CN101946330A - 半导体器件的制造方法 - Google Patents
半导体器件的制造方法 Download PDFInfo
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- CN101946330A CN101946330A CN2009801053018A CN200980105301A CN101946330A CN 101946330 A CN101946330 A CN 101946330A CN 2009801053018 A CN2009801053018 A CN 2009801053018A CN 200980105301 A CN200980105301 A CN 200980105301A CN 101946330 A CN101946330 A CN 101946330A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 132
- 229910052751 metal Inorganic materials 0.000 claims abstract description 89
- 239000002184 metal Substances 0.000 claims abstract description 89
- 238000000034 method Methods 0.000 claims abstract description 62
- 150000001875 compounds Chemical class 0.000 claims abstract description 20
- 239000010410 layer Substances 0.000 claims description 617
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 407
- 229910052710 silicon Inorganic materials 0.000 claims description 407
- 239000010703 silicon Substances 0.000 claims description 407
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 97
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 97
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 95
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 95
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 77
- 229920005591 polysilicon Polymers 0.000 claims description 77
- 238000005530 etching Methods 0.000 claims description 73
- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 71
- 229920002120 photoresistant polymer Polymers 0.000 claims description 65
- 230000003647 oxidation Effects 0.000 claims description 47
- 238000007254 oxidation reaction Methods 0.000 claims description 47
- 239000012535 impurity Substances 0.000 claims description 36
- 230000015572 biosynthetic process Effects 0.000 claims description 30
- 238000009792 diffusion process Methods 0.000 claims description 30
- 230000008569 process Effects 0.000 claims description 28
- 230000004888 barrier function Effects 0.000 claims description 26
- 239000011229 interlayer Substances 0.000 claims description 26
- 238000001259 photo etching Methods 0.000 claims description 25
- 239000011248 coating agent Substances 0.000 claims description 22
- 238000000576 coating method Methods 0.000 claims description 22
- 239000000758 substrate Substances 0.000 claims description 19
- 239000010949 copper Substances 0.000 claims description 18
- 238000009826 distribution Methods 0.000 claims description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- 229910052802 copper Inorganic materials 0.000 claims description 12
- 238000001039 wet etching Methods 0.000 claims description 11
- 238000000227 grinding Methods 0.000 claims description 10
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 claims description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 9
- 230000008859 change Effects 0.000 claims description 9
- 238000007747 plating Methods 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 7
- 230000008676 import Effects 0.000 claims description 7
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 7
- 239000000126 substance Substances 0.000 claims description 7
- 229910052715 tantalum Inorganic materials 0.000 claims description 7
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- 229910052799 carbon Inorganic materials 0.000 claims description 4
- 150000002500 ions Chemical class 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 239000002019 doping agent Substances 0.000 claims description 3
- 238000010301 surface-oxidation reaction Methods 0.000 claims description 3
- 238000000059 patterning Methods 0.000 claims description 2
- 235000013495 cobalt Nutrition 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 44
- 229910021332 silicide Inorganic materials 0.000 description 13
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 13
- 238000007689 inspection Methods 0.000 description 12
- 239000010936 titanium Substances 0.000 description 12
- 238000005259 measurement Methods 0.000 description 11
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 10
- 238000002347 injection Methods 0.000 description 10
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- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 6
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 6
- 229910052719 titanium Inorganic materials 0.000 description 6
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 6
- 229910052721 tungsten Inorganic materials 0.000 description 6
- 239000010937 tungsten Substances 0.000 description 6
- 150000002739 metals Chemical group 0.000 description 5
- 239000001996 bearing alloy Substances 0.000 description 4
- -1 tungsten (W) Chemical group 0.000 description 4
- 238000009825 accumulation Methods 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- 150000004767 nitrides Chemical class 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052785 arsenic Inorganic materials 0.000 description 2
- 239000010941 cobalt Substances 0.000 description 2
- 229910017052 cobalt Inorganic materials 0.000 description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000005416 organic matter Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78642—Vertical transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42384—Gate electrodes for field effect devices for field-effect transistors with insulated gate for thin film field effect transistors, e.g. characterised by the thickness or the shape of the insulator or the dimensions, the shape or the lay-out of the conductor
- H01L29/42392—Gate electrodes for field effect devices for field-effect transistors with insulated gate for thin film field effect transistors, e.g. characterised by the thickness or the shape of the insulator or the dimensions, the shape or the lay-out of the conductor fully surrounding the channel, e.g. gate-all-around
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Computer Hardware Design (AREA)
- Electrodes Of Semiconductors (AREA)
- Thin Film Transistor (AREA)
- Manufacturing & Machinery (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
Description
Claims (22)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2008/052567 WO2009110050A1 (ja) | 2008-02-15 | 2008-02-15 | 半導体装置の製造方法 |
JPPCT/JP2008/052567 | 2008-02-15 | ||
PCT/JP2009/052559 WO2009102061A1 (ja) | 2008-02-15 | 2009-02-16 | 半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101946330A true CN101946330A (zh) | 2011-01-12 |
CN101946330B CN101946330B (zh) | 2012-10-17 |
Family
ID=40957090
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2009801053018A Expired - Fee Related CN101946330B (zh) | 2008-02-15 | 2009-02-16 | 半导体器件的制造方法 |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP2244301A4 (zh) |
JP (7) | JP5356259B2 (zh) |
KR (1) | KR101123987B1 (zh) |
CN (1) | CN101946330B (zh) |
TW (1) | TW200939360A (zh) |
WO (2) | WO2009110050A1 (zh) |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8759178B2 (en) | 2011-11-09 | 2014-06-24 | Unisantis Electronics Singapore Pte. Ltd. | Method for manufacturing semiconductor device and semiconductor device |
US8697511B2 (en) | 2012-05-18 | 2014-04-15 | Unisantis Electronics Singapore Pte. Ltd. | Method for producing semiconductor device and semiconductor device |
US8877578B2 (en) | 2012-05-18 | 2014-11-04 | Unisantis Electronics Singapore Pte. Ltd. | Method for producing semiconductor device and semiconductor device |
CN103779402B (zh) * | 2012-10-26 | 2017-08-04 | 旺宏电子股份有限公司 | 半导体结构与其制造方法 |
JP5670603B1 (ja) | 2013-04-26 | 2015-02-18 | ユニサンティス エレクトロニクス シンガポール プライベート リミテッドUnisantis Electronics Singapore Pte Ltd. | 半導体装置の製造方法及び半導体装置 |
WO2014199433A1 (ja) | 2013-06-10 | 2014-12-18 | ユニサンティス エレクトロニクス シンガポール プライベート リミテッド | 半導体装置の製造方法、及び、半導体装置 |
JP5872054B2 (ja) * | 2013-06-17 | 2016-03-01 | ユニサンティス エレクトロニクス シンガポール プライベート リミテッドUnisantis Electronics Singapore Pte Ltd. | 半導体装置の製造方法、及び、半導体装置 |
WO2014203304A1 (ja) | 2013-06-17 | 2014-12-24 | ユニサンティス エレクトロニクス シンガポール プライベート リミテッド | 半導体装置の製造方法、及び、半導体装置 |
WO2015008387A1 (ja) | 2013-07-19 | 2015-01-22 | ユニサンティス エレクトロニクス シンガポール プライベート リミテッド | 半導体装置の製造方法、及び、半導体装置 |
US10361270B2 (en) * | 2013-11-20 | 2019-07-23 | Taiwan Semiconductor Manufacturing Co., Ltd. | Nanowire MOSFET with different silicides on source and drain |
JP5658382B1 (ja) * | 2014-01-20 | 2015-01-21 | ユニサンティス エレクトロニクス シンガポール プライベート リミテッドUnisantis Electronics Singapore Pte Ltd. | 半導体装置、及び半導体装置の製造方法 |
JP5657151B1 (ja) * | 2014-01-23 | 2015-01-21 | ユニサンティス エレクトロニクス シンガポール プライベート リミテッドUnisantis Electronics Singapore Pte Ltd. | 半導体装置、及び半導体装置の製造方法 |
WO2015193940A1 (ja) | 2014-06-16 | 2015-12-23 | ユニサンティス エレクトロニクス シンガポール プライベート リミテッド | 半導体装置の製造方法、及び、半導体装置 |
WO2016013087A1 (ja) * | 2014-07-24 | 2016-01-28 | ユニサンティス エレクトロニクス シンガポール プライベート リミテッド | 半導体装置の製造方法、及び、半導体装置 |
JP6121386B2 (ja) * | 2014-11-14 | 2017-04-26 | ユニサンティス エレクトロニクス シンガポール プライベート リミテッドUnisantis Electronics Singapore Pte Ltd. | 半導体装置の製造方法、及び、半導体装置 |
JP5986618B2 (ja) * | 2014-12-04 | 2016-09-06 | ユニサンティス エレクトロニクス シンガポール プライベート リミテッドUnisantis Electronics Singapore Pte Ltd. | 半導体装置 |
JP5974066B2 (ja) * | 2014-12-12 | 2016-08-23 | ユニサンティス エレクトロニクス シンガポール プライベート リミテッドUnisantis Electronics Singapore Pte Ltd. | 半導体装置の製造方法と半導体装置 |
JP5917673B2 (ja) * | 2014-12-17 | 2016-05-18 | ユニサンティス エレクトロニクス シンガポール プライベート リミテッドUnisantis Electronics Singapore Pte Ltd. | 半導体装置の製造方法及び半導体装置 |
JP5861197B2 (ja) * | 2015-01-07 | 2016-02-16 | ユニサンティス エレクトロニクス シンガポール プライベート リミテッドUnisantis Electronics Singapore Pte Ltd. | 半導体装置の製造方法、及び、半導体装置 |
JP6156883B2 (ja) * | 2015-02-06 | 2017-07-05 | ユニサンティス エレクトロニクス シンガポール プライベート リミテッドUnisantis Electronics Singapore Pte Ltd. | 半導体装置の製造方法及び半導体装置 |
JP5869166B2 (ja) * | 2015-04-08 | 2016-02-24 | ユニサンティス エレクトロニクス シンガポール プライベート リミテッドUnisantis Electronics Singapore Pte Ltd. | 半導体装置の製造方法、及び、半導体装置 |
JP5890053B2 (ja) * | 2015-04-27 | 2016-03-22 | ユニサンティス エレクトロニクス シンガポール プライベート リミテッドUnisantis Electronics Singapore Pte Ltd. | 半導体装置の製造方法、及び、半導体装置 |
JP5989197B2 (ja) * | 2015-07-13 | 2016-09-07 | ユニサンティス エレクトロニクス シンガポール プライベート リミテッドUnisantis Electronics Singapore Pte Ltd. | 半導体装置の製造方法、及び、半導体装置 |
JP6080989B2 (ja) * | 2016-01-06 | 2017-02-15 | ユニサンティス エレクトロニクス シンガポール プライベート リミテッドUnisantis Electronics Singapore Pte Ltd. | 半導体装置の製造方法、及び、半導体装置 |
JP6211637B2 (ja) * | 2016-02-01 | 2017-10-11 | ユニサンティス エレクトロニクス シンガポール プライベート リミテッドUnisantis Electronics Singapore Pte Ltd. | 半導体装置の製造方法、及び、半導体装置 |
JP6143913B2 (ja) * | 2016-04-06 | 2017-06-07 | ユニサンティス エレクトロニクス シンガポール プライベート リミテッドUnisantis Electronics Singapore Pte Ltd. | 半導体装置の製造方法及び半導体装置 |
JP6235662B2 (ja) * | 2016-08-05 | 2017-11-22 | ユニサンティス エレクトロニクス シンガポール プライベート リミテッドUnisantis Electronics Singapore Pte Ltd. | 半導体装置 |
JP6154051B2 (ja) * | 2016-08-09 | 2017-06-28 | ユニサンティス エレクトロニクス シンガポール プライベート リミテッドUnisantis Electronics Singapore Pte Ltd. | 半導体装置の製造方法、及び、半導体装置 |
CN110402497A (zh) * | 2017-03-29 | 2019-11-01 | 株式会社半导体能源研究所 | 半导体装置、半导体装置的制造方法 |
JP6328832B2 (ja) * | 2017-07-05 | 2018-05-23 | ユニサンティス エレクトロニクス シンガポール プライベート リミテッドUnisantis Electronics Singapore Pte Ltd. | 半導体装置の製造方法、及び、半導体装置 |
US10170588B1 (en) * | 2017-10-30 | 2019-01-01 | International Business Machines Corporation | Method of forming vertical transport fin field effect transistor with high-K dielectric feature uniformity |
WO2023017618A1 (ja) * | 2021-08-13 | 2023-02-16 | ユニサンティス エレクトロニクス シンガポール プライベート リミテッド | 柱状半導体の製造方法 |
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JP2005197612A (ja) * | 2004-01-09 | 2005-07-21 | Sony Corp | 集積型量子細線トランジスタおよびその製造方法ならびに集積型細線トランジスタおよびその製造方法ならびに電子応用装置 |
CN100570894C (zh) * | 2004-01-22 | 2009-12-16 | 国际商业机器公司 | 垂直鳍片场效应晶体管mos器件 |
JP2005332993A (ja) * | 2004-05-20 | 2005-12-02 | Sanyo Electric Co Ltd | 半導体装置および半導体装置の製造方法 |
KR100541515B1 (ko) * | 2004-07-22 | 2006-01-11 | 삼성전자주식회사 | 수직 채널 패턴을 갖는 반도체 장치 및 이를 제조하는 방법 |
JP5017795B2 (ja) * | 2005-04-13 | 2012-09-05 | 日本電気株式会社 | 電界効果トランジスタの製造方法 |
JP2006310651A (ja) * | 2005-04-28 | 2006-11-09 | Toshiba Corp | 半導体装置の製造方法 |
US7230286B2 (en) * | 2005-05-23 | 2007-06-12 | International Business Machines Corporation | Vertical FET with nanowire channels and a silicided bottom contact |
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Publication number | Publication date |
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WO2009102061A1 (ja) | 2009-08-20 |
JP6118434B2 (ja) | 2017-04-19 |
JP6002310B2 (ja) | 2016-10-05 |
CN101946330B (zh) | 2012-10-17 |
KR20100120206A (ko) | 2010-11-12 |
JP5860520B2 (ja) | 2016-02-16 |
JP5914946B2 (ja) | 2016-05-11 |
JP5886391B2 (ja) | 2016-03-16 |
JP2016042603A (ja) | 2016-03-31 |
JPWO2009102061A1 (ja) | 2011-06-16 |
JP2016076736A (ja) | 2016-05-12 |
JP2015015491A (ja) | 2015-01-22 |
JP5639698B2 (ja) | 2014-12-10 |
TW200939360A (en) | 2009-09-16 |
JP2015026846A (ja) | 2015-02-05 |
EP2244301A1 (en) | 2010-10-27 |
JP2013258427A (ja) | 2013-12-26 |
JP2015039031A (ja) | 2015-02-26 |
WO2009110050A1 (ja) | 2009-09-11 |
JP5356259B2 (ja) | 2013-12-04 |
EP2244301A4 (en) | 2013-10-09 |
KR101123987B1 (ko) | 2012-03-23 |
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