CN102439402A - 智能温度测量装置 - Google Patents
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Abstract
提供一种具有集成的智能芯片或电子电路的温度测量装置。该智能芯片或电子电路,包括存储于其中的针对不同温度测量装置的至少一唯一标识号或数据。该电子电路进一步包括存储于其中的温度测量装置的校正数据。温度控制系统的模块控制器被配置为在允许数据在温度测量装置和温度控制器之间进行传输前验证热电偶组件的唯一标识号。图形用户界面允许操作者输入唯一标识号或数据来验证温度测量装置并且当输入的号码或数据与存储在电子电路中的唯一标识号或数据不相同或不匹配时显示错误消息。
Description
技术领域
本发明涉及一种温度测量装置,以及更具体地涉及一种被配置为提高了在半导体处理设备中温度控制的准确性的温度测量装置。
背景技术
温度控制的半导体处理室被用于沉积各种材料层到一个或多个衬底表面。在处理室内处理衬底时,一个或多个衬底或工件,例如硅晶片,被放置在处理室中的工件支承体上。衬底和工件支承体都被加热到期望温度。在典型的处理步骤中,反应气体被引入到处理室中并且通过每个被加热的衬底上方,通过化学气相沉积(CVD)或原子层沉积(ALD)过程在衬底表面上沉积反应气体中的反应材料的薄层。通过接下来的步骤,这些层被形成为集成电路,并且根据衬底的大小和电路的复杂性,从被处理的衬底中切割出成千上万甚至上百万的集成器件。
必须仔细控制各种过程参数以确保生成的沉积层的高质量。一个这样的重要参数是在每个处理步骤期间的衬底温度。例如,在CVD期间,沉积气体在特定温度反应以在衬底上沉积薄层。如果跨衬底表面的温度显著不同,沉积层就会不均匀。因此,在衬底处理期间,衬底温度在期望温度保持稳定和一致是重要的。类似地,在其它的热处理期间,跨衬底的温度的不一致或不稳定会影响衬底表面上的生成的结构的一致性。温度控制很重要的其他过程包括但不限于,氧化,氮化,掺杂扩散,溅射沉积,光蚀刻,干蚀刻,等离子处理,以及高温退火。
在接近和紧邻被处理的衬底的不同位置处测量温度的方法和系统是已知的。典型地,在接近被处理的衬底的不同位置放置热电偶组件,并且这些热电偶组件可操作地与控制器连接以帮助提供跨整个衬底表面的更一致的温度。例如,授权给VanBilsen的美国专利号6,121,061主要教导了多个在围绕衬底的不同点进行温度测量的温度传感器,包括一接近衬底前边缘的热电偶组件,另一接近后边缘的热电偶组件,一在侧面的热电偶组件,以及另一在接近衬底中心的衬底下方的热电偶组件。
通常与因为故障或日常维护导致的热电偶组件替换相关联的问题是每个热电偶组件之间的差异。各个热电偶组件之间的差异可以归因于许多因素,包括但不限于,使用的材料或生产热电偶组件的方法。每个热电偶组件之间的差异会导致不同的温度测量结果,或者相对于之前的热电偶组件在相同温度的不同温度测量结果,这反过来会影响沉积过程,如果所测量的温度与反应室中的实际温度实质上不相同的话。由于温度控制系统是基于与系统连接的每个热电偶组件所测量的校正温度,因此连续的热电偶组件之间的任何校正差异将引起温度控制方案的变化,其会导致衬底上的层的不一致的沉积。
因此,需要一种温度测量装置,其包括预校正参数使得沉积工具可以根据温度测量装置的预校正参数自动地被调整。也需要一种温度测量装置,在其中预校正参数集成地包含在温度测量装置中。
发明内容
在本发明的一个方面,提供一种热电偶组件。该热电偶组件包括至少一个用于测量温度的热电偶接头。该热电偶组件还包括在其上存储有校正数据和唯一标识号的电子电路。该热电偶接头可操作地连接到电子电路。
在本发明的另一个方面,提供一种温度控制系统。该温度控制系统包括至少一个加热元件和一种温度控制器。每个加热元件可操作地连接到温度控制器,并且温度控制器控制加热元件的输出。该温度控制系统进一步包括可操作地连接到温度控制器的温度测量装置。该温度测量装置包括集成在其中的电子电路。
在本发明的又一个方面,提供一种用于对半导体处理工具的温度测量装置进行验证的方法。该方法包括提供一种具有集成于其中的电子电路的温度测量装置,其中电子电路包括存储于其上的至少一唯一标识号或数据。该方法也包括提供一种可操作地连接到温度测量装置的模块控制器。该方法进一步包括提供一种可操作地连接到模块控制器和温度测量装置的温度控制器。该方法还包括在温度测量装置和温度控制器或模块控制器之间传输数据前验证存储在所述温度测量装置上的唯一标识号或数据。
在本发明的进一步的方面,提供一种用于对半导体处理工具的温度测量装置进行验证的方法。该方法包括提供一种可操作地连接到温度控制器的模块控制器。该方法进一步包括将温度测量装置连接到模块控制器,其中模块控制器关于存储在与温度测量装置集成的电子电路上的唯一标识号对温度测量装置进行询问。该方法还包括输入标识号到图形用户界面(GUI)中。该GUI可操作地连接到模块控制器。该方法还包括将存储在温度测量装置的电子电路上的唯一标识号与输入到GUI中的标识号进行比较。该方法包括如果存储在温度测量装置的电子电路上的唯一标识号等于输入到GUI中的标识号,就允许温度测量装置与温度控制器之间的数据传输。该方法进一步包括如果存储在温度测量装置的电子电路上的唯一标识号不等于输入到GUI中的标识号,就阻止温度测量装置与温度控制器之间的数据传输。
对于本领域技术人员而言,通过接下来的对用图示表示和描述的本发明实施例的描述,本发明的优点会更加显而易见。如将被认识到的,本发明能够有其它的和不同的实施例,以及它的细节在不同的方面能够进行修改。因此,附图和描述实际上是例证性的而不是限制性的。
附图的若干视图的简要描述
图1是半导体处理工具的反应器的实施例的侧边横截面视图;
图2是示例的温度控制系统的示意图;
图3是示例的温度测量装置的立体图;以及
图4示出了温度控制系统的电子示意图。
优选实施例的详细描述
参照图1,示出的是一种化学气相沉积(“CVD”)反应器10的示例性实施例。虽然举例说明的实施例是单个衬底、水平流动、冷壁反应器,但本领域技术人员应当明白,这里描述的热电偶技术可以用在其它类型的半导体处理反应器中,也可以用在其它需要精确温度传感器的应用中。反应器10包括限定反应空间14的反应室12,位于反应室12相对各面上的加热元件16,和衬底支承结构18。反应室12是细长的部件,具有用于允许将反应气体引入到反应空间14的入口20和供反应气体和处理副产品通过其离开反应空间14的出口22。在实施例中,反应室12由透明石英形成,其被配置为允许来自加热元件16的基本上所有的辐射能量通过反应室12的壁。加热元件16向反应室12提供辐射能量,而反应室12的壁没有明显的吸收这些辐射能量。加热元件16被配置为提供具有由被处理的衬底以及衬底支承结构18的各部分吸收的波长的辐射热。
在实施例中,如图1所示,衬底支承结构18包括在沉积过程中衬底40被放置于其上的衬底支持体24。衬底支承结构18还包括被配置为支承衬底支持体24的支承部件26。支承部件26连接到通过管30向下延伸的轴28,管从反应室12的下壁延伸。电动机(未示出)被配置为使轴28旋转,从而使衬底支持体24和衬底40在沉积过程中以同样的方式旋转。基座环25围绕衬底40和衬底支持体24的边缘放置以抵消来自边缘的热损失。温度测量装置32,例如热电偶组件、高温计等,被放置在基座环25内以测量衬底40和衬底支持体24周围的预定位置处的局部温度。
参照图2,示出了在反应室内的温度控制系统34的实施例。示出的用于化学气相沉积反应器10的温度控制系统34包括邻近衬底40和衬底支持体24放置的多个温度测量装置32,用于测量预定位置处的温度。温度测量装置32可操作地连接到温度控制器36。温度控制器36可操作地连接到加热元件16以控制反应室12内的加热方案。
在图2的示意图中,示出的实施例的温度控制系统34包括多个围绕衬底40放置的温度测量装置32,在其中温度测量装置32包括:与衬底支持体24的下表面邻近的中心温度传感器32a,前边缘温度传感器32b,后边缘温度传感器32c,以及至少一个侧面边缘温度传感器32d。相对于反应空间14内的反应气体的流动方向A,前和后边缘温度传感器32b、32c邻近衬底40的前和后边缘。温度测量装置32被配置为测量局部区域的温度以及传输温度测量数据到温度控制器36。温度控制器36被配置为响应于温度测量装置32提供的数据有选择地调整从加热元件16发出的能量,以维持跨整个被处理的衬底40的基本一致的温度分布。本领域技术人员应当明白的是温度控制系统34可以包括任意数量的温度测量装置32,温度测量装置32被放置在反应室12内或外部的不同位置,用于向温度控制器36提供被处理的衬底40的温度或邻近衬底40的位置的数据。
温度测量装置32可以包括热电偶组件,高温计,温度计,或能够测量半导体制造仪器内的温度的任何其它温度测量装置。在实施例中,每个温度测量装置32与其它的都是相同的。在另一实施例中,至少一个温度测量装置32与其它的不同。在实施例中,每个温度测量装置32都是热电偶组件,例如在序列号为12/140,809的美国专利申请中描述的热电偶组件。尽管示出的温度控制系统34包括四个温度测量装置32,但本领域技术人员应当明白的是,温度控制系统34可以包括任意数量和类型的温度测量装置32。
参照图3,示出的是智能热电偶组件132的示例性实施例。尽管对本发明的温度测量装置的优选实施例在热电偶组件的上下文中进行了讨论,但本领域技术人员要意识到这里提出的主要原理和优点可以应用到可用于测量半导体处理反应器或半导体制造仪器内的温度的其它温度测量装置中。在实施例中,热电偶组件132包括护套150,支承部件152,电线对154,接头156,盖子158,电子电路160,插头162。该护套150是细长的管状部件,具有形成一封闭端的测量端164。护套150的相对端形成盖子158连接于其上的开口端。在实施例中,护套150由石英组成,然而,本领域技术人员应当明白的是,护套150可以由任意足够经受得住温度变化且相对于引入到反应室中的气体基本无活性的材料组成。
在图3所示的实施例中,支承部件152被放置在护套150中并且延伸护套150的长度的至少一部分。支承部件152被配置为容纳电线对154于其中。在实施例中,支承部件152由陶瓷材料形成。在实施例中,电线对154从邻近护套150测量端164的支承部件152延伸到电子电路160。电线154由不同金属形成,并且每个电线的端部熔合到另一电线的端部以形成提供在其间的热电偶的接头156。描述的实施例示出的是邻近护套150测量端164的接头156,但是本领域技术人员应当明白的是,热电偶组件132可以包括被放置在沿着护套150的长度的任何位置的多个接头。
在实施例中,如图3所示,电线154可操作地将接头156连接到电子电路160和插头162。插头162提供热电偶组件132和温度控制器36之间的接口,如图4所示。插头162提供热电偶组件132和温度控制器36之间的物理连接,但是本领域技术人员应当明白的是,热电偶组件132可以替换地包括无线发送器(未示出),该无线发送器可操作地将热电偶组件132连接到温度控制器136而不需要在它们之间的物理连接。
如图3-4所描述的,接头156可操作地连接到电子电路160。描述的实施例示出的是位于盖子158和插头162之间的电子电路160,但是需要本领域技术人员明白的是,电子电路160可以位于接头和热电偶组件132所连接的接口之间的任意位置。在实施例中,电子电路160集成到盖子158中。在另一实施例中,电子电路160集成到插头162中。需要本领域技术人员明白的是,在维持对接头156的可操作连接的同时,电子电路160可以位于热电偶组件132上的任意位置。
在热电偶组件132的组装过程中,使用来自美国国家标准和技术协会(NIST)的可追溯校正装置来校正热电偶组件132,以验证热电偶组件132的精确性。在热电偶组件132的组装过程中,还为每个热电偶组件132提供该热电偶组件专用的唯一标识号或数据,例如序号等。校正数据和唯一标识号被存储在电子电路160上以及通过并且在智能热电偶组件132中传送。本领域技术人员应当明白的是,除了校正数据和唯一标识号,其它数据或标识符也可以存储在电子电路160中。在实施例中,电子电路160包括热电偶组件132的校正数据和唯一标识号存储于其中的数据存储装置。在实施例中,电子电路160包括校正数据和唯一标识号存储于其中的电可擦除可编程只读存储器(EEPROM)。在另一实施例中,电子电路160包括校正数据和唯一标识号存储于其中的闪存。本领域技术人员应当明白的是,任意其它的热电偶组件的校正数据和唯一标识号存储于其中的数据存储装置可以与电子电路160结合。本领域技术人员应当明白的是,校正数据和唯一标识号可以存储在电子电路160的相同存储装置或不同存储装置中。
智能热电偶组件132被配置为通过提供对热电偶组件的校正和提供预校正设置以减少或消除一旦被安装后校正热电偶组件所需要的时间和精力,来提高温度控制系统34的精确性和性能。智能热电偶组件132还被配置为确保温度测量装置的正确类型与温度控制系统134一起使用,从而允许热电偶组件与温度控制系统134之间的正确通信。智能热电偶组件132还将减小不正确或不合适的校正数据导致错误的可能性,因为相对于安装在反应器10中后进行匆忙的校正(图1),热电偶组件是使用校正装置进行预校正的。
图4示出了示例说明的示意性的温度控制系统34,其具有智能热电偶组件132和温度控制系统34的温度控制器36之间的可操作连接。如前所述,热电偶接头156可操作地连接到集成在热电偶组件132内的电子电路160。当安装热电偶组件132时,通过模块控制器166将热电偶组件132可操作地连接到温度控制器36。图形用户界面(GUI)168也可操作地连接到模块控制器166。GUI 168提供用户与模块控制器之间的接口,由此信息可以在GUI 168和模块控制器166之间传输。模块控制器166被配置为在数据或温度测量结果从热电偶组件132被传输到温度控制器36之前验证连接到温度控制器36的热电偶组件132。换句话说,模块控制器166充当了热电偶组件132与温度控制器36之间的开关,使得来自接头156的温度测量结果在模块控制器166验证热电偶组件132前不被传输到温度控制器。
在操作中,将热电偶组件132安装到反应器10的操作者可操作地将热电偶组件132连接到模块控制器166。一旦热电偶组件132被可操作地连接,模块控制器166向电子电路160传输信号,以向电子电路160询问存储于其上的唯一标识号或数据。如果热电偶组件132被安装在不包含集成于其上的电子电路160的反应器10上时,模块控制器166接收不到从热电偶组件返回的信号或数据,并且于是向GUI 168传输信号以向操作者提供错误消息指示热电偶组件132与温度控制系统34不匹配。如果热电偶组件132包含集成于其上的电子电路160,电子电路160将信号传输到包含特定热电偶组件132的唯一标识号或数据的模块控制器166。一旦模块控制器166接收到来自电子电路160的唯一标识号或数据,模块控制器166向操作者询问输入与特定热电偶组件132相对应的相同唯一标识号或数据,用于通过GUI确认和验证特定热电偶组件132的唯一标识号或数据。一旦操作者输入标识号或数据,标识号或数据就被传输到模块控制器166。模块控制器166将热电偶组件132的唯一标识号与操作者输入的标识号或数据进行比较。如果标识号或数据与热电偶组件132的唯一标识号或数据不相等,模块控制器166向GUI 168传输信号,用以命令GUI 168向操作者显示错误消息以表明操作者输入的标识号或数据与特定热电偶组件132的唯一标识号或数据不对应。当操作者向GUI 168输入的标识号或数据与特定热电偶组件132的唯一标识号或数据不对应时,模块控制器166还阻止数据在热电偶组件132与温度控制器36之间的传输。
以上解释的对热电偶组件132的验证程序可以在热电偶组件132被安装并且被可操作地连接到模块控制器166之后的任意时间进行。在实施例中,验证过程在热电偶组件132可操作地连接到模块控制器166之后立即被执行。在另一实施例中,验证过程在对反应器10进行操作前就立即被执行,使得对反应器10内的衬底40的处理仅仅在热电偶组件132被验证后就可以开始。在反应器里进行处理前立即验证热电偶组件132,确保了另一热电偶组件132没有接通,因为热电偶组件132的接通可能产生由于不同热电偶组件的不同校正数据而导致的没有价值的处理结果。在又一实施例中,在进行处理的过程中,例如,处理随机衬底对之间,验证程序可以在规则间隔进行。本领域技术人员应当明白的是,热电偶组件的验证程序可以在任意时间进行,以确保在处理中使用正确的热电偶组件132以保证最优处理结果。
如果操作者向GUI 168中输入与特定热电偶组件132的唯一标识号或数据相对应的标识号或数据,模块控制器166将热电偶组件132的唯一标识号与操作者输入的标识号或数据进行比较,以确认码或数据是否相等并且验证热电偶组件132。一旦热电偶组件132被验证,模块控制器166就向电子电路160传输信号以询问校正数据存储于其上的电子电路160。于是,电子电路160直接地或通过模块控制器166向温度控制器36传输校正数据。温度控制器36接收校正数据并且相应地调节温度控制系统34。一旦模块控制器166验证了热电偶组件132并且电子电路160上的校正数据被传输到温度控制系统34,数据和信息就可以自由地在热电偶组件132和温度控制器36之间传输。
对具有集成电子电路160的温度测量装置的验证,通过在安装之前确保对温度测量装置进行正确地校正,减少了温度测量装置出错的可能性。对具有集成电子电路160的温度测量装置的验证,通过确认仅仅具有温度测量装置的校正数据和唯一标识号或数据存储于其上的电子电路的温度测量装置被用在半导体处理工具中,也减少了温度测量装置出错的可能性。通过集成校正数据到温度测量装置组件,这种验证过程进一步减少了操作者安装或替换温度测量装置所需要的时间量。
上面描述的智能温度测量装置涉及将热电偶组件作为测量装置,但是本领域技术人员应当明白的是,用于验证和确认温度测量装置的技术可以与任意其它温度测量装置结合,包括高温计、温度计等。
尽管已经描述了本发明的优选实施例,但本领域技术人员应当理解,本发明并非仅限于此并且可以进行修改而不脱离本发明。本发明的范围由附加的权利要求以及字面地或等同地落入权利要求的意图范围内的所有装置,过程和方法来限定。
Claims (20)
1.一种热电偶组件,包括:
用于测量温度的至少一个热电偶接头;以及
其上存储校正数据和唯一标识号的电子电路,其中所述至少一个热电偶接头可操作地连接到所述电子电路。
2.如权利要求1所述的热电偶组件,其特征在于,所述电子电路包括电可擦除可编程只读存储器(EEPROM)。
3.如权利要求2所述的热电偶组件,其特征在于,至少一个所述唯一标识号被存储在所述EEPROM上。
4.如权利要求1所述的热电偶组件,其特征在于,所述电子电路包括闪存。
5.如权利要求2所述的热电偶组件,其特征在于,至少一个所述唯一标识号被存储在所述闪存上。
6.如权利要求1所述的热电偶组件,其特征在于,多个接头可操作地连接到所述电子电路。
7.一种温度控制系统,包括:
至少一个加热元件;
温度控制器,其中所述至少一个加热元件中的每一个可操作地连接到所述温度控制器并且所述温度控制器控制所述至少一个加热元件的输出;以及
可操作地连接到所述温度控制器的温度测量装置,所述温度测量装置具有集成电子电路。
8.如权利要求7所述的温度控制系统,其特征在于,所述温度测量装置与所述温度控制器无线通信。
9.如权利要求7所述的温度控制系统,其特征在于,进一步包括存储在所述电子电路上的校正数据和唯一标识号。
10.如权利要求7所述的温度控制系统,其特征在于,进一步包括可操作地连接到所述温度测量装置和所述温度控制器的模块控制器。
11.如权利要求10所述的温度控制系统,其特征在于,在数据在所述温度测量装置与所述温度控制器之间可传输之前,所述模块控制器验证所述温度测量装置的唯一标识号。
12.如权利要求11所述的温度控制系统,其特征在于,图形用户界面(GUI)可操作地连接到所述模块控制器。
13.一种验证用于半导体处理工具的温度测量装置的方法,所述方法包括;
提供具有集成于其中的电子电路的温度测量装置,其中所述电子电路包括存储于其上的至少一唯一标识号或数据;
提供可操作地连接到所述温度测量装置的模块控制器;
提供可操作地连接到所述模块控制器和所述温度测量装置的温度控制器;以及
在所述温度测量装置和所述温度控制器之间传输数据前验证存储在所述温度测量装置上的所述唯一标识号或数据。
14.如权利要求13所述的方法,其特征在于,验证所述唯一标识号或数据包括:将与所述温度测量装置相对应的所述唯一标识号或数据输入到可操作地连接到所述模块控制器的图形用户界面。
15.如权利要求14所述的方法,其特征在于,验证所述唯一标识号或数据包括:所述模块控制器将所述唯一标识号与所述操作者输入的所述唯一标识号或数据进行比较。
16.如权利要求15所述的方法,其特征在于,如果所述温度测量装置的所述唯一标识号与所述操作者输入的所述唯一标识号不相等,验证所述唯一标识号或数据则阻止数据在所述温度测量装置与所述温度控制器之间传输。
17.如权利要求15所述的方法,其特征在于,如果所述温度测量装置的所述唯一标识号与所述操作者输入的所述唯一标识号相等,验证所述唯一标识号或数据则允许数据在所述温度测量装置与所述温度控制器之间传输。
18.一种验证用于半导体处理工具的温度测量装置的方法,所述方法包括;
提供可操作地连接到温度控制器的模块控制器;
将温度测量装置连接到所述模块控制器,其中所述模块控制器关于存储在与所述温度测量装置集成的电子电路上的唯一标识号向所述温度测量装置进行询问;
将标识号输入到图形用户界面(GUI)中,所述GUI可操作地连接到所述模块控制器;
将存储在所述温度测量装置的所述电子电路上的所述唯一标识号与输入到所述GUI中的所述标识号进行比较;
如果存储在所述温度测量装置的所述电子电路上的所述唯一标识号等于输入到所述GUI中的所述标识号,则允许所述温度测量装置与所述温度控制器之间的数据传输;
如果存储在所述温度测量装置的所述电子电路上的所述唯一标识号不等于输入到所述GUI中的所述标识号,则阻止所述温度测量装置与所述温度控制器之间的数据传输。
19.如权利要求18所述的方法,其特征在于,进一步包括:如果存储在所述温度测量装置的所述电子电路上的所述唯一标识号不等于输入到所述GUI中的所述标识号,则在所述GUI上显示错误消息。
20.如权利要求18所述的方法,其特征在于,进一步包括:如果存储在所述温度测量装置的所述电子电路上的所述唯一标识号等于输入到所述GUI中的所述标识号,则将存储在所述电子电路上的所述温度测量装置的校正数据下载到所述温度控制器。
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Also Published As
Publication number | Publication date |
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US20100286842A1 (en) | 2010-11-11 |
TWI506256B (zh) | 2015-11-01 |
TW201113510A (en) | 2011-04-16 |
CN102439402B (zh) | 2016-01-20 |
WO2010129430A1 (en) | 2010-11-11 |
US9297705B2 (en) | 2016-03-29 |
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