TWI344473B - - Google Patents

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Publication number
TWI344473B
TWI344473B TW096103927A TW96103927A TWI344473B TW I344473 B TWI344473 B TW I344473B TW 096103927 A TW096103927 A TW 096103927A TW 96103927 A TW96103927 A TW 96103927A TW I344473 B TWI344473 B TW I344473B
Authority
TW
Taiwan
Prior art keywords
epoxy resin
hardener
type epoxy
mass
microcapsule
Prior art date
Application number
TW096103927A
Other languages
English (en)
Chinese (zh)
Other versions
TW200734368A (en
Inventor
Yoshikimi Kondo
Hiroshi Uchida
Kazuhiro Daikai
Original Assignee
Asahi Kasei Chemicals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Kasei Chemicals Corp filed Critical Asahi Kasei Chemicals Corp
Publication of TW200734368A publication Critical patent/TW200734368A/zh
Application granted granted Critical
Publication of TWI344473B publication Critical patent/TWI344473B/zh

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Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/182Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
    • C08G59/184Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with amines
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50Amines
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/188Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using encapsulated compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/29Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2989Microcapsule with solid core [includes liposome]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
TW096103927A 2006-02-03 2007-02-02 Microcapsule type hardener for epoxy resin, masterbatch type hardener composition for epoxy resin, one-pack type epoxy resin composition, and processed article TW200734368A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006027073 2006-02-03
JP2006169786 2006-06-20

Publications (2)

Publication Number Publication Date
TW200734368A TW200734368A (en) 2007-09-16
TWI344473B true TWI344473B (enExample) 2011-07-01

Family

ID=38327460

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096103927A TW200734368A (en) 2006-02-03 2007-02-02 Microcapsule type hardener for epoxy resin, masterbatch type hardener composition for epoxy resin, one-pack type epoxy resin composition, and processed article

Country Status (8)

Country Link
US (1) US7927514B2 (enExample)
EP (1) EP1980580A1 (enExample)
JP (1) JP5148292B2 (enExample)
KR (1) KR100976303B1 (enExample)
CN (1) CN101379108B (enExample)
CA (1) CA2641409A1 (enExample)
TW (1) TW200734368A (enExample)
WO (1) WO2007088889A1 (enExample)

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EP1930359A1 (en) * 2005-09-29 2008-06-11 Asahi Kasei Chemicals Corporation High-stability microencapsulated hardener for epoxy resin and epoxy resin composition
WO2009005135A1 (ja) * 2007-07-05 2009-01-08 Asahi Kasei E-Materials Corporation エポキシ樹脂用硬化剤及びエポキシ樹脂用硬化剤組成物
CN102936331A (zh) * 2007-09-20 2013-02-20 日立化成工业株式会社 环氧树脂用微囊型潜在性固化剂及其制造方法
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US8044154B2 (en) 2009-06-12 2011-10-25 Trillion Science, Inc. Latent hardener for epoxy compositions
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JP6063304B2 (ja) * 2013-03-04 2017-01-18 旭化成株式会社 エポキシ樹脂用マイクロカプセル型硬化剤
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CN103194164B (zh) * 2013-04-26 2014-05-21 中国电子科技集团公司第三十八研究所 一种高温自修复型导电银胶及其制备方法
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JP6283568B2 (ja) * 2014-05-22 2018-02-21 旭化成株式会社 エポキシ樹脂用硬化剤、マイクロカプセル型エポキシ樹脂用硬化剤、マスターバッチ型エポキシ樹脂用硬化剤組成物、一液性エポキシ樹脂組成物及び加工品
WO2016004608A1 (zh) * 2014-07-10 2016-01-14 吴琴芬 耐腐蚀金属门窗
CN105047256B (zh) * 2015-06-30 2017-07-14 株洲时代新材料科技股份有限公司 含微胶囊固化促进剂的云母带及其制备方法
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US10400072B2 (en) 2016-04-25 2019-09-03 3M Innovative Properties Company Composite particles for curing epoxy resin compositions and curable and cured epoxy resin compositions prepared using the particles
CN107418121A (zh) * 2016-05-24 2017-12-01 上海羽迪新材料科技有限公司 一种高性能阻燃母粒
US11059967B2 (en) 2016-12-13 2021-07-13 3M Innovative Properties Company Epoxy stabilization using acid-coated nitrogen containing catalysts, particles, and methods
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KR102311179B1 (ko) * 2020-02-26 2021-10-13 한국과학기술원 솔더 도전 입자와 플럭스 첨가제를 함유하는 열압착 접합용 이방성 전도성 접착제 및 이를 이용한 전자부품 간 접속방법
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Also Published As

Publication number Publication date
CN101379108B (zh) 2011-11-30
CN101379108A (zh) 2009-03-04
US20090186962A1 (en) 2009-07-23
JPWO2007088889A1 (ja) 2009-06-25
US7927514B2 (en) 2011-04-19
TW200734368A (en) 2007-09-16
KR100976303B1 (ko) 2010-08-16
EP1980580A1 (en) 2008-10-15
CA2641409A1 (en) 2007-08-09
JP5148292B2 (ja) 2013-02-20
WO2007088889A1 (ja) 2007-08-09
KR20080083054A (ko) 2008-09-12

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