CN113099730A - 阵列基板及其制造方法、显示装置 - Google Patents

阵列基板及其制造方法、显示装置 Download PDF

Info

Publication number
CN113099730A
CN113099730A CN202080000171.8A CN202080000171A CN113099730A CN 113099730 A CN113099730 A CN 113099730A CN 202080000171 A CN202080000171 A CN 202080000171A CN 113099730 A CN113099730 A CN 113099730A
Authority
CN
China
Prior art keywords
substrate
base plate
lead
initial
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN202080000171.8A
Other languages
English (en)
Other versions
CN113099730B (zh
Inventor
刘超
吴忠宝
张功涛
孙海威
董学
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BOE Technology Group Co Ltd filed Critical BOE Technology Group Co Ltd
Publication of CN113099730A publication Critical patent/CN113099730A/zh
Application granted granted Critical
Publication of CN113099730B publication Critical patent/CN113099730B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
    • G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
    • G09G3/3208—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED]
    • G09G3/3225—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED] using an active matrix
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/34—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source
    • G09G3/36—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source using liquid crystals
    • G09G3/3611—Control of matrices with row and column drivers
    • G09G3/3648—Control of matrices with row and column drivers using an active matrix
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1218—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or structure of the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1259—Multistep manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Theoretical Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Led Device Packages (AREA)

Abstract

本公开提供了一种阵列基板及其制造方法、显示装置，该阵列基板，其中，有机材料层(02)包括依次连接的第一平面部(021)、弯折部(022)和第二平面部(023)，第一平面部(021)和第二平面部(023)位于衬底基板(01)的两侧；引线结构(03)包括依次连接的第一引线部(031)、弯折引线部(032)和第二引线部(033)，第一引线部(031)位于第一平面部(021)外侧，弯折引线部(032)位于弯折部(022)外侧，第二引线部(033)位于第二平面部(023)外侧；LED层(04)和控制电路(05)分别位于衬底基板(01)上述两侧。

Description

PCT国内申请，说明书已公开。

Claims (25)

  1. PCT国内申请，权利要求书已公开。
CN202080000171.8A 2019-11-08 2020-02-21 阵列基板及其制造方法、显示装置 Active CN113099730B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
PCT/CN2019/116824 WO2021088037A1 (zh) 2019-11-08 2019-11-08 阵列基板及其制造方法、显示面板、显示装置
CNPCT/CN2019/116824 2019-11-08
PCT/CN2020/076268 WO2021088271A1 (zh) 2019-11-08 2020-02-21 阵列基板及其制造方法、显示装置

Publications (2)

Publication Number Publication Date
CN113099730A true CN113099730A (zh) 2021-07-09
CN113099730B CN113099730B (zh) 2022-06-17

Family

ID=75849372

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201980002374.8A Active CN113614816B (zh) 2019-11-08 2019-11-08 阵列基板及其制造方法、显示面板、显示装置
CN202080000171.8A Active CN113099730B (zh) 2019-11-08 2020-02-21 阵列基板及其制造方法、显示装置

Family Applications Before (1)

Application Number Title Priority Date Filing Date
CN201980002374.8A Active CN113614816B (zh) 2019-11-08 2019-11-08 阵列基板及其制造方法、显示面板、显示装置

Country Status (6)

Country Link
US (3) US11468832B2 (zh)
EP (1) EP4057263A4 (zh)
JP (2) JP7460658B2 (zh)
KR (1) KR20220099490A (zh)
CN (2) CN113614816B (zh)
WO (2) WO2021088037A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023230803A1 (zh) * 2022-05-31 2023-12-07 京东方科技集团股份有限公司 显示面板、显示模组和显示装置

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021088037A1 (zh) * 2019-11-08 2021-05-14 京东方科技集团股份有限公司 阵列基板及其制造方法、显示面板、显示装置
KR20210113480A (ko) * 2020-03-05 2021-09-16 삼성디스플레이 주식회사 표시 장치
CN111900176A (zh) * 2020-09-08 2020-11-06 深圳市华星光电半导体显示技术有限公司 一种阵列基板及其制备方法以及显示面板
CN113471240A (zh) * 2021-06-30 2021-10-01 上海天马微电子有限公司 发光模组及其制备方法、显示装置

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150060931A1 (en) * 2013-08-27 2015-03-05 Samsung Electronics Co., Ltd. Semiconductor packages and display devices including semiconductor packages
CN106486520A (zh) * 2015-08-24 2017-03-08 三星显示有限公司 柔性显示器及其制造方法
CN106611773A (zh) * 2015-10-23 2017-05-03 三星显示有限公司 显示设备
CN106992259A (zh) * 2015-11-20 2017-07-28 株式会社日本显示器 显示装置
CN107871751A (zh) * 2016-09-22 2018-04-03 三星显示有限公司 显示装置
CN109285452A (zh) * 2017-07-19 2019-01-29 群创光电股份有限公司 显示设备以及其制作方法
CN109917953A (zh) * 2019-01-29 2019-06-21 昆山国显光电有限公司 一种显示装置及其制备方法
CN110164901A (zh) * 2019-06-25 2019-08-23 京东方科技集团股份有限公司 阵列基板及其制备方法、显示面板和显示装置
CN110297346A (zh) * 2019-06-28 2019-10-01 云谷（固安）科技有限公司 一种显示面板及其制作方法
CN110308579A (zh) * 2018-03-22 2019-10-08 上海和辉光电有限公司 一种刚性显示面板及其制作方法

Family Cites Families (97)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4074099B2 (ja) 2002-02-04 2008-04-09 東芝松下ディスプレイテクノロジー株式会社 平面表示装置およびその製造方法
JP2005062400A (ja) 2003-08-11 2005-03-10 Toshiba Matsushita Display Technology Co Ltd 平面表示装置およびその製造方法
KR100530749B1 (ko) 2003-12-09 2005-11-23 삼성테크윈 주식회사 연성회로기판
US9071809B2 (en) * 2008-01-04 2015-06-30 Nanolumens Acquisition, Inc. Mobile, personsize display system and method of use
US8576209B2 (en) * 2009-07-07 2013-11-05 Semiconductor Energy Laboratory Co., Ltd. Display device
JP5841638B2 (ja) * 2012-09-28 2016-01-13 シャープ株式会社 液晶表示装置及び表示装置
CN103022079B (zh) 2012-12-12 2015-05-20 京东方科技集团股份有限公司 阵列基板及其制备方法、有机发光二极管显示装置
US8921839B2 (en) 2013-03-12 2014-12-30 Sharp Laboratories Of America, Inc. Light emitting device with spherical back mirror
KR102077525B1 (ko) * 2013-07-30 2020-02-14 엘지디스플레이 주식회사 표시장치 및 그 제조 방법
US9425418B2 (en) 2014-09-30 2016-08-23 Lg Display Co., Ltd. Flexible display device with bend stress reduction member and manufacturing method for the same
US9349758B2 (en) * 2014-09-30 2016-05-24 Lg Display Co., Ltd. Flexible display device with divided power lines and manufacturing method for the same
US20160105950A1 (en) * 2014-10-10 2016-04-14 Apple Inc. Electronic Device Having Structured Flexible Substrates With Bends
CN104317080A (zh) 2014-10-31 2015-01-28 京东方科技集团股份有限公司 一种显示装置及其制作方法
US9627463B2 (en) 2014-11-28 2017-04-18 Lg Display Co., Ltd. Flexible display device with space reducing wire configuration
US9356087B1 (en) * 2014-12-10 2016-05-31 Lg Display Co., Ltd. Flexible display device with bridged wire traces
US20160172428A1 (en) * 2014-12-11 2016-06-16 Lg Display Co., Ltd. Flexible display device with corrosion resistant printed circuit film
US9780157B2 (en) * 2014-12-23 2017-10-03 Lg Display Co., Ltd. Flexible display device with gate-in-panel circuit
US9287329B1 (en) * 2014-12-30 2016-03-15 Lg Display Co., Ltd. Flexible display device with chamfered polarization layer
KR102274142B1 (ko) * 2015-03-10 2021-07-09 삼성디스플레이 주식회사 표시 장치 및 휴대용 단말기
JP6404158B2 (ja) 2015-03-30 2018-10-10 株式会社ジャパンディスプレイ 表示装置
WO2016167354A1 (ja) 2015-04-16 2016-10-20 シャープ株式会社 有機エレクトロルミネッセンス装置
CN105304679B (zh) 2015-09-29 2018-03-16 京东方科技集团股份有限公司 一种底发光型oled显示面板
KR102394723B1 (ko) * 2015-09-30 2022-05-09 엘지디스플레이 주식회사 터치 스크린 패널 및 이를 포함하는 표시 장치
JP6918452B2 (ja) 2015-09-30 2021-08-11 大日本印刷株式会社 発光素子用基板及びモジュール
JP6423781B2 (ja) * 2015-11-20 2018-11-14 株式会社ジャパンディスプレイ 表示装置
KR102611499B1 (ko) * 2015-12-15 2023-12-06 엘지디스플레이 주식회사 플렉서블 표시장치
JP6727843B2 (ja) * 2016-02-25 2020-07-22 株式会社ジャパンディスプレイ 表示装置
KR102652604B1 (ko) * 2016-06-08 2024-04-02 삼성디스플레이 주식회사 표시 장치 및 이의 제조 방법
KR102555407B1 (ko) * 2016-06-30 2023-07-14 엘지디스플레이 주식회사 플렉서블 유기발광 다이오드 표시장치
KR102563284B1 (ko) * 2016-07-13 2023-08-03 삼성디스플레이 주식회사 표시 장치 및 표시 장치의 제조 방법
US10430000B2 (en) * 2016-08-05 2019-10-01 Innolux Corporation Touch display device
KR102611214B1 (ko) * 2016-08-30 2023-12-07 삼성디스플레이 주식회사 표시 장치 및 그 제조 방법
JP2018049193A (ja) * 2016-09-23 2018-03-29 株式会社ジャパンディスプレイ 表示装置
KR102628024B1 (ko) 2016-10-07 2024-01-22 삼성디스플레이 주식회사 폴더블 표시 장치
KR102631989B1 (ko) * 2016-10-31 2024-01-31 엘지디스플레이 주식회사 유기발광 표시장치 및 그 제조방법
KR102593828B1 (ko) * 2016-11-02 2023-10-26 삼성디스플레이 주식회사 표시 장치
KR102655241B1 (ko) * 2016-11-02 2024-04-09 삼성디스플레이 주식회사 표시 장치
JP2018081258A (ja) * 2016-11-18 2018-05-24 株式会社ジャパンディスプレイ 表示パネル及び表示装置
CN106782091B (zh) 2016-12-19 2019-06-04 上海天马微电子有限公司 柔性显示面板及其制造方法、显示设备和便携式终端
KR20180073352A (ko) * 2016-12-22 2018-07-02 엘지디스플레이 주식회사 유기 발광 표시 장치
KR102582059B1 (ko) * 2016-12-30 2023-09-21 엘지디스플레이 주식회사 표시 장치 및 이를 이용한 멀티 스크린 표시 장치
KR102329830B1 (ko) * 2017-01-10 2021-11-23 삼성디스플레이 주식회사 유기 발광 표시 장치
CN106653777B (zh) * 2017-03-22 2020-05-29 京东方科技集团股份有限公司 一种显示面板及其制备方法
KR102432386B1 (ko) * 2017-07-12 2022-08-12 삼성디스플레이 주식회사 표시 장치
KR20190014273A (ko) * 2017-07-31 2019-02-12 삼성디스플레이 주식회사 표시장치 및 이의 제조방법
KR102336569B1 (ko) * 2017-07-31 2021-12-06 엘지디스플레이 주식회사 디스플레이 장치와 이를 포함하는 멀티 스크린 디스플레이 장치
US20190051858A1 (en) 2017-08-10 2019-02-14 Japan Display Inc. Display device
CN107403590B (zh) 2017-08-31 2021-04-13 上海天马微电子有限公司 可折叠显示装置
CN107491221B (zh) * 2017-08-31 2023-08-22 京东方科技集团股份有限公司 显示基板及制备方法、显示装置
WO2019058501A1 (ja) * 2017-09-22 2019-03-28 シャープ株式会社 表示デバイス、及び、表示デバイスの製造方法
KR102400712B1 (ko) * 2017-10-12 2022-05-23 삼성전자주식회사 벤딩 영역을 포함하는 디스플레이 및 이를 포함하는 전자 장치
CN109755256B (zh) * 2017-11-01 2022-01-11 京东方科技集团股份有限公司 柔性显示面板及制备方法、柔性显示装置
CN108039420B (zh) 2017-12-06 2020-11-24 合肥鑫晟光电科技有限公司 衬底及其制备方法、有机发光二极管显示器件
KR102510459B1 (ko) * 2017-12-12 2023-03-17 삼성디스플레이 주식회사 표시 장치
CN108054142B (zh) * 2017-12-14 2021-01-29 京东方科技集团股份有限公司 显示基板的制作方法及显示基板
US10910592B2 (en) * 2017-12-22 2021-02-02 Lg Display Co., Ltd. Flexible electroluminescent display device
CN108198842B (zh) * 2017-12-29 2020-10-16 上海天马微电子有限公司 柔性显示装置
KR102457907B1 (ko) * 2017-12-29 2022-10-25 삼성디스플레이 주식회사 표시 장치
US11342521B2 (en) * 2018-01-29 2022-05-24 Sharp Kabushiki Kaisha Display device and method for manufacturing display device
CN108231800B (zh) 2018-02-02 2019-10-29 京东方科技集团股份有限公司 一种柔性显示面板及其制备方法、显示装置
KR102511543B1 (ko) * 2018-03-09 2023-03-17 삼성디스플레이 주식회사 표시 장치
JP2019168642A (ja) * 2018-03-26 2019-10-03 株式会社ジャパンディスプレイ 電気光学装置
US10950685B2 (en) 2018-03-29 2021-03-16 Innolux Corporation Tiled electronic device
CN108492771B (zh) * 2018-04-03 2020-07-07 京东方科技集团股份有限公司 双面显示装置及其控制方法
KR102575557B1 (ko) * 2018-04-05 2023-09-06 삼성디스플레이 주식회사 표시장치 및 연성회로기판
KR102547854B1 (ko) * 2018-05-04 2023-06-26 삼성디스플레이 주식회사 폴더블 표시 장치 및 폴더블 표시 장치의 제조 방법
CN108681123A (zh) 2018-05-21 2018-10-19 京东方科技集团股份有限公司 液晶显示基板及显示装置
CN208422960U (zh) * 2018-05-31 2019-01-22 京东方科技集团股份有限公司 阵列基板、显示装置
KR102654593B1 (ko) * 2018-06-01 2024-04-05 삼성디스플레이 주식회사 표시 장치 및 이를 포함한 전자 장치
CN108877514A (zh) * 2018-06-07 2018-11-23 武汉华星光电半导体显示技术有限公司 显示面板、显示模组以及电子装置
CN108878483A (zh) 2018-06-22 2018-11-23 武汉华星光电半导体显示技术有限公司 显示面板及电子设备
KR102497285B1 (ko) * 2018-07-03 2023-02-08 삼성디스플레이 주식회사 만입된 형상의 표시부를 포함하는 표시 장치
CN108957878B (zh) * 2018-07-19 2022-03-11 武汉天马微电子有限公司 显示模组及其制备方法和显示装置
KR102568908B1 (ko) * 2018-08-13 2023-08-21 삼성디스플레이 주식회사 표시 장치 및 이를 제조하는 방법
CN109148727B (zh) 2018-08-31 2021-01-29 京东方科技集团股份有限公司 Oled显示基板及制备方法、显示装置
KR102649145B1 (ko) * 2018-09-18 2024-03-21 삼성디스플레이 주식회사 디스플레이 장치
CN109360828B (zh) * 2018-09-27 2021-01-12 京东方科技集团股份有限公司 显示基板及其制造方法、显示装置
KR102598831B1 (ko) * 2018-10-04 2023-11-03 엘지디스플레이 주식회사 스트레처블 표시장치
KR102615116B1 (ko) * 2018-10-10 2023-12-19 삼성디스플레이 주식회사 디스플레이 장치
CN109494314B (zh) * 2018-10-16 2020-12-08 武汉华星光电半导体显示技术有限公司 一种柔性oled显示面板及其制备方法
KR102558846B1 (ko) * 2018-10-31 2023-07-21 엘지디스플레이 주식회사 플렉서블 표시장치
KR102562604B1 (ko) * 2018-11-08 2023-08-01 엘지디스플레이 주식회사 플렉시블 전계발광 표시장치
KR102563783B1 (ko) * 2018-11-13 2023-08-04 엘지디스플레이 주식회사 표시장치
CN109559639B (zh) 2018-11-29 2022-04-05 广州国显科技有限公司 一种显示面板和显示装置
CN109559646A (zh) * 2018-11-30 2019-04-02 云谷（固安）科技有限公司 一种显示面板及其弯折方法
CN109585514A (zh) * 2018-12-12 2019-04-05 武汉华星光电半导体显示技术有限公司 显示面板及具有该显示面板的显示装置
CN109671753B (zh) * 2018-12-14 2021-06-01 武汉华星光电半导体显示技术有限公司 显示装置及其制造方法
CN109658831B (zh) * 2018-12-20 2021-05-04 厦门天马微电子有限公司 一种显示面板及显示装置
CN110534017B (zh) * 2018-12-26 2021-03-26 友达光电股份有限公司 显示面板
US10892257B2 (en) * 2019-01-21 2021-01-12 Innolux Corporation Foldable display device
CN210072572U (zh) 2019-05-29 2020-02-14 华为机器有限公司 触控模组、显示装置及终端设备
US11538784B2 (en) * 2019-05-29 2022-12-27 Seoul Viosys Co., Ltd. Light emitting device having cantilever electrode, LED display panel and LED display apparatus having the same
CN110085655B (zh) 2019-05-30 2021-01-26 京东方科技集团股份有限公司 显示面板及其制造方法、显示装置
CN110246882B (zh) * 2019-06-24 2021-04-20 昆山国显光电有限公司 显示面板、显示装置及显示面板的制造方法
US11049914B2 (en) * 2019-07-05 2021-06-29 Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Display panel and manufacturing method thereof
CN110503898A (zh) 2019-08-28 2019-11-26 京东方科技集团股份有限公司 微发光二极管显示面板及制备方法、拼接显示面板、装置
WO2021088037A1 (zh) * 2019-11-08 2021-05-14 京东方科技集团股份有限公司 阵列基板及其制造方法、显示面板、显示装置

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150060931A1 (en) * 2013-08-27 2015-03-05 Samsung Electronics Co., Ltd. Semiconductor packages and display devices including semiconductor packages
CN106486520A (zh) * 2015-08-24 2017-03-08 三星显示有限公司 柔性显示器及其制造方法
CN106611773A (zh) * 2015-10-23 2017-05-03 三星显示有限公司 显示设备
CN106992259A (zh) * 2015-11-20 2017-07-28 株式会社日本显示器 显示装置
CN107871751A (zh) * 2016-09-22 2018-04-03 三星显示有限公司 显示装置
CN109285452A (zh) * 2017-07-19 2019-01-29 群创光电股份有限公司 显示设备以及其制作方法
CN110308579A (zh) * 2018-03-22 2019-10-08 上海和辉光电有限公司 一种刚性显示面板及其制作方法
CN109917953A (zh) * 2019-01-29 2019-06-21 昆山国显光电有限公司 一种显示装置及其制备方法
CN110164901A (zh) * 2019-06-25 2019-08-23 京东方科技集团股份有限公司 阵列基板及其制备方法、显示面板和显示装置
CN110297346A (zh) * 2019-06-28 2019-10-01 云谷（固安）科技有限公司 一种显示面板及其制作方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023230803A1 (zh) * 2022-05-31 2023-12-07 京东方科技集团股份有限公司 显示面板、显示模组和显示装置

Also Published As

Publication number Publication date
US20210366380A1 (en) 2021-11-25
US11893930B2 (en) 2024-02-06
JP7460658B2 (ja) 2024-04-02
WO2021088271A1 (zh) 2021-05-14
CN113614816B (zh) 2023-12-08
US11468832B2 (en) 2022-10-11
JP2024071470A (ja) 2024-05-24
CN113099730B (zh) 2022-06-17
EP4057263A1 (en) 2022-09-14
CN113614816A (zh) 2021-11-05
WO2021088037A1 (zh) 2021-05-14
EP4057263A4 (en) 2022-12-07
KR20220099490A (ko) 2022-07-13
US20220415253A1 (en) 2022-12-29
US20210398955A1 (en) 2021-12-23
JP2023501024A (ja) 2023-01-18

Similar Documents

Publication Publication Date Title
CN113099730B (zh) 阵列基板及其制造方法、显示装置
KR100936099B1 (ko) 플렉시블 기판을 갖는 액정 디스플레이 장치
US9933140B2 (en) Light emitting device
US9951925B2 (en) Light emitting device
CN103017016B (zh) 发光模块和包括该发光模块的背光组件
US10897815B2 (en) Display device, flexible wiring board, method of manufacturing the display device, and electronic device
KR20120081859A (ko) 수납 유닛 및 이를 포함하는 표시 장치
CN111290174B (zh) 灯板、背光模组以及显示装置
JP2007281378A (ja) フレキシブル配線基板および電子部品
JP2008078520A (ja) 配線基板の半田接合構造
CN112764588A (zh) 显示模组及制造方法与触控显示模组、显示器、电子设备
CN110517584B (zh) 显示模组、显示装置及显示模组的制备方法
KR101420825B1 (ko) 인쇄회로기판 및 이를 갖는 표시장치
CN1145832C (zh) 液晶显示装置
US20020149731A1 (en) Display device and method of manufacturing such a display device
KR20110016794A (ko) 백라이트 유닛 및 이를 구비한 액정표시장치
CN216213461U (zh) 显示模组和显示装置
CN113690291B (zh) 触控显示面板及显示装置
CN110543037B (zh) 显示装置
CN118139463A (zh) 显示面板的制备方法、显示面板及显示装置
CN117877385A (zh) 柔性显示模组和显示装置
CN116096143A (zh) 显示面板、显示模组及显示装置
CN117523981A (zh) 显示模组和显示装置
CN117316060A (zh) 一种显示面板、拼接显示面板以及显示装置
CN114842760A (zh) 显示模组和显示装置

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant