CN1402319A - 集成电路芯片安装结构以及显示设备 - Google Patents
集成电路芯片安装结构以及显示设备 Download PDFInfo
- Publication number
- CN1402319A CN1402319A CN02127168A CN02127168A CN1402319A CN 1402319 A CN1402319 A CN 1402319A CN 02127168 A CN02127168 A CN 02127168A CN 02127168 A CN02127168 A CN 02127168A CN 1402319 A CN1402319 A CN 1402319A
- Authority
- CN
- China
- Prior art keywords
- chip
- driver
- wiring board
- guard block
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
- H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5387—Flexible insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims (16)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001230307 | 2001-07-30 | ||
JP230307/2001 | 2001-07-30 | ||
JP197621/2002 | 2002-07-05 | ||
JP2002197621A JP3983120B2 (ja) | 2001-07-30 | 2002-07-05 | Icチップの実装構造及びディスプレイ装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1402319A true CN1402319A (zh) | 2003-03-12 |
CN1231954C CN1231954C (zh) | 2005-12-14 |
Family
ID=26619581
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB021271682A Expired - Fee Related CN1231954C (zh) | 2001-07-30 | 2002-07-30 | 集成电路芯片安装结构以及显示设备 |
Country Status (6)
Country | Link |
---|---|
US (1) | US6703702B2 (zh) |
EP (1) | EP1282169A3 (zh) |
JP (1) | JP3983120B2 (zh) |
KR (2) | KR100893810B1 (zh) |
CN (1) | CN1231954C (zh) |
TW (1) | TWI221266B (zh) |
Cited By (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1294545C (zh) * | 2003-10-23 | 2007-01-10 | 三星Sdi株式会社 | 等离子体显示装置 |
US7251140B2 (en) | 2003-10-17 | 2007-07-31 | Samsung Sdi Co., Ltd | Display apparatus having heat dissipating structure for driver integrated circuit |
CN100337516C (zh) * | 2003-10-23 | 2007-09-12 | 三星Sdi株式会社 | 具有用于驱动器集成电路的散热结构的等离子体显示装置 |
CN100375916C (zh) * | 2003-09-29 | 2008-03-19 | 友达光电股份有限公司 | 液晶显示器模块 |
CN100377631C (zh) * | 2003-10-29 | 2008-03-26 | 三星Sdi株式会社 | 显示设备及其散热装置 |
CN100392692C (zh) * | 2004-03-04 | 2008-06-04 | 三星Sdi株式会社 | 等离子显示设备 |
CN100409274C (zh) * | 2005-04-26 | 2008-08-06 | 中强光电股份有限公司 | 用于平面显示装置中的散热装置 |
US7432652B2 (en) | 2004-02-20 | 2008-10-07 | Samsung Sdi Co., Ltd. | Plasma display device and method for fabricating a plasma display device |
US7432640B2 (en) | 2004-10-15 | 2008-10-07 | Samsung Sdi Co., Ltd. | Plasma display apparatus having cover members for signal transmission members |
CN100441076C (zh) * | 2004-10-11 | 2008-12-03 | 三星Sdi株式会社 | 等离子体显示装置 |
US7508673B2 (en) | 2004-03-04 | 2009-03-24 | Samsung Sdi Co., Ltd. | Heat dissipating apparatus for plasma display device |
US7535173B2 (en) | 2003-10-16 | 2009-05-19 | Samsung Sdi Co., Ltd. | Plasma display module |
US7561426B2 (en) | 2005-04-12 | 2009-07-14 | Samsung Sdi Co., Ltd. | Display module |
US7573198B2 (en) | 2005-10-06 | 2009-08-11 | Lg Electronics Inc. | Plasma display apparatus |
CN1555080B (zh) * | 2003-12-19 | 2010-05-12 | 友达光电股份有限公司 | 等离子显示器 |
US7777400B2 (en) | 2004-08-28 | 2010-08-17 | Samsung Sdi Co., Ltd. | Plasma display apparatus having a bent chassis base |
CN1774159B (zh) * | 2004-11-11 | 2010-11-17 | 三星Sdi株式会社 | 等离子体显示器面板组件 |
CN1747105B (zh) * | 2005-01-14 | 2011-07-27 | 友达光电股份有限公司 | 平面显示器及等离子体显示器 |
CN102177538A (zh) * | 2008-10-17 | 2011-09-07 | 夏普株式会社 | 显示装置及其制造方法 |
CN101730385B (zh) * | 2008-10-10 | 2012-07-04 | 深圳富泰宏精密工业有限公司 | 电路板结构 |
CN101964159B (zh) * | 2009-07-21 | 2012-09-05 | 旭曜科技股份有限公司 | 移动通讯装置用显示模块 |
WO2013040804A1 (zh) * | 2011-09-20 | 2013-03-28 | 深圳市华星光电技术有限公司 | 液晶显示装置 |
CN105676502A (zh) * | 2016-04-13 | 2016-06-15 | 京东方科技集团股份有限公司 | 一种显示模组及显示设备 |
CN106910422A (zh) * | 2017-03-30 | 2017-06-30 | 武汉天马微电子有限公司 | 一种显示面板和显示设备 |
CN108205973A (zh) * | 2016-12-19 | 2018-06-26 | 上海和辉光电有限公司 | 一种柔性显示屏及其制作方法 |
CN109256050A (zh) * | 2012-12-10 | 2019-01-22 | 达科电子股份有限公司 | 显示模块上的发光元件的封装 |
US10749085B2 (en) | 2012-12-10 | 2020-08-18 | Daktronics, Inc. | Encapsulation of light-emitting elements on a display module |
Families Citing this family (133)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE60033164T2 (de) | 2000-12-22 | 2007-10-25 | Sun Microsystems, Inc., Palo Alto | Serverseitige Ausführung von Anwendungsmodulen in einem Client/Server-System |
KR100477990B1 (ko) * | 2002-09-10 | 2005-03-23 | 삼성에스디아이 주식회사 | 플라즈마 디스플레이 패널 및 그 구동 장치와 구동 방법 |
JP3922152B2 (ja) * | 2002-09-27 | 2007-05-30 | 住友電気工業株式会社 | 光モジュール |
JP2004139186A (ja) * | 2002-10-15 | 2004-05-13 | Toshiba Corp | 電子機器 |
US6921975B2 (en) * | 2003-04-18 | 2005-07-26 | Freescale Semiconductor, Inc. | Circuit device with at least partial packaging, exposed active surface and a voltage reference plane |
US6838776B2 (en) | 2003-04-18 | 2005-01-04 | Freescale Semiconductor, Inc. | Circuit device with at least partial packaging and method for forming |
KR100549666B1 (ko) * | 2003-05-23 | 2006-02-08 | 엘지전자 주식회사 | 플라즈마 디스플레이 패널의 구동장치 |
JP4543772B2 (ja) * | 2003-09-19 | 2010-09-15 | セイコーエプソン株式会社 | 電気光学装置および電子機器 |
JP4617652B2 (ja) * | 2003-10-03 | 2011-01-26 | ソニー株式会社 | 電子機器の放熱機構 |
KR100615174B1 (ko) * | 2003-10-14 | 2006-08-25 | 삼성에스디아이 주식회사 | 플라즈마 표시장치 |
KR100589399B1 (ko) * | 2003-10-16 | 2006-06-13 | 삼성에스디아이 주식회사 | 드라이버 ic 방열구조를 갖는 플라즈마 디스플레이 장치 |
US20050088092A1 (en) * | 2003-10-17 | 2005-04-28 | Myoung-Kon Kim | Plasma display apparatus |
KR100627382B1 (ko) * | 2003-10-23 | 2006-09-22 | 삼성에스디아이 주식회사 | 드라이버 ic 방열구조를 갖는 플라즈마 디스플레이 장치 |
KR100669368B1 (ko) * | 2003-10-23 | 2007-01-15 | 삼성에스디아이 주식회사 | 드라이버 ic 방열구조를 갖는 플라즈마 디스플레이 장치 |
KR100536249B1 (ko) * | 2003-10-24 | 2005-12-12 | 삼성에스디아이 주식회사 | 플라즈마 디스플레이 패널 및 이의 구동장치 및 방법 |
KR100627383B1 (ko) | 2003-10-24 | 2006-09-22 | 삼성에스디아이 주식회사 | 드라이버 ic 방열구조를 갖는 플라즈마 디스플레이 장치 |
KR100627303B1 (ko) | 2003-10-29 | 2006-09-22 | 삼성에스디아이 주식회사 | 플라즈마 디스플레이 장치 |
KR100669696B1 (ko) * | 2003-11-08 | 2007-01-16 | 삼성에스디아이 주식회사 | 플라즈마 표시장치 |
KR100627280B1 (ko) | 2003-11-24 | 2006-09-25 | 삼성에스디아이 주식회사 | 드라이버 ic의 방열구조를 갖는 플라즈마 디스플레이 장치 |
KR100696465B1 (ko) * | 2003-11-25 | 2007-03-19 | 삼성에스디아이 주식회사 | 플라즈마 디스플레이 장치 |
KR100578919B1 (ko) * | 2003-11-26 | 2006-05-11 | 삼성에스디아이 주식회사 | 플라즈마 디스플레이 장치와 이 장치에 적용되는 tcp및 그 제조 방법 |
KR100589370B1 (ko) * | 2003-11-26 | 2006-06-14 | 삼성에스디아이 주식회사 | 플라즈마 디스플레이 장치 |
KR100708643B1 (ko) * | 2003-11-27 | 2007-04-17 | 삼성에스디아이 주식회사 | 플라즈마 표시 장치 |
KR100647592B1 (ko) * | 2003-11-28 | 2006-11-17 | 삼성에스디아이 주식회사 | 플라즈마 디스플레이 장치 |
KR100603322B1 (ko) * | 2003-11-29 | 2006-07-20 | 삼성에스디아이 주식회사 | 플라즈마 표시장치 |
TWI268526B (en) * | 2003-12-05 | 2006-12-11 | Au Optronics Corp | Plasma display |
KR100669706B1 (ko) * | 2004-02-10 | 2007-01-16 | 삼성에스디아이 주식회사 | 플라즈마 디스플레이 장치 |
KR100637151B1 (ko) * | 2004-02-21 | 2006-10-23 | 삼성에스디아이 주식회사 | 플라즈마 디스플레이 장치 |
US6967439B2 (en) * | 2004-02-24 | 2005-11-22 | Eastman Kodak Company | OLED display having thermally conductive backplate |
KR100740118B1 (ko) * | 2004-03-30 | 2007-07-16 | 삼성에스디아이 주식회사 | 플라즈마 디스플레이 장치와 이 장치에 적용되는 tcp |
TWI278795B (en) * | 2004-04-20 | 2007-04-11 | Fujitsu Hitachi Plasma Display | Display device |
KR100570622B1 (ko) * | 2004-04-21 | 2006-04-12 | 삼성에스디아이 주식회사 | 플라즈마 디스플레이 장치 및 이에 사용되는 샤시베이스의 제조 방법 |
JP2005338706A (ja) * | 2004-05-31 | 2005-12-08 | Matsushita Electric Ind Co Ltd | プラズマディスプレイ装置 |
JP2005338707A (ja) * | 2004-05-31 | 2005-12-08 | Matsushita Electric Ind Co Ltd | プラズマディスプレイ装置 |
KR100626012B1 (ko) * | 2004-06-30 | 2006-09-20 | 삼성에스디아이 주식회사 | 플라즈마 디스플레이 장치 |
KR100563069B1 (ko) * | 2004-06-30 | 2006-03-24 | 삼성에스디아이 주식회사 | 플라즈마 디스플레이 장치 |
US6972963B1 (en) * | 2004-07-02 | 2005-12-06 | Chunghwa Picture Tubes | Electronic apparatus having structure for protecting flexible printed circuit and chip thereon |
US7142001B2 (en) * | 2004-07-07 | 2006-11-28 | Robert Bosch Gmbh | Packaged circuit module for improved installation and operation |
JP2006064939A (ja) * | 2004-08-26 | 2006-03-09 | Optrex Corp | 表示装置 |
JP2006073683A (ja) * | 2004-08-31 | 2006-03-16 | Sony Corp | 回路デバイス及び回路デバイスの製造方法 |
KR20060021707A (ko) * | 2004-09-03 | 2006-03-08 | 엘지전자 주식회사 | 플라즈마 디스플레이 패널용 티씨피의 히트 싱크 어셈블리장치 |
KR100669729B1 (ko) * | 2004-09-21 | 2007-01-16 | 삼성에스디아이 주식회사 | 플라즈마 디스플레이 장치 |
KR100669327B1 (ko) * | 2004-10-11 | 2007-01-15 | 삼성에스디아이 주식회사 | 플라즈마 디스플레이 장치 |
KR100683703B1 (ko) * | 2004-11-17 | 2007-02-15 | 삼성에스디아이 주식회사 | 플라즈마 디스플레이 장치 |
KR100659071B1 (ko) * | 2004-11-19 | 2006-12-21 | 삼성에스디아이 주식회사 | 플라즈마 디스플레이 장치 |
KR100684793B1 (ko) | 2004-12-07 | 2007-02-20 | 삼성에스디아이 주식회사 | 릴상의 테이프 캐리어 패키지와 이를 적용한 플라즈마디스플레이 장치 |
KR100730135B1 (ko) * | 2004-12-09 | 2007-06-19 | 삼성에스디아이 주식회사 | 플라즈마 디스플레이 장치 |
KR100705818B1 (ko) * | 2004-12-09 | 2007-04-10 | 엘지전자 주식회사 | 드라이브 보드상에 데이타 드라이브 아이씨칩이 실장된플라즈마 표시 패널 유니트 |
JP4426430B2 (ja) * | 2004-12-15 | 2010-03-03 | 日東電工株式会社 | カテーテル及びその製造方法 |
KR20060072783A (ko) * | 2004-12-23 | 2006-06-28 | 엘지전자 주식회사 | 플라즈마 표시장치 |
JP4581726B2 (ja) * | 2004-12-28 | 2010-11-17 | ソニー株式会社 | 表示装置および携帯機器 |
JP4623061B2 (ja) * | 2004-12-28 | 2011-02-02 | ソニー株式会社 | 表示装置および携帯機器 |
KR20060080409A (ko) * | 2005-01-05 | 2006-07-10 | 삼성에스디아이 주식회사 | 플라즈마 디스플레이 패널의 직부착 필터의 접지용브라켓의 장착방법 및 그 장착구조 |
US20060158075A1 (en) * | 2005-01-14 | 2006-07-20 | Au Optronics Corporation | Plasma display panel thermal dissipation-equilibration apparatus and mehtod |
KR100670273B1 (ko) * | 2005-01-18 | 2007-01-16 | 삼성에스디아이 주식회사 | 플라즈마 디스플레이 장치용 방열 조립체 및 이를구비하는 플라즈마 디스플레이 장치 |
KR100759550B1 (ko) | 2005-01-20 | 2007-09-18 | 삼성에스디아이 주식회사 | 디스플레이 모듈 |
KR100741073B1 (ko) * | 2005-01-22 | 2007-07-20 | 삼성에스디아이 주식회사 | 디스플레이 장치용 신호전달부재의 방열 기구 및 이를구비한 플라즈마 디스플레이 장치 |
KR100749463B1 (ko) * | 2005-01-31 | 2007-08-14 | 삼성에스디아이 주식회사 | 플라즈마 디스플레이 장치 |
KR100739051B1 (ko) * | 2005-02-01 | 2007-07-12 | 삼성에스디아이 주식회사 | 플라즈마 디스플레이 장치 |
KR100683759B1 (ko) * | 2005-02-03 | 2007-02-20 | 삼성에스디아이 주식회사 | 플라즈마 디스플레이 장치 |
KR100709244B1 (ko) * | 2005-02-16 | 2007-04-19 | 삼성에스디아이 주식회사 | 플라즈마 디스플레이 장치 |
KR100637214B1 (ko) * | 2005-02-19 | 2006-10-23 | 삼성에스디아이 주식회사 | 커버플레이트 장착구조 및 이를 구비한 플라즈마 디스플레이 모듈 |
KR100637217B1 (ko) | 2005-03-03 | 2006-10-23 | 삼성에스디아이 주식회사 | 플라즈마 디스플레이 장치 |
KR20060098689A (ko) * | 2005-03-03 | 2006-09-19 | 엘지전자 주식회사 | 티씨피 모듈의 그라운드 강화 설계 구조 |
KR100759553B1 (ko) | 2005-04-06 | 2007-09-18 | 삼성에스디아이 주식회사 | 플라즈마 디스플레이 모듈 |
KR100701957B1 (ko) | 2005-04-15 | 2007-03-30 | 엘지전자 주식회사 | 플라즈마 디스플레이 패널 |
KR100696627B1 (ko) * | 2005-04-21 | 2007-03-19 | 삼성에스디아이 주식회사 | 플라즈마 디스플레이 장치 |
KR100696515B1 (ko) * | 2005-04-26 | 2007-03-19 | 삼성에스디아이 주식회사 | 플라즈마 디스플레이 장치 |
KR100696517B1 (ko) * | 2005-05-02 | 2007-03-19 | 삼성에스디아이 주식회사 | 플라즈마 디스플레이 모듈의 집적회로칩 방열 구조 및 이를구비한 플라즈마 디스플레이 모듈 |
KR100730136B1 (ko) | 2005-06-16 | 2007-06-19 | 삼성에스디아이 주식회사 | 플라즈마 디스플레이 모듈의 집적회로칩 방열 구조 및 이를구비한 플라즈마 디스플레이 모듈 |
WO2006136984A2 (en) * | 2005-06-21 | 2006-12-28 | Koninklijke Philips Electronics N.V. | Thin film circuit connections |
KR100709855B1 (ko) * | 2005-07-04 | 2007-04-23 | 삼성에스디아이 주식회사 | 플라즈마 표시장치 |
KR100649566B1 (ko) * | 2005-07-07 | 2006-11-27 | 삼성에스디아이 주식회사 | 플라즈마 디스플레이 패널 |
US20100134459A1 (en) * | 2005-07-12 | 2010-06-03 | Toyoshi Kawada | Flat display device |
KR100652748B1 (ko) | 2005-07-19 | 2006-12-01 | 엘지전자 주식회사 | 엘시디모듈 및 이를 구비한 이동통신 단말기 |
KR100649216B1 (ko) * | 2005-07-21 | 2006-11-24 | 삼성에스디아이 주식회사 | 플라즈마 디스플레이 장치 |
CN101208732A (zh) * | 2005-08-18 | 2008-06-25 | 富士通日立等离子显示器股份有限公司 | 平板显示装置 |
KR100749621B1 (ko) * | 2005-12-08 | 2007-08-14 | 삼성에스디아이 주식회사 | 플라즈마 표시장치 |
KR100759562B1 (ko) * | 2005-12-22 | 2007-09-18 | 삼성에스디아이 주식회사 | 디스플레이 장치용 섀시 조립체 및 이를 구비한 디스플레이장치 |
KR100793549B1 (ko) * | 2006-03-08 | 2008-01-14 | 엘지이노텍 주식회사 | 액정표시모듈 및 이를 구비하는 이동통신 단말기 |
KR100814819B1 (ko) * | 2006-10-31 | 2008-03-20 | 삼성에스디아이 주식회사 | 플라즈마 디스플레이 장치 |
WO2008072302A1 (ja) * | 2006-12-11 | 2008-06-19 | Hitachi Plasma Display Limited | 駆動回路基板装置 |
JP2008203376A (ja) * | 2007-02-19 | 2008-09-04 | Matsushita Electric Ind Co Ltd | 半導体装置、並びに表示装置 |
US8035789B2 (en) * | 2007-03-19 | 2011-10-11 | Sony Corporation | Mounting structure, electro-optical device, input device, method of manufacturing mounting structure, and electronic apparatus |
KR100852696B1 (ko) * | 2007-03-19 | 2008-08-19 | 삼성에스디아이 주식회사 | 플라즈마 디스플레이 장치 |
JP5147268B2 (ja) * | 2007-03-20 | 2013-02-20 | キヤノン株式会社 | フラットパネル表示装置 |
US7926173B2 (en) * | 2007-07-05 | 2011-04-19 | Occam Portfolio Llc | Method of making a circuit assembly |
JP5029890B2 (ja) * | 2007-07-13 | 2012-09-19 | 日本精機株式会社 | 表示装置 |
JP4466692B2 (ja) | 2007-07-18 | 2010-05-26 | セイコーエプソン株式会社 | 半導体装置 |
KR101065935B1 (ko) * | 2007-07-19 | 2011-09-19 | 엔이씨 액세스 테크니카 가부시키가이샤 | 전자 부품 실장 장치 및 그 제조 방법 |
JP2009080894A (ja) * | 2007-09-26 | 2009-04-16 | Toshiba Corp | 磁気ディスク装置 |
KR100907235B1 (ko) | 2007-10-30 | 2009-07-10 | 히다찌 플라즈마 디스플레이 가부시키가이샤 | 플랫 디스플레이 장치 |
KR20090067744A (ko) * | 2007-12-21 | 2009-06-25 | 엘지전자 주식회사 | 연성 필름 |
KR100896439B1 (ko) * | 2007-12-26 | 2009-05-14 | 엘지전자 주식회사 | 연성 필름 |
KR100889002B1 (ko) * | 2007-12-27 | 2009-03-19 | 엘지전자 주식회사 | 연성 필름 |
KR100947607B1 (ko) * | 2007-12-27 | 2010-03-15 | 엘지전자 주식회사 | 연성 필름 |
KR20100119781A (ko) * | 2008-02-01 | 2010-11-10 | 파나소닉 주식회사 | 드라이버 모듈 구조 |
JP4466744B2 (ja) * | 2008-02-06 | 2010-05-26 | 株式会社デンソー | 電子装置の放熱構造 |
KR100926611B1 (ko) * | 2008-07-15 | 2009-11-11 | 삼성에스디아이 주식회사 | 스캔 구동장치 및 이를 이용한 플라즈마 디스플레이 장치 |
BRPI0920787A2 (pt) * | 2008-10-01 | 2015-12-22 | Sharp Kk | aparelho eletrônico, dispositivo de iluminação, dispositivo de exibição e receptor de televisão |
JP2010267954A (ja) * | 2009-04-15 | 2010-11-25 | Panasonic Corp | 電子機器 |
US8698391B2 (en) * | 2009-04-29 | 2014-04-15 | Global Oled Technology Llc | Chiplet display with oriented chiplets and busses |
JP5273553B2 (ja) * | 2009-05-29 | 2013-08-28 | 日本精機株式会社 | 液晶表示装置 |
JP2011013605A (ja) * | 2009-07-06 | 2011-01-20 | Hitachi Displays Ltd | 表示装置 |
KR20110014033A (ko) * | 2009-08-04 | 2011-02-10 | 삼성에스디아이 주식회사 | 플라즈마 디스플레이 장치 |
TWI383735B (zh) * | 2009-11-23 | 2013-01-21 | Chimei Innolux Corp | 液晶顯示裝置 |
US8879273B2 (en) * | 2010-12-23 | 2014-11-04 | Sony Corporation | Mobile terminal and casing connecting structure |
CN102823229B (zh) * | 2011-01-31 | 2016-08-24 | 松下电器产业株式会社 | 拍摄装置 |
US8488335B2 (en) * | 2011-04-18 | 2013-07-16 | Japan Display West, Inc. | Electro-optical device and electronic apparatus |
US20130070189A1 (en) * | 2011-09-20 | 2013-03-21 | Shenzhen China Star Optoelectronics Technology Co. Ltd. | Liquid crystal display device |
CN104380365B (zh) | 2012-06-29 | 2017-06-23 | 索尼公司 | 显示单元 |
KR20140079062A (ko) | 2012-12-18 | 2014-06-26 | 삼성전자주식회사 | 반도체 패키지 및 이를 이용한 표시 장치 |
TWI527505B (zh) * | 2013-01-10 | 2016-03-21 | 元太科技工業股份有限公司 | 電路基板結構及其製造方法 |
CN103345882B (zh) * | 2013-06-24 | 2015-02-04 | 句容骏成电子有限公司 | 一种cob产品扭脚、检测气动一体化装置 |
US9089051B2 (en) | 2013-06-27 | 2015-07-21 | International Business Machines Corporation | Multichip module with stiffening frame and associated covers |
JP2015056265A (ja) * | 2013-09-11 | 2015-03-23 | 株式会社東芝 | 電子機器 |
JP6379616B2 (ja) * | 2014-04-17 | 2018-08-29 | セイコーエプソン株式会社 | 電気光学装置及び電子機器 |
KR102415651B1 (ko) * | 2015-07-01 | 2022-07-01 | 엘지전자 주식회사 | 이동 단말기 |
KR102571574B1 (ko) * | 2015-12-16 | 2023-08-25 | 엘지디스플레이 주식회사 | 플렉서블 필름 및 이를 포함하는 액정 표시 장치 |
CN205620644U (zh) * | 2016-05-17 | 2016-10-05 | 京东方科技集团股份有限公司 | 一种显示装置 |
US10925160B1 (en) * | 2016-06-28 | 2021-02-16 | Amazon Technologies, Inc. | Electronic device with a display assembly and silicon circuit board substrate |
JP6829377B2 (ja) * | 2016-10-20 | 2021-02-10 | 三菱電機株式会社 | 表示装置 |
KR101911270B1 (ko) | 2017-04-27 | 2018-10-24 | 엘지전자 주식회사 | 이동 단말기 |
JP6856777B2 (ja) | 2017-05-15 | 2021-04-14 | エルジー イノテック カンパニー リミテッド | オールインワンチップオンフィルム用軟性回路基板及びこれを含むチップパッケージ、及びこれを含む電子デバイス |
KR102351372B1 (ko) | 2017-07-06 | 2022-01-14 | 삼성전자주식회사 | 디스플레이를 구비한 전자장치 |
US10276487B1 (en) * | 2017-10-18 | 2019-04-30 | Micron Technology, Inc. | Semiconductor device with flexible circuit for enabling non-destructive attaching and detaching of device to system board |
US10477691B2 (en) | 2017-12-13 | 2019-11-12 | E Ink Holdings Inc. | Flexible display device and manufacturing method thereof |
CN108241240B (zh) * | 2018-02-08 | 2021-05-14 | 上海天马微电子有限公司 | 一种显示面板以及显示装置 |
KR102093497B1 (ko) * | 2018-07-11 | 2020-03-26 | 삼성디스플레이 주식회사 | 표시모듈 및 이를 포함하는 표시장치 |
KR20200112068A (ko) | 2019-03-20 | 2020-10-05 | 삼성전자주식회사 | 칩 온 필름 패키지 및 이를 포함하는 표시 장치 |
CN210489211U (zh) * | 2019-11-29 | 2020-05-08 | 北京京东方显示技术有限公司 | 一种驱动电路板以及显示装置 |
CN111221181A (zh) * | 2020-01-20 | 2020-06-02 | 深圳市华星光电半导体显示技术有限公司 | 背光源及其制备方法 |
CN113539091B (zh) * | 2021-07-13 | 2023-11-24 | 京东方科技集团股份有限公司 | 一种显示装置 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2803699B2 (ja) | 1992-01-21 | 1998-09-24 | 富士通株式会社 | Icチップの実装構造 |
JPH05226487A (ja) * | 1992-02-14 | 1993-09-03 | Nec Corp | 半導体装置 |
JP2801487B2 (ja) * | 1992-04-30 | 1998-09-21 | シャープ株式会社 | パネルの実装構造および実装方法並びに樹脂供給硬化方法 |
US5581443A (en) | 1994-09-14 | 1996-12-03 | Kabushiki Kaisha Toshiba | Structure for cooling a circuit module having a circuit board and a heat-generating IC chip mounted on the board, and portable electronic apparatus incorporating the structure |
JP2776344B2 (ja) * | 1995-10-26 | 1998-07-16 | 日本電気株式会社 | 液晶表示装置 |
JPH09283976A (ja) * | 1996-04-08 | 1997-10-31 | Kitagawa Ind Co Ltd | 放熱・シールド材 |
JPH10260641A (ja) | 1997-03-17 | 1998-09-29 | Nec Corp | フラットパネル型表示装置用ドライバicの実装構造 |
JP2991172B2 (ja) * | 1997-10-24 | 1999-12-20 | 日本電気株式会社 | 半導体装置 |
EP1041633B1 (en) * | 1998-09-09 | 2008-04-23 | Seiko Epson Corporation | Semiconductor device, method of manufacture thereof, circuit board, and electronic device |
JP2000172191A (ja) | 1998-12-04 | 2000-06-23 | Fujitsu Ltd | 平面表示装置 |
JP2000250425A (ja) | 1999-02-25 | 2000-09-14 | Fujitsu Ltd | ドライバic実装モジュール |
JP3450213B2 (ja) | 1999-03-18 | 2003-09-22 | Necエレクトロニクス株式会社 | フラットパネル型表示装置 |
US6365978B1 (en) * | 1999-04-02 | 2002-04-02 | Texas Instruments Incorporated | Electrical redundancy for improved mechanical reliability in ball grid array packages |
JP3656455B2 (ja) | 1999-04-13 | 2005-06-08 | 富士電機デバイステクノロジー株式会社 | ドライバーモジュール構造 |
JP2001013883A (ja) * | 1999-06-30 | 2001-01-19 | Fujitsu Ltd | ドライバic実装モジュール及びそれを使用した平板型表示装置 |
JP3367554B2 (ja) | 1999-10-13 | 2003-01-14 | 日本電気株式会社 | フリップチップパッケージ |
JP3881488B2 (ja) * | 1999-12-13 | 2007-02-14 | 株式会社東芝 | 回路モジュールの冷却装置およびこの冷却装置を有する電子機器 |
-
2002
- 2002-07-05 JP JP2002197621A patent/JP3983120B2/ja not_active Expired - Fee Related
- 2002-07-26 US US10/202,831 patent/US6703702B2/en not_active Expired - Fee Related
- 2002-07-29 EP EP02255270A patent/EP1282169A3/en not_active Withdrawn
- 2002-07-29 KR KR1020020044548A patent/KR100893810B1/ko not_active IP Right Cessation
- 2002-07-29 TW TW091116886A patent/TWI221266B/zh not_active IP Right Cessation
- 2002-07-30 CN CNB021271682A patent/CN1231954C/zh not_active Expired - Fee Related
-
2008
- 2008-04-08 KR KR1020080032680A patent/KR100887032B1/ko not_active IP Right Cessation
Cited By (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100375916C (zh) * | 2003-09-29 | 2008-03-19 | 友达光电股份有限公司 | 液晶显示器模块 |
US7535173B2 (en) | 2003-10-16 | 2009-05-19 | Samsung Sdi Co., Ltd. | Plasma display module |
US7251140B2 (en) | 2003-10-17 | 2007-07-31 | Samsung Sdi Co., Ltd | Display apparatus having heat dissipating structure for driver integrated circuit |
US7394185B2 (en) | 2003-10-23 | 2008-07-01 | Samsung Sdi Co., Ltd. | Plasma display apparatus having heat dissipating structure for driver integrated circuit |
CN1294545C (zh) * | 2003-10-23 | 2007-01-10 | 三星Sdi株式会社 | 等离子体显示装置 |
CN100337516C (zh) * | 2003-10-23 | 2007-09-12 | 三星Sdi株式会社 | 具有用于驱动器集成电路的散热结构的等离子体显示装置 |
CN100377631C (zh) * | 2003-10-29 | 2008-03-26 | 三星Sdi株式会社 | 显示设备及其散热装置 |
US7414204B2 (en) | 2003-10-29 | 2008-08-19 | Samsung Sdi Co., Ltd. | Display device and heat dissipating means therefor |
CN1555080B (zh) * | 2003-12-19 | 2010-05-12 | 友达光电股份有限公司 | 等离子显示器 |
US7432652B2 (en) | 2004-02-20 | 2008-10-07 | Samsung Sdi Co., Ltd. | Plasma display device and method for fabricating a plasma display device |
CN100466023C (zh) * | 2004-02-20 | 2009-03-04 | 三星Sdi株式会社 | 等离子体显示装置及用于制造等离子体显示装置的方法 |
CN100392692C (zh) * | 2004-03-04 | 2008-06-04 | 三星Sdi株式会社 | 等离子显示设备 |
US7508673B2 (en) | 2004-03-04 | 2009-03-24 | Samsung Sdi Co., Ltd. | Heat dissipating apparatus for plasma display device |
US7777400B2 (en) | 2004-08-28 | 2010-08-17 | Samsung Sdi Co., Ltd. | Plasma display apparatus having a bent chassis base |
CN100441076C (zh) * | 2004-10-11 | 2008-12-03 | 三星Sdi株式会社 | 等离子体显示装置 |
US7432640B2 (en) | 2004-10-15 | 2008-10-07 | Samsung Sdi Co., Ltd. | Plasma display apparatus having cover members for signal transmission members |
CN1774159B (zh) * | 2004-11-11 | 2010-11-17 | 三星Sdi株式会社 | 等离子体显示器面板组件 |
CN1747105B (zh) * | 2005-01-14 | 2011-07-27 | 友达光电股份有限公司 | 平面显示器及等离子体显示器 |
US7561426B2 (en) | 2005-04-12 | 2009-07-14 | Samsung Sdi Co., Ltd. | Display module |
CN100409274C (zh) * | 2005-04-26 | 2008-08-06 | 中强光电股份有限公司 | 用于平面显示装置中的散热装置 |
US7573198B2 (en) | 2005-10-06 | 2009-08-11 | Lg Electronics Inc. | Plasma display apparatus |
CN101730385B (zh) * | 2008-10-10 | 2012-07-04 | 深圳富泰宏精密工业有限公司 | 电路板结构 |
CN102177538A (zh) * | 2008-10-17 | 2011-09-07 | 夏普株式会社 | 显示装置及其制造方法 |
CN101964159B (zh) * | 2009-07-21 | 2012-09-05 | 旭曜科技股份有限公司 | 移动通讯装置用显示模块 |
WO2013040804A1 (zh) * | 2011-09-20 | 2013-03-28 | 深圳市华星光电技术有限公司 | 液晶显示装置 |
CN109256050A (zh) * | 2012-12-10 | 2019-01-22 | 达科电子股份有限公司 | 显示模块上的发光元件的封装 |
US10749085B2 (en) | 2012-12-10 | 2020-08-18 | Daktronics, Inc. | Encapsulation of light-emitting elements on a display module |
CN105676502A (zh) * | 2016-04-13 | 2016-06-15 | 京东方科技集团股份有限公司 | 一种显示模组及显示设备 |
US10444557B2 (en) | 2016-04-13 | 2019-10-15 | Boe Technology Group Co., Ltd. | Display module and display device |
CN105676502B (zh) * | 2016-04-13 | 2019-11-29 | 京东方科技集团股份有限公司 | 一种显示模组及显示设备 |
CN108205973A (zh) * | 2016-12-19 | 2018-06-26 | 上海和辉光电有限公司 | 一种柔性显示屏及其制作方法 |
CN106910422A (zh) * | 2017-03-30 | 2017-06-30 | 武汉天马微电子有限公司 | 一种显示面板和显示设备 |
Also Published As
Publication number | Publication date |
---|---|
EP1282169A3 (en) | 2005-10-05 |
KR20030011647A (ko) | 2003-02-11 |
CN1231954C (zh) | 2005-12-14 |
JP3983120B2 (ja) | 2007-09-26 |
KR100887032B1 (ko) | 2009-03-04 |
TWI221266B (en) | 2004-09-21 |
JP2003115568A (ja) | 2003-04-18 |
KR100893810B1 (ko) | 2009-04-20 |
US20030020152A1 (en) | 2003-01-30 |
KR20080039856A (ko) | 2008-05-07 |
US6703702B2 (en) | 2004-03-09 |
EP1282169A2 (en) | 2003-02-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN1231954C (zh) | 集成电路芯片安装结构以及显示设备 | |
CN1229863C (zh) | 半导体装置及其制造方法、电路基板和电子装置 | |
US5757073A (en) | Heatsink and package structure for wirebond chip rework and replacement | |
CN1271712C (zh) | 具有从密封树脂暴露出来的散热器的半导体器件 | |
JP2003108017A (ja) | フラットパネル型表示装置 | |
CN1574608A (zh) | 温度补偿晶体振荡器 | |
US20140177181A1 (en) | Electromagnetic Interference Shielding Structures | |
CN1767177A (zh) | 半导体器件以及电子设备 | |
CN1318182A (zh) | 电光装置及其制造方法和电子设备 | |
CN101065842A (zh) | 电子元器件及其制造方法 | |
CN1130958A (zh) | 多芯片模块 | |
CN1815733A (zh) | 半导体装置及其制造方法 | |
CN1235457C (zh) | 电路基片及其制造方法和显示装置 | |
US7254032B1 (en) | Techniques for providing EMI shielding within a circuit board component | |
CN1649264A (zh) | 温度补偿式晶体振荡器 | |
CN1419803A (zh) | 用于把电能提供到具有集成的热量和电磁干扰管理的微处理器的方法和装置 | |
CN1763933A (zh) | 印刷电路板与引入其的电路单元 | |
US20080284765A1 (en) | Plasma display device and signal transmitting unit for plasma display device | |
JP3152209B2 (ja) | 半導体装置及びその製造方法 | |
CN1734935A (zh) | 陶瓷封装件、集合基板及其制造方法 | |
JP4839244B2 (ja) | プラズマディスプレイ装置およびフラットディスプレイ装置 | |
JP2010267954A (ja) | 電子機器 | |
JPWO2018181871A1 (ja) | モジュール | |
JP4528795B2 (ja) | プラズマディスプレイ装置およびフラットディスプレイ装置 | |
JP4832334B2 (ja) | プラズマディスプレイ装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee | ||
CP03 | Change of name, title or address |
Address after: Kanagawa Patentee after: Hitachi Plasma Display Co., Ltd. Address before: Kanagawa Patentee before: Fuji Hitachi Plasma Display Co., Ltd. |
|
ASS | Succession or assignment of patent right |
Owner name: HITACHI, LTD. Free format text: FORMER OWNER: HITACHI PLASMA DISPLAY CO., LTD. Effective date: 20120604 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20120604 Address after: Tokyo, Japan Patentee after: Hitachi Manufacturing Co., Ltd. Address before: Kanagawa Patentee before: Hitachi Plasma Display Co., Ltd. |
|
ASS | Succession or assignment of patent right |
Owner name: HITACHI LTD. Free format text: FORMER OWNER: HITACHI,LTD. Effective date: 20130724 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20130724 Address after: Tokyo, Japan Patentee after: Hitachi Consumer Electronics Co.,Ltd. Address before: Tokyo, Japan Patentee before: Hitachi Manufacturing Co., Ltd. |
|
ASS | Succession or assignment of patent right |
Owner name: HITACHI MAXELL LTD. Free format text: FORMER OWNER: HITACHI LTD. Effective date: 20150325 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20150325 Address after: Osaka, Japan Patentee after: Hitachi Maxell, Ltd. Address before: Tokyo, Japan Patentee before: Hitachi Consumer Electronics Co.,Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20051214 Termination date: 20150730 |
|
EXPY | Termination of patent right or utility model |