CN1163796C - 用于光致抗蚀剂的交联剂及含该交联剂的光致抗蚀剂组合物 - Google Patents
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Abstract
本发明涉及用于光致抗蚀剂组合物的交联剂,该光致抗蚀剂组合物适用于使用KrF(248nm),ArF(193nm),电子束,离子束或EUV光源的照相平板印刷法中。按照本发明,优选的交联剂含有(i)由下列化学分子式1表示的化合物和/或(ii)选自由丙烯酸,甲基丙烯酸和马来酸酐所组成的组中的一种或多种化合物的一种共聚物。
Description
技术领域
本发明涉及可用于光致抗蚀剂组合物的交联剂,其聚合物,以及含有该交联剂的光致抗蚀剂组合物。更具体地说,本发明涉及用于光致抗蚀剂的交联剂以及使用该交联剂的光致抗蚀剂组合物,该光致抗蚀剂适用于当制备一种高度集成的半导体元件的微电路时使用KrF(248nm),ArF(193nm),电子束,离子束或EUV光源的照相平板印刷法中。
背景技术
近年来,已经证明化学放大型DUV(深紫外)光致抗蚀剂在半导体制造业中用于制造微电路的过程中能用于获得高的灵敏度。这些光致抗蚀剂通常是将光酸发生剂与具有酸不稳定结构的聚合物基质高分子混合而制备。
根据这种光致抗蚀剂的反应机理,当它被光源照射时,光酸发生剂产生酸,并且该聚合物基质高分子的主链或支链与所产生的酸交联以形成一种交联的结构。因此,暴露于光线的部分不能被显影液所溶解并保持不变,从而在基材上产生掩模的负的影像。在平版印刷过程中,图案分辨率取决于光源的波长—波长越短,可形成的图案就越小。但是,当降低光源的波长以形成微型图案(例如在使用193nm的波长或者EUV(超紫外)光线的情况下)时,其缺点是曝光装置的镜头会因该光源而变形,从而缩短其寿命。
传统交联剂三聚氰胺具有受限制的数目(三个)的可与酸交联的官能团。而且当三聚氰胺用作交联剂时必须产生大量的酸,因为交联反应消耗酸。结果是这种交联剂需要较高能量的光源曝光。
为了克服上述缺点,需要可与光致抗蚀剂树脂交联的化学放大型化合物并使用很少量的能量。但是这种化学放大型交联剂至今还未开发出来。
另外,在高度完整的图案中,显影液可以渗透入到交联位置,使交联位置溶胀。因此为了形成高度完整的图案,需要能够更精巧地进行交联的新交联剂的加入。
图1是使用含有一种传统交联剂(J.Photopolymer Science andTechnology(光聚合物科学和技术),第11卷,第3期,1998,第507-512页)的光致抗蚀剂组合物而形成的光致抗蚀图案。该图案是由使用ArF光源和单交联剂的照相平版印刷术而得到的0.225微米L/S图案。
由图1可以看出,在传统的光致抗蚀图案中产生了溶胀,所以很难获得低于0.225微米L/S的图案。
发明内容
本发明的目的是提供一种光致抗蚀剂交联剂,和制备该交联剂的方法。
本发明的另一目的是提供含有该交联剂的光致抗蚀剂组合物,和制备该组合物的方法。
本发明的一个进一步的目的是提供一种通过使用该光致抗蚀剂组合物而制造的半导体元件。
为了达到上述目的,本发明提供一种含有由下列化学分子式1表示的化合物的交联剂单体:
<化学分子式1>
其中,R1和R2分别代表直链或支链的选择性地包含一个酯基、酮基、羧基或缩醛基的C1-10烷基,或直链或支链的包含至少一个羟基和选择性地包含一个酯基、酮基、羧基或缩醛基的C1-10烷基;R3代表氢或甲基。
为了达到本发明的另一个目的,提供了光致抗蚀剂组合物,该组合物含有(i)一种选自由下列化学分子式1表示的单体、其均聚物、其共聚物和其混合物组成的组中的一种的交联剂,
<化学分子式1>
其中,R1和R2分别代表直链或支链的选择性地包含一个酯基、酮基、羧基或缩醛基的C1-10烷基,或直链或支链的包含至少一个羟基和选择性地包含一个酯基、酮基、羧基或缩醛基的C1-10烷基;R3代表氢或甲基;(ii)一种光致抗蚀剂聚合物,其在酸存在下通过所述交联剂交联;(iii)一种光酸发生剂和(iv)一种有机溶剂。
图1为使用一种传统交联剂制得的光致抗蚀图案。
图2-图12为使用本发明的交联剂制得的光致抗蚀图案。
本发明人为达到本发明的上述目的进行了周密的研究,发现由下列化学分子式1表示的化合物具有在负光致抗蚀剂聚合物的形成中能够作为交联单体的合适的性质。
<化学分子式1>
其中,R1和R2分别代表直链或支链的选择性地包含一个酯基、酮基、羧基或缩醛基的C1-10烷基,或直链或支链的包含至少一个羟基和选择性地包含一个酯基、酮基、羧基或缩醛基的C1-10烷基;R3代表氢或甲基。
具有源于化学分子式1的化合物的重复单元的交联剂聚合物与含有羟基的光致抗蚀剂树脂在酸存在下反应,以诱导光致抗蚀剂聚合物之间的交联反应。该化合物是一种化学放大型交联剂,因此可进一步与光致抗蚀剂树脂结合产生酸(H+)以诱导连续的链交联。因此光致抗蚀剂树脂的暴露部分可在半导体制造工艺的后烘焙步骤中成形为高密度,从而获得优良的图案。
本发明的光致抗蚀剂交联剂可以是由化学分子式1表示的化合物的均聚物;但是更优选的是,该交联剂是(i)由化学分子式1表示的化合物和(ii)作为第二共聚单体的选自由丙烯酸酯,甲基丙烯酸酯和马来酸酐所组成的组中的一种或多种化合物的共聚物。在此情况下,本发明的交联剂可以由下列化学分子式2或化学分子式3表示:
<化学分子式2>
其中,其中,R1和R2分别代表直链或支链的选择性地包含一个酯基、酮基、羧基或缩醛基的C1-10烷基,或直链或支链的包含至少一个羟基和选择性地包含一个酯基、酮基、羧基或缩醛基的C1-10烷基;R3和R4分别代表氢或甲基;a∶b=10-100摩尔%∶0-90摩尔%。
<化学分子式3>
其中,其中,R1和R2分别代表直链或支链的选择性地包含一个酯基、酮基、羧基或缩醛基的C1-10烷基,或直链或支链的包含至少一个羟基和选择性地包含一个酯基、酮基、羧基或缩醛基的C1-10烷基;R3代表氢或甲基;a∶b=10-90摩尔%∶10-90摩尔%。
本发明的交联剂的反应机理将参考后面所示的反应路线1进行描述。
首先,本发明的交联剂与光致抗蚀剂树脂混合,并将该混合物涂敷在一种常规的半导体基材上(步骤1)。然后,当基材的预定区域暴露于光线时,该暴露部分产生酸(步骤2)。由于暴露部分产生的酸的作用,本发明的交联剂与光致抗蚀剂结合在一起,这种交联将进一步产生酸,从而发生连续的链交联(步骤3)。
<反应路线1>
本发明的交联聚合物的制备在下面的实施例1-8中具体描述。
在实施例1-8中,AIBN用作聚合引发剂,但其它常规的自由基聚合引发剂如月桂基过氧化物可以代替它使用。
在这些实施例中,四氢呋喃用作聚合作用的溶剂,但其它溶剂如丙二醇,甲苯,甲醚和乙酸酯可以代替它使用。
使用本发明交联剂制备负光致抗蚀剂组合物的方法描述如下:
由于本发明的交联剂是化学放大型交联剂,本发明的光致抗蚀剂组合物含有(i)一种负光致抗蚀剂树脂,(ii)一种本发明的交联剂,(iii)一种光酸发生剂与(iv)一种有机溶剂的结合,其中这些物质被混合在一起。
作为光酸发生剂,优选使用的是硫化物或鎓类化合物。例如,该光酸发生剂可以是选自由六氟化磷酸二苯碘、六氟化砷酸二苯碘、六氟化锑酸二苯碘、三氟甲磺酸二苯基对甲氧基苯基锍、三氟甲磺酸二苯基对亚苄基锍、三氟甲磺酸二苯基对异丁基苯基锍、三氟甲磺酸二苯基对叔丁基苯基锍、六氟化磷酸三苯基锍、六氟化砷酸三苯基锍、六氟化锑酸三苯基锍、三氟甲磺酸三苯基锍、和三氟甲磺酸二丁基萘基锍所组成的组中的一种或多种化合物。
作为有机溶剂,可以使用环己酮、3-甲氧基丙酸甲酯、3-乙氧基丙酸乙酯,丙二醇甲基醚乙酸酯或其它常规的有机溶剂。
将按本发明制备的光致抗蚀剂组合物旋转涂敷在硅干胶片上形成一种薄膜,将该薄膜在炉子中或热的平板上于70-200℃,更优选80-150℃进行“软烘烤”1-5分钟。然后将该光致抗蚀剂薄膜通过使用一种深紫外曝光器或者一种激基缔合物激光曝光器进行曝光,然后在10-200℃,更优选100-200℃下进行“后烘烤”。作为光源,可以使用ArF光,KrF光,电子束,X射线,EUV(超紫外),DUV(深紫外)或类似光源。曝光能量优选的是0.1-100毫焦耳/平方厘米。
通过将该干胶片在一种碱性显影液如2.38重量%或2.5重量%的四甲基氢氧化铵(TMAH)水溶液中浸渍预定时间,优选1.5分钟而将曝光的干胶片显影,得到一种超微图案(图2)。
当用本发明的新交联剂制备光致抗蚀剂组合物时,光致抗蚀剂树脂的暴露部分和非暴露部分之间的成形能力的差别变得很明显,从而能得到具有优良轮廓的光致抗蚀图案。另外,本发明的交联剂在仅仅使用少量的光酸发生剂时能得到有效的结果,因为该交联剂是化学放大型交联剂。因此由于使用大量的光酸发生剂而产生的问题可以得到克服。该光致抗蚀剂组合物表现出优良的光敏性,因此曝光时使用低照射能量也能得到有效的曝光。因此适用于使用非常短的波长的光源如ArF(193nm)的照相平板印刷术中。
具体实施方式
通过下面的实施例将对本发明进行更详细的描述,但是应该注意本发明并不限定于这些实施例。
实施例1:聚(3,3-二甲氧基丙烯)的合成
将由下列化学分子式4表示的丙烯醛(30克),AIBN(0.6克)和四氢呋喃(75克)装在一个200毫升烧瓶中,在氮气或氩气的气氛中在65℃下反应8小时。聚合反应完成后,将聚丙烯醛从乙醚中沉淀出来(产率:60%)。
将所得的聚丙烯醛(20克)和甲醇(200克)装在一个500毫升的圆底烧瓶中并充分混合。向其中加入三氟甲磺酸(0.5克),将所得混合物在回流下于80℃加热24小时,然后用TAMH溶液中和至pH7-8。然后将反应混合物用旋转蒸发器浓缩,所得残余物用蒸馏水沉淀。将该沉淀在真空中干燥,得到化学分子式5的聚(3,3-二甲氧基丙烯)树脂(产率:60%)。通过NMR谱中8-9ppm的醛峰的消失证明是化学分子式5的化合物。化学分子式5的化合物的分子量优选的是在4000-6000的范围内。
<化学分子式4>
<化学分子式5>
在该分子式中,n代表参加均聚反应的单体的数目。
实施例2:聚(3,3-二甲氧基丙烯/丙烯酸)的合成
将化学分子式4表示的丙烯醛(30克),丙烯酸(3克),AIBN(0.66克)和四氢呋喃(80克)装在一个200毫升烧瓶中,将该混合物在氮气或氩气的气氛中在60℃下反应8小时。聚合反应完成后,通过用水沉淀得到聚合物(16克,产率:50%)。将所得的聚合物(16克)和甲醇(300克)装在一个圆底烧瓶中并充分混合。向其中加入三氟甲磺酸(0.8克),将所得混合物在回流下于80℃加热8小时,然后用TAMH溶液中和至pH7-8。然后将反应混合物用旋转蒸发器浓缩,将所得溶液溶解在氯仿(300克)中。将溶液放在分液漏斗中,向其中加入蒸馏水(300克)。然后分出蒸馏水层并在减压下蒸发浓缩得到化学分子式6的聚(3,3-二甲氧基丙烯/丙烯酸)树脂(产率:70%,分子量:4000-7000)。
<化学分子式6>
在该分子式中,a和b分别代表每个共聚单体的聚合比例。
实施例3:聚(3,3-二乙氧基丙烯)的合成
重复实施例1的步骤,所不同的是用乙醇代替甲醇,获得由化学分子式7表示的化合物聚(3,3-二乙氧基丙烯)(产率:67%)。
<化学分子式7>
在该分子式中,n代表参加均聚反应的单体的数目。
实施例4:聚(3,3-二乙氧基丙烯/丙烯酸)的合成
重复实施例2的步骤,所不同的是用乙醇代替甲醇,获得由化学分子式8表示的化合物聚(3,3-二乙氧基丙烯/丙烯酸)(产率:67%)。
<化学分子式8>
在该分子式中,a和b分别代表每个共聚单体的聚合比例。
实施例5:聚(3,3-二甲氧基丙烯/马来酸酐)的合成
将化学分子式9的3,3-二甲氧基丙烯(0.3摩尔),马来酸酐(0.1摩尔),AIBN(0.8克)和四氢呋喃(42克)装在一个100毫升烧瓶中,将该混合物在氮气或氩气的气氛中在65℃下反应8小时。聚合反应完成后,将聚合物从乙醚中沉淀出来。将该聚合物沉淀在真空中干燥,得到纯的由下列化学分子式10表示的树脂。
<化学分子式9>
<化学分子式10>
其中,a和b分别代表每个共聚单体的聚合比例。
实施例6:聚(3,3-二乙氧基丙烯/马来酸酐)的合成
重复实施例5的步骤,所不同的是使用化学分子式11的3,3-二乙氧基丙烯(0.3摩尔)代替化学分子式9的3,3-二甲氧基丙烯(0.3摩尔),获得由化学分子式12表示的化合物(产率:51%)。
<化学分子式11>
<化学分子式12>
在该分子式中,a和b分别代表每个共聚单体的聚合比例。
实施例7:聚(3,3-二甲氧基-2-甲基丙烯)的合成
重复实施例1的步骤,所不同的是用甲基丙烯醛代替丙烯醛,获得由化学分子式13表示的化合物聚(3,3-二甲氧基-2-甲基丙烯)。
<化学分子式13>
在该分子式中,n代表参加均聚反应的单体的数目。
实施例8:聚(3,3-二乙氧基-2-甲基丙烯)的合成
重复实施例3的步骤,所不同的是用甲基丙烯醛代替丙烯醛,获得由化学分子式14表示的化合物聚(3,3-二乙氧基-2-甲基丙烯)。
<化学分子式14>
在该分子式中,n代表参加均聚反应的单体的数目。
实施例9
将(i)由下列化学分子式15表示的光致抗蚀剂树脂,即聚(二环[2.2.1]庚-5-烯/二环[2.2.1]庚-5-烯)2-羧酸2-羟乙基酯/马来酸酐)(20克),(ii)得自本发明实施例1的聚(3,3-二甲氧基丙烯)交联剂(5克),和(iii)作为光酸发生剂的三氟甲磺酸三苯基锍(0.6克),溶解在作为有机溶剂的丙二醇甲基醚乙酸酯(200克)中,制成一种光致抗蚀剂组合物。
<化学分子式15>
将制得的光致抗蚀剂组合物涂敷在硅干胶片上,并且在110℃下软烘焙90秒,通过使用ArF曝光器进行曝光,再在110℃下后烘焙90秒,然后在2.38重量%TMAH显影液中显影。结果得到一种如图3所示的0.13微米L/S超微负图案。
此时曝光的能量为18毫焦耳/平方厘米。在如此低强度的曝光能量下,该光致抗蚀剂组合物的成形敏感度非常好,并且没有观察到图1中显示的溶胀。这些结果归于聚(3,3-二甲氧基丙烯)树脂,本发明的交联剂,以及由它们所产生的至密交联的非常优良的可成形性。因此该超微图案表现出优良的图案轮廓。
实施例10
将(i)由化学分子式15表示的光致抗蚀剂树脂,即聚(二环[2.2.1]庚-5-烯/二环[2.2.1]庚-5-烯2-羧酸2-羟乙基酯/马来酸酐)(20克),(ii)得自本发明实施例2的聚(3,3-二甲氧基丙烯/丙烯酸)交联剂(20克),和(iii)作为光酸发生剂的三氟甲磺酸三苯基锍(0.7克),溶解在作为有机溶剂的丙二醇甲基醚乙酸酯(200克)中,制成一种光致抗蚀剂组合物。
将制得的光致抗蚀剂组合物涂敷在硅干胶片上,并且在110℃下软烘焙90秒,通过使用ArF曝光器进行曝光,再在110℃下后烘焙90秒,然后在2.38重量%TMAH显影液中显影,得到一种0.13微米L/S超微负图案。此时虽然如实施例1一样曝光的能量非常弱(18毫焦耳/平方厘米),但得到了具有优良的图案轮廓的超微图案(图4)。
实施例11-16
用从实施例3至实施例8获得的交联剂重复相同的步骤,结果得到如实施例9和10中的优良的微图案(图5-10)。
实施例17
将(i)由化学分子式16表示的光致抗蚀剂树脂(20克),(ii)得自本发明实施例2的聚(3,3-二甲氧基丙烯/丙烯酸)交联剂(10克),和(iii)作为光酸发生剂的三氟甲磺酸三苯基锍(0.6克),溶解在作为有机溶剂的丙二醇甲基醚乙酸酯(200克)中,制成一种光致抗蚀剂组合物。
将制得的光致抗蚀剂组合物涂敷在硅干胶片上,并且在110℃下软烘焙90秒,通过使用ArF曝光器进行曝光,再在110℃下后烘焙90秒,然后在2.38重量%TMAH显影液中显影,得到一种0.13微米L/S超微负图案。此时虽然如实施例1一样曝光的能量非常弱(15毫焦耳/平方厘米),但得到了具有优良的图案轮廓的超微图案(图11)。
<化学分子式16>
实施例18
重复实施例17的步骤,所不同的是使用化学分子式17的光致抗蚀剂树脂代替化学分子式16的树脂,得到一种0.18微米L/S超微负图案(图12)。
<化学分子式17>
实施例19
重复实施例17的步骤,所不同的是使用化学分子式18的光致抗蚀剂树脂代替化学分子式16的树脂,得到一种0.20微米L/S超微负图案。
<化学分子式18>
实施例20
重复实施例17的步骤,所不同的是使用化学分子式19的光致抗蚀剂树脂代替化学分子式16的树脂,得到一种0.20微米L/S超微负图案。
实施例21
重复实施例17的步骤,所不同的是使用化学分子式20的光致抗蚀剂树脂代替化学分子式16的树脂,得到一种0.20微米L/S超微负图案。
<化学分子式20>
Claims (10)
3.按照权利要求1的负光致抗蚀剂组合物,其中的光酸发生剂是选自由六氟化磷酸二苯碘、六氟化砷酸二苯碘、六氟化锑酸二苯碘、三氟甲磺酸二苯基对甲氧基苯基锍、三氟甲磺酸二苯基对亚苄基锍、三氟甲磺酸二苯基对异丁基苯基锍、三氟甲磺酸二苯基对叔丁基苯基锍、六氟化磷酸三苯基锍、六氟化砷酸三苯基锍、六氟化锑酸三苯基锍、三氟甲磺酸三苯基锍、和三氟甲磺酸二丁基萘基锍所组成的组中的一种或多种化合物。
4.按照权利要求1的负光致抗蚀剂组合物,其中的有机溶剂选自由环己酮、3-甲氧基丙酸甲酯,3-乙氧基丙酸乙酯和丙二醇甲基醚乙酸酯所组成的组中。
5.按照权利要求1的负光致抗蚀剂组合物,其中所述交联剂选自由聚(3,3-二甲氧基丙烯)、聚(3,3-二乙氧基丙烯)、聚(3,3-二甲氧基丙烯/丙烯酸)、聚(3,3-二乙氧基丙烯)、聚(3,3-二乙氧基丙烯/丙烯酸)、聚(3,3-二甲氧基丙烯/马来酸酐)、聚(3,3-二乙氧基丙烯/马来酸酐)、聚(3,3-二甲氧基-2-甲基丙烯)和聚(3,3-二乙氧基-2-甲基丙烯)组成组中。
6.一种用于形成光致抗蚀图案的方法,该方法包括步骤(a)将权利要求1的组合物涂敷在一种干胶片上,(b)通过使用曝光器将该干胶片暴露在光线下,和(c)将曝光的干胶片显影。
7.按照权利要求6的方法,其中的光源选自由波长为193nm的ArF,波长为248nm的KrF,电子束,X射线,EUV,DUV所组成的组中。
8.按照权利要求6的方法,其中的显影步骤通过使用一种碱性显影液而进行。
9.按照权利要求8的方法,其中的碱性显影液为2.38重量%或2.5重量%的四甲基氢氧化铵水溶液。
10.按照权利要求1的负光致抗蚀剂组合物在制造半导体元件中的应用。
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Families Citing this family (327)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100546105B1 (ko) * | 1999-11-03 | 2006-01-24 | 주식회사 하이닉스반도체 | 신규의 포토레지스트용 중합체 및 이를 함유하는포토레지스트 조성물 |
KR100359862B1 (ko) * | 1999-12-23 | 2002-11-09 | 주식회사 하이닉스반도체 | 난반사 방지막용 중합체와 그 제조방법 |
JP4790153B2 (ja) * | 2000-09-01 | 2011-10-12 | 富士通株式会社 | ネガ型レジスト組成物、レジストパターンの形成方法及び電子デバイスの製造方法 |
KR100415091B1 (ko) * | 2002-03-26 | 2004-01-13 | 주식회사 하이닉스반도체 | 미세패턴 형성 방법 |
KR100478982B1 (ko) * | 2002-05-02 | 2005-03-25 | 금호석유화학 주식회사 | 신규 산발생제 및 이를 함유한 박막 조성물 |
JP4393258B2 (ja) * | 2003-08-29 | 2010-01-06 | 富士フイルム株式会社 | 画像記録材料及び平版印刷版 |
KR100680405B1 (ko) * | 2003-11-19 | 2007-02-08 | 주식회사 하이닉스반도체 | Euv용 포토레지스트 조성물 및 이를 이용한포토레지스트 패턴 형성 방법 |
KR100732301B1 (ko) * | 2005-06-02 | 2007-06-25 | 주식회사 하이닉스반도체 | 포토레지스트 중합체, 포토레지스트 조성물 및 이를 이용한반도체 소자의 제조 방법 |
US7666575B2 (en) * | 2006-10-18 | 2010-02-23 | Az Electronic Materials Usa Corp | Antireflective coating compositions |
US7749680B2 (en) * | 2007-01-05 | 2010-07-06 | Hynix Semiconductor Inc. | Photoresist composition and method for forming pattern of a semiconductor device |
US10378106B2 (en) | 2008-11-14 | 2019-08-13 | Asm Ip Holding B.V. | Method of forming insulation film by modified PEALD |
US9394608B2 (en) | 2009-04-06 | 2016-07-19 | Asm America, Inc. | Semiconductor processing reactor and components thereof |
US8802201B2 (en) | 2009-08-14 | 2014-08-12 | Asm America, Inc. | Systems and methods for thin-film deposition of metal oxides using excited nitrogen-oxygen species |
US9312155B2 (en) | 2011-06-06 | 2016-04-12 | Asm Japan K.K. | High-throughput semiconductor-processing apparatus equipped with multiple dual-chamber modules |
US10364496B2 (en) | 2011-06-27 | 2019-07-30 | Asm Ip Holding B.V. | Dual section module having shared and unshared mass flow controllers |
US10854498B2 (en) | 2011-07-15 | 2020-12-01 | Asm Ip Holding B.V. | Wafer-supporting device and method for producing same |
US20130023129A1 (en) | 2011-07-20 | 2013-01-24 | Asm America, Inc. | Pressure transmitter for a semiconductor processing environment |
JP5840899B2 (ja) * | 2011-08-29 | 2016-01-06 | 積水化学工業株式会社 | ポリビニルアセタール樹脂の製造方法 |
US9017481B1 (en) | 2011-10-28 | 2015-04-28 | Asm America, Inc. | Process feed management for semiconductor substrate processing |
US9659799B2 (en) | 2012-08-28 | 2017-05-23 | Asm Ip Holding B.V. | Systems and methods for dynamic semiconductor process scheduling |
JP5927095B2 (ja) * | 2012-09-28 | 2016-05-25 | 富士フイルム株式会社 | 感活性光線性又は感放射線性組成物、並びに、それを用いたレジスト膜、マスクブランクス、及びレジストパターン形成方法 |
US10714315B2 (en) | 2012-10-12 | 2020-07-14 | Asm Ip Holdings B.V. | Semiconductor reaction chamber showerhead |
US20160376700A1 (en) | 2013-02-01 | 2016-12-29 | Asm Ip Holding B.V. | System for treatment of deposition reactor |
US9484191B2 (en) | 2013-03-08 | 2016-11-01 | Asm Ip Holding B.V. | Pulsed remote plasma method and system |
US9589770B2 (en) | 2013-03-08 | 2017-03-07 | Asm Ip Holding B.V. | Method and systems for in-situ formation of intermediate reactive species |
US9240412B2 (en) | 2013-09-27 | 2016-01-19 | Asm Ip Holding B.V. | Semiconductor structure and device and methods of forming same using selective epitaxial process |
JP5920322B2 (ja) * | 2013-11-28 | 2016-05-18 | 信越化学工業株式会社 | ネガ型レジスト材料並びにこれを用いたパターン形成方法 |
US10683571B2 (en) | 2014-02-25 | 2020-06-16 | Asm Ip Holding B.V. | Gas supply manifold and method of supplying gases to chamber using same |
US10167557B2 (en) | 2014-03-18 | 2019-01-01 | Asm Ip Holding B.V. | Gas distribution system, reactor including the system, and methods of using the same |
US11015245B2 (en) | 2014-03-19 | 2021-05-25 | Asm Ip Holding B.V. | Gas-phase reactor and system having exhaust plenum and components thereof |
US10858737B2 (en) | 2014-07-28 | 2020-12-08 | Asm Ip Holding B.V. | Showerhead assembly and components thereof |
US9890456B2 (en) | 2014-08-21 | 2018-02-13 | Asm Ip Holding B.V. | Method and system for in situ formation of gas-phase compounds |
US9657845B2 (en) | 2014-10-07 | 2017-05-23 | Asm Ip Holding B.V. | Variable conductance gas distribution apparatus and method |
US10941490B2 (en) | 2014-10-07 | 2021-03-09 | Asm Ip Holding B.V. | Multiple temperature range susceptor, assembly, reactor and system including the susceptor, and methods of using the same |
KR102263121B1 (ko) | 2014-12-22 | 2021-06-09 | 에이에스엠 아이피 홀딩 비.브이. | 반도체 소자 및 그 제조 방법 |
US10529542B2 (en) | 2015-03-11 | 2020-01-07 | Asm Ip Holdings B.V. | Cross-flow reactor and method |
US10276355B2 (en) | 2015-03-12 | 2019-04-30 | Asm Ip Holding B.V. | Multi-zone reactor, system including the reactor, and method of using the same |
US10458018B2 (en) | 2015-06-26 | 2019-10-29 | Asm Ip Holding B.V. | Structures including metal carbide material, devices including the structures, and methods of forming same |
US10600673B2 (en) | 2015-07-07 | 2020-03-24 | Asm Ip Holding B.V. | Magnetic susceptor to baseplate seal |
US10083836B2 (en) | 2015-07-24 | 2018-09-25 | Asm Ip Holding B.V. | Formation of boron-doped titanium metal films with high work function |
US9960072B2 (en) | 2015-09-29 | 2018-05-01 | Asm Ip Holding B.V. | Variable adjustment for precise matching of multiple chamber cavity housings |
US10211308B2 (en) | 2015-10-21 | 2019-02-19 | Asm Ip Holding B.V. | NbMC layers |
US10322384B2 (en) | 2015-11-09 | 2019-06-18 | Asm Ip Holding B.V. | Counter flow mixer for process chamber |
US11139308B2 (en) | 2015-12-29 | 2021-10-05 | Asm Ip Holding B.V. | Atomic layer deposition of III-V compounds to form V-NAND devices |
US10529554B2 (en) | 2016-02-19 | 2020-01-07 | Asm Ip Holding B.V. | Method for forming silicon nitride film selectively on sidewalls or flat surfaces of trenches |
US10468251B2 (en) | 2016-02-19 | 2019-11-05 | Asm Ip Holding B.V. | Method for forming spacers using silicon nitride film for spacer-defined multiple patterning |
US10501866B2 (en) | 2016-03-09 | 2019-12-10 | Asm Ip Holding B.V. | Gas distribution apparatus for improved film uniformity in an epitaxial system |
US10343920B2 (en) | 2016-03-18 | 2019-07-09 | Asm Ip Holding B.V. | Aligned carbon nanotubes |
US9892913B2 (en) | 2016-03-24 | 2018-02-13 | Asm Ip Holding B.V. | Radial and thickness control via biased multi-port injection settings |
US10865475B2 (en) | 2016-04-21 | 2020-12-15 | Asm Ip Holding B.V. | Deposition of metal borides and silicides |
US10190213B2 (en) | 2016-04-21 | 2019-01-29 | Asm Ip Holding B.V. | Deposition of metal borides |
US10032628B2 (en) | 2016-05-02 | 2018-07-24 | Asm Ip Holding B.V. | Source/drain performance through conformal solid state doping |
US10367080B2 (en) | 2016-05-02 | 2019-07-30 | Asm Ip Holding B.V. | Method of forming a germanium oxynitride film |
KR102592471B1 (ko) | 2016-05-17 | 2023-10-20 | 에이에스엠 아이피 홀딩 비.브이. | 금속 배선 형성 방법 및 이를 이용한 반도체 장치의 제조 방법 |
US11453943B2 (en) | 2016-05-25 | 2022-09-27 | Asm Ip Holding B.V. | Method for forming carbon-containing silicon/metal oxide or nitride film by ALD using silicon precursor and hydrocarbon precursor |
US10388509B2 (en) | 2016-06-28 | 2019-08-20 | Asm Ip Holding B.V. | Formation of epitaxial layers via dislocation filtering |
US10612137B2 (en) | 2016-07-08 | 2020-04-07 | Asm Ip Holdings B.V. | Organic reactants for atomic layer deposition |
US9859151B1 (en) | 2016-07-08 | 2018-01-02 | Asm Ip Holding B.V. | Selective film deposition method to form air gaps |
US10714385B2 (en) | 2016-07-19 | 2020-07-14 | Asm Ip Holding B.V. | Selective deposition of tungsten |
KR102354490B1 (ko) | 2016-07-27 | 2022-01-21 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 방법 |
US9887082B1 (en) | 2016-07-28 | 2018-02-06 | Asm Ip Holding B.V. | Method and apparatus for filling a gap |
US9812320B1 (en) | 2016-07-28 | 2017-11-07 | Asm Ip Holding B.V. | Method and apparatus for filling a gap |
KR102532607B1 (ko) | 2016-07-28 | 2023-05-15 | 에이에스엠 아이피 홀딩 비.브이. | 기판 가공 장치 및 그 동작 방법 |
US10395919B2 (en) | 2016-07-28 | 2019-08-27 | Asm Ip Holding B.V. | Method and apparatus for filling a gap |
US10410943B2 (en) | 2016-10-13 | 2019-09-10 | Asm Ip Holding B.V. | Method for passivating a surface of a semiconductor and related systems |
US10643826B2 (en) | 2016-10-26 | 2020-05-05 | Asm Ip Holdings B.V. | Methods for thermally calibrating reaction chambers |
US11532757B2 (en) | 2016-10-27 | 2022-12-20 | Asm Ip Holding B.V. | Deposition of charge trapping layers |
US10229833B2 (en) | 2016-11-01 | 2019-03-12 | Asm Ip Holding B.V. | Methods for forming a transition metal nitride film on a substrate by atomic layer deposition and related semiconductor device structures |
US10714350B2 (en) | 2016-11-01 | 2020-07-14 | ASM IP Holdings, B.V. | Methods for forming a transition metal niobium nitride film on a substrate by atomic layer deposition and related semiconductor device structures |
US10435790B2 (en) | 2016-11-01 | 2019-10-08 | Asm Ip Holding B.V. | Method of subatmospheric plasma-enhanced ALD using capacitively coupled electrodes with narrow gap |
US10643904B2 (en) | 2016-11-01 | 2020-05-05 | Asm Ip Holdings B.V. | Methods for forming a semiconductor device and related semiconductor device structures |
US10134757B2 (en) | 2016-11-07 | 2018-11-20 | Asm Ip Holding B.V. | Method of processing a substrate and a device manufactured by using the method |
KR102546317B1 (ko) | 2016-11-15 | 2023-06-21 | 에이에스엠 아이피 홀딩 비.브이. | 기체 공급 유닛 및 이를 포함하는 기판 처리 장치 |
US10340135B2 (en) | 2016-11-28 | 2019-07-02 | Asm Ip Holding B.V. | Method of topologically restricted plasma-enhanced cyclic deposition of silicon or metal nitride |
TWI746628B (zh) * | 2016-12-08 | 2021-11-21 | 南韓商三星電子股份有限公司 | 光阻組成物以及使用該光阻組成物形成精細圖案的方法 |
KR20180068582A (ko) | 2016-12-14 | 2018-06-22 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치 |
US11581186B2 (en) | 2016-12-15 | 2023-02-14 | Asm Ip Holding B.V. | Sequential infiltration synthesis apparatus |
US11447861B2 (en) | 2016-12-15 | 2022-09-20 | Asm Ip Holding B.V. | Sequential infiltration synthesis apparatus and a method of forming a patterned structure |
KR102700194B1 (ko) | 2016-12-19 | 2024-08-28 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치 |
US10269558B2 (en) | 2016-12-22 | 2019-04-23 | Asm Ip Holding B.V. | Method of forming a structure on a substrate |
US10867788B2 (en) | 2016-12-28 | 2020-12-15 | Asm Ip Holding B.V. | Method of forming a structure on a substrate |
US11390950B2 (en) | 2017-01-10 | 2022-07-19 | Asm Ip Holding B.V. | Reactor system and method to reduce residue buildup during a film deposition process |
US10655221B2 (en) | 2017-02-09 | 2020-05-19 | Asm Ip Holding B.V. | Method for depositing oxide film by thermal ALD and PEALD |
US10468261B2 (en) | 2017-02-15 | 2019-11-05 | Asm Ip Holding B.V. | Methods for forming a metallic film on a substrate by cyclical deposition and related semiconductor device structures |
US10529563B2 (en) | 2017-03-29 | 2020-01-07 | Asm Ip Holdings B.V. | Method for forming doped metal oxide films on a substrate by cyclical deposition and related semiconductor device structures |
US10283353B2 (en) | 2017-03-29 | 2019-05-07 | Asm Ip Holding B.V. | Method of reforming insulating film deposited on substrate with recess pattern |
KR102457289B1 (ko) | 2017-04-25 | 2022-10-21 | 에이에스엠 아이피 홀딩 비.브이. | 박막 증착 방법 및 반도체 장치의 제조 방법 |
US10892156B2 (en) | 2017-05-08 | 2021-01-12 | Asm Ip Holding B.V. | Methods for forming a silicon nitride film on a substrate and related semiconductor device structures |
US10446393B2 (en) | 2017-05-08 | 2019-10-15 | Asm Ip Holding B.V. | Methods for forming silicon-containing epitaxial layers and related semiconductor device structures |
US10770286B2 (en) | 2017-05-08 | 2020-09-08 | Asm Ip Holdings B.V. | Methods for selectively forming a silicon nitride film on a substrate and related semiconductor device structures |
US10504742B2 (en) | 2017-05-31 | 2019-12-10 | Asm Ip Holding B.V. | Method of atomic layer etching using hydrogen plasma |
US10886123B2 (en) | 2017-06-02 | 2021-01-05 | Asm Ip Holding B.V. | Methods for forming low temperature semiconductor layers and related semiconductor device structures |
US12040200B2 (en) | 2017-06-20 | 2024-07-16 | Asm Ip Holding B.V. | Semiconductor processing apparatus and methods for calibrating a semiconductor processing apparatus |
US11306395B2 (en) | 2017-06-28 | 2022-04-19 | Asm Ip Holding B.V. | Methods for depositing a transition metal nitride film on a substrate by atomic layer deposition and related deposition apparatus |
US10685834B2 (en) | 2017-07-05 | 2020-06-16 | Asm Ip Holdings B.V. | Methods for forming a silicon germanium tin layer and related semiconductor device structures |
KR20190009245A (ko) | 2017-07-18 | 2019-01-28 | 에이에스엠 아이피 홀딩 비.브이. | 반도체 소자 구조물 형성 방법 및 관련된 반도체 소자 구조물 |
US10541333B2 (en) | 2017-07-19 | 2020-01-21 | Asm Ip Holding B.V. | Method for depositing a group IV semiconductor and related semiconductor device structures |
US11018002B2 (en) | 2017-07-19 | 2021-05-25 | Asm Ip Holding B.V. | Method for selectively depositing a Group IV semiconductor and related semiconductor device structures |
US11374112B2 (en) | 2017-07-19 | 2022-06-28 | Asm Ip Holding B.V. | Method for depositing a group IV semiconductor and related semiconductor device structures |
US10605530B2 (en) | 2017-07-26 | 2020-03-31 | Asm Ip Holding B.V. | Assembly of a liner and a flange for a vertical furnace as well as the liner and the vertical furnace |
US10590535B2 (en) | 2017-07-26 | 2020-03-17 | Asm Ip Holdings B.V. | Chemical treatment, deposition and/or infiltration apparatus and method for using the same |
US10312055B2 (en) | 2017-07-26 | 2019-06-04 | Asm Ip Holding B.V. | Method of depositing film by PEALD using negative bias |
US10770336B2 (en) | 2017-08-08 | 2020-09-08 | Asm Ip Holding B.V. | Substrate lift mechanism and reactor including same |
US10692741B2 (en) | 2017-08-08 | 2020-06-23 | Asm Ip Holdings B.V. | Radiation shield |
US11769682B2 (en) | 2017-08-09 | 2023-09-26 | Asm Ip Holding B.V. | Storage apparatus for storing cassettes for substrates and processing apparatus equipped therewith |
US10249524B2 (en) | 2017-08-09 | 2019-04-02 | Asm Ip Holding B.V. | Cassette holder assembly for a substrate cassette and holding member for use in such assembly |
US11139191B2 (en) | 2017-08-09 | 2021-10-05 | Asm Ip Holding B.V. | Storage apparatus for storing cassettes for substrates and processing apparatus equipped therewith |
USD900036S1 (en) | 2017-08-24 | 2020-10-27 | Asm Ip Holding B.V. | Heater electrical connector and adapter |
US11830730B2 (en) | 2017-08-29 | 2023-11-28 | Asm Ip Holding B.V. | Layer forming method and apparatus |
US11056344B2 (en) | 2017-08-30 | 2021-07-06 | Asm Ip Holding B.V. | Layer forming method |
US11295980B2 (en) | 2017-08-30 | 2022-04-05 | Asm Ip Holding B.V. | Methods for depositing a molybdenum metal film over a dielectric surface of a substrate by a cyclical deposition process and related semiconductor device structures |
KR102491945B1 (ko) | 2017-08-30 | 2023-01-26 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치 |
KR102401446B1 (ko) | 2017-08-31 | 2022-05-24 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치 |
US10607895B2 (en) | 2017-09-18 | 2020-03-31 | Asm Ip Holdings B.V. | Method for forming a semiconductor device structure comprising a gate fill metal |
KR102630301B1 (ko) | 2017-09-21 | 2024-01-29 | 에이에스엠 아이피 홀딩 비.브이. | 침투성 재료의 순차 침투 합성 방법 처리 및 이를 이용하여 형성된 구조물 및 장치 |
US10844484B2 (en) | 2017-09-22 | 2020-11-24 | Asm Ip Holding B.V. | Apparatus for dispensing a vapor phase reactant to a reaction chamber and related methods |
US10658205B2 (en) | 2017-09-28 | 2020-05-19 | Asm Ip Holdings B.V. | Chemical dispensing apparatus and methods for dispensing a chemical to a reaction chamber |
US10403504B2 (en) | 2017-10-05 | 2019-09-03 | Asm Ip Holding B.V. | Method for selectively depositing a metallic film on a substrate |
US10319588B2 (en) | 2017-10-10 | 2019-06-11 | Asm Ip Holding B.V. | Method for depositing a metal chalcogenide on a substrate by cyclical deposition |
US10923344B2 (en) | 2017-10-30 | 2021-02-16 | Asm Ip Holding B.V. | Methods for forming a semiconductor structure and related semiconductor structures |
US10910262B2 (en) | 2017-11-16 | 2021-02-02 | Asm Ip Holding B.V. | Method of selectively depositing a capping layer structure on a semiconductor device structure |
KR102443047B1 (ko) | 2017-11-16 | 2022-09-14 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치 방법 및 그에 의해 제조된 장치 |
US11022879B2 (en) | 2017-11-24 | 2021-06-01 | Asm Ip Holding B.V. | Method of forming an enhanced unexposed photoresist layer |
JP7214724B2 (ja) | 2017-11-27 | 2023-01-30 | エーエスエム アイピー ホールディング ビー.ブイ. | バッチ炉で利用されるウェハカセットを収納するための収納装置 |
WO2019103610A1 (en) | 2017-11-27 | 2019-05-31 | Asm Ip Holding B.V. | Apparatus including a clean mini environment |
US10290508B1 (en) | 2017-12-05 | 2019-05-14 | Asm Ip Holding B.V. | Method for forming vertical spacers for spacer-defined patterning |
US10872771B2 (en) | 2018-01-16 | 2020-12-22 | Asm Ip Holding B. V. | Method for depositing a material film on a substrate within a reaction chamber by a cyclical deposition process and related device structures |
TWI799494B (zh) | 2018-01-19 | 2023-04-21 | 荷蘭商Asm 智慧財產控股公司 | 沈積方法 |
CN111630203A (zh) | 2018-01-19 | 2020-09-04 | Asm Ip私人控股有限公司 | 通过等离子体辅助沉积来沉积间隙填充层的方法 |
USD903477S1 (en) | 2018-01-24 | 2020-12-01 | Asm Ip Holdings B.V. | Metal clamp |
US11018047B2 (en) | 2018-01-25 | 2021-05-25 | Asm Ip Holding B.V. | Hybrid lift pin |
USD880437S1 (en) | 2018-02-01 | 2020-04-07 | Asm Ip Holding B.V. | Gas supply plate for semiconductor manufacturing apparatus |
US10535516B2 (en) | 2018-02-01 | 2020-01-14 | Asm Ip Holdings B.V. | Method for depositing a semiconductor structure on a surface of a substrate and related semiconductor structures |
US11081345B2 (en) | 2018-02-06 | 2021-08-03 | Asm Ip Holding B.V. | Method of post-deposition treatment for silicon oxide film |
US10896820B2 (en) | 2018-02-14 | 2021-01-19 | Asm Ip Holding B.V. | Method for depositing a ruthenium-containing film on a substrate by a cyclical deposition process |
JP7124098B2 (ja) | 2018-02-14 | 2022-08-23 | エーエスエム・アイピー・ホールディング・ベー・フェー | 周期的堆積プロセスにより基材上にルテニウム含有膜を堆積させる方法 |
US10731249B2 (en) | 2018-02-15 | 2020-08-04 | Asm Ip Holding B.V. | Method of forming a transition metal containing film on a substrate by a cyclical deposition process, a method for supplying a transition metal halide compound to a reaction chamber, and related vapor deposition apparatus |
US10658181B2 (en) | 2018-02-20 | 2020-05-19 | Asm Ip Holding B.V. | Method of spacer-defined direct patterning in semiconductor fabrication |
KR102636427B1 (ko) | 2018-02-20 | 2024-02-13 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 방법 및 장치 |
US10975470B2 (en) | 2018-02-23 | 2021-04-13 | Asm Ip Holding B.V. | Apparatus for detecting or monitoring for a chemical precursor in a high temperature environment |
US11473195B2 (en) | 2018-03-01 | 2022-10-18 | Asm Ip Holding B.V. | Semiconductor processing apparatus and a method for processing a substrate |
US11629406B2 (en) | 2018-03-09 | 2023-04-18 | Asm Ip Holding B.V. | Semiconductor processing apparatus comprising one or more pyrometers for measuring a temperature of a substrate during transfer of the substrate |
US11114283B2 (en) | 2018-03-16 | 2021-09-07 | Asm Ip Holding B.V. | Reactor, system including the reactor, and methods of manufacturing and using same |
KR102646467B1 (ko) | 2018-03-27 | 2024-03-11 | 에이에스엠 아이피 홀딩 비.브이. | 기판 상에 전극을 형성하는 방법 및 전극을 포함하는 반도체 소자 구조 |
US10510536B2 (en) | 2018-03-29 | 2019-12-17 | Asm Ip Holding B.V. | Method of depositing a co-doped polysilicon film on a surface of a substrate within a reaction chamber |
US11230766B2 (en) | 2018-03-29 | 2022-01-25 | Asm Ip Holding B.V. | Substrate processing apparatus and method |
US11088002B2 (en) | 2018-03-29 | 2021-08-10 | Asm Ip Holding B.V. | Substrate rack and a substrate processing system and method |
KR102501472B1 (ko) | 2018-03-30 | 2023-02-20 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 방법 |
TWI843623B (zh) | 2018-05-08 | 2024-05-21 | 荷蘭商Asm Ip私人控股有限公司 | 藉由循環沉積製程於基板上沉積氧化物膜之方法及相關裝置結構 |
US12025484B2 (en) | 2018-05-08 | 2024-07-02 | Asm Ip Holding B.V. | Thin film forming method |
KR20190129718A (ko) | 2018-05-11 | 2019-11-20 | 에이에스엠 아이피 홀딩 비.브이. | 기판 상에 피도핑 금속 탄화물 막을 형성하는 방법 및 관련 반도체 소자 구조 |
KR102596988B1 (ko) | 2018-05-28 | 2023-10-31 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 방법 및 그에 의해 제조된 장치 |
TWI840362B (zh) | 2018-06-04 | 2024-05-01 | 荷蘭商Asm Ip私人控股有限公司 | 水氣降低的晶圓處置腔室 |
US11718913B2 (en) | 2018-06-04 | 2023-08-08 | Asm Ip Holding B.V. | Gas distribution system and reactor system including same |
US11286562B2 (en) | 2018-06-08 | 2022-03-29 | Asm Ip Holding B.V. | Gas-phase chemical reactor and method of using same |
KR102568797B1 (ko) | 2018-06-21 | 2023-08-21 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 시스템 |
US10797133B2 (en) | 2018-06-21 | 2020-10-06 | Asm Ip Holding B.V. | Method for depositing a phosphorus doped silicon arsenide film and related semiconductor device structures |
WO2020003000A1 (en) | 2018-06-27 | 2020-01-02 | Asm Ip Holding B.V. | Cyclic deposition methods for forming metal-containing material and films and structures including the metal-containing material |
TW202409324A (zh) | 2018-06-27 | 2024-03-01 | 荷蘭商Asm Ip私人控股有限公司 | 用於形成含金屬材料之循環沉積製程 |
KR102686758B1 (ko) | 2018-06-29 | 2024-07-18 | 에이에스엠 아이피 홀딩 비.브이. | 박막 증착 방법 및 반도체 장치의 제조 방법 |
US10612136B2 (en) | 2018-06-29 | 2020-04-07 | ASM IP Holding, B.V. | Temperature-controlled flange and reactor system including same |
US10755922B2 (en) | 2018-07-03 | 2020-08-25 | Asm Ip Holding B.V. | Method for depositing silicon-free carbon-containing film as gap-fill layer by pulse plasma-assisted deposition |
US10388513B1 (en) | 2018-07-03 | 2019-08-20 | Asm Ip Holding B.V. | Method for depositing silicon-free carbon-containing film as gap-fill layer by pulse plasma-assisted deposition |
US10767789B2 (en) | 2018-07-16 | 2020-09-08 | Asm Ip Holding B.V. | Diaphragm valves, valve components, and methods for forming valve components |
US10483099B1 (en) | 2018-07-26 | 2019-11-19 | Asm Ip Holding B.V. | Method for forming thermally stable organosilicon polymer film |
US11053591B2 (en) | 2018-08-06 | 2021-07-06 | Asm Ip Holding B.V. | Multi-port gas injection system and reactor system including same |
US10883175B2 (en) | 2018-08-09 | 2021-01-05 | Asm Ip Holding B.V. | Vertical furnace for processing substrates and a liner for use therein |
US10829852B2 (en) | 2018-08-16 | 2020-11-10 | Asm Ip Holding B.V. | Gas distribution device for a wafer processing apparatus |
US11430674B2 (en) | 2018-08-22 | 2022-08-30 | Asm Ip Holding B.V. | Sensor array, apparatus for dispensing a vapor phase reactant to a reaction chamber and related methods |
US11024523B2 (en) | 2018-09-11 | 2021-06-01 | Asm Ip Holding B.V. | Substrate processing apparatus and method |
KR102707956B1 (ko) | 2018-09-11 | 2024-09-19 | 에이에스엠 아이피 홀딩 비.브이. | 박막 증착 방법 |
US11049751B2 (en) | 2018-09-14 | 2021-06-29 | Asm Ip Holding B.V. | Cassette supply system to store and handle cassettes and processing apparatus equipped therewith |
TWI844567B (zh) | 2018-10-01 | 2024-06-11 | 荷蘭商Asm Ip私人控股有限公司 | 基材保持裝置、含有此裝置之系統及其使用之方法 |
US11232963B2 (en) | 2018-10-03 | 2022-01-25 | Asm Ip Holding B.V. | Substrate processing apparatus and method |
KR102592699B1 (ko) | 2018-10-08 | 2023-10-23 | 에이에스엠 아이피 홀딩 비.브이. | 기판 지지 유닛 및 이를 포함하는 박막 증착 장치와 기판 처리 장치 |
US10847365B2 (en) | 2018-10-11 | 2020-11-24 | Asm Ip Holding B.V. | Method of forming conformal silicon carbide film by cyclic CVD |
US10811256B2 (en) | 2018-10-16 | 2020-10-20 | Asm Ip Holding B.V. | Method for etching a carbon-containing feature |
KR102605121B1 (ko) | 2018-10-19 | 2023-11-23 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치 및 기판 처리 방법 |
KR102546322B1 (ko) | 2018-10-19 | 2023-06-21 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치 및 기판 처리 방법 |
USD948463S1 (en) | 2018-10-24 | 2022-04-12 | Asm Ip Holding B.V. | Susceptor for semiconductor substrate supporting apparatus |
US10381219B1 (en) | 2018-10-25 | 2019-08-13 | Asm Ip Holding B.V. | Methods for forming a silicon nitride film |
US11087997B2 (en) | 2018-10-31 | 2021-08-10 | Asm Ip Holding B.V. | Substrate processing apparatus for processing substrates |
KR20200051105A (ko) | 2018-11-02 | 2020-05-13 | 에이에스엠 아이피 홀딩 비.브이. | 기판 지지 유닛 및 이를 포함하는 기판 처리 장치 |
US11572620B2 (en) | 2018-11-06 | 2023-02-07 | Asm Ip Holding B.V. | Methods for selectively depositing an amorphous silicon film on a substrate |
US11031242B2 (en) | 2018-11-07 | 2021-06-08 | Asm Ip Holding B.V. | Methods for depositing a boron doped silicon germanium film |
US10847366B2 (en) | 2018-11-16 | 2020-11-24 | Asm Ip Holding B.V. | Methods for depositing a transition metal chalcogenide film on a substrate by a cyclical deposition process |
US10818758B2 (en) | 2018-11-16 | 2020-10-27 | Asm Ip Holding B.V. | Methods for forming a metal silicate film on a substrate in a reaction chamber and related semiconductor device structures |
US10559458B1 (en) | 2018-11-26 | 2020-02-11 | Asm Ip Holding B.V. | Method of forming oxynitride film |
US12040199B2 (en) | 2018-11-28 | 2024-07-16 | Asm Ip Holding B.V. | Substrate processing apparatus for processing substrates |
US11217444B2 (en) | 2018-11-30 | 2022-01-04 | Asm Ip Holding B.V. | Method for forming an ultraviolet radiation responsive metal oxide-containing film |
KR102636428B1 (ko) | 2018-12-04 | 2024-02-13 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치를 세정하는 방법 |
US11158513B2 (en) | 2018-12-13 | 2021-10-26 | Asm Ip Holding B.V. | Methods for forming a rhenium-containing film on a substrate by a cyclical deposition process and related semiconductor device structures |
JP7504584B2 (ja) | 2018-12-14 | 2024-06-24 | エーエスエム・アイピー・ホールディング・ベー・フェー | 窒化ガリウムの選択的堆積を用いてデバイス構造体を形成する方法及びそのためのシステム |
TWI819180B (zh) | 2019-01-17 | 2023-10-21 | 荷蘭商Asm 智慧財產控股公司 | 藉由循環沈積製程於基板上形成含過渡金屬膜之方法 |
KR20200091543A (ko) | 2019-01-22 | 2020-07-31 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치 |
CN111524788B (zh) | 2019-02-01 | 2023-11-24 | Asm Ip私人控股有限公司 | 氧化硅的拓扑选择性膜形成的方法 |
KR102626263B1 (ko) | 2019-02-20 | 2024-01-16 | 에이에스엠 아이피 홀딩 비.브이. | 처리 단계를 포함하는 주기적 증착 방법 및 이를 위한 장치 |
JP2020136678A (ja) | 2019-02-20 | 2020-08-31 | エーエスエム・アイピー・ホールディング・ベー・フェー | 基材表面内に形成された凹部を充填するための方法および装置 |
TWI845607B (zh) | 2019-02-20 | 2024-06-21 | 荷蘭商Asm Ip私人控股有限公司 | 用來填充形成於基材表面內之凹部的循環沉積方法及設備 |
KR20200102357A (ko) | 2019-02-20 | 2020-08-31 | 에이에스엠 아이피 홀딩 비.브이. | 3-d nand 응용의 플러그 충진체 증착용 장치 및 방법 |
TWI842826B (zh) | 2019-02-22 | 2024-05-21 | 荷蘭商Asm Ip私人控股有限公司 | 基材處理設備及處理基材之方法 |
US11742198B2 (en) | 2019-03-08 | 2023-08-29 | Asm Ip Holding B.V. | Structure including SiOCN layer and method of forming same |
KR20200108243A (ko) | 2019-03-08 | 2020-09-17 | 에이에스엠 아이피 홀딩 비.브이. | SiOC 층을 포함한 구조체 및 이의 형성 방법 |
KR20200108242A (ko) | 2019-03-08 | 2020-09-17 | 에이에스엠 아이피 홀딩 비.브이. | 실리콘 질화물 층을 선택적으로 증착하는 방법, 및 선택적으로 증착된 실리콘 질화물 층을 포함하는 구조체 |
KR20200116033A (ko) | 2019-03-28 | 2020-10-08 | 에이에스엠 아이피 홀딩 비.브이. | 도어 개방기 및 이를 구비한 기판 처리 장치 |
KR20200116855A (ko) | 2019-04-01 | 2020-10-13 | 에이에스엠 아이피 홀딩 비.브이. | 반도체 소자를 제조하는 방법 |
KR20200123380A (ko) | 2019-04-19 | 2020-10-29 | 에이에스엠 아이피 홀딩 비.브이. | 층 형성 방법 및 장치 |
KR20200125453A (ko) | 2019-04-24 | 2020-11-04 | 에이에스엠 아이피 홀딩 비.브이. | 기상 반응기 시스템 및 이를 사용하는 방법 |
KR20200130121A (ko) | 2019-05-07 | 2020-11-18 | 에이에스엠 아이피 홀딩 비.브이. | 딥 튜브가 있는 화학물질 공급원 용기 |
KR20200130118A (ko) | 2019-05-07 | 2020-11-18 | 에이에스엠 아이피 홀딩 비.브이. | 비정질 탄소 중합체 막을 개질하는 방법 |
KR20200130652A (ko) | 2019-05-10 | 2020-11-19 | 에이에스엠 아이피 홀딩 비.브이. | 표면 상에 재료를 증착하는 방법 및 본 방법에 따라 형성된 구조 |
JP2020188254A (ja) | 2019-05-16 | 2020-11-19 | エーエスエム アイピー ホールディング ビー.ブイ. | ウェハボートハンドリング装置、縦型バッチ炉および方法 |
JP2020188255A (ja) | 2019-05-16 | 2020-11-19 | エーエスエム アイピー ホールディング ビー.ブイ. | ウェハボートハンドリング装置、縦型バッチ炉および方法 |
USD947913S1 (en) | 2019-05-17 | 2022-04-05 | Asm Ip Holding B.V. | Susceptor shaft |
USD975665S1 (en) | 2019-05-17 | 2023-01-17 | Asm Ip Holding B.V. | Susceptor shaft |
USD935572S1 (en) | 2019-05-24 | 2021-11-09 | Asm Ip Holding B.V. | Gas channel plate |
USD922229S1 (en) | 2019-06-05 | 2021-06-15 | Asm Ip Holding B.V. | Device for controlling a temperature of a gas supply unit |
KR20200141003A (ko) | 2019-06-06 | 2020-12-17 | 에이에스엠 아이피 홀딩 비.브이. | 가스 감지기를 포함하는 기상 반응기 시스템 |
KR20200143254A (ko) | 2019-06-11 | 2020-12-23 | 에이에스엠 아이피 홀딩 비.브이. | 개질 가스를 사용하여 전자 구조를 형성하는 방법, 상기 방법을 수행하기 위한 시스템, 및 상기 방법을 사용하여 형성되는 구조 |
USD944946S1 (en) | 2019-06-14 | 2022-03-01 | Asm Ip Holding B.V. | Shower plate |
USD931978S1 (en) | 2019-06-27 | 2021-09-28 | Asm Ip Holding B.V. | Showerhead vacuum transport |
KR20210005515A (ko) | 2019-07-03 | 2021-01-14 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치용 온도 제어 조립체 및 이를 사용하는 방법 |
JP7499079B2 (ja) | 2019-07-09 | 2024-06-13 | エーエスエム・アイピー・ホールディング・ベー・フェー | 同軸導波管を用いたプラズマ装置、基板処理方法 |
CN112216646A (zh) | 2019-07-10 | 2021-01-12 | Asm Ip私人控股有限公司 | 基板支撑组件及包括其的基板处理装置 |
KR20210010307A (ko) | 2019-07-16 | 2021-01-27 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치 |
KR20210010816A (ko) | 2019-07-17 | 2021-01-28 | 에이에스엠 아이피 홀딩 비.브이. | 라디칼 보조 점화 플라즈마 시스템 및 방법 |
KR20210010820A (ko) | 2019-07-17 | 2021-01-28 | 에이에스엠 아이피 홀딩 비.브이. | 실리콘 게르마늄 구조를 형성하는 방법 |
US11643724B2 (en) | 2019-07-18 | 2023-05-09 | Asm Ip Holding B.V. | Method of forming structures using a neutral beam |
KR20210010817A (ko) | 2019-07-19 | 2021-01-28 | 에이에스엠 아이피 홀딩 비.브이. | 토폴로지-제어된 비정질 탄소 중합체 막을 형성하는 방법 |
TWI839544B (zh) | 2019-07-19 | 2024-04-21 | 荷蘭商Asm Ip私人控股有限公司 | 形成形貌受控的非晶碳聚合物膜之方法 |
CN112309843A (zh) | 2019-07-29 | 2021-02-02 | Asm Ip私人控股有限公司 | 实现高掺杂剂掺入的选择性沉积方法 |
CN112309899A (zh) | 2019-07-30 | 2021-02-02 | Asm Ip私人控股有限公司 | 基板处理设备 |
CN112309900A (zh) | 2019-07-30 | 2021-02-02 | Asm Ip私人控股有限公司 | 基板处理设备 |
US11227782B2 (en) | 2019-07-31 | 2022-01-18 | Asm Ip Holding B.V. | Vertical batch furnace assembly |
US11587815B2 (en) | 2019-07-31 | 2023-02-21 | Asm Ip Holding B.V. | Vertical batch furnace assembly |
US11587814B2 (en) | 2019-07-31 | 2023-02-21 | Asm Ip Holding B.V. | Vertical batch furnace assembly |
CN118422165A (zh) | 2019-08-05 | 2024-08-02 | Asm Ip私人控股有限公司 | 用于化学源容器的液位传感器 |
USD965044S1 (en) | 2019-08-19 | 2022-09-27 | Asm Ip Holding B.V. | Susceptor shaft |
USD965524S1 (en) | 2019-08-19 | 2022-10-04 | Asm Ip Holding B.V. | Susceptor support |
JP2021031769A (ja) | 2019-08-21 | 2021-03-01 | エーエスエム アイピー ホールディング ビー.ブイ. | 成膜原料混合ガス生成装置及び成膜装置 |
USD940837S1 (en) | 2019-08-22 | 2022-01-11 | Asm Ip Holding B.V. | Electrode |
USD949319S1 (en) | 2019-08-22 | 2022-04-19 | Asm Ip Holding B.V. | Exhaust duct |
KR20210024423A (ko) | 2019-08-22 | 2021-03-05 | 에이에스엠 아이피 홀딩 비.브이. | 홀을 구비한 구조체를 형성하기 위한 방법 |
USD930782S1 (en) | 2019-08-22 | 2021-09-14 | Asm Ip Holding B.V. | Gas distributor |
USD979506S1 (en) | 2019-08-22 | 2023-02-28 | Asm Ip Holding B.V. | Insulator |
US11286558B2 (en) | 2019-08-23 | 2022-03-29 | Asm Ip Holding B.V. | Methods for depositing a molybdenum nitride film on a surface of a substrate by a cyclical deposition process and related semiconductor device structures including a molybdenum nitride film |
KR20210024420A (ko) | 2019-08-23 | 2021-03-05 | 에이에스엠 아이피 홀딩 비.브이. | 비스(디에틸아미노)실란을 사용하여 peald에 의해 개선된 품질을 갖는 실리콘 산화물 막을 증착하기 위한 방법 |
KR20210029090A (ko) | 2019-09-04 | 2021-03-15 | 에이에스엠 아이피 홀딩 비.브이. | 희생 캡핑 층을 이용한 선택적 증착 방법 |
KR20210029663A (ko) | 2019-09-05 | 2021-03-16 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치 |
US11562901B2 (en) | 2019-09-25 | 2023-01-24 | Asm Ip Holding B.V. | Substrate processing method |
CN112593212B (zh) | 2019-10-02 | 2023-12-22 | Asm Ip私人控股有限公司 | 通过循环等离子体增强沉积工艺形成拓扑选择性氧化硅膜的方法 |
TWI846953B (zh) | 2019-10-08 | 2024-07-01 | 荷蘭商Asm Ip私人控股有限公司 | 基板處理裝置 |
KR20210042810A (ko) | 2019-10-08 | 2021-04-20 | 에이에스엠 아이피 홀딩 비.브이. | 활성 종을 이용하기 위한 가스 분배 어셈블리를 포함한 반응기 시스템 및 이를 사용하는 방법 |
KR20210043460A (ko) | 2019-10-10 | 2021-04-21 | 에이에스엠 아이피 홀딩 비.브이. | 포토레지스트 하부층을 형성하기 위한 방법 및 이를 포함한 구조체 |
US12009241B2 (en) | 2019-10-14 | 2024-06-11 | Asm Ip Holding B.V. | Vertical batch furnace assembly with detector to detect cassette |
TWI834919B (zh) | 2019-10-16 | 2024-03-11 | 荷蘭商Asm Ip私人控股有限公司 | 氧化矽之拓撲選擇性膜形成之方法 |
US11637014B2 (en) | 2019-10-17 | 2023-04-25 | Asm Ip Holding B.V. | Methods for selective deposition of doped semiconductor material |
KR20210047808A (ko) | 2019-10-21 | 2021-04-30 | 에이에스엠 아이피 홀딩 비.브이. | 막을 선택적으로 에칭하기 위한 장치 및 방법 |
KR20210050453A (ko) | 2019-10-25 | 2021-05-07 | 에이에스엠 아이피 홀딩 비.브이. | 기판 표면 상의 갭 피처를 충진하는 방법 및 이와 관련된 반도체 소자 구조 |
US11646205B2 (en) | 2019-10-29 | 2023-05-09 | Asm Ip Holding B.V. | Methods of selectively forming n-type doped material on a surface, systems for selectively forming n-type doped material, and structures formed using same |
KR20210054983A (ko) | 2019-11-05 | 2021-05-14 | 에이에스엠 아이피 홀딩 비.브이. | 도핑된 반도체 층을 갖는 구조체 및 이를 형성하기 위한 방법 및 시스템 |
US11501968B2 (en) | 2019-11-15 | 2022-11-15 | Asm Ip Holding B.V. | Method for providing a semiconductor device with silicon filled gaps |
KR20210062561A (ko) | 2019-11-20 | 2021-05-31 | 에이에스엠 아이피 홀딩 비.브이. | 기판의 표면 상에 탄소 함유 물질을 증착하는 방법, 상기 방법을 사용하여 형성된 구조물, 및 상기 구조물을 형성하기 위한 시스템 |
CN112951697A (zh) | 2019-11-26 | 2021-06-11 | Asm Ip私人控股有限公司 | 基板处理设备 |
KR20210065848A (ko) | 2019-11-26 | 2021-06-04 | 에이에스엠 아이피 홀딩 비.브이. | 제1 유전체 표면과 제2 금속성 표면을 포함한 기판 상에 타겟 막을 선택적으로 형성하기 위한 방법 |
CN112885692A (zh) | 2019-11-29 | 2021-06-01 | Asm Ip私人控股有限公司 | 基板处理设备 |
CN112885693A (zh) | 2019-11-29 | 2021-06-01 | Asm Ip私人控股有限公司 | 基板处理设备 |
JP7527928B2 (ja) | 2019-12-02 | 2024-08-05 | エーエスエム・アイピー・ホールディング・ベー・フェー | 基板処理装置、基板処理方法 |
KR20210070898A (ko) | 2019-12-04 | 2021-06-15 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치 |
TW202125596A (zh) | 2019-12-17 | 2021-07-01 | 荷蘭商Asm Ip私人控股有限公司 | 形成氮化釩層之方法以及包括該氮化釩層之結構 |
US11527403B2 (en) | 2019-12-19 | 2022-12-13 | Asm Ip Holding B.V. | Methods for filling a gap feature on a substrate surface and related semiconductor structures |
KR20210089079A (ko) | 2020-01-06 | 2021-07-15 | 에이에스엠 아이피 홀딩 비.브이. | 채널형 리프트 핀 |
TW202140135A (zh) | 2020-01-06 | 2021-11-01 | 荷蘭商Asm Ip私人控股有限公司 | 氣體供應總成以及閥板總成 |
US11993847B2 (en) | 2020-01-08 | 2024-05-28 | Asm Ip Holding B.V. | Injector |
KR102675856B1 (ko) | 2020-01-20 | 2024-06-17 | 에이에스엠 아이피 홀딩 비.브이. | 박막 형성 방법 및 박막 표면 개질 방법 |
TW202130846A (zh) | 2020-02-03 | 2021-08-16 | 荷蘭商Asm Ip私人控股有限公司 | 形成包括釩或銦層的結構之方法 |
TW202146882A (zh) | 2020-02-04 | 2021-12-16 | 荷蘭商Asm Ip私人控股有限公司 | 驗證一物品之方法、用於驗證一物品之設備、及用於驗證一反應室之系統 |
US11776846B2 (en) | 2020-02-07 | 2023-10-03 | Asm Ip Holding B.V. | Methods for depositing gap filling fluids and related systems and devices |
US11781243B2 (en) | 2020-02-17 | 2023-10-10 | Asm Ip Holding B.V. | Method for depositing low temperature phosphorous-doped silicon |
TW202203344A (zh) | 2020-02-28 | 2022-01-16 | 荷蘭商Asm Ip控股公司 | 專用於零件清潔的系統 |
KR20210116240A (ko) | 2020-03-11 | 2021-09-27 | 에이에스엠 아이피 홀딩 비.브이. | 조절성 접합부를 갖는 기판 핸들링 장치 |
KR20210116249A (ko) | 2020-03-11 | 2021-09-27 | 에이에스엠 아이피 홀딩 비.브이. | 록아웃 태그아웃 어셈블리 및 시스템 그리고 이의 사용 방법 |
CN113394086A (zh) | 2020-03-12 | 2021-09-14 | Asm Ip私人控股有限公司 | 用于制造具有目标拓扑轮廓的层结构的方法 |
KR20210124042A (ko) | 2020-04-02 | 2021-10-14 | 에이에스엠 아이피 홀딩 비.브이. | 박막 형성 방법 |
TW202146689A (zh) | 2020-04-03 | 2021-12-16 | 荷蘭商Asm Ip控股公司 | 阻障層形成方法及半導體裝置的製造方法 |
TW202145344A (zh) | 2020-04-08 | 2021-12-01 | 荷蘭商Asm Ip私人控股有限公司 | 用於選擇性蝕刻氧化矽膜之設備及方法 |
US11821078B2 (en) | 2020-04-15 | 2023-11-21 | Asm Ip Holding B.V. | Method for forming precoat film and method for forming silicon-containing film |
KR20210128343A (ko) | 2020-04-15 | 2021-10-26 | 에이에스엠 아이피 홀딩 비.브이. | 크롬 나이트라이드 층을 형성하는 방법 및 크롬 나이트라이드 층을 포함하는 구조 |
US11996289B2 (en) | 2020-04-16 | 2024-05-28 | Asm Ip Holding B.V. | Methods of forming structures including silicon germanium and silicon layers, devices formed using the methods, and systems for performing the methods |
KR20210132600A (ko) | 2020-04-24 | 2021-11-04 | 에이에스엠 아이피 홀딩 비.브이. | 바나듐, 질소 및 추가 원소를 포함한 층을 증착하기 위한 방법 및 시스템 |
JP2021172884A (ja) | 2020-04-24 | 2021-11-01 | エーエスエム・アイピー・ホールディング・ベー・フェー | 窒化バナジウム含有層を形成する方法および窒化バナジウム含有層を含む構造体 |
TW202146831A (zh) | 2020-04-24 | 2021-12-16 | 荷蘭商Asm Ip私人控股有限公司 | 垂直批式熔爐總成、及用於冷卻垂直批式熔爐之方法 |
KR20210134226A (ko) | 2020-04-29 | 2021-11-09 | 에이에스엠 아이피 홀딩 비.브이. | 고체 소스 전구체 용기 |
KR20210134869A (ko) | 2020-05-01 | 2021-11-11 | 에이에스엠 아이피 홀딩 비.브이. | Foup 핸들러를 이용한 foup의 빠른 교환 |
TW202147543A (zh) | 2020-05-04 | 2021-12-16 | 荷蘭商Asm Ip私人控股有限公司 | 半導體處理系統 |
KR20210141379A (ko) | 2020-05-13 | 2021-11-23 | 에이에스엠 아이피 홀딩 비.브이. | 반응기 시스템용 레이저 정렬 고정구 |
TW202146699A (zh) | 2020-05-15 | 2021-12-16 | 荷蘭商Asm Ip私人控股有限公司 | 形成矽鍺層之方法、半導體結構、半導體裝置、形成沉積層之方法、及沉積系統 |
KR20210143653A (ko) | 2020-05-19 | 2021-11-29 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치 |
KR20210145078A (ko) | 2020-05-21 | 2021-12-01 | 에이에스엠 아이피 홀딩 비.브이. | 다수의 탄소 층을 포함한 구조체 및 이를 형성하고 사용하는 방법 |
KR102702526B1 (ko) | 2020-05-22 | 2024-09-03 | 에이에스엠 아이피 홀딩 비.브이. | 과산화수소를 사용하여 박막을 증착하기 위한 장치 |
TW202201602A (zh) | 2020-05-29 | 2022-01-01 | 荷蘭商Asm Ip私人控股有限公司 | 基板處理方法 |
TW202212620A (zh) | 2020-06-02 | 2022-04-01 | 荷蘭商Asm Ip私人控股有限公司 | 處理基板之設備、形成膜之方法、及控制用於處理基板之設備之方法 |
TW202218133A (zh) | 2020-06-24 | 2022-05-01 | 荷蘭商Asm Ip私人控股有限公司 | 形成含矽層之方法 |
TW202217953A (zh) | 2020-06-30 | 2022-05-01 | 荷蘭商Asm Ip私人控股有限公司 | 基板處理方法 |
KR102707957B1 (ko) | 2020-07-08 | 2024-09-19 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 방법 |
TW202219628A (zh) | 2020-07-17 | 2022-05-16 | 荷蘭商Asm Ip私人控股有限公司 | 用於光微影之結構與方法 |
TW202204662A (zh) | 2020-07-20 | 2022-02-01 | 荷蘭商Asm Ip私人控股有限公司 | 用於沉積鉬層之方法及系統 |
US12040177B2 (en) | 2020-08-18 | 2024-07-16 | Asm Ip Holding B.V. | Methods for forming a laminate film by cyclical plasma-enhanced deposition processes |
KR20220027026A (ko) | 2020-08-26 | 2022-03-07 | 에이에스엠 아이피 홀딩 비.브이. | 금속 실리콘 산화물 및 금속 실리콘 산질화물 층을 형성하기 위한 방법 및 시스템 |
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Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB695789A (en) | 1950-02-11 | 1953-08-19 | Distillers Co Yeast Ltd | Oxygen containing propene derivatives |
US2866813A (en) * | 1956-03-29 | 1958-12-30 | Union Carbide Corp | Aldehyde diacylates and process for producing the same |
US3468857A (en) | 1965-10-04 | 1969-09-23 | Ashland Oil Inc | Thermosetting polymers of unsaturated acetals |
US4476033A (en) * | 1982-07-30 | 1984-10-09 | Phillips Petroleum Company | Method and compositions for acidizing and fracturing wells |
US4562009A (en) * | 1983-11-28 | 1985-12-31 | The Dow Chemical Company | Halonitriles, their preparation and use to make halopyridines |
DE3346266A1 (de) * | 1983-12-21 | 1985-07-11 | Lentia Gmbh | Verfahren zur herstelung von glyoxal, alkylglyoxalen und von deren acetalen |
DE3403426A1 (de) * | 1984-02-01 | 1985-08-01 | Degussa Ag, 6000 Frankfurt | Verfahren zur herstellung von acetalen |
PH23983A (en) * | 1986-12-23 | 1990-02-09 | Biopolymers Ltd | Biostatic and biocidal composition |
DE3714276C2 (de) | 1987-04-29 | 2002-09-19 | Celanese Ventures Gmbh | Hydrophile, vernetzte Polymerisate, Verfahren zu ihrer Herstellung und ihre Verwendung |
US5200051A (en) * | 1988-11-14 | 1993-04-06 | I-Stat Corporation | Wholly microfabricated biosensors and process for the manufacture and use thereof |
EP0720052A1 (en) * | 1994-12-27 | 1996-07-03 | Mitsubishi Chemical Corporation | Photosensitive composition and photosensitive lithographic printing plate |
US5958995A (en) * | 1996-08-29 | 1999-09-28 | Xerox Corporation | Blends containing photosensitive high performance aromatic ether curable polymers |
US6121399A (en) * | 1997-10-23 | 2000-09-19 | Eastman Chemical Company | Polymers of 3-butene esters, their preparation and use |
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1999
- 1999-11-24 DE DE19956531A patent/DE19956531A1/de not_active Withdrawn
- 1999-11-24 US US09/448,916 patent/US6368773B1/en not_active Expired - Fee Related
- 1999-11-24 GB GB9927637A patent/GB2344104B/en not_active Expired - Fee Related
- 1999-11-26 TW TW088120825A patent/TW459010B/zh active
- 1999-11-26 NL NL1013685A patent/NL1013685C2/nl not_active IP Right Cessation
- 1999-11-26 CN CNB991258568A patent/CN1163796C/zh not_active Expired - Fee Related
- 1999-11-26 FR FR9914920A patent/FR2786491B1/fr not_active Expired - Fee Related
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GB2344104A (en) | 2000-05-31 |
CN1255652A (zh) | 2000-06-07 |
US6368773B1 (en) | 2002-04-09 |
GB9927637D0 (en) | 2000-01-19 |
ITTO991042A0 (it) | 1999-11-26 |
JP4127941B2 (ja) | 2008-07-30 |
FR2786491A1 (fr) | 2000-06-02 |
IT1308659B1 (it) | 2002-01-09 |
TW459010B (en) | 2001-10-11 |
DE19956531A1 (de) | 2000-05-31 |
GB2344104B (en) | 2004-04-07 |
NL1013685C2 (nl) | 2001-06-21 |
FR2786491B1 (fr) | 2003-04-18 |
ITTO991042A1 (it) | 2001-05-26 |
NL1013685A1 (nl) | 2000-05-30 |
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