DE69319360T2 - Heteroübergang-Bipolartransistor mit Siliziumkarbid - Google Patents
Heteroübergang-Bipolartransistor mit SiliziumkarbidInfo
- Publication number
- DE69319360T2 DE69319360T2 DE69319360T DE69319360T DE69319360T2 DE 69319360 T2 DE69319360 T2 DE 69319360T2 DE 69319360 T DE69319360 T DE 69319360T DE 69319360 T DE69319360 T DE 69319360T DE 69319360 T2 DE69319360 T2 DE 69319360T2
- Authority
- DE
- Germany
- Prior art keywords
- silicon carbide
- bipolar transistor
- heterojunction bipolar
- heterojunction
- transistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 title 1
- 229910010271 silicon carbide Inorganic materials 0.000 title 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66015—Multistep manufacturing processes of devices having a semiconductor body comprising semiconducting carbon, e.g. diamond, diamond-like carbon, graphene
- H01L29/66037—Multistep manufacturing processes of devices having a semiconductor body comprising semiconducting carbon, e.g. diamond, diamond-like carbon, graphene the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02373—Group 14 semiconducting materials
- H01L21/02376—Carbon, e.g. diamond-like carbon
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02373—Group 14 semiconducting materials
- H01L21/02378—Silicon carbide
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02441—Group 14 semiconducting materials
- H01L21/02447—Silicon carbide
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02524—Group 14 semiconducting materials
- H01L21/02529—Silicon carbide
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
- H01L21/0254—Nitrides
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
- H01L21/02543—Phosphides
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/0257—Doping during depositing
- H01L21/02573—Conductivity type
- H01L21/02576—N-type
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/0257—Doping during depositing
- H01L21/02573—Conductivity type
- H01L21/02579—P-type
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02636—Selective deposition, e.g. simultaneous growth of mono- and non-monocrystalline semiconductor materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/26—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, elements provided for in two or more of the groups H01L29/16, H01L29/18, H01L29/20, H01L29/22, H01L29/24, e.g. alloys
- H01L29/267—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, elements provided for in two or more of the groups H01L29/16, H01L29/18, H01L29/20, H01L29/22, H01L29/24, e.g. alloys in different semiconductor regions, e.g. heterojunctions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66053—Multistep manufacturing processes of devices having a semiconductor body comprising crystalline silicon carbide
- H01L29/66068—Multistep manufacturing processes of devices having a semiconductor body comprising crystalline silicon carbide the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/73—Bipolar junction transistors
- H01L29/737—Hetero-junction transistors
- H01L29/7371—Vertical transistors
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/931—Silicon carbide semiconductor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/932—Boron nitride semiconductor
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6610792A JPH05275440A (ja) | 1992-03-24 | 1992-03-24 | 半導体装置及びその製造方法 |
JP06610892A JP3339508B2 (ja) | 1992-03-24 | 1992-03-24 | 半導体装置 |
JP8726092A JPH05291277A (ja) | 1992-04-08 | 1992-04-08 | 半導体装置及びその製造方法 |
JP8726892A JPH05291278A (ja) | 1992-04-08 | 1992-04-08 | 半導体装置及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69319360D1 DE69319360D1 (de) | 1998-08-06 |
DE69319360T2 true DE69319360T2 (de) | 1998-12-17 |
Family
ID=27464669
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69319360T Expired - Fee Related DE69319360T2 (de) | 1992-03-24 | 1993-03-23 | Heteroübergang-Bipolartransistor mit Siliziumkarbid |
Country Status (4)
Country | Link |
---|---|
US (2) | US5536952A (de) |
EP (1) | EP0562549B1 (de) |
CA (1) | CA2092215A1 (de) |
DE (1) | DE69319360T2 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7315050B2 (en) | 2001-05-28 | 2008-01-01 | Showa Denko K.K. | Semiconductor device, semiconductor layer and production method thereof |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA2092215A1 (en) * | 1992-03-24 | 1993-09-25 | Shinichi Shikata | Semiconductor device |
DE4440072C1 (de) * | 1994-11-10 | 1996-02-22 | Inst Halbleiterphysik Gmbh | Verfahren zur Herstellung einer vergrabenen monokristallinen Siliziumcarbidschicht |
DE19533313A1 (de) * | 1995-09-08 | 1997-03-13 | Max Planck Gesellschaft | Halbleiterstruktur für einen Transistor |
US5939738A (en) * | 1995-10-25 | 1999-08-17 | Texas Instruments Incorporated | Low base-resistance bipolar transistor |
US5847414A (en) * | 1995-10-30 | 1998-12-08 | Abb Research Limited | Semiconductor device having a hetero-junction between SiC and a Group 3B-nitride |
US5859447A (en) * | 1997-05-09 | 1999-01-12 | Yang; Edward S. | Heterojunction bipolar transistor having heterostructure ballasting emitter |
SE9801881D0 (sv) * | 1998-05-28 | 1998-05-28 | Asea Brown Boveri | A switching device |
SE9804135L (sv) | 1998-11-30 | 2000-05-31 | Abb Ab | Fotokonduktiv omkopplare |
JP2000277622A (ja) * | 1999-01-18 | 2000-10-06 | Sony Corp | 半導体装置およびその製造方法 |
SE9901410D0 (sv) * | 1999-04-21 | 1999-04-21 | Abb Research Ltd | Abipolar transistor |
US6573565B2 (en) * | 1999-07-28 | 2003-06-03 | International Business Machines Corporation | Method and structure for providing improved thermal conduction for silicon semiconductor devices |
DE10005405A1 (de) * | 2000-02-04 | 2001-08-09 | Inst Halbleiterphysik Gmbh | Schichtstapel für pnp-Heterobipolar-Transistor |
DE10104776A1 (de) * | 2001-02-02 | 2002-08-22 | Infineon Technologies Ag | Bipolartransistor und Verfahren zu dessen Herstellung |
US7132701B1 (en) * | 2001-07-27 | 2006-11-07 | Fairchild Semiconductor Corporation | Contact method for thin silicon carbide epitaxial layer and semiconductor devices formed by those methods |
CN106784125A (zh) * | 2016-12-08 | 2017-05-31 | 西安电子科技大学 | Ga2O3/SiC异质结光电PNP晶体管及其制备方法 |
WO2018103645A1 (zh) * | 2016-12-08 | 2018-06-14 | 西安电子科技大学 | Ga2O3/SiC异质结NPN/PNP光电晶体管的制备方法 |
CN109244179A (zh) * | 2018-08-10 | 2019-01-18 | 西安电子科技大学 | 基于金刚石/SiC异质结构的光电NPN晶体管及其制备方法 |
CN113140620B (zh) * | 2021-04-13 | 2022-12-02 | 西安电子科技大学 | 宽禁带半导体BPN/GaN异质结材料及外延生长方法 |
Family Cites Families (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4097888A (en) * | 1975-10-15 | 1978-06-27 | Signetics Corporation | High density collector-up structure |
US4529996A (en) * | 1983-04-14 | 1985-07-16 | Allied Coporation | Indium phosphide-boron phosphide heterojunction bipolar transistor |
JPS62159463A (ja) * | 1986-01-08 | 1987-07-15 | Fujitsu Ltd | 半導体装置の製造方法 |
JPS62160760A (ja) * | 1986-01-10 | 1987-07-16 | Fujitsu Ltd | 半導体装置の製造方法 |
JPH0770540B2 (ja) * | 1986-03-18 | 1995-07-31 | 富士通株式会社 | ヘテロ接合バイポ−ラトランジスタ |
JPS62265762A (ja) * | 1986-05-14 | 1987-11-18 | Fujitsu Ltd | 半導体装置 |
US4863529A (en) * | 1987-03-12 | 1989-09-05 | Sumitomo Electric Industries, Ltd. | Thin film single crystal diamond substrate |
JP2519740B2 (ja) * | 1987-08-26 | 1996-07-31 | 住友電気工業株式会社 | ヘテロ接合トランジスタ及びその製造法 |
US4945394A (en) * | 1987-10-26 | 1990-07-31 | North Carolina State University | Bipolar junction transistor on silicon carbide |
JPH01143261A (ja) * | 1987-11-27 | 1989-06-05 | Nec Corp | 半導体装置 |
US5179070A (en) * | 1988-04-30 | 1993-01-12 | Sumitomo Electric Industries, Ltd. | Semiconductor substrate having a superconducting thin film with a buffer layer in between |
US5006914A (en) * | 1988-12-02 | 1991-04-09 | Advanced Technology Materials, Inc. | Single crystal semiconductor substrate articles and semiconductor devices comprising same |
JPH02192494A (ja) * | 1989-01-20 | 1990-07-30 | Sumitomo Electric Ind Ltd | 複合材料 |
JP2860138B2 (ja) * | 1989-03-29 | 1999-02-24 | キヤノン株式会社 | 半導体装置およびこれを用いた光電変換装置 |
US4985742A (en) * | 1989-07-07 | 1991-01-15 | University Of Colorado Foundation, Inc. | High temperature semiconductor devices having at least one gallium nitride layer |
JPH0397275A (ja) * | 1989-09-09 | 1991-04-23 | Katsunobu Maeda | 炭化硅素の青色発光ダイオード素子 |
EP0420188A1 (de) * | 1989-09-27 | 1991-04-03 | Sumitomo Electric Industries, Ltd. | Halbleitende Heteroübergangsstruktur |
US5164810A (en) * | 1989-12-06 | 1992-11-17 | General Motors Corporation | Cubic boron nitride bipolar transistor |
JP2730271B2 (ja) * | 1990-03-07 | 1998-03-25 | 住友電気工業株式会社 | 半導体装置 |
US5043773A (en) * | 1990-06-04 | 1991-08-27 | Advanced Technology Materials, Inc. | Wafer base for silicon carbide semiconductor devices, incorporating alloy substrates |
US5266819A (en) * | 1991-05-13 | 1993-11-30 | Rockwell International Corporation | Self-aligned gallium arsenide/aluminum gallium arsenide collector-up heterojunction bipolar transistors capable of microwave applications and method |
JP3214868B2 (ja) * | 1991-07-19 | 2001-10-02 | ローム株式会社 | ヘテロ接合バイポーラトランジスタの製造方法 |
JP3150376B2 (ja) * | 1991-09-30 | 2001-03-26 | ローム株式会社 | ヘテロ接合バイポーラトランジスタの製法 |
US5378921A (en) * | 1991-10-21 | 1995-01-03 | Rohm Co., Ltd. | Heterojunction multicollector transistor |
EP0562272A3 (en) * | 1992-03-23 | 1994-05-25 | Texas Instruments Inc | Microwave heterojunction bipolar transistors with emitters designed for high power applications and method for fabricating same |
CA2092215A1 (en) * | 1992-03-24 | 1993-09-25 | Shinichi Shikata | Semiconductor device |
US5326992A (en) * | 1992-07-29 | 1994-07-05 | The United States Of America As Represented By The Secretary Of The Navy | Silicon carbide and SiCAlN heterojunction bipolar transistor structures |
US5272096A (en) * | 1992-09-29 | 1993-12-21 | Motorola, Inc. | Method for making a bipolar transistor having a silicon carbide layer |
US5285089A (en) * | 1992-12-02 | 1994-02-08 | Kobe Steel U.S.A., Inc. | Diamond and silicon carbide heterojunction bipolar transistor |
US5442199A (en) * | 1993-05-14 | 1995-08-15 | Kobe Steel Usa, Inc. | Diamond hetero-junction rectifying element |
-
1993
- 1993-03-23 CA CA002092215A patent/CA2092215A1/en not_active Abandoned
- 1993-03-23 EP EP93104757A patent/EP0562549B1/de not_active Expired - Lifetime
- 1993-03-23 DE DE69319360T patent/DE69319360T2/de not_active Expired - Fee Related
-
1994
- 1994-07-26 US US08/280,805 patent/US5536952A/en not_active Expired - Fee Related
-
1995
- 1995-04-06 US US08/417,781 patent/US5624853A/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7315050B2 (en) | 2001-05-28 | 2008-01-01 | Showa Denko K.K. | Semiconductor device, semiconductor layer and production method thereof |
US7622398B2 (en) | 2001-05-28 | 2009-11-24 | Showa Denko K.K. | Semiconductor device, semiconductor layer and production method thereof |
Also Published As
Publication number | Publication date |
---|---|
EP0562549B1 (de) | 1998-07-01 |
US5624853A (en) | 1997-04-29 |
EP0562549A3 (en) | 1994-09-07 |
EP0562549A2 (de) | 1993-09-29 |
US5536952A (en) | 1996-07-16 |
DE69319360D1 (de) | 1998-08-06 |
CA2092215A1 (en) | 1993-09-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |