CN102104016A - 衬底保持器和夹具 - Google Patents

衬底保持器和夹具 Download PDF

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CN102104016A
CN102104016A CN2010105354201A CN201010535420A CN102104016A CN 102104016 A CN102104016 A CN 102104016A CN 2010105354201 A CN2010105354201 A CN 2010105354201A CN 201010535420 A CN201010535420 A CN 201010535420A CN 102104016 A CN102104016 A CN 102104016A
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substrate
clamping device
stopping element
substrate holder
anchor clamps
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T·贝纳尔
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Soitec SA
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
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    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
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    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
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    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68771Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate

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Abstract

本发明涉及一种衬底保持器和夹具,所述衬底保持器包括:衬底支撑件;可移动的夹紧装置,其被配置为在第一位置接合位于所述支撑件上的衬底以及在不同的位置远离衬底;定位装置,其用于使所述夹紧装置从所述第二位置向所述第一位置移动。为了防止当没有衬底位于所述支撑件上时所述夹紧装置和所述支撑件之间接触,使用限制所述夹紧装置的运动的弹性止动元件。本发明还涉及一种夹具以及一种使用所述衬底保持器和所述夹具的离子注入机。

Description

衬底保持器和夹具
技术领域
本发明涉及一种衬底保持器和一种用于将衬底可拆除地保持在衬底保持器上的夹具。这种衬底保持器和/或夹具例如用于离子注入设备当中。
背景技术
离子注入机,例如应用材料公司(Applied Materials)的Quantum注入机用于向半导体衬底中注入离子。例如,在用于制造绝缘体上半导体(SOI)衬底的所谓的Smart CutTM工艺中,将氢和/或氦离子注入直径为200或300mm的硅晶片中。
图1示意性地显示了这种注入机。设备包括具有多个臂3的注入轮(wheel)1,每个臂3在其外端具有放置待处理衬底的衬底支撑件5。在图1中看不到衬底,因为衬底放置在衬底支撑件5的不可见的那一侧。轮1能够围绕它的轴7在垂直面内以大约850rpm的速度转动。注入轮1位于离子注入机的腔9内,腔9还包括离子束发生器11,离子束发生器11被配置成发射用于注入到衬底中的离子束,例如所述氢和/或氦离子。轮1不仅被配置为围绕轴7转动,还可以在方向13中平移,从而可以对放置在衬底支撑件5的其中之一上的衬底的整个表面进行注入。
为在转动和平移过程中将衬底固定在衬底支撑件5上,衬底支撑件5在位于轮1外缘的衬底支撑件5的边缘区域包括固定保持装置15,如显示衬底支撑件5的背面的图2所示。在转动过程中,离心力迫使位于衬底支撑件5上的衬底抵靠在固定保持装置15上,从而将其稳固地保持在适当的位置。同样为了在轮1减速和停下来的时候(例如为了装载或卸载轮)将衬底保持在衬底支撑件5上,在与固定保持装置15相对的一侧设置有额外的夹紧装置17和19。在Quantum注入机中,夹紧装置17,19被配置成当轮1减速和停下来的时候接合衬底支撑件5上的衬底,但在轮1高速转动的时候离开衬底。这可以通过使用弹簧和平衡物来实现,其中平衡物被配置和设置成当离心力不存在或低于某个阈值的时候,弹簧所施加的力使夹紧装置17,19向衬底方向回退,以将衬底保持在保持器5上,以及在转动过程中,平衡块上的离心力将抵消弹簧的弹性力,从而夹紧装置17,19离开衬底。
在Smart CutTM工艺中,离子被注入到半导体衬底上以形成预定的分裂区域,随后半导体衬底被键合到第二衬底上以转移由预定的分裂区域限定的层,因此注入步骤的质量是至关重要的。但是,衬底离开注入机时被小颗粒污染是经常出现的问题,由于必须进行清洁操作,导致工具的正常运行时间减少。在离子注入机中已经确认有多个污染源。另外,由于衬底在轮1上的装载机构、离子束的产生以及轮1的转动,也会出现污染。为了确保最终的产品质量,必须不得不因此而中断生产周期,定期打开注入腔9以将离子注入机清理干净。每次打开工具进行保养时都必须进行检验,这增加了生产线的停机时间,因此增加了总的制造成本。
发明内容
出于以上原因,本发明的目的在于提供一种能够减少小颗粒污染的方案。
通过根据权利要求1的衬底保持器来实现这一目的。根据本发明的衬底保持器包括:衬底支撑件;可移动的夹紧装置,其被配置为在第一位置接合所述衬底支撑件上的衬底以及在第二位置远离所述衬底;定位装置,特别是弹性定位装置,其用于使所述夹紧装置从所述第二位置向所述第一位置移动;以及止动装置,特别是弹性止动元件,其用于在所述第二位置和所述第一位置所限定的方向上限制所述夹紧装置朝向所述衬底支撑件的运动,从而即使所述衬底支撑件上没有衬底,所述夹紧装置也保持远离所述衬底支撑件。
通过提供止动装置,可以减少在注入机中观察到的颗粒污染。即使衬底支撑件上没有衬底,止动装置,特别是弹性元件,确保夹紧装置和衬底支撑件之间不会发生接触。与此形成对比的是,在现有技术中,当轮减速时,夹紧装置和空闲的衬底支撑件之间发生接触,这会导致颗粒的产生。实际上,朝向衬底保持器的运动可由弹簧来保证,并且仅由衬底保持器自身来限制。
优选地,所述可移动的夹紧装置、所述定位装置以及所述止动装置形成一个模块单元。通过提供模块单元,易于将现有技术中已有的夹紧装置同定位装置一同调换,从而不需要长时间停机即可升级本领域中已经使用的机器。
更优选地,所述模块单元可包括用于将所述模块单元连接到所述衬底支撑件上的连接板。这进一步有助于已经使用的工具的升级。
根据优选实施例,所述衬底支撑件包括金属板,所述夹紧装置也是金属的。衬底支撑件应该是金属的,从而其可以作为热沉,夹紧装置也是由金属制成的,以便在将衬底夹紧在衬底支撑件上的时候具有足够的硬度。金属夹紧销一方面可以具有足够的耐热性,从而在离子束的冲击下,夹紧装置保持其形状。另一方面,不再需要额外的检验过程。
优选地,所述弹性止动元件可以是由聚偏二氟乙烯(PVDF)或聚醚醚酮(PEEK)制成的。PVDF和PEEK具有柔性,重量轻,且具有良好的耐化学性、耐热性和耐燃性,从而其使用寿命足够长,能够用于离子注入机的高要求环境中。PVDF比PEEK更经济。
根据优选实施例,所述衬底保持器可包括反向定位装置,所述反向定位装置用于将所述夹紧装置从所述第一位置移动到所述第二位置,特别是基于转动力/离心力。因此,在注入过程中,夹紧装置离开衬底,从而衬底的整个表面可被注入,因为可以防止由于邻近夹紧装置而出现的阴影效应等等。
还通过根据权利要求7的夹具来实现本发明的目的,其适合于将衬底可拆除地保持在根据上述实施例及变形的衬底保持器上。该夹具包括:可移动的夹紧装置;定位装置,其用于移动所述夹紧装置,特别用于线性移动所述夹紧装置;以及止动装置,特别是弹性止动元件,其用于在至少一个方向上限制由所述定位装置赋予所述夹紧装置的定位运动的程度。通过该设备,可以防止或至少减少可移动夹紧装置和衬底保持器之间的不必要的接触,这种不必要的接触可导致颗粒的形成,而颗粒会污染随后放到衬底保持器上的衬底的表面。
优选地,所述弹性止动元件可以是由聚偏二氟乙烯(PVDF)制成的,聚偏二氟乙烯(PVDF)具有柔性,重量轻,并且具有良好的耐化学性、耐热性和耐燃性,从而其使用寿命足够长,能够用于离子注入机的高要求环境中。
有利地,所述弹性止动元件是固定的。通过将弹性止动元件设置在夹具的固定部分上,可以简化夹具的设计,并且可以将活动部分的重量降至最低。
根据另一优选实施例,所述夹紧装置可包括销区域和止动元件接合板,其被配置和设置成所述止动元件接合板与所述止动装置接触,从而阻止所述夹紧装置的运动。这样,两个功能都可以通过单一工件来实现,因此进一步简化了夹具的设计。
优选地,所述止动元件接合板可被配置和设置成所述止动元件接合板至少部分地遮盖所述弹性止动元件。这样,可以防止弹性止动元件受到离子束的作用。
本发明还涉及包括如上文所述的衬底保持器和夹具的离子注入设备。
附图说明
下面将根据附图更详细地描述本发明:
图1示意性地显示了本领域已知的离子注入机的注入轮,
图2显示了本领域已知的离子注入机中使用的衬底保持器的后视图。
图3a-图3c示意性地显示了根据本发明的衬底保持器的一部分和夹具的仰视图、俯视图及示意性侧剖图,其中相应的夹紧装置处于第一位置,
图4a-图4c示意性地显示了当夹紧装置处于第二位置时衬底保持器和夹具的仰视图、俯视图以及侧剖图,
图5显示了当衬底保持器上存在衬底时根据本发明的衬底保持器和夹具。
具体实施方式
图3a示意性地显示了根据本发明的衬底保持器21的底部的局部视图。图中的衬底保持器上没有放置衬底。对于接下将描述的具有图1所显示的离子注入机和图2所显示的衬底保持器中已使用的附图标记的特征时,将不再进行详细的描述,而是以引用的方式将它们的描述包括于此。
根据本发明的衬底保持器21包括衬底支撑件5和夹具23,衬底支撑件5典型为圆形金属板,例如由不锈钢(inox)制成,从而可以作为热沉。夹具23在衬底保持器5上的设置位置与图2所示的现有技术的夹具17和19相同。
夹具23包括具有销区域(pin region)25和防护板27的可移动的夹紧装置。在该实施例中,销区域25和防护板27是由单一工件制成。此外,代表反向定位装置(counter positioning means)的平衡体(counter body)31与销区域25和防护板27一体成型。该工件固定在限定转动轴的枢轴29上,其中该工件构成一个臂,销区域和防护板27构成第二个臂。
构成转动轴的枢轴29与连接板33相连接,连接板33用于通过螺钉37使夹具23连接到衬底保持器21的连接区域(attachment area)35。当不存在其他的力时,作为弹性定位装置并且连接销区域25和连接板33的弹簧39的弹性力将销区域25保持在靠近边缘41的固定位置上,确切地说是将其保持在衬底支撑件5的边缘区域中的弧形空隙43中,而不接触衬底支撑件5。
为了确保销区域25和边缘41之间不存在接触,将作为止动装置的弹性止动元件45连接到连接板33上。在该实施例中,止动元件45具有立方体形状且由聚偏二氟乙烯(PVDF)或聚醚醚酮(PEEK)制成。在该实施例中,当防护板27停在弹性止动元件45的表面47上的时候,止动元件45有效地限制弹簧39赋予夹紧装置(销区域25和防护板27)的运动。
将PVDF之类的弹性材料用于止动元件45,以防止当防护板27接触表面47时产生小颗粒。PVDF具有柔性,重量轻,且具有良好的耐化学性、耐热性和耐燃性。本发明的止动元件45不限于立方体形状,因为任何能够使防护板27紧靠在止动元件45上的形状都能实现该创造性功能。
防护板27在离子注入过程中防止下面的止动元件45暴露在离子束中。
图3b是与图3a的情形相对应的衬底保持器21的俯视图。图3b显示了具有固定保持装置15和臂元件3的衬底支撑件5。从上方能够看见两个夹具23的销区域25。根据本发明,弹性止动元件45协同止动元件接合板(stop element engagement plate)27来确保当衬底支撑件5上没有衬底时,销区域25与衬底支撑件5之间不存在接触。
在该视图中止动元件45是不可见的。事实上,上文已经提到过,弹性止动元件45被还充当止动元件接合板的防护板27保护起来,以免被离子束冲击。
图3c用侧剖图显示了相同的情形。在弹簧39的弹性力如箭头所示的作用下,销区域25和平衡体31围绕枢轴29转动,止动元件接合板27停在止动元件45上,平衡体31远离连接板33。因而衬底保持器5的边缘43的空隙与销25之间不存在接触。
在该实施例中,具有夹紧区域25的夹具23、防护板27、由枢轴29与弹簧39共同构成的定位装置、平衡体31以及止动元件45全部都连接到连接板33上,从而形成模块单元。
根据一种变形,不是使防护板27与止动元件45之间接触来限制销区域25的运动,而是可以将止动元件45’置于在弹簧39的力的作用下使平衡体紧靠止动元件45’的位置。在图3c中用虚线示意性地显示了这种方式。
图4a再次显示了衬底保持器21的局部视图,但其中销区域25现在是位于进一步远离衬底保持器5的边缘43的第二位置。当轮1以例如大约850rpm的高速转动时可以出现这种情形,这时作为反向定位装置的平衡体31上的转动力抵抗弹性定位装置39的弹性力以引起围绕枢轴29的转动,从而使销25离开衬底支撑件5的边缘43附近的位置,如图3a所示。实际上,由于转动力,平衡体向转动平面移动。在该实施例中,与弹性力相反的移动被进一步限制,以防止平衡体31和连接板33之间的任何的金属和金属的接触。在图4a所示的配置中,在高速情况下,平衡体31位于转动平面。止动元件接合板27(防护板27)不再和止动元件45接触。
图4b中显示了相应的俯视图。其显示了具有固定保持装置15的衬底保持器5、臂区域3以及此时与图3b相比进一步远离衬底支撑件5的边缘41的可移动的夹紧装置25。
图4c显示了与侧剖图中相同的情形。在第二位置,止动元件接合板27不再接触止动元件45。
通过这种方式,当在衬底保持器5上卸载或装载衬底时,夹子致动器(clip actuator)迫使实质上处于与图4a至图4c中相同的位置的平衡体31将夹紧销25从衬底支撑件的边缘41移开,这在轮静止时有助于卸载或装载。
图5通过侧剖示意图显示了当轮1静止时衬底保持器5上放置有衬底51的情形。在衬底保持器5的边缘41的空隙区域43中,衬底51超出衬底支撑件5的边缘41横向延伸。由于弹簧39的弹性力(见箭头),销区域25保持与衬底51的边缘53接触,实际上是将衬底51压靠到固定保持装置15,从而将衬底51卡紧在衬底保持器5上。此处,销区域25因此接触衬底51的边缘55,这可以防止弹簧39使止动元件接合板27抵靠在止动元件45的表面47上。因此,在衬底接合位置,销区域25处于图3c所示的位置和图4c所述的位置之间的中间位置。
通过包括例如可用于如图1所述的离子注入设备的创造性的夹具23的创造性衬底保持器21,可以确保在轮1的衬底保持器5的其中之一上没有放置衬底的时候,销区域25一直不接触衬底支撑件5。这样可以防止或者至少减少现有技术所出现的由于衬底附近的金属/金属接触而产生颗粒。
通过提供模块单元,不需要改变机器的设计就可以替换已经使用的不具有止动元件41的夹具。

Claims (12)

1.一种衬底保持器,包括:
衬底支撑件(5),
可移动的夹紧装置(25),其被配置为在第一位置接合所述衬底支撑件(5)上的衬底(51)以及在第二位置远离所述衬底,
定位装置(39),特别是弹性定位装置,其用于将所述夹紧装置(25)从所述第二位置移动到所述第一位置,以及
止动装置,特别是弹性止动元件(45),其用于在所述第二位置和所述第一位置所限定的方向上限制所述夹紧装置(25)朝向所述衬底支撑件的运动,从而即使所述衬底支撑件(5)上没有衬底,所述夹紧装置(25)也保持远离所述衬底支撑件(5)。
2.根据权利要求1所述的衬底保持器,其中所述可移动的夹紧装置(25)、所述定位装置(39)以及所述止动装置(41)形成一个模块单元。
3.根据权利要求2所述的衬底保持器,其中所述模块单元包括用于将所述模块单元连接到所述衬底支撑件(5)上的连接板(33)。
4.根据权利要求1至3中任一项所述的衬底保持器,其中所述衬底支撑件(5)包括金属板,以及其中所述夹紧装置(25)也是金属的。
5.根据权利要求1至4中任一项所述的衬底保持器,其中所述弹性止动元件(45)是由聚偏二氟乙烯或聚醚醚酮制成的。
6.根据权利要求1至5中任一项所述的衬底保持器,进一步包括反向定位装置(31),所述反向定位装置(31)用于将所述夹紧装置(25)从所述第一位置移动到所述第二位置,特别是基于转动力。
7.一种夹具,用于将衬底可拆除地保持在根据权利要求1至6中任一项所述的衬底保持器上,包括:
可移动的夹紧装置(25),
定位装置(39),其用于移动所述夹紧装置,特别用于线性移动所述夹紧装置,以及
止动装置,特别是弹性止动元件(45),其用于在至少一个方向上限制由所述定位装置(39)赋予所述夹紧装置(25)的定位运动的程度。
8.根据权利要求7所述的夹具,其中所述弹性止动元件(45)是由聚偏二氟乙烯或聚醚醚酮制成的。
9.根据权利要求7或8所述的夹具,其中所述弹性止动元件(45)是固定的。
10.根据权利要求7或8所述的夹具,其中所述夹紧装置包括销区域(25)和止动元件接合板(27),其被配置和设置成所述止动元件接合板(27)与所述止动装置(41)接触,从而阻止所述夹紧装置(25)的运动。
11.根据权利要求10所述的夹具,其中所述止动元件接合板(27)被配置和设置成所述止动元件接合板(27)至少部分地遮盖所述弹性止动元件(45)。
12.一种离子注入设备,包括根据权利要求1至6中任一项所述的衬底保持器以及根据权利要求7至11中任一项所述的夹具。
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