WO2013040804A1 - 液晶显示装置 - Google Patents

液晶显示装置 Download PDF

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Publication number
WO2013040804A1
WO2013040804A1 PCT/CN2011/080388 CN2011080388W WO2013040804A1 WO 2013040804 A1 WO2013040804 A1 WO 2013040804A1 CN 2011080388 W CN2011080388 W CN 2011080388W WO 2013040804 A1 WO2013040804 A1 WO 2013040804A1
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WO
WIPO (PCT)
Prior art keywords
liquid crystal
crystal display
display device
chip
sided tape
Prior art date
Application number
PCT/CN2011/080388
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English (en)
French (fr)
Inventor
李全
Original Assignee
深圳市华星光电技术有限公司
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Publication date
Application filed by 深圳市华星光电技术有限公司 filed Critical 深圳市华星光电技术有限公司
Priority to US13/377,150 priority Critical patent/US20130070189A1/en
Publication of WO2013040804A1 publication Critical patent/WO2013040804A1/zh

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133615—Edge-illuminating devices, i.e. illuminating from the side
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0085—Means for removing heat created by the light source from the package
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
    • H05K7/20963—Heat transfer by conduction from internal heat source to heat radiating structure
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0086—Positioning aspects
    • G02B6/0088—Positioning aspects of the light guide or other optical sheets in the package
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0086—Positioning aspects
    • G02B6/009—Positioning aspects of the light source in the package
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133628—Illuminating devices with cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit

Definitions

  • the present invention relates to the field of liquid crystal display, and in particular to a liquid crystal display device.
  • liquid crystal display devices have been widely used in various technical fields due to their characteristics of being thin and light, occupying small space, and having small radiation.
  • a liquid crystal display panel is provided with a flexible printed circuit board, and a chip is disposed on the flexible printed circuit board, and the chip is used to drive the liquid crystal display panel, that is, using a so-called flip chip technology ( Chip On Film, COF).
  • COF Chip On Film
  • the length of the flexible printed circuit board is about 8 mm, so that the flip chip cannot be placed horizontally like the conventional design and the liquid crystal display panel needs to be bent downward to save space.
  • the flip chip is bent in a natural state, it may easily cause a stab in the front frame due to lifting during transportation and use, resulting in problems such as poor display.
  • a main object of the present invention is to provide a liquid crystal display device which aims to solve the problem of heat dissipation of a driving chip on a liquid crystal display panel.
  • the present invention provides a liquid crystal display device including a liquid crystal display panel, a flexible printed circuit board disposed on one side of the liquid crystal display panel, and a driving device disposed on the flexible printed circuit board.
  • the chip of the liquid crystal display panel further includes a heat dissipating component, the heat dissipating component envelops the chip, and the heat generated by the chip is dissipated through the heat dissipating component, wherein the heat dissipating component comprises a thermal buffer material and a first A thermally conductive double-sided tape is connected to the chip through the first thermally conductive double-sided tape.
  • the liquid crystal display device further includes a light guide plate and a reflective sheet, and an end of the flexible printed circuit board remote from the liquid crystal display panel is disposed opposite to the light guide plate; the reflective sheet is disposed on the guide The light plate is interposed between the heat conductive buffer material, and the reflective sheet is attached to the light guide plate.
  • the heat dissipating component further includes a second heat conductive double-sided tape, the second heat conductive double-sided tape is disposed between the reflective sheet and the thermal buffer material, the reflective sheet and the thermal buffer material Connected by the second thermally conductive double-sided tape.
  • the liquid crystal display device further includes a plastic frame, the plastic frame is disposed between the light guide plate and the thermal buffer material for supporting the liquid crystal display panel;
  • the third thermal conductive double-sided adhesive is disposed between the plastic frame and the thermal buffer material, and the plastic frame is connected to the thermal conductive buffer through the third thermal conductive double-sided adhesive.
  • the thermal conductive buffer material is a flexible sheet having thermal conductivity, and the opposite sides of the front and back sides of the flexible sheet are respectively provided with a fourth heat conductive double-sided tape, and the flexible sheet is fixed by the fourth heat conductive double-sided tape On the flexible printed circuit board on opposite sides of the chip.
  • the first thermally conductive double-sided adhesive is disposed at a geometric center position of the flexible sheet.
  • the chip is a source driver chip or a gate driver chip.
  • the present invention also provides a liquid crystal display device including a liquid crystal display panel, a flexible printed circuit board disposed on one side of the liquid crystal display panel, and a chip for driving the liquid crystal display panel disposed on the flexible printed circuit board And further comprising a heat dissipating component covering the chip, so that heat generated by the chip is dissipated through the heat dissipating component.
  • the heat dissipating component comprises a thermal conductive buffer material and a first thermal conductive double-sided adhesive, and the thermal conductive buffer material is connected to the chip through the first thermal conductive double-sided adhesive.
  • the liquid crystal display device further includes a light guide plate, and an end of the flexible printed circuit board remote from the liquid crystal display panel is disposed opposite to the light guide plate.
  • the liquid crystal display device further includes a reflective sheet disposed between the light guide plate and the thermal buffer material, and the reflective sheet is attached to the light guide plate.
  • the heat dissipating component further includes a second heat conductive double-sided tape, the second heat conductive double-sided tape is disposed between the reflective sheet and the thermal buffer material, the reflective sheet and the thermal buffer material Connected by the second thermally conductive double-sided tape.
  • the liquid crystal display device further includes a plastic frame disposed between the light guide plate and the thermal buffer material for supporting the liquid crystal display panel.
  • the heat dissipating component further includes a third thermal conductive double-sided adhesive, the third thermal conductive double-sided adhesive is disposed between the plastic frame and the thermal buffer material, the plastic frame and the thermal buffer material Connected by the third thermally conductive double-sided tape.
  • the thermal conductive buffer material is a flexible sheet having thermal conductivity, and the opposite sides of the front and back sides of the flexible sheet are respectively provided with a fourth heat conductive double-sided tape, and the flexible sheet is fixed by the fourth heat conductive double-sided tape On the flexible printed circuit board on opposite sides of the chip.
  • the first thermally conductive double-sided adhesive is disposed at a geometric center position of the flexible sheet.
  • the chip is a source driver chip or a gate driver chip.
  • the invention covers the heat-dissipating component on the outer side of the chip, so that the heat generated by the chip is emitted in time, thereby avoiding damage to the chip due to excessive temperature and prolonging the service life of the liquid crystal display device.
  • FIG. 1 is a schematic structural view of a first embodiment of a liquid crystal display device of the present invention
  • Figure 2 is an enlarged view of the junction C of the flexible printed circuit board and the liquid crystal display panel of Figure 1;
  • FIG. 3 is a schematic structural view of a second embodiment of a liquid crystal display device of the present invention.
  • FIG. 4 is a schematic structural view of a heat conduction buffer block in a third embodiment of the liquid crystal display device of the present invention.
  • FIG. 1 is a schematic structural view of a first embodiment of a liquid crystal display device of the present invention.
  • 2 is an enlarged view of a portion C of the flexible printed circuit board and the liquid crystal display panel of FIG.
  • the liquid crystal display device includes a liquid crystal display panel 10, a flexible printed circuit board 20 disposed on one side of the liquid crystal display panel 10, and a chip 21 for driving the liquid crystal display panel 10 disposed on the flexible printed circuit board 20.
  • the heat dissipating component 30 is further included, and the heat dissipating component 30 covers the chip 21, so that the heat generated by the chip 21 is dissipated through the heat dissipating component 30, thereby avoiding damage to the chip due to excessive temperature and prolonging the service life of the liquid crystal display device.
  • the chip 21 in this embodiment is a source driving chip or a gate driving chip.
  • the heat dissipating component 30 includes a thermal buffer material 31 and a first thermal conductive double-sided adhesive 32 for dissipating heat of the chip 21, which is connected to the chip 21 through the first thermal double-sided adhesive 32.
  • the heat-dissipating buffer material 31 is a heat-conductive foaming material, and may be disposed in a plate shape, and has a groove in the middle of the surface of the surface to accommodate the chip 21, thereby forming a coating on the chip 21. The groove bottom plane of the groove can be adhered to the surface of the chip 21 through the first heat-conductive double-sided tape 32.
  • the heat generated by the chip 21 can be The first heat-conductive double-sided tape 32 is conducted to the heat-dissipating cushioning material 31, and the heat is dissipated by the heat-dissipating cushioning material 31.
  • the liquid crystal display device further includes a light guide plate 60.
  • An end of the flexible printed circuit board 20 remote from the liquid crystal display panel 10 is disposed opposite to the light guide plate 60.
  • the light guide plate 60 is disposed corresponding to the liquid crystal display panel 10.
  • a buffer sheet 2 is disposed between the light guide plate 60 and the liquid crystal display panel 10, and the buffer sheet 2 is used for supporting The liquid crystal display panel 10.
  • the flexible printed circuit board 20 is bent at the light guide plate 60 at the liquid crystal display panel 10 such that the thermal conductive buffer member 31 is opposed to the light guide plate 60.
  • a reflection sheet 50 is disposed between the light guide plate 60 and the thermal conductive buffer member 31, and the reflection sheet 50 is attached to the light guide plate 60.
  • the flexible printed circuit board 20 Since the flexible printed circuit board 20 is bent toward the light guide plate 60, the width W of the frame 11 facing the viewer on the front frame 1 for accommodating the flexible printed circuit board 20 in the liquid crystal display device can be greatly reduced, thereby realizing liquid crystal display.
  • the narrow bezel design of the device After the flexible printed circuit board 20 is bent, it can be connected to the light guide plate 60 or other objects in various ways.
  • the flexible printed circuit board 20 can be fixed by glue or double-sided tape, etc., to avoid the warpage and the iron frame. A hard object scratches or stabs; it also contributes to the design of a narrower bezel.
  • the flexible printed circuit board 20 is preferably fixed by providing a thermally conductive double-sided tape between the flexible printed circuit board 20 and the light guide plate 60.
  • the heat dissipating component 30 is provided with a second heat conductive double-sided tape 33 , which is disposed between the reflective sheet 50 and the thermal buffer material 31 .
  • the reflection sheet 50 and the thermal buffer material 31 are connected by the second thermal double-sided tape 33.
  • the flexible printed circuit board 20 and the reflection sheet 50 can be fixed to avoid scratching or stabbing by a hard object such as an iron frame after warping; Narrow border design.
  • FIG. 3 is a schematic structural view of a second embodiment of a liquid crystal display device according to the present invention.
  • the liquid crystal display device includes a plastic frame 3, and the plastic film frame 3 is used to replace the buffer sheet 2 in the first embodiment.
  • the plastic frame 3 is disposed between the light guide plate 60 and the thermal buffer material 31 for supporting the liquid crystal display panel 10.
  • the heat dissipating component 30 includes a third thermally conductive double-sided tape 34 in addition to the first thermally conductive double-sided tape 32.
  • the third thermal conductive double-sided adhesive 34 is disposed between the plastic frame 3 and the thermal buffer material 31.
  • the plastic frame 3 and the thermal buffer material 31 are connected by the third thermal conductive double-sided adhesive 34.
  • the third heat-conductive double-sided tape 34 functions the same as the second heat-conductive double-sided tape 33, and both fix the flexible printed circuit board 20 and perform heat conduction. Therefore, the second heat-conductive double-sided tape 33 can be used to replace the third. Thermal double-sided tape 34.
  • FIG. 4 is a schematic structural view of a heat-dissipating cushioning material 31 according to a third embodiment of the present invention.
  • the thermal conductive buffer material 31 is a flexible sheet having thermal conductivity, such as a thermoplastic elastomer TPE, etc.
  • a fourth thermal conduction pair is disposed on each of the opposite sides of the flexible sheet.
  • the surface adhesive 35 (the other side is not shown) connects a fourth heat-conductive double-sided tape 35 to the flexible printed circuit board 20 on one side of the opposite sides of the chip, and the other fourth heat-conductive double-sided tape is opposite to the opposite sides of the chip.
  • the flexible printed circuit board 20 on the other side is connected.
  • the first heat-conductive double-sided tape 32 is disposed at a geometric center position of the flexible sheet having thermal conductivity, and the first heat-conductive double-sided tape 32 is first connected to the chip 21, and then has heat conduction.
  • the flexible sheet is bent on both sides to form a space for accommodating the chip 21.
  • both sides of the heat-conductive buffer material 31 are connected to the flexible printed circuit board 20 through the fourth heat-conductive double-sided tape 35, and are fixed to the chip 21. Both ends, thereby forming a cladding of the chip 21.
  • the chip 21 on the flexible printed circuit board 20 is covered by the heat dissipating component 30, so that the heat generated by the chip 21 can be dissipated in time, thereby avoiding damage to the chip 21 due to excessive temperature and prolonging the liquid crystal.
  • the present invention can realize a narrow bezel design by fixing the flexible printed circuit board 20, and can prevent the flexible printed circuit board 20 from being warped and being scratched or stabbed by a hard object such as an iron frame.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Nonlinear Science (AREA)
  • Liquid Crystal (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

一种液晶显示装置，包括液晶显示面板（10）、设于所述液晶显示面板（10）一侧的柔性印刷电路板（20）以及设于所述柔性印刷电路板（20）上的用于驱动所述液晶显示面板（10）的芯片（21）。液晶显示装置还包括散热元件（30），所述散热元件（30）包覆所述芯片（21），使所述芯片（21）产生的热量通过所述散热元件（30）散发，避免因温度过高而损害芯片（21），延长了液晶显示装置的使用寿命。

Description

液晶显示装置
技术领域
本发明涉及液晶显示领域，特别涉及一种液晶显示装置。
背景技术
近年来，液晶显示装置因其轻薄、占用空间小、辐射小等特点，已经广泛应用于各个技术领域。
目前，一种液晶显示装置中，其液晶显示面板上设置有柔性印刷电路板，在柔性印刷电路板上设置芯片，该芯片用来驱动所述液晶显示面板，即采用所谓的覆晶薄膜技术（Chip On Film，COF）。但是，在液晶显示装置工作中，芯片产生大量的热量不能及时散发出来，导致芯片易损坏，缩短了液晶显示装置的使用寿命。同时，该柔性印刷电路板的长度大概在8mm左右，这样就出现覆晶薄膜无法像传统设计一样和液晶显示面板水平放置，需要向下弯折以节省空间。但如果覆晶薄膜自然状态下弯折，则在运输和使用过程中容易出现因翘起而摩擦前框造成刺伤，导致出现显示画面不良等问题。
发明内容
本发明的主要目的为提供一种液晶显示装置，旨在解决液晶显示面板上的驱动芯片的散热问题。
为了解决所述技术问题，本发明提供一种液晶显示装置，包括液晶显示面板、设于所述液晶显示面板一侧的柔性印刷电路板以及设于所述柔性印刷电路板上的用于驱动所述液晶显示面板的芯片，其中，还包括散热元件，所述散热元件包覆所述芯片，使所述芯片产生的热量通过所述散热元件散发，所述散热元件包括一导热缓冲材和一第一导热双面胶，所述导热缓冲材通过所述第一导热双面胶与所述芯片连接。
优选地，所述液晶显示装置还包括一导光板和一反射片，所述柔性印刷电路板的远离所述液晶显示面板的一端与所述导光板相对设置；所述反射片设于所述导光板与所述导热缓冲材之间，且所述反射片贴附于所述导光板上。
优选地，所述散热元件还包括一第二导热双面胶，所述第二导热双面胶设于所述反射片与所述导热缓冲材之间，所述反射片与所述导热缓冲材通过所述第二导热双面胶连接。
优选地，所述液晶显示装置还包括一胶框，所述胶框设于所述导光板与所述导热缓冲材之间，用于支撑所述液晶显示面板；所述散热元件还包括一第三导热双面胶，所述第三导热双面胶设于所述胶框与所述导热缓冲材之间，所述胶框与所述导热缓冲材通过所述第三导热双面胶连接。
优选地，所述导热缓冲材为具有导热性的柔性薄片，所述柔性薄片正反两面的异侧分别设有一第四导热双面胶，所述柔性薄片通过所述第四导热双面胶固定于所述芯片相对两侧的所述柔性印刷电路板上。
优选地，所述第一导热双面胶设于所述柔性薄片的几何中心位置。
优选地，所述芯片为源极驱动芯片或栅极驱动芯片。
本发明还提供一种液晶显示装置，包括液晶显示面板、设于所述液晶显示面板一侧的柔性印刷电路板以及设于所述柔性印刷电路板上的用于驱动所述液晶显示面板的芯片，其中，还包括散热元件，所述散热元件包覆所述芯片，使所述芯片产生的热量通过所述散热元件散发。
优选地，所述散热元件包括一导热缓冲材和一第一导热双面胶，所述导热缓冲材通过所述第一导热双面胶与所述芯片连接。
优选地，所述液晶显示装置还包括一导光板，所述柔性印刷电路板的远离所述液晶显示面板的一端与所述导光板相对设置。
优选地，所述液晶显示装置还包括一反射片，所述反射片设于所述导光板与所述导热缓冲材之间，且所述反射片贴附于所述导光板上。
优选地，所述散热元件还包括一第二导热双面胶，所述第二导热双面胶设于所述反射片与所述导热缓冲材之间，所述反射片与所述导热缓冲材通过所述第二导热双面胶连接。
优选地，所述液晶显示装置还包括一胶框，所述胶框设于所述导光板与所述导热缓冲材之间，用于支撑所述液晶显示面板。
优选地，所述散热元件还包括一第三导热双面胶，所述第三导热双面胶设于所述胶框与所述导热缓冲材之间，所述胶框与所述导热缓冲材通过所述第三导热双面胶连接。
优选地，所述导热缓冲材为具有导热性的柔性薄片，所述柔性薄片正反两面的异侧分别设有一第四导热双面胶，所述柔性薄片通过所述第四导热双面胶固定于所述芯片相对两侧的所述柔性印刷电路板上。
优选地，所述第一导热双面胶设于所述柔性薄片的几何中心位置。
优选地，所述芯片为源极驱动芯片或栅极驱动芯片。
本发明通过在芯片外侧覆盖有散热元件，使芯片产生的热量及时散发出，避免因温度过高而损害芯片，延长了液晶显示装置的使用寿命。
附图说明
图1是本发明液晶显示装置第一实施例的结构示意图；
图2是图1中柔性印刷电路板与液晶显示面板连接处C处的放大图；
图3是本发明液晶显示装置第二实施例的结构示意图；
图4是本发明液晶显示装置第三实施例中导热缓冲块的结构示意图。
本发明目的的实现、功能特点及优点将结合实施例，参照附图做进一步说明。
具体实施方式
应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。
参照图1和图2，图1为本发明液晶显示装置第一实施例的结构示意图。图2为图1中柔性印刷电路板与液晶显示面板连接处C处的放大图。
在本实施例中，液晶显示装置包括液晶显示面板10、设于液晶显示面板10一侧的柔性印刷电路板20以及设于柔性印刷电路板20上的用于驱动液晶显示面板10的芯片21，其中，还包括散热元件30，散热元件30包覆芯片21，使芯片21产生的热量通过散热元件30散发，避免因温度过高而损害芯片，延长了液晶显示装置的使用寿命。还有，本实施例中的芯片21为源极驱动芯片或栅极驱动芯片。
具体的实施例中，散热元件30包括一导热缓冲材31和第一导热双面胶32，导热缓冲材31用于将芯片21的热量散发，其通过第一导热双面胶32与芯片21连接。本实施例中，导热缓冲材31为导热泡棉，可以呈板状设置，其表平面中部具有可容置芯片21的凹槽，从而对芯片21形成包覆。凹槽的槽底平面可通过第一导热双面胶32与芯片21的表面粘接，由于导热缓冲材31与芯片21之间通过第一导热双面胶32连接，芯片21所产生的热量可以通过第一导热双面胶32传导至导热缓冲材31，再由导热缓冲材31将热量散发出去。
本实施例中，液晶显示装置还包括一导光板60，柔性印刷电路板20的远离液晶显示面板10的一端与导光板60相对设置。具体地，导光板60对应液晶显示面板10设置，在导光板60与液晶显示面板10的一侧，导光板60与液晶显示面板10之间垫设有缓冲片2，该缓冲片2用于支撑液晶显示面板10。柔性印刷电路板20由液晶显示面板10处向导光板60处弯折，使得导热缓冲材31与导光板60相对。在导光板60与导热缓冲材31之间设有反射片50，该反射片50贴附于导光板60上。由于柔性印刷电路板20向导光板60弯折，这样就可使得液晶显示装置中用于收容柔性印刷电路板20的前框1上与观众相对的边框11的宽度W大为减少，从而实现液晶显示装置的窄边框设计。柔性印刷电路板20弯折后，可通过多种方式与导光板60或者其它物体连接，例如，可通过胶水或者双面胶等，从而将柔性印刷电路板20固定，避免翘曲后被铁框等硬物刮伤或刺伤；同时有助于更窄边框的设计。本实施例优选通过在柔性印刷电路板20与导光板60之间设置导热双面胶，从而将柔性印刷电路板20固定。如图2所示，散热元件30除了第一导热双面胶32外，还设有一第二导热双面胶33，该第二导热双面胶33设于反射片50与导热缓冲材31之间，反射片50与导热缓冲材31通过第二导热双面胶33连接。本实施例中，由于设有第二导热双面胶33，可将柔性印刷电路板20与反射片50固定，避免翘曲后被铁框等硬物刮伤或刺伤；同时有助于更窄边框的设计。
参照图3，图3为本发明液晶显示装置第二实施例的结构示意图。本实施例与第一实施例不同之处在于，液晶显示装置包括一胶框3，用所述胶框3取代第一实施例中的缓冲片2。该胶框3设于导光板60与导热缓冲材31之间，用于支撑液晶显示面板10。散热元件30除第一导热双面胶32外，还包括一第三导热双面胶34。该第三导热双面胶34设于胶框3与导热缓冲材31之间，胶框3与导热缓冲材31通过第三导热双面胶34连接。第三导热双面胶34与第二导热双面胶33所起的作用相同，都是将柔性印刷电路板20固定并起到热传导的作用，因此也可用第二导热双面胶33替换第三导热双面胶34。
参照图4，图4为本发明第三实施例中导热缓冲材31的结构示意图。与前述第一、二实施例中的区别在于，导热缓冲材31为一具有导热性的柔性薄片，例如热塑性弹性体TPE等，在该柔性薄片正反两面的异侧分别设置有一第四导热双面胶35（另一面未示出），将一第四导热双面胶35与芯片相对两侧中一侧的柔性印刷电路板20连接，另一第四导热双面胶与芯片相对两侧的另一侧的柔性印刷电路板20连接。具体地，在设置具有导热性的柔性薄片时，在具有导热性的柔性薄片的几何中心位置设置第一导热双面胶32，先将第一导热双面胶32连接芯片21，然后将具有导热性的柔性薄片两侧弯折，形成一可容置芯片21的空间，接着，通过第四导热双面胶35将导热缓冲材31的两侧连接到柔性印刷电路板20上，固定于芯片21的两端，从而形成对芯片21的包覆。
本发明液晶显示装置实施例中，通过散热元件30包覆柔性印刷电路板20上的芯片21，使芯片21产生的热量能及时散发出，可避免因温度过高而损害芯片21，延长了液晶显示装置的使用寿命，此外，本发明由于将柔性印刷电路板20固定，可实现窄边框设计，并且可避免柔性印刷电路板20产生翘曲，被铁框等硬物刮伤或刺伤。
以上所述仅为本发明的优选实施例，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构变换，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。

Claims (17)

  1. 一种液晶显示装置，包括液晶显示面板、设于所述液晶显示面板一侧的柔性印刷电路板以及设于所述柔性印刷电路板上的用于驱动所述液晶显示面板的芯片，其特征在于，还包括散热元件，所述散热元件包覆所述芯片，使所述芯片产生的热量通过所述散热元件散发，所述散热元件包括一导热缓冲材和一第一导热双面胶，所述导热缓冲材通过所述第一导热双面胶与所述芯片连接。
  2. 如权利要求1所述的液晶显示装置，其特征在于，所述液晶显示装置还包括一导光板和一反射片，所述柔性印刷电路板的远离所述液晶显示面板的一端与所述导光板相对设置；所述反射片设于所述导光板与所述导热缓冲材之间，且所述反射片贴附于所述导光板上。
  3. 如权利要求2所述的液晶显示装置，其特征在于，所述散热元件还包括一第二导热双面胶，所述第二导热双面胶设于所述反射片与所述导热缓冲材之间，所述反射片与所述导热缓冲材通过所述第二导热双面胶连接。
  4. 如权利要求2所述的液晶显示装置，其特征在于，所述液晶显示装置还包括一胶框，所述胶框设于所述导光板与所述导热缓冲材之间，用于支撑所述液晶显示面板；所述散热元件还包括一第三导热双面胶，所述第三导热双面胶设于所述胶框与所述导热缓冲材之间，所述胶框与所述导热缓冲材通过所述第三导热双面胶连接。
  5. 如权利要求1所述的液晶显示装置，其特征在于，所述导热缓冲材为具有导热性的柔性薄片，所述柔性薄片正反两面的异侧分别设有一第四导热双面胶，所述柔性薄片通过所述第四导热双面胶固定于所述芯片相对两侧的所述柔性印刷电路板上。
  6. 如权利要求6所述的液晶显示装置，其特征在于，所述第一导热双面胶设于所述柔性薄片的几何中心位置。
  7. 如权利要求1所述的液晶显示装置，其特征在于，所述芯片为源极驱动芯片或栅极驱动芯片。
  8. 一种液晶显示装置，包括液晶显示面板、设于所述液晶显示面板一侧的柔性印刷电路板以及设于所述柔性印刷电路板上的用于驱动所述液晶显示面板的芯片，其特征在于，还包括散热元件，所述散热元件包覆所述芯片，使所述芯片产生的热量通过所述散热元件散发。
  9. 如权利要求8所述的液晶显示装置，其特征在于，所述散热元件包括一导热缓冲材和一第一导热双面胶，所述导热缓冲材通过所述第一导热双面胶与所述芯片连接。
  10. 如权利要求9所述的液晶显示装置，其特征在于，所述液晶显示装置还包括一导光板，所述柔性印刷电路板的远离所述液晶显示面板的一端与所述导光板相对设置。
  11. 如权利要求10所述的液晶显示装置，其特征在于，所述液晶显示装置还包括一反射片，所述反射片设于所述导光板与所述导热缓冲材之间，且所述反射片贴附于所述导光板上。
  12. 如权利要求11所述的液晶显示装置，其特征在于，所述散热元件还包括一第二导热双面胶，所述第二导热双面胶设于所述反射片与所述导热缓冲材之间，所述反射片与所述导热缓冲材通过所述第二导热双面胶连接。
  13. 如权利要求11所述的液晶显示装置，其特征在于，所述液晶显示装置还包括一胶框，所述胶框设于所述导光板与所述导热缓冲材之间，用于支撑所述液晶显示面板。
  14. 如权利要求13所述的液晶显示装置，其特征在于，所述散热元件还包括一第三导热双面胶，所述第三导热双面胶设于所述胶框与所述导热缓冲材之间，所述胶框与所述导热缓冲材通过所述第三导热双面胶连接。
  15. 如权利要求9所述的液晶显示装置，其特征在于，所述导热缓冲材为具有导热性的柔性薄片，所述柔性薄片正反两面的异侧分别设有一第四导热双面胶，所述柔性薄片通过所述第四导热双面胶固定于所述芯片相对两侧的所述柔性印刷电路板上。
  16. 如权利要求15所述的液晶显示装置，其特征在于，所述第一导热双面胶设于所述柔性薄片的几何中心位置。
  17. 如权利要求8所述的液晶显示装置，其特征在于，所述芯片为源极驱动芯片或栅极驱动芯片。
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CN102867476B (zh) * 2012-09-19 2015-04-15 深圳市华星光电技术有限公司 显示装置
KR102046864B1 (ko) * 2013-03-13 2019-11-20 삼성전자주식회사 유연성 디스플레이 장치
CN103249246B (zh) * 2013-05-06 2016-06-01 深圳市华星光电技术有限公司 电路板及显示装置
CN106793743A (zh) * 2016-12-12 2017-05-31 晟光科技股份有限公司 一种低成本fpc设计实现方法
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CN109581715B (zh) * 2019-01-07 2021-07-23 惠州市华星光电技术有限公司 显示模组
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