DE60329886D1 - Substrat-Behandlungsvorrichtung - Google Patents

Substrat-Behandlungsvorrichtung

Info

Publication number
DE60329886D1
DE60329886D1 DE60329886T DE60329886T DE60329886D1 DE 60329886 D1 DE60329886 D1 DE 60329886D1 DE 60329886 T DE60329886 T DE 60329886T DE 60329886 T DE60329886 T DE 60329886T DE 60329886 D1 DE60329886 D1 DE 60329886D1
Authority
DE
Germany
Prior art keywords
block
treating apparatus
main transport
substrates
substrate treating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60329886T
Other languages
English (en)
Inventor
Yoshiteru Fukutomi
Kenji Sugimoto
Takashi Ito
Takeo Okamoto
Yukihiko Inagaki
Katsushi Yoshioka
Tsuyoshi Mitsuhashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dainippon Screen Manufacturing Co Ltd
Original Assignee
Dainippon Screen Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Manufacturing Co Ltd filed Critical Dainippon Screen Manufacturing Co Ltd
Application granted granted Critical
Publication of DE60329886D1 publication Critical patent/DE60329886D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/67225—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one lithography chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
DE60329886T 2002-05-01 2003-04-11 Substrat-Behandlungsvorrichtung Expired - Lifetime DE60329886D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002129817A JP4342147B2 (ja) 2002-05-01 2002-05-01 基板処理装置

Publications (1)

Publication Number Publication Date
DE60329886D1 true DE60329886D1 (de) 2009-12-17

Family

ID=29243953

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60329886T Expired - Lifetime DE60329886D1 (de) 2002-05-01 2003-04-11 Substrat-Behandlungsvorrichtung

Country Status (7)

Country Link
US (1) US6893171B2 (de)
EP (1) EP1361600B1 (de)
JP (1) JP4342147B2 (de)
KR (1) KR100564780B1 (de)
CN (2) CN100413019C (de)
AT (1) ATE447764T1 (de)
DE (1) DE60329886D1 (de)

Families Citing this family (109)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004342654A (ja) 2003-05-13 2004-12-02 Dainippon Screen Mfg Co Ltd 基板処理装置
JP4279102B2 (ja) * 2003-09-22 2009-06-17 大日本スクリーン製造株式会社 基板処理装置及び基板処理方法
JP4381121B2 (ja) 2003-12-11 2009-12-09 大日本スクリーン製造株式会社 基板処理装置
JP4490779B2 (ja) * 2004-10-04 2010-06-30 大日本スクリーン製造株式会社 基板処理装置
JP2006310724A (ja) 2004-11-10 2006-11-09 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP4463081B2 (ja) 2004-11-10 2010-05-12 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP5008280B2 (ja) * 2004-11-10 2012-08-22 株式会社Ｓｏｋｕｄｏ 基板処理装置および基板処理方法
JP5154008B2 (ja) * 2004-11-10 2013-02-27 株式会社Ｓｏｋｕｄｏ 基板処理装置および基板処理方法
JP4381285B2 (ja) 2004-11-11 2009-12-09 株式会社Ｓｏｋｕｄｏ 基板処理装置および基板処理方法
JP4926433B2 (ja) 2004-12-06 2012-05-09 株式会社Ｓｏｋｕｄｏ 基板処理装置および基板処理方法
JP5154007B2 (ja) * 2004-12-06 2013-02-27 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5154006B2 (ja) * 2004-12-06 2013-02-27 株式会社Ｓｏｋｕｄｏ 基板処理装置
CN100424815C (zh) * 2004-12-06 2008-10-08 株式会社迅动 基板处理装置及基板处理方法
JP5008268B2 (ja) 2004-12-06 2012-08-22 株式会社Ｓｏｋｕｄｏ 基板処理装置および基板処理方法
JP4794232B2 (ja) * 2004-12-06 2011-10-19 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP4490801B2 (ja) * 2004-12-16 2010-06-30 大日本スクリーン製造株式会社 基板処理装置
US7798764B2 (en) 2005-12-22 2010-09-21 Applied Materials, Inc. Substrate processing sequence in a cartesian robot cluster tool
US7255747B2 (en) 2004-12-22 2007-08-14 Sokudo Co., Ltd. Coat/develop module with independent stations
US7819079B2 (en) 2004-12-22 2010-10-26 Applied Materials, Inc. Cartesian cluster tool configuration for lithography type processes
US7651306B2 (en) 2004-12-22 2010-01-26 Applied Materials, Inc. Cartesian robot cluster tool architecture
US7699021B2 (en) 2004-12-22 2010-04-20 Sokudo Co., Ltd. Cluster tool substrate throughput optimization
JP4401285B2 (ja) * 2004-12-24 2010-01-20 大日本スクリーン製造株式会社 基板処理装置
US7245348B2 (en) * 2005-01-21 2007-07-17 Tokyo Electron Limited Coating and developing system and coating and developing method with antireflection film and an auxiliary block for inspection and cleaning
JP4459831B2 (ja) 2005-02-01 2010-04-28 東京エレクトロン株式会社 塗布、現像装置
JP4515331B2 (ja) * 2005-05-30 2010-07-28 東京エレクトロン株式会社 基板の処理システム
JP4716362B2 (ja) * 2005-06-07 2011-07-06 東京エレクトロン株式会社 基板処理システム及び基板処理方法
JP4514657B2 (ja) * 2005-06-24 2010-07-28 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP4522329B2 (ja) 2005-06-24 2010-08-11 株式会社Ｓｏｋｕｄｏ 基板処理装置
US7766565B2 (en) 2005-07-01 2010-08-03 Sokudo Co., Ltd. Substrate drying apparatus, substrate cleaning apparatus and substrate processing system
JP4753641B2 (ja) * 2005-07-01 2011-08-24 株式会社Ｓｏｋｕｄｏ 基板処理システム
JP4937559B2 (ja) * 2005-09-14 2012-05-23 株式会社Ｓｏｋｕｄｏ 基板処理装置および基板処理方法
JP4761907B2 (ja) * 2005-09-28 2011-08-31 株式会社Ｓｏｋｕｄｏ 基板処理装置
KR100775696B1 (ko) * 2005-09-27 2007-11-09 다이닛뽕스크린 세이조오 가부시키가이샤 기판처리장치 및 기판반송방법
JP4667252B2 (ja) 2006-01-16 2011-04-06 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP2007201078A (ja) 2006-01-25 2007-08-09 Sokudo:Kk 基板処理装置
JP4771816B2 (ja) 2006-01-27 2011-09-14 大日本スクリーン製造株式会社 基板処理装置
JP5132108B2 (ja) * 2006-02-02 2013-01-30 株式会社Ｓｏｋｕｄｏ 基板処理装置
TWI274034B (en) * 2006-03-15 2007-02-21 Mjc Probe Inc Multi-directional gripping apparatus
JP4832201B2 (ja) 2006-07-24 2011-12-07 大日本スクリーン製造株式会社 基板処理装置
JP2008060302A (ja) * 2006-08-31 2008-03-13 Sokudo:Kk 基板処理装置
JP4726776B2 (ja) * 2006-12-27 2011-07-20 大日本スクリーン製造株式会社 反転装置およびそれを備えた基板処理装置
JP4744426B2 (ja) 2006-12-27 2011-08-10 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
US7694688B2 (en) 2007-01-05 2010-04-13 Applied Materials, Inc. Wet clean system design
US7950407B2 (en) * 2007-02-07 2011-05-31 Applied Materials, Inc. Apparatus for rapid filling of a processing volume
JP2008198879A (ja) * 2007-02-15 2008-08-28 Sokudo:Kk 基板処理装置
JP5004612B2 (ja) * 2007-02-15 2012-08-22 大日本スクリーン製造株式会社 基板処理装置
JP5004611B2 (ja) 2007-02-15 2012-08-22 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5149513B2 (ja) 2007-02-15 2013-02-20 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP4949064B2 (ja) * 2007-02-15 2012-06-06 株式会社Ｓｏｋｕｄｏ 基板処理装置
US9050634B2 (en) 2007-02-15 2015-06-09 SCREEN Holdings Co., Ltd. Substrate processing apparatus
JP5064069B2 (ja) * 2007-03-20 2012-10-31 株式会社Ｓｏｋｕｄｏ 基板搬送装置および熱処理装置
JP4908304B2 (ja) * 2007-04-27 2012-04-04 東京エレクトロン株式会社 基板の処理方法、基板の処理システム及びコンピュータ読み取り可能な記憶媒体
US20080292433A1 (en) * 2007-05-11 2008-11-27 Bachrach Robert Z Batch equipment robots and methods of array to array work-piece transfer for photovoltaic factory
US20080279672A1 (en) * 2007-05-11 2008-11-13 Bachrach Robert Z Batch equipment robots and methods of stack to array work-piece transfer for photovoltaic factory
US20080279658A1 (en) * 2007-05-11 2008-11-13 Bachrach Robert Z Batch equipment robots and methods within equipment work-piece transfer for photovoltaic factory
JP5006122B2 (ja) 2007-06-29 2012-08-22 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP4979079B2 (ja) * 2007-07-09 2012-07-18 東京エレクトロン株式会社 基板処理装置
JP5039468B2 (ja) 2007-07-26 2012-10-03 株式会社Ｓｏｋｕｄｏ 基板洗浄装置およびそれを備えた基板処理装置
US7641406B2 (en) 2007-07-26 2010-01-05 Sokudo Co., Ltd. Bevel inspection apparatus for substrate processing
JP5148944B2 (ja) 2007-08-14 2013-02-20 大日本スクリーン製造株式会社 基板処理システム
JP5166802B2 (ja) 2007-09-13 2013-03-21 株式会社Ｓｏｋｕｄｏ 基板処理装置および基板処理方法
JP5192206B2 (ja) 2007-09-13 2013-05-08 株式会社Ｓｏｋｕｄｏ 基板処理装置および基板処理方法
JP4473343B2 (ja) * 2007-11-09 2010-06-02 キヤノンアネルバ株式会社 インライン型ウェハ搬送装置
JP5015729B2 (ja) * 2007-11-13 2012-08-29 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP2009135169A (ja) * 2007-11-29 2009-06-18 Tokyo Electron Ltd 基板処理システムおよび基板処理方法
JP5128918B2 (ja) * 2007-11-30 2013-01-23 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5318403B2 (ja) * 2007-11-30 2013-10-16 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5160204B2 (ja) * 2007-11-30 2013-03-13 株式会社Ｓｏｋｕｄｏ 基板処理装置
KR100892756B1 (ko) * 2007-12-27 2009-04-15 세메스 주식회사 기판 처리 장치 및 이를 이용한 기판 이송 방법
JP5179170B2 (ja) 2007-12-28 2013-04-10 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5001828B2 (ja) * 2007-12-28 2012-08-15 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5107122B2 (ja) * 2008-04-03 2012-12-26 大日本スクリーン製造株式会社 基板処理装置
JP5430873B2 (ja) * 2008-04-16 2014-03-05 株式会社Ｓｏｋｕｄｏ 基板洗浄装置およびそれを備えた基板処理装置
JP5280141B2 (ja) * 2008-09-30 2013-09-04 株式会社Ｓｏｋｕｄｏ 基板処理装置
KR101100833B1 (ko) 2008-11-25 2012-01-02 세메스 주식회사 기판처리장치 및 기판처리방법
US8941809B2 (en) 2008-12-22 2015-01-27 Screen Semiconductor Solutions Co., Ltd. Substrate processing apparatus and substrate processing method
JP5237082B2 (ja) * 2008-12-24 2013-07-17 株式会社Ｓｏｋｕｄｏ 基板処理装置
CN101794710B (zh) 2009-01-30 2012-10-03 细美事有限公司 用于处理基板的系统及方法
JP2010177673A (ja) * 2009-01-30 2010-08-12 Semes Co Ltd 基板処理設備及び基板処理方法
JP5462506B2 (ja) 2009-03-18 2014-04-02 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5410212B2 (ja) 2009-09-15 2014-02-05 株式会社Ｓｏｋｕｄｏ 基板処理装置、基板処理システムおよび検査周辺露光装置
JP5381592B2 (ja) * 2009-10-06 2014-01-08 東京エレクトロン株式会社 基板処理装置
JP4906140B2 (ja) * 2010-03-29 2012-03-28 東京エレクトロン株式会社 基板処理システム
JP4906141B2 (ja) * 2010-03-29 2012-03-28 東京エレクトロン株式会社 基板処理システム
CN102064095A (zh) * 2010-12-03 2011-05-18 孙丽杰 半导体基板加工设备
CN102354665B (zh) * 2011-09-28 2016-03-02 上海华虹宏力半导体制造有限公司 内置光刻胶检测单元的退火装置、光刻胶的检测方法
JP5841389B2 (ja) 2011-09-29 2016-01-13 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 基板処理装置および基板処理方法
JP5608148B2 (ja) * 2011-11-25 2014-10-15 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 基板処理装置
US9196515B2 (en) 2012-03-26 2015-11-24 Taiwan Semiconductor Manufacturing Co., Ltd. Litho cluster and modulization to enhance productivity
US8903532B2 (en) * 2012-03-26 2014-12-02 Taiwan Semiconductor Manufacturing Co., Ltd. Litho cluster and modulization to enhance productivity
JP5890255B2 (ja) 2012-04-02 2016-03-22 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 露光装置、基板処理装置、基板の露光方法および基板処理方法
JP2013247197A (ja) * 2012-05-24 2013-12-09 Sokudo Co Ltd 基板処理装置
JP6239813B2 (ja) 2012-07-18 2017-11-29 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 基板処理装置および基板処理方法
JP6001961B2 (ja) 2012-08-29 2016-10-05 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 基板処理装置および基板処理方法
JP6049367B2 (ja) 2012-09-13 2016-12-21 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 基板処理装置および基板処理システム
JP5442890B2 (ja) * 2013-05-17 2014-03-12 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5442889B2 (ja) * 2013-05-17 2014-03-12 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5977728B2 (ja) * 2013-11-14 2016-08-24 東京エレクトロン株式会社 基板処理システム
JP5852219B2 (ja) * 2014-12-24 2016-02-03 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 基板処理方法および基板処理装置
JP6548513B2 (ja) * 2015-08-21 2019-07-24 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6503280B2 (ja) * 2015-11-12 2019-04-17 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6195601B2 (ja) * 2015-12-03 2017-09-13 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 基板処理方法および基板処理装置
JP6870944B2 (ja) 2016-09-26 2021-05-12 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6557647B2 (ja) * 2016-11-22 2019-08-07 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 基板処理装置
JP6860365B2 (ja) * 2017-01-31 2021-04-14 キヤノン株式会社 基板処理装置、基板処理システム、基板処理方法、物品製造方法、およびプログラム
JP7358044B2 (ja) * 2018-02-09 2023-10-10 東京エレクトロン株式会社 基板処理装置
CN111063645A (zh) * 2019-12-31 2020-04-24 昆山晟丰精密机械有限公司 半导体基板自动收放料系统及方法
CN111421545B (zh) * 2020-04-08 2022-08-09 广东工业大学 一种液晶屏机器人搬运系统及其搬运方法
CN114367447A (zh) * 2020-10-16 2022-04-19 深圳顺丰泰森控股(集团)有限公司 物流系统

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3043094B2 (ja) 1991-04-02 2000-05-22 大日本スクリーン製造株式会社 フォトレジスト処理装置
EP0634699A1 (de) * 1993-07-16 1995-01-18 Semiconductor Systems, Inc. Gruppiertes fotolithografisches System
JPH07171478A (ja) 1993-12-20 1995-07-11 Dainippon Screen Mfg Co Ltd 基板処理装置
JP3196917B2 (ja) * 1994-06-17 2001-08-06 大日本スクリーン製造株式会社 基板処理装置
JP3779393B2 (ja) * 1996-09-06 2006-05-24 東京エレクトロン株式会社 処理システム
US6099643A (en) * 1996-12-26 2000-08-08 Dainippon Screen Mfg. Co., Ltd. Apparatus for processing a substrate providing an efficient arrangement and atmospheric isolation of chemical treatment section
JP3445757B2 (ja) * 1999-05-06 2003-09-08 東京エレクトロン株式会社 基板処理装置及び基板処理方法
US6402400B1 (en) * 1999-10-06 2002-06-11 Tokyo Electron Limited Substrate processing apparatus

Also Published As

Publication number Publication date
JP4342147B2 (ja) 2009-10-14
US20030213431A1 (en) 2003-11-20
CN1266738C (zh) 2006-07-26
CN1734713A (zh) 2006-02-15
ATE447764T1 (de) 2009-11-15
JP2003324139A (ja) 2003-11-14
KR100564780B1 (ko) 2006-03-27
KR20030086900A (ko) 2003-11-12
EP1361600A3 (de) 2006-10-25
CN100413019C (zh) 2008-08-20
EP1361600B1 (de) 2009-11-04
US6893171B2 (en) 2005-05-17
EP1361600A2 (de) 2003-11-12
CN1455438A (zh) 2003-11-12

Similar Documents

Publication Publication Date Title
DE60329886D1 (de) Substrat-Behandlungsvorrichtung
TW200625394A (en) Substrate processing apparatus and substrate processing method
TW200707113A (en) Substrate processing apparatus
TW200735251A (en) Substrate transportation processing apparatus and method of trouble measures of substrate transportation processing apparatus and computer readable medium encoded with a program for trouble measures of substrate transportation processing apparatus
TW200709276A (en) A system and method for lithography in semiconductor manufacturing
WO2008031031A3 (en) Cartesian cluster tool configuration for lithography type processes
TW200616101A (en) Method for manufacturing semiconductor device
TW200638098A (en) Treatment system
TWI233628B (en) Coating and developing system
TW200632127A (en) Shadow frame with mask panels
MA27803A1 (fr) Procede et dispositif de traitement d'une couche de materiau en vrac
KR960030309A (ko) 레지스트처리장치 및 레지스트처리방법
WO2008120785A1 (ja) 露光装置及び露光方法
TW200715065A (en) Exposure apparatus and exposure method, and method of manufacturing electrical wiring board
TW200508128A (en) Transporting apparatus
TW200628998A (en) Lithographic apparatus and device manufacturing method
DK0820359T3 (da) Fremgangsmåde og apparat til behandling af kredsløbsplade
ATE424997T1 (de) Wässriger entwickler für lithographische druckplatten
TW200638462A (en) System and method for manufacturing a mask for semiconductor processing
WO2005022602A3 (en) A method and apparatus for semiconductor processing
JP6049367B2 (ja) 基板処理装置および基板処理システム
TW200722935A (en) Exposure apparatus, exposure method, projection optical system and device manufacturing method
JP2001118904A5 (de)
TW200618055A (en) Pattern control system
TW200729287A (en) Method of manufacturing semiconductor device

Legal Events

Date Code Title Description
8364 No opposition during term of opposition