CN102034718A - 半导体器件和在tsv转接板中形成开口腔以在wlcsmp中容纳半导体裸片的方法 - Google Patents
半导体器件和在tsv转接板中形成开口腔以在wlcsmp中容纳半导体裸片的方法 Download PDFInfo
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- CN102034718A CN102034718A CN2010102944207A CN201010294420A CN102034718A CN 102034718 A CN102034718 A CN 102034718A CN 2010102944207 A CN2010102944207 A CN 2010102944207A CN 201010294420 A CN201010294420 A CN 201010294420A CN 102034718 A CN102034718 A CN 102034718A
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Abstract
Description
Claims (25)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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US12/565380 | 2009-09-23 | ||
US12/565,380 US8143097B2 (en) | 2009-09-23 | 2009-09-23 | Semiconductor device and method of forming open cavity in TSV interposer to contain semiconductor die in WLCSMP |
Publications (2)
Publication Number | Publication Date |
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CN102034718A true CN102034718A (zh) | 2011-04-27 |
CN102034718B CN102034718B (zh) | 2015-12-16 |
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Also Published As
Publication number | Publication date |
---|---|
TWI499030B (zh) | 2015-09-01 |
US8143097B2 (en) | 2012-03-27 |
US20120168916A1 (en) | 2012-07-05 |
US20130299974A1 (en) | 2013-11-14 |
US9048306B2 (en) | 2015-06-02 |
SG183027A1 (en) | 2012-08-30 |
TW201133769A (en) | 2011-10-01 |
US9263332B2 (en) | 2016-02-16 |
SG169931A1 (en) | 2011-04-29 |
US20110068444A1 (en) | 2011-03-24 |
CN102034718B (zh) | 2015-12-16 |
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