CN101379108B - 微胶囊型环氧树脂用固化剂、母料型环氧树脂用固化剂组合物、单液型环氧树脂组合物、及其加工品 - Google Patents
微胶囊型环氧树脂用固化剂、母料型环氧树脂用固化剂组合物、单液型环氧树脂组合物、及其加工品 Download PDFInfo
- Publication number
- CN101379108B CN101379108B CN2007800043842A CN200780004384A CN101379108B CN 101379108 B CN101379108 B CN 101379108B CN 2007800043842 A CN2007800043842 A CN 2007800043842A CN 200780004384 A CN200780004384 A CN 200780004384A CN 101379108 B CN101379108 B CN 101379108B
- Authority
- CN
- China
- Prior art keywords
- epoxy resin
- curing agent
- type epoxy
- mentioned
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
- C08G59/184—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with amines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/188—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using encapsulated compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
- Y10T428/2989—Microcapsule with solid core [includes liposome]
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006027073 | 2006-02-03 | ||
| JP027073/2006 | 2006-02-03 | ||
| JP169786/2006 | 2006-06-20 | ||
| JP2006169786 | 2006-06-20 | ||
| PCT/JP2007/051595 WO2007088889A1 (ja) | 2006-02-03 | 2007-01-31 | マイクロカプセル型エポキシ樹脂用硬化剤、マスタ-バッチ型エポキシ樹脂用硬化剤組成物、一液性エポキシ樹脂組成物、および加工品 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101379108A CN101379108A (zh) | 2009-03-04 |
| CN101379108B true CN101379108B (zh) | 2011-11-30 |
Family
ID=38327460
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007800043842A Active CN101379108B (zh) | 2006-02-03 | 2007-01-31 | 微胶囊型环氧树脂用固化剂、母料型环氧树脂用固化剂组合物、单液型环氧树脂组合物、及其加工品 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US7927514B2 (enExample) |
| EP (1) | EP1980580A1 (enExample) |
| JP (1) | JP5148292B2 (enExample) |
| KR (1) | KR100976303B1 (enExample) |
| CN (1) | CN101379108B (enExample) |
| CA (1) | CA2641409A1 (enExample) |
| TW (1) | TW200734368A (enExample) |
| WO (1) | WO2007088889A1 (enExample) |
Families Citing this family (45)
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|---|---|---|---|---|
| EP1930359A1 (en) * | 2005-09-29 | 2008-06-11 | Asahi Kasei Chemicals Corporation | High-stability microencapsulated hardener for epoxy resin and epoxy resin composition |
| WO2009005135A1 (ja) * | 2007-07-05 | 2009-01-08 | Asahi Kasei E-Materials Corporation | エポキシ樹脂用硬化剤及びエポキシ樹脂用硬化剤組成物 |
| CN102936331A (zh) * | 2007-09-20 | 2013-02-20 | 日立化成工业株式会社 | 环氧树脂用微囊型潜在性固化剂及其制造方法 |
| JP2011512036A (ja) * | 2008-02-11 | 2011-04-14 | エムイーエムシー・エレクトロニック・マテリアルズ・インコーポレイテッド | インゴットをワイヤーソーによりスライスしてウェハとする際に使用される、カーボンナノチューブで強化されたワイヤーソー梁部 |
| TWI449723B (zh) * | 2009-02-27 | 2014-08-21 | Asahi Kasei E Materials Corp | A hardening agent for a microcapsule type epoxy resin, a hardener composition for a masterbatch type epoxy resin, a single-liquid epoxy resin composition, and a processed product |
| JP5561949B2 (ja) * | 2009-04-08 | 2014-07-30 | 日東電工株式会社 | 熱硬化型ダイボンドフィルム |
| WO2010122995A1 (ja) * | 2009-04-24 | 2010-10-28 | 旭化成イーマテリアルズ株式会社 | イミダゾール化合物含有マイクロカプセル化組成物、それを用いた硬化性組成物及びマスターバッチ型硬化剤 |
| US8044154B2 (en) | 2009-06-12 | 2011-10-25 | Trillion Science, Inc. | Latent hardener for epoxy compositions |
| US8067484B2 (en) | 2010-03-12 | 2011-11-29 | Trillion Science, Inc. | Latent hardener with improved barrier properties and compatibility |
| JP5565931B2 (ja) * | 2009-10-01 | 2014-08-06 | 株式会社Adeka | シリコンウエハ接着性樹脂組成物 |
| JP5691219B2 (ja) | 2010-03-30 | 2015-04-01 | 住友ベークライト株式会社 | 半導体封止用樹脂組成物の製造方法および粉砕装置 |
| JP5166495B2 (ja) * | 2010-08-11 | 2013-03-21 | 株式会社日立製作所 | ドライマイカテープ及びこれを用いた電気絶縁線輪 |
| RU2478670C1 (ru) * | 2011-08-03 | 2013-04-10 | Татьяна Валентиновна Лапицкая | Способ получения отвердителей эпоксидных смол |
| RU2014110182A (ru) * | 2011-08-18 | 2015-09-27 | ДАУ ГЛОБАЛ ТЕКНОЛОДЖИС ЭлЭлСи | Отверждаемые полимерные композиции |
| TW201320434A (zh) * | 2011-09-26 | 2013-05-16 | Sumitomo Chemical Co | 二次電池用接著樹脂組合物 |
| US8986578B2 (en) | 2011-12-28 | 2015-03-24 | King Fahd University Of Petroleum And Minerals | High impact strength conductive adhesives |
| US9243164B1 (en) | 2012-02-21 | 2016-01-26 | Park Electrochemical Corporation | Thermosetting resin composition containing a polyphenylene ether and a brominated fire retardant compound |
| US9051465B1 (en) | 2012-02-21 | 2015-06-09 | Park Electrochemical Corporation | Thermosetting resin composition containing a polyphenylene ether and a brominated fire retardant compound |
| US8753924B2 (en) | 2012-03-08 | 2014-06-17 | Texas Instruments Incorporated | Grown carbon nanotube die attach structures, articles, devices, and processes for making them |
| JP5605516B2 (ja) * | 2012-03-29 | 2014-10-15 | Dic株式会社 | 導電性インキ組成物、導電性パターンの製造方法及び導電性回路 |
| JP6085130B2 (ja) * | 2012-09-07 | 2017-02-22 | 旭化成株式会社 | 液状樹脂組成物、及び加工品 |
| US20140103572A1 (en) * | 2012-10-15 | 2014-04-17 | Asustek Computer Inc. | Casing molding method |
| JP6063304B2 (ja) * | 2013-03-04 | 2017-01-18 | 旭化成株式会社 | エポキシ樹脂用マイクロカプセル型硬化剤 |
| JP2014185296A (ja) * | 2013-03-25 | 2014-10-02 | Asahi Kasei E-Materials Corp | 液状樹脂組成物及び加工品 |
| CN103194164B (zh) * | 2013-04-26 | 2014-05-21 | 中国电子科技集团公司第三十八研究所 | 一种高温自修复型导电银胶及其制备方法 |
| CN103446966A (zh) * | 2013-09-09 | 2013-12-18 | 华东理工大学 | 制备贮存稳定的用于不饱和聚酯固化的微胶囊及其制备方法 |
| JP6331526B2 (ja) * | 2014-03-14 | 2018-05-30 | オムロン株式会社 | 樹脂組成物およびその硬化物 |
| JP6283568B2 (ja) * | 2014-05-22 | 2018-02-21 | 旭化成株式会社 | エポキシ樹脂用硬化剤、マイクロカプセル型エポキシ樹脂用硬化剤、マスターバッチ型エポキシ樹脂用硬化剤組成物、一液性エポキシ樹脂組成物及び加工品 |
| WO2016004608A1 (zh) * | 2014-07-10 | 2016-01-14 | 吴琴芬 | 耐腐蚀金属门窗 |
| CN105047256B (zh) * | 2015-06-30 | 2017-07-14 | 株洲时代新材料科技股份有限公司 | 含微胶囊固化促进剂的云母带及其制备方法 |
| JP6619628B2 (ja) * | 2015-11-20 | 2019-12-11 | 旭化成株式会社 | 接着フィルム用エポキシ樹脂組成物。 |
| KR101646531B1 (ko) * | 2016-01-18 | 2016-08-08 | 회명산업 주식회사 | 에폭시 수지용 잠재성 경화제, 그 제조방법, 이를 포함하는 일액형 에폭시 수지 조성물 |
| US10400072B2 (en) | 2016-04-25 | 2019-09-03 | 3M Innovative Properties Company | Composite particles for curing epoxy resin compositions and curable and cured epoxy resin compositions prepared using the particles |
| CN107418121A (zh) * | 2016-05-24 | 2017-12-01 | 上海羽迪新材料科技有限公司 | 一种高性能阻燃母粒 |
| US11059967B2 (en) | 2016-12-13 | 2021-07-13 | 3M Innovative Properties Company | Epoxy stabilization using acid-coated nitrogen containing catalysts, particles, and methods |
| EP3632952B1 (en) * | 2017-05-24 | 2022-02-16 | Toray Industries, Inc. | Epoxy resin composition for fiber-reinforced composite materials, and fiber-reinforced composite material |
| WO2019078044A1 (ja) * | 2017-10-18 | 2019-04-25 | 株式会社スリーボンド | 熱伝導性樹脂組成物、硬化物および放熱方法 |
| US20220152574A1 (en) | 2019-03-28 | 2022-05-19 | 3M Innovative Properties Company | Epoxide microcapsules with pickering emulsifiers |
| EP3947582A1 (en) | 2019-03-28 | 2022-02-09 | 3M Innovative Properties Company | Structural bonding tape with epoxide microcapsules |
| KR102311179B1 (ko) * | 2020-02-26 | 2021-10-13 | 한국과학기술원 | 솔더 도전 입자와 플럭스 첨가제를 함유하는 열압착 접합용 이방성 전도성 접착제 및 이를 이용한 전자부품 간 접속방법 |
| JP7643845B2 (ja) * | 2020-08-18 | 2025-03-11 | 旭化成株式会社 | マスターバッチ型熱硬化性樹脂組成物、及び熱硬化性樹脂組成物 |
| PH12022550506A1 (en) * | 2020-09-29 | 2023-03-20 | Furukawa Electric Co Ltd | Transparent adhesive composition, film-shaped transparent adhesive, method of producing transparent adhesive cured layer-attached member, and electronic component and method of producing the same |
| WO2022123498A1 (en) | 2020-12-10 | 2022-06-16 | 3M Innovative Properties Company | Crosslinked polymer particles and related compositions and processes |
| EP4349906A4 (en) * | 2021-06-21 | 2025-05-21 | Tomoegawa Co., Ltd. | Solid polymer fuel cell sealing material |
| JP2023008549A (ja) * | 2021-07-06 | 2023-01-19 | 旭化成株式会社 | エポキシ樹脂組成物 |
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| CN1087366A (zh) * | 1992-10-02 | 1994-06-01 | 格雷斯公司 | 低粘度和无溶剂的单组分型环氧树脂粘合剂组合物 |
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| EP1930359A1 (en) * | 2005-09-29 | 2008-06-11 | Asahi Kasei Chemicals Corporation | High-stability microencapsulated hardener for epoxy resin and epoxy resin composition |
-
2007
- 2007-01-31 CA CA002641409A patent/CA2641409A1/en not_active Abandoned
- 2007-01-31 JP JP2007556890A patent/JP5148292B2/ja active Active
- 2007-01-31 EP EP07713755A patent/EP1980580A1/en not_active Withdrawn
- 2007-01-31 WO PCT/JP2007/051595 patent/WO2007088889A1/ja not_active Ceased
- 2007-01-31 US US12/223,523 patent/US7927514B2/en active Active
- 2007-01-31 CN CN2007800043842A patent/CN101379108B/zh active Active
- 2007-01-31 KR KR1020087019075A patent/KR100976303B1/ko active Active
- 2007-02-02 TW TW096103927A patent/TW200734368A/zh unknown
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1087366A (zh) * | 1992-10-02 | 1994-06-01 | 格雷斯公司 | 低粘度和无溶剂的单组分型环氧树脂粘合剂组合物 |
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| Title |
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| JP特开2005-344046A 2005.12.15 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101379108A (zh) | 2009-03-04 |
| US20090186962A1 (en) | 2009-07-23 |
| JPWO2007088889A1 (ja) | 2009-06-25 |
| US7927514B2 (en) | 2011-04-19 |
| TW200734368A (en) | 2007-09-16 |
| KR100976303B1 (ko) | 2010-08-16 |
| EP1980580A1 (en) | 2008-10-15 |
| CA2641409A1 (en) | 2007-08-09 |
| JP5148292B2 (ja) | 2013-02-20 |
| TWI344473B (enExample) | 2011-07-01 |
| WO2007088889A1 (ja) | 2007-08-09 |
| KR20080083054A (ko) | 2008-09-12 |
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