and PEALD
|
US10468261B2
(en)
|
2017-02-15 |
2019-11-05 |
Asm Ip Holding B.V. |
Methods for forming a metallic film on a substrate by cyclical deposition and related semiconductor device structures
|
US10529563B2
(en)
|
2017-03-29 |
2020-01-07 |
Asm Ip Holdings B.V. |
Method for forming doped metal oxide films on a substrate by cyclical deposition and related semiconductor device structures
|
US10283353B2
(en)
|
2017-03-29 |
2019-05-07 |
Asm Ip Holding B.V. |
Method of reforming insulating film deposited on substrate with recess pattern
|
US10847529B2
(en)
|
2017-04-13 |
2020-11-24 |
Asm Ip Holding B.V. |
Substrate processing method and device manufactured by the same
|
CN110582474A
(zh)
|
2017-04-20 |
2019-12-17 |
劳力士有限公司 |
陶瓷组件的制造
|
KR102457289B1
(ko)
|
2017-04-25 |
2022-10-21 |
에이에스엠 아이피 홀딩 비.브이. |
박막 증착 방법 및 반도체 장치의 제조 방법
|
US10504901B2
(en)
|
2017-04-26 |
2019-12-10 |
Asm Ip Holding B.V. |
Substrate processing method and device manufactured using the same
|
US11158500B2
(en)
|
2017-05-05 |
2021-10-26 |
Asm Ip Holding B.V. |
Plasma enhanced deposition processes for controlled formation of oxygen containing thin films
|
US10770286B2
(en)
|
2017-05-08 |
2020-09-08 |
Asm Ip Holdings B.V. |
Methods for selectively forming a silicon nitride film on a substrate and related semiconductor device structures
|
US10892156B2
(en)
|
2017-05-08 |
2021-01-12 |
Asm Ip Holding B.V. |
Methods for forming a silicon nitride film on a substrate and related semiconductor device structures
|
US10446393B2
(en)
|
2017-05-08 |
2019-10-15 |
Asm Ip Holding B.V. |
Methods for forming silicon-containing epitaxial layers and related semiconductor device structures
|
US10504742B2
(en)
|
2017-05-31 |
2019-12-10 |
Asm Ip Holding B.V. |
Method of atomic layer etching using hydrogen plasma
|
US10886123B2
(en)
|
2017-06-02 |
2021-01-05 |
Asm Ip Holding B.V. |
Methods for forming low temperature semiconductor layers and related semiconductor device structures
|
US12040200B2
(en)
|
2017-06-20 |
2024-07-16 |
Asm Ip Holding B.V. |
Semiconductor processing apparatus and methods for calibrating a semiconductor processing apparatus
|
US11306395B2
(en)
|
2017-06-28 |
2022-04-19 |
Asm Ip Holding B.V. |
Methods for depositing a transition metal nitride film on a substrate by atomic layer deposition and related deposition apparatus
|
US10685834B2
(en)
|
2017-07-05 |
2020-06-16 |
Asm Ip Holdings B.V. |
Methods for forming a silicon germanium tin layer and related semiconductor device structures
|
KR20190009245A
(ko)
|
2017-07-18 |
2019-01-28 |
에이에스엠 아이피 홀딩 비.브이. |
반도체 소자 구조물 형성 방법 및 관련된 반도체 소자 구조물
|
US11018002B2
(en)
|
2017-07-19 |
2021-05-25 |
Asm Ip Holding B.V. |
Method for selectively depositing a Group IV semiconductor and related semiconductor device structures
|
US11374112B2
(en)
|
2017-07-19 |
2022-06-28 |
Asm Ip Holding B.V. |
Method for depositing a group IV semiconductor and related semiconductor device structures
|
US10541333B2
(en)
|
2017-07-19 |
2020-01-21 |
Asm Ip Holding B.V. |
Method for depositing a group IV semiconductor and related semiconductor device structures
|
US10590535B2
(en)
|
2017-07-26 |
2020-03-17 |
Asm Ip Holdings B.V. |
Chemical treatment, deposition and/or infiltration apparatus and method for using the same
|
US10312055B2
(en)
|
2017-07-26 |
2019-06-04 |
Asm Ip Holding B.V. |
Method of depositing film by PEALD using negative bias
|
US10605530B2
(en)
|
2017-07-26 |
2020-03-31 |
Asm Ip Holding B.V. |
Assembly of a liner and a flange for a vertical furnace as well as the liner and the vertical furnace
|
US10692741B2
(en)
|
2017-08-08 |
2020-06-23 |
Asm Ip Holdings B.V. |
Radiation shield
|
US10770336B2
(en)
|
2017-08-08 |
2020-09-08 |
Asm Ip Holding B.V. |
Substrate lift mechanism and reactor including same
|
US10249524B2
(en)
|
2017-08-09 |
2019-04-02 |
Asm Ip Holding B.V. |
Cassette holder assembly for a substrate cassette and holding member for use in such assembly
|
US11139191B2
(en)
|
2017-08-09 |
2021-10-05 |
Asm Ip Holding B.V. |
Storage apparatus for storing cassettes for substrates and processing apparatus equipped therewith
|
US11769682B2
(en)
|
2017-08-09 |
2023-09-26 |
Asm Ip Holding B.V. |
Storage apparatus for storing cassettes for substrates and processing apparatus equipped therewith
|
US10236177B1
(en)
|
2017-08-22 |
2019-03-19 |
ASM IP Holding B.V.. |
Methods for depositing a doped germanium tin semiconductor and related semiconductor device structures
|
USD900036S1
(en)
|
2017-08-24 |
2020-10-27 |
Asm Ip Holding B.V. |
Heater electrical connector and adapter
|
US11830730B2
(en)
|
2017-08-29 |
2023-11-28 |
Asm Ip Holding B.V. |
Layer forming method and apparatus
|
KR102491945B1
(ko)
|
2017-08-30 |
2023-01-26 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치
|
US11295980B2
(en)
|
2017-08-30 |
2022-04-05 |
Asm Ip Holding B.V. |
Methods for depositing a molybdenum metal film over a dielectric surface of a substrate by a cyclical deposition process and related semiconductor device structures
|
US11056344B2
(en)
|
2017-08-30 |
2021-07-06 |
Asm Ip Holding B.V. |
Layer forming method
|
KR102401446B1
(ko)
|
2017-08-31 |
2022-05-24 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치
|
US10607895B2
(en)
|
2017-09-18 |
2020-03-31 |
Asm Ip Holdings B.V. |
Method for forming a semiconductor device structure comprising a gate fill metal
|
KR102630301B1
(ko)
|
2017-09-21 |
2024-01-29 |
에이에스엠 아이피 홀딩 비.브이. |
침투성 재료의 순차 침투 합성 방법 처리 및 이를 이용하여 형성된 구조물 및 장치
|
US10844484B2
(en)
|
2017-09-22 |
2020-11-24 |
Asm Ip Holding B.V. |
Apparatus for dispensing a vapor phase reactant to a reaction chamber and related methods
|
US10658205B2
(en)
|
2017-09-28 |
2020-05-19 |
Asm Ip Holdings B.V. |
Chemical dispensing apparatus and methods for dispensing a chemical to a reaction chamber
|
US10403504B2
(en)
|
2017-10-05 |
2019-09-03 |
Asm Ip Holding B.V. |
Method for selectively depositing a metallic film on a substrate
|
US10319588B2
(en)
|
2017-10-10 |
2019-06-11 |
Asm Ip Holding B.V. |
Method for depositing a metal chalcogenide on a substrate by cyclical deposition
|
US10923344B2
(en)
|
2017-10-30 |
2021-02-16 |
Asm Ip Holding B.V. |
Methods for forming a semiconductor structure and related semiconductor structures
|
KR102443047B1
(ko)
|
2017-11-16 |
2022-09-14 |
에이에스엠 아이피 홀딩 비.브이. |
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|
US10910262B2
(en)
|
2017-11-16 |
2021-02-02 |
Asm Ip Holding B.V. |
Method of selectively depositing a capping layer structure on a semiconductor device structure
|
US11022879B2
(en)
|
2017-11-24 |
2021-06-01 |
Asm Ip Holding B.V. |
Method of forming an enhanced unexposed photoresist layer
|
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(ja)
|
2017-11-27 |
2023-01-30 |
エーエスエム アイピー ホールディング ビー.ブイ. |
バッチ炉で利用されるウェハカセットを収納するための収納装置
|
WO2019103610A1
(en)
|
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2019-05-31 |
Asm Ip Holding B.V. |
Apparatus including a clean mini environment
|
US10991573B2
(en)
|
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2021-04-27 |
Asm Ip Holding B.V. |
Uniform deposition of SiOC on dielectric and metal surfaces
|
US10290508B1
(en)
|
2017-12-05 |
2019-05-14 |
Asm Ip Holding B.V. |
Method for forming vertical spacers for spacer-defined patterning
|
US10872771B2
(en)
|
2018-01-16 |
2020-12-22 |
Asm Ip Holding B. V. |
Method for depositing a material film on a substrate within a reaction chamber by a cyclical deposition process and related device structures
|
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(zh)
|
2018-01-19 |
2020-09-04 |
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通过等离子体辅助沉积来沉积间隙填充层的方法
|
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(zh)
|
2018-01-19 |
2023-04-21 |
荷蘭商Asm 智慧財產控股公司 |
沈積方法
|
USD903477S1
(en)
|
2018-01-24 |
2020-12-01 |
Asm Ip Holdings B.V. |
Metal clamp
|
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(en)
|
2018-01-25 |
2021-05-25 |
Asm Ip Holding B.V. |
Hybrid lift pin
|
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(en)
|
2018-02-01 |
2020-04-07 |
Asm Ip Holding B.V. |
Gas supply plate for semiconductor manufacturing apparatus
|
US10535516B2
(en)
|
2018-02-01 |
2020-01-14 |
Asm Ip Holdings B.V. |
Method for depositing a semiconductor structure on a surface of a substrate and related semiconductor structures
|
US11081345B2
(en)
|
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2021-08-03 |
Asm Ip Holding B.V. |
Method of post-deposition treatment for silicon oxide film
|
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(ko)
|
2018-02-09 |
2019-08-20 |
(주)울텍 |
원자층 증착 시스템
|
US10896820B2
(en)
|
2018-02-14 |
2021-01-19 |
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Method for depositing a ruthenium-containing film on a substrate by a cyclical deposition process
|
JP7124098B2
(ja)
|
2018-02-14 |
2022-08-23 |
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|
US10731249B2
(en)
|
2018-02-15 |
2020-08-04 |
Asm Ip Holding B.V. |
Method of forming a transition metal containing film on a substrate by a cyclical deposition process, a method for supplying a transition metal halide compound to a reaction chamber, and related vapor deposition apparatus
|
KR102636427B1
(ko)
|
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2024-02-13 |
에이에스엠 아이피 홀딩 비.브이. |
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|
US10658181B2
(en)
|
2018-02-20 |
2020-05-19 |
Asm Ip Holding B.V. |
Method of spacer-defined direct patterning in semiconductor fabrication
|
US10975470B2
(en)
|
2018-02-23 |
2021-04-13 |
Asm Ip Holding B.V. |
Apparatus for detecting or monitoring for a chemical precursor in a high temperature environment
|
US11473195B2
(en)
|
2018-03-01 |
2022-10-18 |
Asm Ip Holding B.V. |
Semiconductor processing apparatus and a method for processing a substrate
|
US11629406B2
(en)
|
2018-03-09 |
2023-04-18 |
Asm Ip Holding B.V. |
Semiconductor processing apparatus comprising one or more pyrometers for measuring a temperature of a substrate during transfer of the substrate
|
US11114283B2
(en)
|
2018-03-16 |
2021-09-07 |
Asm Ip Holding B.V. |
Reactor, system including the reactor, and methods of manufacturing and using same
|
KR102646467B1
(ko)
|
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2024-03-11 |
에이에스엠 아이피 홀딩 비.브이. |
기판 상에 전극을 형성하는 방법 및 전극을 포함하는 반도체 소자 구조
|
US11230766B2
(en)
|
2018-03-29 |
2022-01-25 |
Asm Ip Holding B.V. |
Substrate processing apparatus and method
|
US10510536B2
(en)
|
2018-03-29 |
2019-12-17 |
Asm Ip Holding B.V. |
Method of depositing a co-doped polysilicon film on a surface of a substrate within a reaction chamber
|
US11088002B2
(en)
|
2018-03-29 |
2021-08-10 |
Asm Ip Holding B.V. |
Substrate rack and a substrate processing system and method
|
KR102501472B1
(ko)
|
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2023-02-20 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 방법
|
US12025484B2
(en)
|
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2024-07-02 |
Asm Ip Holding B.V. |
Thin film forming method
|
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(zh)
|
2018-05-08 |
2024-05-21 |
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藉由循環沉積製程於基板上沉積氧化物膜之方法及相關裝置結構
|
KR20190129718A
(ko)
|
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2019-11-20 |
에이에스엠 아이피 홀딩 비.브이. |
기판 상에 피도핑 금속 탄화물 막을 형성하는 방법 및 관련 반도체 소자 구조
|
KR102596988B1
(ko)
|
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에이에스엠 아이피 홀딩 비.브이. |
기판 처리 방법 및 그에 의해 제조된 장치
|
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(zh)
|
2018-06-04 |
2024-05-01 |
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|
US11718913B2
(en)
|
2018-06-04 |
2023-08-08 |
Asm Ip Holding B.V. |
Gas distribution system and reactor system including same
|
US11286562B2
(en)
|
2018-06-08 |
2022-03-29 |
Asm Ip Holding B.V. |
Gas-phase chemical reactor and method of using same
|
KR102568797B1
(ko)
|
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2023-08-21 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 시스템
|
US10797133B2
(en)
|
2018-06-21 |
2020-10-06 |
Asm Ip Holding B.V. |
Method for depositing a phosphorus doped silicon arsenide film and related semiconductor device structures
|
WO2020003000A1
(en)
|
2018-06-27 |
2020-01-02 |
Asm Ip Holding B.V. |
Cyclic deposition methods for forming metal-containing material and films and structures including the metal-containing material
|
TW202409324A
(zh)
|
2018-06-27 |
2024-03-01 |
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用於形成含金屬材料之循環沉積製程
|
US10612136B2
(en)
|
2018-06-29 |
2020-04-07 |
ASM IP Holding, B.V. |
Temperature-controlled flange and reactor system including same
|
KR102686758B1
(ko)
|
2018-06-29 |
2024-07-18 |
에이에스엠 아이피 홀딩 비.브이. |
박막 증착 방법 및 반도체 장치의 제조 방법
|
US10388513B1
(en)
|
2018-07-03 |
2019-08-20 |
Asm Ip Holding B.V. |
Method for depositing silicon-free carbon-containing film as gap-fill layer by pulse plasma-assisted deposition
|
US10755922B2
(en)
|
2018-07-03 |
2020-08-25 |
Asm Ip Holding B.V. |
Method for depositing silicon-free carbon-containing film as gap-fill layer by pulse plasma-assisted deposition
|
US10767789B2
(en)
|
2018-07-16 |
2020-09-08 |
Asm Ip Holding B.V. |
Diaphragm valves, valve components, and methods for forming valve components
|
US10483099B1
(en)
|
2018-07-26 |
2019-11-19 |
Asm Ip Holding B.V. |
Method for forming thermally stable organosilicon polymer film
|
US11053591B2
(en)
|
2018-08-06 |
2021-07-06 |
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|
US10883175B2
(en)
|
2018-08-09 |
2021-01-05 |
Asm Ip Holding B.V. |
Vertical furnace for processing substrates and a liner for use therein
|
US10829852B2
(en)
|
2018-08-16 |
2020-11-10 |
Asm Ip Holding B.V. |
Gas distribution device for a wafer processing apparatus
|
US11430674B2
(en)
|
2018-08-22 |
2022-08-30 |
Asm Ip Holding B.V. |
Sensor array, apparatus for dispensing a vapor phase reactant to a reaction chamber and related methods
|
KR102707956B1
(ko)
|
2018-09-11 |
2024-09-19 |
에이에스엠 아이피 홀딩 비.브이. |
박막 증착 방법
|
US11024523B2
(en)
|
2018-09-11 |
2021-06-01 |
Asm Ip Holding B.V. |
Substrate processing apparatus and method
|
US11049751B2
(en)
|
2018-09-14 |
2021-06-29 |
Asm Ip Holding B.V. |
Cassette supply system to store and handle cassettes and processing apparatus equipped therewith
|
TWI844567B
(zh)
|
2018-10-01 |
2024-06-11 |
荷蘭商Asm Ip私人控股有限公司 |
基材保持裝置、含有此裝置之系統及其使用之方法
|
US11232963B2
(en)
|
2018-10-03 |
2022-01-25 |
Asm Ip Holding B.V. |
Substrate processing apparatus and method
|
KR102592699B1
(ko)
|
2018-10-08 |
2023-10-23 |
에이에스엠 아이피 홀딩 비.브이. |
기판 지지 유닛 및 이를 포함하는 박막 증착 장치와 기판 처리 장치
|
US10847365B2
(en)
|
2018-10-11 |
2020-11-24 |
Asm Ip Holding B.V. |
Method of forming conformal silicon carbide film by cyclic CVD
|
US10811256B2
(en)
|
2018-10-16 |
2020-10-20 |
Asm Ip Holding B.V. |
Method for etching a carbon-containing feature
|
KR102546322B1
(ko)
|
2018-10-19 |
2023-06-21 |
에이에스엠 아이피 홀딩 비.브이. |
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|
KR102605121B1
(ko)
|
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2023-11-23 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치 및 기판 처리 방법
|
USD948463S1
(en)
|
2018-10-24 |
2022-04-12 |
Asm Ip Holding B.V. |
Susceptor for semiconductor substrate supporting apparatus
|
US10381219B1
(en)
|
2018-10-25 |
2019-08-13 |
Asm Ip Holding B.V. |
Methods for forming a silicon nitride film
|
US11087997B2
(en)
|
2018-10-31 |
2021-08-10 |
Asm Ip Holding B.V. |
Substrate processing apparatus for processing substrates
|
KR20200051105A
(ko)
|
2018-11-02 |
2020-05-13 |
에이에스엠 아이피 홀딩 비.브이. |
기판 지지 유닛 및 이를 포함하는 기판 처리 장치
|
US11572620B2
(en)
|
2018-11-06 |
2023-02-07 |
Asm Ip Holding B.V. |
Methods for selectively depositing an amorphous silicon film on a substrate
|
US11031242B2
(en)
|
2018-11-07 |
2021-06-08 |
Asm Ip Holding B.V. |
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|
US10818758B2
(en)
|
2018-11-16 |
2020-10-27 |
Asm Ip Holding B.V. |
Methods for forming a metal silicate film on a substrate in a reaction chamber and related semiconductor device structures
|
US10847366B2
(en)
|
2018-11-16 |
2020-11-24 |
Asm Ip Holding B.V. |
Methods for depositing a transition metal chalcogenide film on a substrate by a cyclical deposition process
|
US10559458B1
(en)
|
2018-11-26 |
2020-02-11 |
Asm Ip Holding B.V. |
Method of forming oxynitride film
|
US12040199B2
(en)
|
2018-11-28 |
2024-07-16 |
Asm Ip Holding B.V. |
Substrate processing apparatus for processing substrates
|
US11217444B2
(en)
|
2018-11-30 |
2022-01-04 |
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Method for forming an ultraviolet radiation responsive metal oxide-containing film
|
KR102636428B1
(ko)
|
2018-12-04 |
2024-02-13 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치를 세정하는 방법
|
US11158513B2
(en)
|
2018-12-13 |
2021-10-26 |
Asm Ip Holding B.V. |
Methods for forming a rhenium-containing film on a substrate by a cyclical deposition process and related semiconductor device structures
|
JP7504584B2
(ja)
|
2018-12-14 |
2024-06-24 |
エーエスエム・アイピー・ホールディング・ベー・フェー |
窒化ガリウムの選択的堆積を用いてデバイス構造体を形成する方法及びそのためのシステム
|
TWI819180B
(zh)
|
2019-01-17 |
2023-10-21 |
荷蘭商Asm 智慧財產控股公司 |
藉由循環沈積製程於基板上形成含過渡金屬膜之方法
|
KR20200091543A
(ko)
|
2019-01-22 |
2020-07-31 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치
|
CN111524788B
(zh)
|
2019-02-01 |
2023-11-24 |
Asm Ip私人控股有限公司 |
氧化硅的拓扑选择性膜形成的方法
|
KR102626263B1
(ko)
|
2019-02-20 |
2024-01-16 |
에이에스엠 아이피 홀딩 비.브이. |
처리 단계를 포함하는 주기적 증착 방법 및 이를 위한 장치
|
KR20200102357A
(ko)
|
2019-02-20 |
2020-08-31 |
에이에스엠 아이피 홀딩 비.브이. |
3-d nand 응용의 플러그 충진체 증착용 장치 및 방법
|
TWI845607B
(zh)
|
2019-02-20 |
2024-06-21 |
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用來填充形成於基材表面內之凹部的循環沉積方法及設備
|
JP2020136678A
(ja)
|
2019-02-20 |
2020-08-31 |
エーエスエム・アイピー・ホールディング・ベー・フェー |
基材表面内に形成された凹部を充填するための方法および装置
|
TWI842826B
(zh)
|
2019-02-22 |
2024-05-21 |
荷蘭商Asm Ip私人控股有限公司 |
基材處理設備及處理基材之方法
|
KR20200108243A
(ko)
|
2019-03-08 |
2020-09-17 |
에이에스엠 아이피 홀딩 비.브이. |
SiOC 층을 포함한 구조체 및 이의 형성 방법
|
US11742198B2
(en)
|
2019-03-08 |
2023-08-29 |
Asm Ip Holding B.V. |
Structure including SiOCN layer and method of forming same
|
KR20200108242A
(ko)
|
2019-03-08 |
2020-09-17 |
에이에스엠 아이피 홀딩 비.브이. |
실리콘 질화물 층을 선택적으로 증착하는 방법, 및 선택적으로 증착된 실리콘 질화물 층을 포함하는 구조체
|
KR20200116033A
(ko)
|
2019-03-28 |
2020-10-08 |
에이에스엠 아이피 홀딩 비.브이. |
도어 개방기 및 이를 구비한 기판 처리 장치
|
KR20200116855A
(ko)
|
2019-04-01 |
2020-10-13 |
에이에스엠 아이피 홀딩 비.브이. |
반도체 소자를 제조하는 방법
|
KR20200123380A
(ko)
|
2019-04-19 |
2020-10-29 |
에이에스엠 아이피 홀딩 비.브이. |
층 형성 방법 및 장치
|
KR20200125453A
(ko)
|
2019-04-24 |
2020-11-04 |
에이에스엠 아이피 홀딩 비.브이. |
기상 반응기 시스템 및 이를 사용하는 방법
|
KR20200130118A
(ko)
|
2019-05-07 |
2020-11-18 |
에이에스엠 아이피 홀딩 비.브이. |
비정질 탄소 중합체 막을 개질하는 방법
|
KR20200130121A
(ko)
|
2019-05-07 |
2020-11-18 |
에이에스엠 아이피 홀딩 비.브이. |
딥 튜브가 있는 화학물질 공급원 용기
|
KR20200130652A
(ko)
|
2019-05-10 |
2020-11-19 |
에이에스엠 아이피 홀딩 비.브이. |
표면 상에 재료를 증착하는 방법 및 본 방법에 따라 형성된 구조
|
JP2020188254A
(ja)
|
2019-05-16 |
2020-11-19 |
エーエスエム アイピー ホールディング ビー.ブイ. |
ウェハボートハンドリング装置、縦型バッチ炉および方法
|
JP2020188255A
(ja)
|
2019-05-16 |
2020-11-19 |
エーエスエム アイピー ホールディング ビー.ブイ. |
ウェハボートハンドリング装置、縦型バッチ炉および方法
|
USD947913S1
(en)
|
2019-05-17 |
2022-04-05 |
Asm Ip Holding B.V. |
Susceptor shaft
|
USD975665S1
(en)
|
2019-05-17 |
2023-01-17 |
Asm Ip Holding B.V. |
Susceptor shaft
|
USD935572S1
(en)
|
2019-05-24 |
2021-11-09 |
Asm Ip Holding B.V. |
Gas channel plate
|
USD922229S1
(en)
|
2019-06-05 |
2021-06-15 |
Asm Ip Holding B.V. |
Device for controlling a temperature of a gas supply unit
|
KR20200141003A
(ko)
|
2019-06-06 |
2020-12-17 |
에이에스엠 아이피 홀딩 비.브이. |
가스 감지기를 포함하는 기상 반응기 시스템
|
KR20200143254A
(ko)
|
2019-06-11 |
2020-12-23 |
에이에스엠 아이피 홀딩 비.브이. |
개질 가스를 사용하여 전자 구조를 형성하는 방법, 상기 방법을 수행하기 위한 시스템, 및 상기 방법을 사용하여 형성되는 구조
|
USD944946S1
(en)
|
2019-06-14 |
2022-03-01 |
Asm Ip Holding B.V. |
Shower plate
|
USD931978S1
(en)
|
2019-06-27 |
2021-09-28 |
Asm Ip Holding B.V. |
Showerhead vacuum transport
|
KR20210005515A
(ko)
|
2019-07-03 |
2021-01-14 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치용 온도 제어 조립체 및 이를 사용하는 방법
|
JP7499079B2
(ja)
|
2019-07-09 |
2024-06-13 |
エーエスエム・アイピー・ホールディング・ベー・フェー |
同軸導波管を用いたプラズマ装置、基板処理方法
|
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(zh)
|
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基板支撑组件及包括其的基板处理装置
|
KR20210010307A
(ko)
|
2019-07-16 |
2021-01-27 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치
|
KR20210010820A
(ko)
|
2019-07-17 |
2021-01-28 |
에이에스엠 아이피 홀딩 비.브이. |
실리콘 게르마늄 구조를 형성하는 방법
|
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(ko)
|
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2021-01-28 |
에이에스엠 아이피 홀딩 비.브이. |
라디칼 보조 점화 플라즈마 시스템 및 방법
|
US11643724B2
(en)
|
2019-07-18 |
2023-05-09 |
Asm Ip Holding B.V. |
Method of forming structures using a neutral beam
|
TWI839544B
(zh)
|
2019-07-19 |
2024-04-21 |
荷蘭商Asm Ip私人控股有限公司 |
形成形貌受控的非晶碳聚合物膜之方法
|
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(ko)
|
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2021-01-28 |
에이에스엠 아이피 홀딩 비.브이. |
토폴로지-제어된 비정질 탄소 중합체 막을 형성하는 방법
|
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(zh)
|
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Asm Ip私人控股有限公司 |
实现高掺杂剂掺入的选择性沉积方法
|
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(zh)
|
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2021-02-02 |
Asm Ip私人控股有限公司 |
基板处理设备
|
CN112309899A
(zh)
|
2019-07-30 |
2021-02-02 |
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基板处理设备
|
US11587814B2
(en)
|
2019-07-31 |
2023-02-21 |
Asm Ip Holding B.V. |
Vertical batch furnace assembly
|
US11227782B2
(en)
|
2019-07-31 |
2022-01-18 |
Asm Ip Holding B.V. |
Vertical batch furnace assembly
|
US11587815B2
(en)
|
2019-07-31 |
2023-02-21 |
Asm Ip Holding B.V. |
Vertical batch furnace assembly
|
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(zh)
|
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2024-08-02 |
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用于化学源容器的液位传感器
|
USD965524S1
(en)
|
2019-08-19 |
2022-10-04 |
Asm Ip Holding B.V. |
Susceptor support
|
USD965044S1
(en)
|
2019-08-19 |
2022-09-27 |
Asm Ip Holding B.V. |
Susceptor shaft
|
JP2021031769A
(ja)
|
2019-08-21 |
2021-03-01 |
エーエスエム アイピー ホールディング ビー.ブイ. |
成膜原料混合ガス生成装置及び成膜装置
|
USD979506S1
(en)
|
2019-08-22 |
2023-02-28 |
Asm Ip Holding B.V. |
Insulator
|
USD940837S1
(en)
|
2019-08-22 |
2022-01-11 |
Asm Ip Holding B.V. |
Electrode
|
KR20210024423A
(ko)
|
2019-08-22 |
2021-03-05 |
에이에스엠 아이피 홀딩 비.브이. |
홀을 구비한 구조체를 형성하기 위한 방법
|
USD930782S1
(en)
|
2019-08-22 |
2021-09-14 |
Asm Ip Holding B.V. |
Gas distributor
|
USD949319S1
(en)
|
2019-08-22 |
2022-04-19 |
Asm Ip Holding B.V. |
Exhaust duct
|
KR20210024420A
(ko)
|
2019-08-23 |
2021-03-05 |
에이에스엠 아이피 홀딩 비.브이. |
비스(디에틸아미노)실란을 사용하여 peald에 의해 개선된 품질을 갖는 실리콘 산화물 막을 증착하기 위한 방법
|
US11286558B2
(en)
|
2019-08-23 |
2022-03-29 |
Asm Ip Holding B.V. |
Methods for depositing a molybdenum nitride film on a surface of a substrate by a cyclical deposition process and related semiconductor device structures including a molybdenum nitride film
|
KR20210029090A
(ko)
|
2019-09-04 |
2021-03-15 |
에이에스엠 아이피 홀딩 비.브이. |
희생 캡핑 층을 이용한 선택적 증착 방법
|
KR20210029663A
(ko)
|
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2021-03-16 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치
|
US11976357B2
(en)
|
2019-09-09 |
2024-05-07 |
Applied Materials, Inc. |
Methods for forming a protective coating on processing chamber surfaces or components
|
US11562901B2
(en)
|
2019-09-25 |
2023-01-24 |
Asm Ip Holding B.V. |
Substrate processing method
|
CN112593212B
(zh)
|
2019-10-02 |
2023-12-22 |
Asm Ip私人控股有限公司 |
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|
TWI846953B
(zh)
|
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2024-07-01 |
荷蘭商Asm Ip私人控股有限公司 |
基板處理裝置
|
KR20210042810A
(ko)
|
2019-10-08 |
2021-04-20 |
에이에스엠 아이피 홀딩 비.브이. |
활성 종을 이용하기 위한 가스 분배 어셈블리를 포함한 반응기 시스템 및 이를 사용하는 방법
|
KR20210043460A
(ko)
|
2019-10-10 |
2021-04-21 |
에이에스엠 아이피 홀딩 비.브이. |
포토레지스트 하부층을 형성하기 위한 방법 및 이를 포함한 구조체
|
US12009241B2
(en)
|
2019-10-14 |
2024-06-11 |
Asm Ip Holding B.V. |
Vertical batch furnace assembly with detector to detect cassette
|
TWI834919B
(zh)
|
2019-10-16 |
2024-03-11 |
荷蘭商Asm Ip私人控股有限公司 |
氧化矽之拓撲選擇性膜形成之方法
|
US11637014B2
(en)
|
2019-10-17 |
2023-04-25 |
Asm Ip Holding B.V. |
Methods for selective deposition of doped semiconductor material
|
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(ko)
|
2019-10-21 |
2021-04-30 |
에이에스엠 아이피 홀딩 비.브이. |
막을 선택적으로 에칭하기 위한 장치 및 방법
|
KR20210050453A
(ko)
|
2019-10-25 |
2021-05-07 |
에이에스엠 아이피 홀딩 비.브이. |
기판 표면 상의 갭 피처를 충진하는 방법 및 이와 관련된 반도체 소자 구조
|
US11646205B2
(en)
|
2019-10-29 |
2023-05-09 |
Asm Ip Holding B.V. |
Methods of selectively forming n-type doped material on a surface, systems for selectively forming n-type doped material, and structures formed using same
|
KR20210054983A
(ko)
|
2019-11-05 |
2021-05-14 |
에이에스엠 아이피 홀딩 비.브이. |
도핑된 반도체 층을 갖는 구조체 및 이를 형성하기 위한 방법 및 시스템
|
US11501968B2
(en)
|
2019-11-15 |
2022-11-15 |
Asm Ip Holding B.V. |
Method for providing a semiconductor device with silicon filled gaps
|
KR20210062561A
(ko)
|
2019-11-20 |
2021-05-31 |
에이에스엠 아이피 홀딩 비.브이. |
기판의 표면 상에 탄소 함유 물질을 증착하는 방법, 상기 방법을 사용하여 형성된 구조물, 및 상기 구조물을 형성하기 위한 시스템
|
KR20210065848A
(ko)
|
2019-11-26 |
2021-06-04 |
에이에스엠 아이피 홀딩 비.브이. |
제1 유전체 표면과 제2 금속성 표면을 포함한 기판 상에 타겟 막을 선택적으로 형성하기 위한 방법
|
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(zh)
|
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2021-06-11 |
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|
CN112885692A
(zh)
|
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2021-06-01 |
Asm Ip私人控股有限公司 |
基板处理设备
|
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(zh)
|
2019-11-29 |
2021-06-01 |
Asm Ip私人控股有限公司 |
基板处理设备
|
JP7527928B2
(ja)
|
2019-12-02 |
2024-08-05 |
エーエスエム・アイピー・ホールディング・ベー・フェー |
基板処理装置、基板処理方法
|
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(ko)
|
2019-12-04 |
2021-06-15 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치
|
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(zh)
|
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2021-07-01 |
荷蘭商Asm Ip私人控股有限公司 |
形成氮化釩層之方法以及包括該氮化釩層之結構
|
US11527403B2
(en)
|
2019-12-19 |
2022-12-13 |
Asm Ip Holding B.V. |
Methods for filling a gap feature on a substrate surface and related semiconductor structures
|
KR20210089079A
(ko)
|
2020-01-06 |
2021-07-15 |
에이에스엠 아이피 홀딩 비.브이. |
채널형 리프트 핀
|
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(zh)
|
2020-01-06 |
2021-11-01 |
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氣體供應總成以及閥板總成
|
US11993847B2
(en)
|
2020-01-08 |
2024-05-28 |
Asm Ip Holding B.V. |
Injector
|
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(ko)
|
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2024-06-17 |
에이에스엠 아이피 홀딩 비.브이. |
박막 형성 방법 및 박막 표면 개질 방법
|
TW202130846A
(zh)
|
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2021-08-16 |
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形成包括釩或銦層的結構之方法
|
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(zh)
|
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|
US11776846B2
(en)
|
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2023-10-03 |
Asm Ip Holding B.V. |
Methods for depositing gap filling fluids and related systems and devices
|
US11781243B2
(en)
|
2020-02-17 |
2023-10-10 |
Asm Ip Holding B.V. |
Method for depositing low temperature phosphorous-doped silicon
|
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(zh)
|
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2022-01-16 |
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專用於零件清潔的系統
|
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(ko)
|
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2021-09-27 |
에이에스엠 아이피 홀딩 비.브이. |
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|
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(ko)
|
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2021-09-27 |
에이에스엠 아이피 홀딩 비.브이. |
록아웃 태그아웃 어셈블리 및 시스템 그리고 이의 사용 방법
|
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(zh)
|
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2021-09-14 |
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|
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(ko)
|
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2021-10-14 |
에이에스엠 아이피 홀딩 비.브이. |
박막 형성 방법
|
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(zh)
|
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2021-12-16 |
荷蘭商Asm Ip控股公司 |
阻障層形成方法及半導體裝置的製造方法
|
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(zh)
|
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2021-12-01 |
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用於選擇性蝕刻氧化矽膜之設備及方法
|
US11821078B2
(en)
|
2020-04-15 |
2023-11-21 |
Asm Ip Holding B.V. |
Method for forming precoat film and method for forming silicon-containing film
|
KR20210128343A
(ko)
|
2020-04-15 |
2021-10-26 |
에이에스엠 아이피 홀딩 비.브이. |
크롬 나이트라이드 층을 형성하는 방법 및 크롬 나이트라이드 층을 포함하는 구조
|
US11996289B2
(en)
|
2020-04-16 |
2024-05-28 |
Asm Ip Holding B.V. |
Methods of forming structures including silicon germanium and silicon layers, devices formed using the methods, and systems for performing the methods
|
KR20210132600A
(ko)
|
2020-04-24 |
2021-11-04 |
에이에스엠 아이피 홀딩 비.브이. |
바나듐, 질소 및 추가 원소를 포함한 층을 증착하기 위한 방법 및 시스템
|
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(zh)
|
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2021-12-16 |
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垂直批式熔爐總成、及用於冷卻垂直批式熔爐之方法
|
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(ja)
|
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2021-11-01 |
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|
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(ko)
|
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2021-11-09 |
에이에스엠 아이피 홀딩 비.브이. |
고체 소스 전구체 용기
|
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(ko)
|
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2021-11-11 |
에이에스엠 아이피 홀딩 비.브이. |
Foup 핸들러를 이용한 foup의 빠른 교환
|
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(zh)
|
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荷蘭商Asm Ip私人控股有限公司 |
半導體處理系統
|
KR20210141379A
(ko)
|
2020-05-13 |
2021-11-23 |
에이에스엠 아이피 홀딩 비.브이. |
반응기 시스템용 레이저 정렬 고정구
|
TW202146699A
(zh)
|
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2021-12-16 |
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形成矽鍺層之方法、半導體結構、半導體裝置、形成沉積層之方法、及沉積系統
|
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(ko)
|
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2021-11-29 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치
|
KR20210145078A
(ko)
|
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2021-12-01 |
에이에스엠 아이피 홀딩 비.브이. |
다수의 탄소 층을 포함한 구조체 및 이를 형성하고 사용하는 방법
|
KR102702526B1
(ko)
|
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2024-09-03 |
에이에스엠 아이피 홀딩 비.브이. |
과산화수소를 사용하여 박막을 증착하기 위한 장치
|
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(zh)
|
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2022-01-01 |
荷蘭商Asm Ip私人控股有限公司 |
基板處理方法
|
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(zh)
|
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2022-04-01 |
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處理基板之設備、形成膜之方法、及控制用於處理基板之設備之方法
|
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(zh)
|
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2022-05-01 |
荷蘭商Asm Ip私人控股有限公司 |
形成含矽層之方法
|
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(zh)
|
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2022-05-01 |
荷蘭商Asm Ip私人控股有限公司 |
基板處理方法
|
KR102707957B1
(ko)
|
2020-07-08 |
2024-09-19 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 방법
|
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(zh)
|
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2022-05-16 |
荷蘭商Asm Ip私人控股有限公司 |
用於光微影之結構與方法
|
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(zh)
|
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2022-02-01 |
荷蘭商Asm Ip私人控股有限公司 |
用於沉積鉬層之方法及系統
|
US12040177B2
(en)
|
2020-08-18 |
2024-07-16 |
Asm Ip Holding B.V. |
Methods for forming a laminate film by cyclical plasma-enhanced deposition processes
|
KR20220027026A
(ko)
|
2020-08-26 |
2022-03-07 |
에이에스엠 아이피 홀딩 비.브이. |
금속 실리콘 산화물 및 금속 실리콘 산질화물 층을 형성하기 위한 방법 및 시스템
|
TW202229601A
(zh)
|
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2022-08-01 |
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形成圖案化結構的方法、操控機械特性的方法、裝置結構、及基板處理系統
|
USD990534S1
(en)
|
2020-09-11 |
2023-06-27 |
Asm Ip Holding B.V. |
Weighted lift pin
|
USD1012873S1
(en)
|
2020-09-24 |
2024-01-30 |
Asm Ip Holding B.V. |
Electrode for semiconductor processing apparatus
|
US12009224B2
(en)
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