TWI344473B - - Google Patents

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Publication number
TWI344473B
TWI344473B TW096103927A TW96103927A TWI344473B TW I344473 B TWI344473 B TW I344473B TW 096103927 A TW096103927 A TW 096103927A TW 96103927 A TW96103927 A TW 96103927A TW I344473 B TWI344473 B TW I344473B
Authority
TW
Taiwan
Prior art keywords
epoxy resin
hardener
type epoxy
mass
microcapsule
Prior art date
Application number
TW096103927A
Other languages
English (en)
Chinese (zh)
Other versions
TW200734368A (en
Inventor
Yoshikimi Kondo
Hiroshi Uchida
Kazuhiro Daikai
Original Assignee
Asahi Kasei Chemicals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Kasei Chemicals Corp filed Critical Asahi Kasei Chemicals Corp
Publication of TW200734368A publication Critical patent/TW200734368A/zh
Application granted granted Critical
Publication of TWI344473B publication Critical patent/TWI344473B/zh

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/182Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
    • C08G59/184Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with amines
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50Amines
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/188Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using encapsulated compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/29Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2989Microcapsule with solid core [includes liposome]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
TW096103927A 2006-02-03 2007-02-02 Microcapsule type hardener for epoxy resin, masterbatch type hardener composition for epoxy resin, one-pack type epoxy resin composition, and processed article TW200734368A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006027073 2006-02-03
JP2006169786 2006-06-20

Publications (2)

Publication Number Publication Date
TW200734368A TW200734368A (en) 2007-09-16
TWI344473B true TWI344473B (enExample) 2011-07-01

Family

ID=38327460

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096103927A TW200734368A (en) 2006-02-03 2007-02-02 Microcapsule type hardener for epoxy resin, masterbatch type hardener composition for epoxy resin, one-pack type epoxy resin composition, and processed article

Country Status (8)

Country Link
US (1) US7927514B2 (enExample)
EP (1) EP1980580A1 (enExample)
JP (1) JP5148292B2 (enExample)
KR (1) KR100976303B1 (enExample)
CN (1) CN101379108B (enExample)
CA (1) CA2641409A1 (enExample)
TW (1) TW200734368A (enExample)
WO (1) WO2007088889A1 (enExample)

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CN101283017B (zh) * 2005-09-29 2011-06-15 旭化成电子材料株式会社 高稳定性微胶囊型环氧树脂用固化剂和环氧树脂组合物
WO2009005135A1 (ja) * 2007-07-05 2009-01-08 Asahi Kasei E-Materials Corporation エポキシ樹脂用硬化剤及びエポキシ樹脂用硬化剤組成物
CN101802050A (zh) * 2007-09-20 2010-08-11 日立化成工业株式会社 环氧树脂用微囊型潜在性固化剂及其制造方法,和一液性环氧树脂组合物及其固化物
WO2009102630A1 (en) * 2008-02-11 2009-08-20 Memc Electronic Materials, Inc. Carbon nanotube reinforced wiresaw beam used in wiresaw slicing of ingots into wafers
JP5534615B2 (ja) * 2009-02-27 2014-07-02 旭化成イーマテリアルズ株式会社 マイクロカプセル型エポキシ樹脂用硬化剤、マスターバッチ型エポキシ樹脂用硬化剤組成物、一液性エポキシ樹脂組成物、および加工品
JP5561949B2 (ja) * 2009-04-08 2014-07-30 日東電工株式会社 熱硬化型ダイボンドフィルム
WO2010122995A1 (ja) * 2009-04-24 2010-10-28 旭化成イーマテリアルズ株式会社 イミダゾール化合物含有マイクロカプセル化組成物、それを用いた硬化性組成物及びマスターバッチ型硬化剤
US8044154B2 (en) 2009-06-12 2011-10-25 Trillion Science, Inc. Latent hardener for epoxy compositions
US8067484B2 (en) 2010-03-12 2011-11-29 Trillion Science, Inc. Latent hardener with improved barrier properties and compatibility
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US9243164B1 (en) 2012-02-21 2016-01-26 Park Electrochemical Corporation Thermosetting resin composition containing a polyphenylene ether and a brominated fire retardant compound
US8753924B2 (en) 2012-03-08 2014-06-17 Texas Instruments Incorporated Grown carbon nanotube die attach structures, articles, devices, and processes for making them
JP5605516B2 (ja) * 2012-03-29 2014-10-15 Dic株式会社 導電性インキ組成物、導電性パターンの製造方法及び導電性回路
JP6085130B2 (ja) * 2012-09-07 2017-02-22 旭化成株式会社 液状樹脂組成物、及び加工品
US20140103572A1 (en) * 2012-10-15 2014-04-17 Asustek Computer Inc. Casing molding method
JP6063304B2 (ja) * 2013-03-04 2017-01-18 旭化成株式会社 エポキシ樹脂用マイクロカプセル型硬化剤
JP2014185296A (ja) * 2013-03-25 2014-10-02 Asahi Kasei E-Materials Corp 液状樹脂組成物及び加工品
CN103194164B (zh) * 2013-04-26 2014-05-21 中国电子科技集团公司第三十八研究所 一种高温自修复型导电银胶及其制备方法
CN103446966A (zh) * 2013-09-09 2013-12-18 华东理工大学 制备贮存稳定的用于不饱和聚酯固化的微胶囊及其制备方法
JP6331526B2 (ja) * 2014-03-14 2018-05-30 オムロン株式会社 樹脂組成物およびその硬化物
JP6283568B2 (ja) * 2014-05-22 2018-02-21 旭化成株式会社 エポキシ樹脂用硬化剤、マイクロカプセル型エポキシ樹脂用硬化剤、マスターバッチ型エポキシ樹脂用硬化剤組成物、一液性エポキシ樹脂組成物及び加工品
WO2016004608A1 (zh) * 2014-07-10 2016-01-14 吴琴芬 耐腐蚀金属门窗
CN105047256B (zh) * 2015-06-30 2017-07-14 株洲时代新材料科技股份有限公司 含微胶囊固化促进剂的云母带及其制备方法
JP6619628B2 (ja) * 2015-11-20 2019-12-11 旭化成株式会社 接着フィルム用エポキシ樹脂組成物。
KR101646531B1 (ko) * 2016-01-18 2016-08-08 회명산업 주식회사 에폭시 수지용 잠재성 경화제, 그 제조방법, 이를 포함하는 일액형 에폭시 수지 조성물
WO2017189388A1 (en) 2016-04-25 2017-11-02 3M Innovative Properties Company Composite particles for curing epoxy resin compositions and curable and cured epoxy resin compositions prepared using the particles
CN107418121A (zh) * 2016-05-24 2017-12-01 上海羽迪新材料科技有限公司 一种高性能阻燃母粒
EP3555169A1 (en) 2016-12-13 2019-10-23 3M Innovative Properties Company Epoxy stabilization using acid-coated nitrogen-containing catalysts, particles, and methods
WO2018216643A1 (ja) * 2017-05-24 2018-11-29 東レ株式会社 繊維強化複合材料用エポキシ樹脂組成物、および繊維強化複合材料
JPWO2019078044A1 (ja) * 2017-10-18 2020-11-05 株式会社スリーボンド 熱伝導性樹脂組成物、硬化物および放熱方法
JP2022526956A (ja) 2019-03-28 2022-05-27 スリーエム イノベイティブ プロパティズ カンパニー ピッカリング乳化剤を有するエポキシドマイクロカプセル
US20220195247A1 (en) 2019-03-28 2022-06-23 3M Innovative Properties Company Structural bonding tape with epoxide microcapsules
KR102311179B1 (ko) * 2020-02-26 2021-10-13 한국과학기술원 솔더 도전 입자와 플럭스 첨가제를 함유하는 열압착 접합용 이방성 전도성 접착제 및 이를 이용한 전자부품 간 접속방법
JP7643845B2 (ja) * 2020-08-18 2025-03-11 旭化成株式会社 マスターバッチ型熱硬化性樹脂組成物、及び熱硬化性樹脂組成物
PT4047065T (pt) * 2020-09-29 2025-04-23 Furukawa Electric Co Ltd Composição adesiva transparente, adesivo transparente tipo película, método para o fabrico de elemento dotado de camada curada adesiva transparente, e componente eletrónico e método para o fabrico do mesmo
WO2022123498A1 (en) 2020-12-10 2022-06-16 3M Innovative Properties Company Crosslinked polymer particles and related compositions and processes
JPWO2022270286A1 (enExample) * 2021-06-21 2022-12-29
JP2023008549A (ja) * 2021-07-06 2023-01-19 旭化成株式会社 エポキシ樹脂組成物

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Also Published As

Publication number Publication date
TW200734368A (en) 2007-09-16
CN101379108A (zh) 2009-03-04
EP1980580A1 (en) 2008-10-15
JPWO2007088889A1 (ja) 2009-06-25
US7927514B2 (en) 2011-04-19
CN101379108B (zh) 2011-11-30
WO2007088889A1 (ja) 2007-08-09
JP5148292B2 (ja) 2013-02-20
KR100976303B1 (ko) 2010-08-16
US20090186962A1 (en) 2009-07-23
KR20080083054A (ko) 2008-09-12
CA2641409A1 (en) 2007-08-09

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