JP6018379B2 - 基板保持装置 - Google Patents
基板保持装置 Download PDFInfo
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- JP6018379B2 JP6018379B2 JP2011284825A JP2011284825A JP6018379B2 JP 6018379 B2 JP6018379 B2 JP 6018379B2 JP 2011284825 A JP2011284825 A JP 2011284825A JP 2011284825 A JP2011284825 A JP 2011284825A JP 6018379 B2 JP6018379 B2 JP 6018379B2
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- 239000000758 substrate Substances 0.000 title claims description 246
- 230000007246 mechanism Effects 0.000 claims description 45
- 238000003825 pressing Methods 0.000 claims description 3
- 229910000831 Steel Inorganic materials 0.000 description 10
- 238000012423 maintenance Methods 0.000 description 10
- 239000010959 steel Substances 0.000 description 10
- 238000012546 transfer Methods 0.000 description 9
- 239000004065 semiconductor Substances 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 210000000078 claw Anatomy 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000036544 posture Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/0052—Gripping heads and other end effectors multiple gripper units or multiple end effectors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/0084—Programme-controlled manipulators comprising a plurality of manipulators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/0084—Programme-controlled manipulators comprising a plurality of manipulators
- B25J9/009—Programme-controlled manipulators comprising a plurality of manipulators being mechanically linked with one another at their distal ends
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Warehouses Or Storage Devices (AREA)
Description
図1は、基板保持装置100を含む基板搬送システム1の構成例を示す図である。
図2は、基板保持装置100の構成例を示す外観図である。図3は、基板保持装置100の構成例を示す要部拡大斜視図であり、後述する基板保持体10の基端部付近を示したものである。
[動作例]
次に、基板保持装置100を含む基板搬送システム1の動作例を説明する。
<変形例>
上記実施の形態においては、基板保持装置100は、円形の基板を可動保持部材24及び二つの固定保持部材22によって把持する構成を示したがこれに限られるものではない。これに代えて、例えば、図10に示すように、矩形の基板を把持する構成としてもよい。更に、この矩形の基板を対向する可動保持部材124及び固定保持部材122によって把持してもよい。
2 第1カセット
2a 開口部
3 第2カセット
3a 開口部
4 ロボット
5 昇降台
6 ストッパ
10 基板保持体
11 切り欠き
12 支持機構
14 保持部
16 可動体
16a 本体部
16b レバー部
18 付勢機構
20 押し戻し機構
22 固定保持部材
24 可動保持部材
50 支持台
51 長孔
52 ガイドレール
54 回動部材
55 係合ピン
57 ガイド溝
60 押し戻し部
61 押し戻し駆動部
62 ロッド
100 基板保持装置
Claims (7)
- 複数の基板保持体と、
複数の前記基板保持体を第1の方向に並ぶように支持し、且つ複数の前記基板保持体の前記第1の方向におけるピッチを変更する支持機構と、
それぞれの前記基板保持体に設けられ、前記基板保持体に対し移動可能な1以上の可動保持部材を含み、前記可動保持部材によって、複数の前記基板保持体に対応する複数の基板が前記第1の方向に並ぶように当該基板を把持するよう構成された保持部と、
前記第1の方向に交差する第2の方向及びその反対方向の第3の方向に移動可能であり、当該移動に伴って1以上の前記可動保持部材を移動させるように、それぞれの前記基板保持体に設けられた可動体と、
前記第2の方向に前記可動体を付勢し、前記可動保持部材が前記基板に接触して当該基板を押圧把持するようそれぞれの前記基板保持体に設けられた付勢機構と、
押し戻し部を含み、当該押し戻し部が、複数の前記基板保持体にそれぞれ設けられた前記可動体を、前記第3の方向に前記付勢機構が前記第2の方向に前記可動体を付勢する力に抗して移動させて、前記可動保持部材による前記基板の押圧保持を解除する押し戻し機構と、を備え、
前記押し戻し機構は、前記押し戻し部を前記可動体と非接触となる待機位置に位置させることができるよう構成されている、基板保持装置。 - 前記待機位置は、前記可動保持部材が前記基板に接触して当該基板を押圧把持する把持位置よりも前記第2の方向側である、請求項1に記載の基板保持装置。
- 前記保持部は、前記基板保持体に固定された1以上の固定保持部材を含み、当該固定保持部材と前記可動保持部材とによって、複数の前記基板保持体に対応する複数の基板を把持するよう構成されている、請求項1又は2に記載の基板保持装置。
- 前記可動保持部材は、それぞれの前記基板保持体に2以上設けられている、請求項1乃至3の何れかに記載の基板保持装置。
- 前記付勢機構は、前記可動保持部材が前記基板に接触して当該基板を押圧把持する把持位置よりも前記第2の方向側であって、前記可動体に対する前記第2の方向への付勢力が解かれる付勢可能限度位置を含み、
前記待機位置は、前記付勢可能限度位置より前記第2の方向側に位置するよう構成されている、請求項1乃至4の何れかに記載の、基板保持装置。 - 前記可動体の前記第2の方向側への移動を規制するストッパを備え、当該ストッパによって前記付勢可能限度位置が規定される、請求項5に記載の基板保持装置。
- 前記支持機構は、前記押し戻し機構の前記押し戻し部が前記待機位置に位置しているときに複数の前記基板保持体の前記第1の方向におけるピッチを変更するよう構成されている、請求項1乃至6の何れかに記載の基板保持装置。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011284825A JP6018379B2 (ja) | 2011-12-27 | 2011-12-27 | 基板保持装置 |
PCT/JP2012/008086 WO2013099154A1 (ja) | 2011-12-27 | 2012-12-18 | 基板保持装置 |
CN201280060127.1A CN103959454B (zh) | 2011-12-27 | 2012-12-18 | 基板保持装置 |
KR1020147015704A KR101666121B1 (ko) | 2011-12-27 | 2012-12-18 | 기판 유지 장치 |
US14/369,382 US9245784B2 (en) | 2011-12-27 | 2012-12-18 | Substrate retaining device with push back portion |
TW101148884A TWI511231B (zh) | 2011-12-27 | 2012-12-21 | Substrate holding device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011284825A JP6018379B2 (ja) | 2011-12-27 | 2011-12-27 | 基板保持装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013135099A JP2013135099A (ja) | 2013-07-08 |
JP6018379B2 true JP6018379B2 (ja) | 2016-11-02 |
Family
ID=48696700
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011284825A Active JP6018379B2 (ja) | 2011-12-27 | 2011-12-27 | 基板保持装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US9245784B2 (ja) |
JP (1) | JP6018379B2 (ja) |
KR (1) | KR101666121B1 (ja) |
CN (1) | CN103959454B (ja) |
TW (1) | TWI511231B (ja) |
WO (1) | WO2013099154A1 (ja) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9401296B2 (en) * | 2011-11-29 | 2016-07-26 | Persimmon Technologies Corporation | Vacuum robot adapted to grip and transport a substrate and method thereof with passive bias |
JP6190645B2 (ja) * | 2013-07-09 | 2017-08-30 | 東京エレクトロン株式会社 | 基板搬送方法 |
US9214369B2 (en) * | 2013-11-01 | 2015-12-15 | Varian Semiconductor Equipment Associates, Inc. | Dynamic pitch substrate lift |
JP6314157B2 (ja) * | 2013-12-26 | 2018-04-18 | 川崎重工業株式会社 | エンドエフェクタおよび基板搬送ロボット |
US10381257B2 (en) * | 2015-08-31 | 2019-08-13 | Kawasaki Jukogyo Kabushiki Kaisha | Substrate conveying robot and substrate processing system with pair of blade members arranged in position out of vertical direction |
US9953677B1 (en) * | 2017-01-06 | 2018-04-24 | Futurewei Technologies, Inc. | Device for multiple disc load and unload with a plurality of telescopic sections |
JP7162521B2 (ja) * | 2018-12-21 | 2022-10-28 | 株式会社ダイヘン | 多段式ハンドおよびこれを備える搬送ロボット |
JP7149837B2 (ja) | 2018-12-21 | 2022-10-07 | 株式会社ダイヘン | 多段式ハンドおよびこれを備える搬送ロボット |
US11300936B2 (en) | 2019-03-26 | 2022-04-12 | Lenovo (Singapore) Pte. Ltd. | Extracting EtherCAT datagrams from an EtherCAT frame |
CN115335977A (zh) | 2020-03-20 | 2022-11-11 | 应用材料公司 | 用于基板处理设备的基板托盘传送系统 |
JP7429578B2 (ja) | 2020-03-27 | 2024-02-08 | 株式会社ダイヘン | アライナ装置およびワークの位置ずれ補正方法 |
TWI707753B (zh) * | 2020-05-07 | 2020-10-21 | 鈦昇科技股份有限公司 | 自動化手臂更換機構 |
TWI746014B (zh) * | 2020-06-16 | 2021-11-11 | 大立鈺科技有限公司 | 晶圓存取總成及其晶圓存取裝置與晶圓載具 |
JP2022051282A (ja) * | 2020-09-18 | 2022-03-31 | 日本電産サンキョー株式会社 | 産業用ロボット |
KR102628389B1 (ko) * | 2021-11-04 | 2024-01-23 | 주식회사 유케이로보틱스 | 반도체 웨이퍼를 이송하기 위한 장치 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1154589A (ja) * | 1997-07-31 | 1999-02-26 | Kokusai Electric Co Ltd | 基板搬送装置 |
JP2001210696A (ja) * | 2000-01-28 | 2001-08-03 | Ohkura Electric Co Ltd | ウェーハ移載機のピッチ変換機構 |
JP2002164413A (ja) * | 2000-11-24 | 2002-06-07 | Toshiba Ceramics Co Ltd | ピッチ変換装置 |
JP2006313865A (ja) | 2005-05-09 | 2006-11-16 | Tatsumo Kk | 基板保持装置 |
JP2009141300A (ja) * | 2007-12-05 | 2009-06-25 | Omiya Kogyo Kk | 半導体ウエハなどのピッチ変換装置 |
WO2009136567A1 (ja) * | 2008-05-09 | 2009-11-12 | 川崎重工業株式会社 | 物品搬送ロボット装置 |
JP5231274B2 (ja) * | 2009-02-06 | 2013-07-10 | 日本電産サンキョー株式会社 | 産業用ロボット |
JP5303301B2 (ja) * | 2009-02-06 | 2013-10-02 | 日本電産サンキョー株式会社 | 産業用ロボット |
EP2743975A4 (en) * | 2011-08-10 | 2015-06-03 | Kawasaki Heavy Ind Ltd | END EFFECTOR DEVICE AND SUBSTRATE TRANSPORT ROBOT WITH THIS END EFFECTOR DEVICE |
-
2011
- 2011-12-27 JP JP2011284825A patent/JP6018379B2/ja active Active
-
2012
- 2012-12-18 CN CN201280060127.1A patent/CN103959454B/zh active Active
- 2012-12-18 WO PCT/JP2012/008086 patent/WO2013099154A1/ja active Application Filing
- 2012-12-18 KR KR1020147015704A patent/KR101666121B1/ko active IP Right Grant
- 2012-12-18 US US14/369,382 patent/US9245784B2/en active Active
- 2012-12-21 TW TW101148884A patent/TWI511231B/zh active
Also Published As
Publication number | Publication date |
---|---|
US20150016935A1 (en) | 2015-01-15 |
KR20140089604A (ko) | 2014-07-15 |
WO2013099154A1 (ja) | 2013-07-04 |
CN103959454B (zh) | 2016-06-29 |
KR101666121B1 (ko) | 2016-10-13 |
JP2013135099A (ja) | 2013-07-08 |
TW201330171A (zh) | 2013-07-16 |
US9245784B2 (en) | 2016-01-26 |
CN103959454A (zh) | 2014-07-30 |
TWI511231B (zh) | 2015-12-01 |
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