USRE48111E1 - Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect - Google Patents

Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect Download PDF

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USRE48111E1
USRE48111E1 US15/473,447 US201715473447A USRE48111E US RE48111 E1 USRE48111 E1 US RE48111E1 US 201715473447 A US201715473447 A US 201715473447A US RE48111 E USRE48111 E US RE48111E
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Prior art keywords
semiconductor die
interposer frame
over
encapsulant
semiconductor
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US15/473,447
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Reza A. Pagaila
Seng Guan Chow
Seung Uk Yoon
Byung Tai Do
Linda Pei Ee CHUA
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Jcet Semiconductor Shaoxing Co Ltd
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Jcet Semiconductor Shaoxing Co Ltd
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Priority to US12/545,357 priority Critical patent/US8169058B2/en
Priority to US12/875,981 priority patent/US8383457B2/en
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Priority to US15/473,447 priority patent/USRE48111E1/en
Assigned to JCET SEMICONDUCTOR (SHAOXING) CO., LTD. reassignment JCET SEMICONDUCTOR (SHAOXING) CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: STATS ChipPAC Pte. Ltd.
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