CN102598284B - 半导体器件 - Google Patents

半导体器件 Download PDF

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Publication number
CN102598284B
CN102598284B CN201080050574.XA CN201080050574A CN102598284B CN 102598284 B CN102598284 B CN 102598284B CN 201080050574 A CN201080050574 A CN 201080050574A CN 102598284 B CN102598284 B CN 102598284B
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Prior art keywords
layer
oxide semiconductor
metal
mixed layer
semiconductor layer
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Chinese (zh)
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CN102598284A (zh
Inventor
山崎舜平
平石铃之介
秋元健吾
坂田淳一郎
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Semiconductor Energy Laboratory Co Ltd
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Semiconductor Energy Laboratory Co Ltd
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Priority to CN201410581750.2A priority Critical patent/CN104465318B/zh
Publication of CN102598284A publication Critical patent/CN102598284A/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/60—Electrodes characterised by their materials
    • H10D64/62—Electrodes ohmically coupled to a semiconductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
    • H01L21/02164—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material being a silicon oxide, e.g. SiO2
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02172—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides
    • H01L21/02175—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides characterised by the metal
    • H01L21/02178—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides characterised by the metal the material containing aluminium, e.g. Al2O3
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/02521—Materials
    • H01L21/02565—Oxide semiconducting materials not being Group 12/16 materials, e.g. ternary compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/02631—Physical deposition at reduced pressure, e.g. MBE, sputtering, evaporation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/674—Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/421—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer
    • H10D86/423—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer comprising semiconductor materials not belonging to the Group IV, e.g. InGaZnO

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Thin Film Transistor (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Electroluminescent Light Sources (AREA)
CN201080050574.XA 2009-11-06 2010-10-19 半导体器件 Active CN102598284B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410581750.2A CN104465318B (zh) 2009-11-06 2010-10-19 制造半导体器件的方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2009-255272 2009-11-06
JP2009255272 2009-11-06
PCT/JP2010/068794 WO2011055645A1 (en) 2009-11-06 2010-10-19 Semiconductor device

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN201410581750.2A Division CN104465318B (zh) 2009-11-06 2010-10-19 制造半导体器件的方法

Publications (2)

Publication Number Publication Date
CN102598284A CN102598284A (zh) 2012-07-18
CN102598284B true CN102598284B (zh) 2015-04-15

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CN201410581750.2A Active CN104465318B (zh) 2009-11-06 2010-10-19 制造半导体器件的方法

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US (2) US8841662B2 (enExample)
JP (5) JP5665480B2 (enExample)
KR (3) KR101876470B1 (enExample)
CN (2) CN102598284B (enExample)
TW (3) TWI647849B (enExample)
WO (1) WO2011055645A1 (enExample)

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US8247276B2 (en) * 2009-02-20 2012-08-21 Semiconductor Energy Laboratory Co., Ltd. Thin film transistor, method for manufacturing the same, and semiconductor device
CN102598279B (zh) 2009-11-06 2015-10-07 株式会社半导体能源研究所 半导体装置
KR101945660B1 (ko) 2009-11-20 2019-02-07 가부시키가이샤 한도오따이 에네루기 켄큐쇼 트랜지스터
KR101895325B1 (ko) 2010-12-17 2018-09-05 가부시키가이샤 한도오따이 에네루기 켄큐쇼 산화물 재료 및 반도체 장치
US9196741B2 (en) 2012-02-03 2015-11-24 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
WO2014005841A1 (en) * 2012-07-03 2014-01-09 Imec A method for fabricating a thin film transistor
WO2014103901A1 (en) 2012-12-25 2014-07-03 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
KR102290247B1 (ko) * 2013-03-14 2021-08-13 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치와 그 제작 방법
TWI631711B (zh) * 2013-05-01 2018-08-01 半導體能源研究所股份有限公司 半導體裝置
TWI513004B (zh) * 2013-07-04 2015-12-11 Ye Xin Technology Consulting Co Ltd 薄膜電晶體及其製造方法
CN104282767B (zh) * 2013-07-05 2017-12-12 鸿富锦精密工业（深圳）有限公司 薄膜晶体管及其制造方法
US11809451B2 (en) 2014-02-19 2023-11-07 Snowflake Inc. Caching systems and methods
US9941324B2 (en) 2015-04-28 2018-04-10 Nlt Technologies, Ltd. Semiconductor device, method of manufacturing semiconductor device, photodiode array, and imaging apparatus
CN104934330A (zh) * 2015-05-08 2015-09-23 京东方科技集团股份有限公司 一种薄膜晶体管及其制备方法、阵列基板和显示面板
CN105405768A (zh) * 2015-12-14 2016-03-16 华南理工大学 一种薄膜晶体管及其制备方法
US20170309852A1 (en) * 2016-04-22 2017-10-26 Semiconductor Energy Laboratory Co., Ltd. Light-Emitting Element, Display Device, Electronic Device, and Lighting Device
CN106098559A (zh) * 2016-06-21 2016-11-09 北京大学深圳研究生院 一种底栅共平面型金属氧化物薄膜晶体管的制备方法
KR102589754B1 (ko) 2016-08-05 2023-10-18 삼성디스플레이 주식회사 트랜지스터 및 이를 포함하는 표시 장치
CN106229260A (zh) * 2016-08-31 2016-12-14 深圳市华星光电技术有限公司 一种薄膜晶体管及其制造方法
EP3435045B1 (en) * 2017-07-27 2023-12-13 ams AG Optical sensor package
KR102402945B1 (ko) 2017-08-31 2022-05-30 마이크론 테크놀로지, 인크 금속 산화물 반도체 디바이스의 접촉을 위한 반도체 디바이스, 트랜지스터, 및 관련된 방법
KR102396806B1 (ko) 2017-08-31 2022-05-12 마이크론 테크놀로지, 인크 반도체 장치, 하이브리드 트랜지스터 및 관련 방법
CN110265548B (zh) * 2019-06-04 2020-12-22 华东师范大学 一种铟掺杂n型有机薄膜晶体管及其制备方法
CN113889488B (zh) * 2021-09-18 2025-08-26 厦门天马显示科技有限公司 显示面板及显示装置
JP2023149086A (ja) * 2022-03-30 2023-10-13 株式会社ジャパンディスプレイ 半導体装置の製造方法

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