CN113614816A - 阵列基板及其制造方法、显示面板、显示装置 - Google Patents

阵列基板及其制造方法、显示面板、显示装置 Download PDF

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CN113614816A
CN113614816A CN201980002374.8A CN201980002374A CN113614816A CN 113614816 A CN113614816 A CN 113614816A CN 201980002374 A CN201980002374 A CN 201980002374A CN 113614816 A CN113614816 A CN 113614816A
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substrate
base plate
lead
bent
array
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CN113614816B (zh
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朱小研
黄华
袁广才
董学
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BOE Technology Group Co Ltd
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    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09GARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G09G3/30Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
    • G09G3/32Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
    • G09G3/3208Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED]
    • G09G3/3225Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED] using an active matrix
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09GARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/34Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source
    • G09G3/36Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source using liquid crystals
    • G09G3/3611Control of matrices with row and column drivers
    • G09G3/3648Control of matrices with row and column drivers using an active matrix
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1218Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or structure of the substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1259Multistep manufacturing methods
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    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58Optical field-shaping elements
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    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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    • H01L2933/0066Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
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    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
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    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10Substrates, e.g. flexible substrates
    • H10K77/111Flexible substrates
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract

一种阵列基板及其制造方法、显示面板、显示装置,属于显示技术领域。阵列基板(0)包括:衬底基板(01)、像素电路(02)、柔性基板(051)、引线结构(03)、控制电路(04)和平坦层(301)。柔性基板(051)包括:第一基板部分(0511)和第二基板部分(0513),引线结构(03)包括:第一引线部分(031)和第二引线部分(033)。像素电路(02)、第一引线部分(031)和第一基板部分(0511)均位于衬底基板(01)的第一侧(21),控制电路(04)、第二引线部分(033)和第二基板部分(0513)均位于衬底基板(01)的第二侧(22),且第二侧(22)与第一侧(21)相对。

Description

PCT国内申请,说明书已公开。

Claims (20)

  1. PCT国内申请,权利要求书已公开。
CN201980002374.8A 2019-11-08 2019-11-08 阵列基板及其制造方法、显示面板、显示装置 Active CN113614816B (zh)

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Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11468832B2 (en) * 2019-11-08 2022-10-11 Beijing Boe Technology Development Co., Ltd. Array substrate and method for manufacturing same, display panel, and display device
KR20210113480A (ko) * 2020-03-05 2021-09-16 삼성디스플레이 주식회사 표시 장치
CN111900176A (zh) * 2020-09-08 2020-11-06 深圳市华星光电半导体显示技术有限公司 一种阵列基板及其制备方法以及显示面板
CN113471240A (zh) * 2021-06-30 2021-10-01 上海天马微电子有限公司 发光模组及其制备方法、显示装置
CN117501334A (zh) * 2022-05-31 2024-02-02 京东方科技集团股份有限公司 显示面板、显示模组和显示装置

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015026065A (ja) * 2012-09-28 2015-02-05 シャープ株式会社 液晶表示装置及び表示装置
CN107491221A (zh) * 2017-08-31 2017-12-19 京东方科技集团股份有限公司 显示基板及制备方法、显示装置
CN108198842A (zh) * 2017-12-29 2018-06-22 上海天马微电子有限公司 柔性显示装置
US20180182829A1 (en) * 2016-12-22 2018-06-28 Lg Display Co., Ltd. Organic Light Emitting Display Device
CN108877514A (zh) * 2018-06-07 2018-11-23 武汉华星光电半导体显示技术有限公司 显示面板、显示模组以及电子装置
CN108957878A (zh) * 2018-07-19 2018-12-07 武汉天马微电子有限公司 显示模组及其制备方法和显示装置
CN109285452A (zh) * 2017-07-19 2019-01-29 群创光电股份有限公司 显示设备以及其制作方法
CN109658831A (zh) * 2018-12-20 2019-04-19 厦门天马微电子有限公司 一种显示面板及显示装置
CN109755256A (zh) * 2017-11-01 2019-05-14 京东方科技集团股份有限公司 柔性显示面板及制备方法、柔性显示装置
WO2019114438A1 (zh) * 2017-12-14 2019-06-20 京东方科技集团股份有限公司 显示基板及其制作方法
CN110246882A (zh) * 2019-06-24 2019-09-17 昆山国显光电有限公司 显示面板、显示装置及显示面板的制造方法
CN110297346A (zh) * 2019-06-28 2019-10-01 云谷(固安)科技有限公司 一种显示面板及其制作方法

Family Cites Families (95)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4074099B2 (ja) 2002-02-04 2008-04-09 東芝松下ディスプレイテクノロジー株式会社 平面表示装置およびその製造方法
JP2005062400A (ja) 2003-08-11 2005-03-10 Toshiba Matsushita Display Technology Co Ltd 平面表示装置およびその製造方法
KR100530749B1 (ko) 2003-12-09 2005-11-23 삼성테크윈 주식회사 연성회로기판
US9071809B2 (en) * 2008-01-04 2015-06-30 Nanolumens Acquisition, Inc. Mobile, personsize display system and method of use
US8576209B2 (en) * 2009-07-07 2013-11-05 Semiconductor Energy Laboratory Co., Ltd. Display device
CN103022079B (zh) 2012-12-12 2015-05-20 京东方科技集团股份有限公司 阵列基板及其制备方法、有机发光二极管显示装置
US8921839B2 (en) 2013-03-12 2014-12-30 Sharp Laboratories Of America, Inc. Light emitting device with spherical back mirror
KR102077525B1 (ko) * 2013-07-30 2020-02-14 엘지디스플레이 주식회사 표시장치 및 그 제조 방법
KR102144378B1 (ko) 2013-08-27 2020-08-13 삼성전자주식회사 칩 온 필름 패키지 및 이를 포함하는 표시 장치
US9349758B2 (en) * 2014-09-30 2016-05-24 Lg Display Co., Ltd. Flexible display device with divided power lines and manufacturing method for the same
US9425418B2 (en) 2014-09-30 2016-08-23 Lg Display Co., Ltd. Flexible display device with bend stress reduction member and manufacturing method for the same
US20160105950A1 (en) * 2014-10-10 2016-04-14 Apple Inc. Electronic Device Having Structured Flexible Substrates With Bends
CN104317080A (zh) 2014-10-31 2015-01-28 京东方科技集团股份有限公司 一种显示装置及其制作方法
US9627463B2 (en) * 2014-11-28 2017-04-18 Lg Display Co., Ltd. Flexible display device with space reducing wire configuration
US9356087B1 (en) * 2014-12-10 2016-05-31 Lg Display Co., Ltd. Flexible display device with bridged wire traces
US20160172428A1 (en) 2014-12-11 2016-06-16 Lg Display Co., Ltd. Flexible display device with corrosion resistant printed circuit film
US9780157B2 (en) * 2014-12-23 2017-10-03 Lg Display Co., Ltd. Flexible display device with gate-in-panel circuit
US9287329B1 (en) * 2014-12-30 2016-03-15 Lg Display Co., Ltd. Flexible display device with chamfered polarization layer
KR102274142B1 (ko) * 2015-03-10 2021-07-09 삼성디스플레이 주식회사 표시 장치 및 휴대용 단말기
JP6404158B2 (ja) 2015-03-30 2018-10-10 株式会社ジャパンディスプレイ 表示装置
US10164202B2 (en) 2015-04-16 2018-12-25 Sharp Kabushiki Kaisha Organic electroluminescence device including an organic electroluminescence element above a contact hole
KR102463838B1 (ko) 2015-08-24 2022-11-04 삼성디스플레이 주식회사 가요성 표시 장치와 이의 제조 방법
CN105304679B (zh) 2015-09-29 2018-03-16 京东方科技集团股份有限公司 一种底发光型oled显示面板
KR102394723B1 (ko) * 2015-09-30 2022-05-09 엘지디스플레이 주식회사 터치 스크린 패널 및 이를 포함하는 표시 장치
JP6918452B2 (ja) 2015-09-30 2021-08-11 大日本印刷株式会社 発光素子用基板及びモジュール
KR102454152B1 (ko) 2015-10-23 2022-10-13 삼성디스플레이 주식회사 표시 장치
JP6423781B2 (ja) * 2015-11-20 2018-11-14 株式会社ジャパンディスプレイ 表示装置
JP6396879B2 (ja) 2015-11-20 2018-09-26 株式会社ジャパンディスプレイ 表示装置
KR102611499B1 (ko) * 2015-12-15 2023-12-06 엘지디스플레이 주식회사 플렉서블 표시장치
JP6727843B2 (ja) * 2016-02-25 2020-07-22 株式会社ジャパンディスプレイ 表示装置
KR102652604B1 (ko) * 2016-06-08 2024-04-02 삼성디스플레이 주식회사 표시 장치 및 이의 제조 방법
KR102555407B1 (ko) 2016-06-30 2023-07-14 엘지디스플레이 주식회사 플렉서블 유기발광 다이오드 표시장치
KR102563284B1 (ko) * 2016-07-13 2023-08-03 삼성디스플레이 주식회사 표시 장치 및 표시 장치의 제조 방법
US10430000B2 (en) * 2016-08-05 2019-10-01 Innolux Corporation Touch display device
KR102611214B1 (ko) * 2016-08-30 2023-12-07 삼성디스플레이 주식회사 표시 장치 및 그 제조 방법
KR20180032719A (ko) 2016-09-22 2018-04-02 삼성디스플레이 주식회사 표시 장치
JP2018049193A (ja) * 2016-09-23 2018-03-29 株式会社ジャパンディスプレイ 表示装置
KR102628024B1 (ko) 2016-10-07 2024-01-22 삼성디스플레이 주식회사 폴더블 표시 장치
KR102631989B1 (ko) * 2016-10-31 2024-01-31 엘지디스플레이 주식회사 유기발광 표시장치 및 그 제조방법
KR102593828B1 (ko) * 2016-11-02 2023-10-26 삼성디스플레이 주식회사 표시 장치
KR102655241B1 (ko) * 2016-11-02 2024-04-09 삼성디스플레이 주식회사 표시 장치
JP2018081258A (ja) * 2016-11-18 2018-05-24 株式会社ジャパンディスプレイ 表示パネル及び表示装置
CN106782091B (zh) 2016-12-19 2019-06-04 上海天马微电子有限公司 柔性显示面板及其制造方法、显示设备和便携式终端
KR102582059B1 (ko) * 2016-12-30 2023-09-21 엘지디스플레이 주식회사 표시 장치 및 이를 이용한 멀티 스크린 표시 장치
KR102329830B1 (ko) * 2017-01-10 2021-11-23 삼성디스플레이 주식회사 유기 발광 표시 장치
CN106653777B (zh) * 2017-03-22 2020-05-29 京东方科技集团股份有限公司 一种显示面板及其制备方法
KR102432386B1 (ko) * 2017-07-12 2022-08-12 삼성디스플레이 주식회사 표시 장치
KR102336569B1 (ko) * 2017-07-31 2021-12-06 엘지디스플레이 주식회사 디스플레이 장치와 이를 포함하는 멀티 스크린 디스플레이 장치
KR20190014273A (ko) * 2017-07-31 2019-02-12 삼성디스플레이 주식회사 표시장치 및 이의 제조방법
US20190051858A1 (en) * 2017-08-10 2019-02-14 Japan Display Inc. Display device
CN107403590B (zh) 2017-08-31 2021-04-13 上海天马微电子有限公司 可折叠显示装置
WO2019058501A1 (ja) * 2017-09-22 2019-03-28 シャープ株式会社 表示デバイス、及び、表示デバイスの製造方法
KR102400712B1 (ko) * 2017-10-12 2022-05-23 삼성전자주식회사 벤딩 영역을 포함하는 디스플레이 및 이를 포함하는 전자 장치
CN108039420B (zh) 2017-12-06 2020-11-24 合肥鑫晟光电科技有限公司 衬底及其制备方法、有机发光二极管显示器件
KR102510459B1 (ko) * 2017-12-12 2023-03-17 삼성디스플레이 주식회사 표시 장치
US10910592B2 (en) * 2017-12-22 2021-02-02 Lg Display Co., Ltd. Flexible electroluminescent display device
KR102457907B1 (ko) * 2017-12-29 2022-10-25 삼성디스플레이 주식회사 표시 장치
US11342521B2 (en) * 2018-01-29 2022-05-24 Sharp Kabushiki Kaisha Display device and method for manufacturing display device
CN108231800B (zh) * 2018-02-02 2019-10-29 京东方科技集团股份有限公司 一种柔性显示面板及其制备方法、显示装置
KR102511543B1 (ko) * 2018-03-09 2023-03-17 삼성디스플레이 주식회사 표시 장치
CN110308579B (zh) * 2018-03-22 2022-04-12 上海和辉光电股份有限公司 一种刚性显示面板及其制作方法
JP2019168642A (ja) * 2018-03-26 2019-10-03 株式会社ジャパンディスプレイ 電気光学装置
US10950685B2 (en) * 2018-03-29 2021-03-16 Innolux Corporation Tiled electronic device
CN108492771B (zh) * 2018-04-03 2020-07-07 京东方科技集团股份有限公司 双面显示装置及其控制方法
KR102575557B1 (ko) 2018-04-05 2023-09-06 삼성디스플레이 주식회사 표시장치 및 연성회로기판
KR102547854B1 (ko) * 2018-05-04 2023-06-26 삼성디스플레이 주식회사 폴더블 표시 장치 및 폴더블 표시 장치의 제조 방법
CN108681123A (zh) 2018-05-21 2018-10-19 京东方科技集团股份有限公司 液晶显示基板及显示装置
CN208422960U (zh) * 2018-05-31 2019-01-22 京东方科技集团股份有限公司 阵列基板、显示装置
KR102654593B1 (ko) * 2018-06-01 2024-04-05 삼성디스플레이 주식회사 표시 장치 및 이를 포함한 전자 장치
CN108878483A (zh) 2018-06-22 2018-11-23 武汉华星光电半导体显示技术有限公司 显示面板及电子设备
KR102497285B1 (ko) * 2018-07-03 2023-02-08 삼성디스플레이 주식회사 만입된 형상의 표시부를 포함하는 표시 장치
KR102568908B1 (ko) * 2018-08-13 2023-08-21 삼성디스플레이 주식회사 표시 장치 및 이를 제조하는 방법
CN109148727B (zh) 2018-08-31 2021-01-29 京东方科技集团股份有限公司 Oled显示基板及制备方法、显示装置
KR102649145B1 (ko) * 2018-09-18 2024-03-21 삼성디스플레이 주식회사 디스플레이 장치
CN109360828B (zh) * 2018-09-27 2021-01-12 京东方科技集团股份有限公司 显示基板及其制造方法、显示装置
KR102598831B1 (ko) * 2018-10-04 2023-11-03 엘지디스플레이 주식회사 스트레처블 표시장치
KR102615116B1 (ko) * 2018-10-10 2023-12-19 삼성디스플레이 주식회사 디스플레이 장치
CN109494314B (zh) * 2018-10-16 2020-12-08 武汉华星光电半导体显示技术有限公司 一种柔性oled显示面板及其制备方法
KR102558846B1 (ko) * 2018-10-31 2023-07-21 엘지디스플레이 주식회사 플렉서블 표시장치
KR102562604B1 (ko) * 2018-11-08 2023-08-01 엘지디스플레이 주식회사 플렉시블 전계발광 표시장치
KR102563783B1 (ko) * 2018-11-13 2023-08-04 엘지디스플레이 주식회사 표시장치
CN109559639B (zh) 2018-11-29 2022-04-05 广州国显科技有限公司 一种显示面板和显示装置
CN109559646A (zh) * 2018-11-30 2019-04-02 云谷(固安)科技有限公司 一种显示面板及其弯折方法
CN109585514A (zh) * 2018-12-12 2019-04-05 武汉华星光电半导体显示技术有限公司 显示面板及具有该显示面板的显示装置
CN109671753B (zh) * 2018-12-14 2021-06-01 武汉华星光电半导体显示技术有限公司 显示装置及其制造方法
CN110534017B (zh) * 2018-12-26 2021-03-26 友达光电股份有限公司 显示面板
US10892257B2 (en) * 2019-01-21 2021-01-12 Innolux Corporation Foldable display device
CN109917953B (zh) 2019-01-29 2022-04-19 广州国显科技有限公司 一种显示装置及其制备方法
CN210072572U (zh) 2019-05-29 2020-02-14 华为机器有限公司 触控模组、显示装置及终端设备
US11538784B2 (en) * 2019-05-29 2022-12-27 Seoul Viosys Co., Ltd. Light emitting device having cantilever electrode, LED display panel and LED display apparatus having the same
CN110085655B (zh) 2019-05-30 2021-01-26 京东方科技集团股份有限公司 显示面板及其制造方法、显示装置
CN110164901B (zh) * 2019-06-25 2021-10-22 京东方科技集团股份有限公司 阵列基板及其制备方法、显示面板和显示装置
US11049914B2 (en) * 2019-07-05 2021-06-29 Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Display panel and manufacturing method thereof
CN110503898A (zh) 2019-08-28 2019-11-26 京东方科技集团股份有限公司 微发光二极管显示面板及制备方法、拼接显示面板、装置
US11468832B2 (en) * 2019-11-08 2022-10-11 Beijing Boe Technology Development Co., Ltd. Array substrate and method for manufacturing same, display panel, and display device

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015026065A (ja) * 2012-09-28 2015-02-05 シャープ株式会社 液晶表示装置及び表示装置
US20180182829A1 (en) * 2016-12-22 2018-06-28 Lg Display Co., Ltd. Organic Light Emitting Display Device
CN109285452A (zh) * 2017-07-19 2019-01-29 群创光电股份有限公司 显示设备以及其制作方法
CN107491221A (zh) * 2017-08-31 2017-12-19 京东方科技集团股份有限公司 显示基板及制备方法、显示装置
CN109755256A (zh) * 2017-11-01 2019-05-14 京东方科技集团股份有限公司 柔性显示面板及制备方法、柔性显示装置
WO2019114438A1 (zh) * 2017-12-14 2019-06-20 京东方科技集团股份有限公司 显示基板及其制作方法
CN108198842A (zh) * 2017-12-29 2018-06-22 上海天马微电子有限公司 柔性显示装置
CN108877514A (zh) * 2018-06-07 2018-11-23 武汉华星光电半导体显示技术有限公司 显示面板、显示模组以及电子装置
CN108957878A (zh) * 2018-07-19 2018-12-07 武汉天马微电子有限公司 显示模组及其制备方法和显示装置
CN109658831A (zh) * 2018-12-20 2019-04-19 厦门天马微电子有限公司 一种显示面板及显示装置
CN110246882A (zh) * 2019-06-24 2019-09-17 昆山国显光电有限公司 显示面板、显示装置及显示面板的制造方法
CN110297346A (zh) * 2019-06-28 2019-10-01 云谷(固安)科技有限公司 一种显示面板及其制作方法

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