CA2641409A1 - Microcapsule-based hardener for epoxy resin, masterbatch-based hardener composition for epoxy resin, one-part epoxy resin composition, and processed good - Google Patents
Microcapsule-based hardener for epoxy resin, masterbatch-based hardener composition for epoxy resin, one-part epoxy resin composition, and processed good Download PDFInfo
- Publication number
- CA2641409A1 CA2641409A1 CA002641409A CA2641409A CA2641409A1 CA 2641409 A1 CA2641409 A1 CA 2641409A1 CA 002641409 A CA002641409 A CA 002641409A CA 2641409 A CA2641409 A CA 2641409A CA 2641409 A1 CA2641409 A1 CA 2641409A1
- Authority
- CA
- Canada
- Prior art keywords
- epoxy resin
- hardener
- microcapsule
- composition
- based hardener
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
- C08G59/184—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with amines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/188—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using encapsulated compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
- Y10T428/2989—Microcapsule with solid core [includes liposome]
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006027073 | 2006-02-03 | ||
| JP2006-027073 | 2006-02-03 | ||
| JP2006-169786 | 2006-06-20 | ||
| JP2006169786 | 2006-06-20 | ||
| PCT/JP2007/051595 WO2007088889A1 (ja) | 2006-02-03 | 2007-01-31 | マイクロカプセル型エポキシ樹脂用硬化剤、マスタ-バッチ型エポキシ樹脂用硬化剤組成物、一液性エポキシ樹脂組成物、および加工品 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA2641409A1 true CA2641409A1 (en) | 2007-08-09 |
Family
ID=38327460
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002641409A Abandoned CA2641409A1 (en) | 2006-02-03 | 2007-01-31 | Microcapsule-based hardener for epoxy resin, masterbatch-based hardener composition for epoxy resin, one-part epoxy resin composition, and processed good |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US7927514B2 (enExample) |
| EP (1) | EP1980580A1 (enExample) |
| JP (1) | JP5148292B2 (enExample) |
| KR (1) | KR100976303B1 (enExample) |
| CN (1) | CN101379108B (enExample) |
| CA (1) | CA2641409A1 (enExample) |
| TW (1) | TW200734368A (enExample) |
| WO (1) | WO2007088889A1 (enExample) |
Families Citing this family (45)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101283017B (zh) * | 2005-09-29 | 2011-06-15 | 旭化成电子材料株式会社 | 高稳定性微胶囊型环氧树脂用固化剂和环氧树脂组合物 |
| WO2009005135A1 (ja) * | 2007-07-05 | 2009-01-08 | Asahi Kasei E-Materials Corporation | エポキシ樹脂用硬化剤及びエポキシ樹脂用硬化剤組成物 |
| CN101802050A (zh) * | 2007-09-20 | 2010-08-11 | 日立化成工业株式会社 | 环氧树脂用微囊型潜在性固化剂及其制造方法,和一液性环氧树脂组合物及其固化物 |
| WO2009102630A1 (en) * | 2008-02-11 | 2009-08-20 | Memc Electronic Materials, Inc. | Carbon nanotube reinforced wiresaw beam used in wiresaw slicing of ingots into wafers |
| JP5534615B2 (ja) * | 2009-02-27 | 2014-07-02 | 旭化成イーマテリアルズ株式会社 | マイクロカプセル型エポキシ樹脂用硬化剤、マスターバッチ型エポキシ樹脂用硬化剤組成物、一液性エポキシ樹脂組成物、および加工品 |
| JP5561949B2 (ja) * | 2009-04-08 | 2014-07-30 | 日東電工株式会社 | 熱硬化型ダイボンドフィルム |
| WO2010122995A1 (ja) * | 2009-04-24 | 2010-10-28 | 旭化成イーマテリアルズ株式会社 | イミダゾール化合物含有マイクロカプセル化組成物、それを用いた硬化性組成物及びマスターバッチ型硬化剤 |
| US8044154B2 (en) | 2009-06-12 | 2011-10-25 | Trillion Science, Inc. | Latent hardener for epoxy compositions |
| US8067484B2 (en) | 2010-03-12 | 2011-11-29 | Trillion Science, Inc. | Latent hardener with improved barrier properties and compatibility |
| JP5565931B2 (ja) * | 2009-10-01 | 2014-08-06 | 株式会社Adeka | シリコンウエハ接着性樹脂組成物 |
| JP5691219B2 (ja) | 2010-03-30 | 2015-04-01 | 住友ベークライト株式会社 | 半導体封止用樹脂組成物の製造方法および粉砕装置 |
| JP5166495B2 (ja) * | 2010-08-11 | 2013-03-21 | 株式会社日立製作所 | ドライマイカテープ及びこれを用いた電気絶縁線輪 |
| RU2478670C1 (ru) * | 2011-08-03 | 2013-04-10 | Татьяна Валентиновна Лапицкая | Способ получения отвердителей эпоксидных смол |
| RU2014110182A (ru) * | 2011-08-18 | 2015-09-27 | ДАУ ГЛОБАЛ ТЕКНОЛОДЖИС ЭлЭлСи | Отверждаемые полимерные композиции |
| WO2013047853A1 (ja) * | 2011-09-26 | 2013-04-04 | 住友化学株式会社 | 二次電池用接着樹脂組成物 |
| US8986578B2 (en) | 2011-12-28 | 2015-03-24 | King Fahd University Of Petroleum And Minerals | High impact strength conductive adhesives |
| US9051465B1 (en) | 2012-02-21 | 2015-06-09 | Park Electrochemical Corporation | Thermosetting resin composition containing a polyphenylene ether and a brominated fire retardant compound |
| US9243164B1 (en) | 2012-02-21 | 2016-01-26 | Park Electrochemical Corporation | Thermosetting resin composition containing a polyphenylene ether and a brominated fire retardant compound |
| US8753924B2 (en) | 2012-03-08 | 2014-06-17 | Texas Instruments Incorporated | Grown carbon nanotube die attach structures, articles, devices, and processes for making them |
| JP5605516B2 (ja) * | 2012-03-29 | 2014-10-15 | Dic株式会社 | 導電性インキ組成物、導電性パターンの製造方法及び導電性回路 |
| JP6085130B2 (ja) * | 2012-09-07 | 2017-02-22 | 旭化成株式会社 | 液状樹脂組成物、及び加工品 |
| US20140103572A1 (en) * | 2012-10-15 | 2014-04-17 | Asustek Computer Inc. | Casing molding method |
| JP6063304B2 (ja) * | 2013-03-04 | 2017-01-18 | 旭化成株式会社 | エポキシ樹脂用マイクロカプセル型硬化剤 |
| JP2014185296A (ja) * | 2013-03-25 | 2014-10-02 | Asahi Kasei E-Materials Corp | 液状樹脂組成物及び加工品 |
| CN103194164B (zh) * | 2013-04-26 | 2014-05-21 | 中国电子科技集团公司第三十八研究所 | 一种高温自修复型导电银胶及其制备方法 |
| CN103446966A (zh) * | 2013-09-09 | 2013-12-18 | 华东理工大学 | 制备贮存稳定的用于不饱和聚酯固化的微胶囊及其制备方法 |
| JP6331526B2 (ja) * | 2014-03-14 | 2018-05-30 | オムロン株式会社 | 樹脂組成物およびその硬化物 |
| JP6283568B2 (ja) * | 2014-05-22 | 2018-02-21 | 旭化成株式会社 | エポキシ樹脂用硬化剤、マイクロカプセル型エポキシ樹脂用硬化剤、マスターバッチ型エポキシ樹脂用硬化剤組成物、一液性エポキシ樹脂組成物及び加工品 |
| WO2016004608A1 (zh) * | 2014-07-10 | 2016-01-14 | 吴琴芬 | 耐腐蚀金属门窗 |
| CN105047256B (zh) * | 2015-06-30 | 2017-07-14 | 株洲时代新材料科技股份有限公司 | 含微胶囊固化促进剂的云母带及其制备方法 |
| JP6619628B2 (ja) * | 2015-11-20 | 2019-12-11 | 旭化成株式会社 | 接着フィルム用エポキシ樹脂組成物。 |
| KR101646531B1 (ko) * | 2016-01-18 | 2016-08-08 | 회명산업 주식회사 | 에폭시 수지용 잠재성 경화제, 그 제조방법, 이를 포함하는 일액형 에폭시 수지 조성물 |
| WO2017189388A1 (en) | 2016-04-25 | 2017-11-02 | 3M Innovative Properties Company | Composite particles for curing epoxy resin compositions and curable and cured epoxy resin compositions prepared using the particles |
| CN107418121A (zh) * | 2016-05-24 | 2017-12-01 | 上海羽迪新材料科技有限公司 | 一种高性能阻燃母粒 |
| EP3555169A1 (en) | 2016-12-13 | 2019-10-23 | 3M Innovative Properties Company | Epoxy stabilization using acid-coated nitrogen-containing catalysts, particles, and methods |
| WO2018216643A1 (ja) * | 2017-05-24 | 2018-11-29 | 東レ株式会社 | 繊維強化複合材料用エポキシ樹脂組成物、および繊維強化複合材料 |
| JPWO2019078044A1 (ja) * | 2017-10-18 | 2020-11-05 | 株式会社スリーボンド | 熱伝導性樹脂組成物、硬化物および放熱方法 |
| JP2022526956A (ja) | 2019-03-28 | 2022-05-27 | スリーエム イノベイティブ プロパティズ カンパニー | ピッカリング乳化剤を有するエポキシドマイクロカプセル |
| US20220195247A1 (en) | 2019-03-28 | 2022-06-23 | 3M Innovative Properties Company | Structural bonding tape with epoxide microcapsules |
| KR102311179B1 (ko) * | 2020-02-26 | 2021-10-13 | 한국과학기술원 | 솔더 도전 입자와 플럭스 첨가제를 함유하는 열압착 접합용 이방성 전도성 접착제 및 이를 이용한 전자부품 간 접속방법 |
| JP7643845B2 (ja) * | 2020-08-18 | 2025-03-11 | 旭化成株式会社 | マスターバッチ型熱硬化性樹脂組成物、及び熱硬化性樹脂組成物 |
| PT4047065T (pt) * | 2020-09-29 | 2025-04-23 | Furukawa Electric Co Ltd | Composição adesiva transparente, adesivo transparente tipo película, método para o fabrico de elemento dotado de camada curada adesiva transparente, e componente eletrónico e método para o fabrico do mesmo |
| WO2022123498A1 (en) | 2020-12-10 | 2022-06-16 | 3M Innovative Properties Company | Crosslinked polymer particles and related compositions and processes |
| JPWO2022270286A1 (enExample) * | 2021-06-21 | 2022-12-29 | ||
| JP2023008549A (ja) * | 2021-07-06 | 2023-01-19 | 旭化成株式会社 | エポキシ樹脂組成物 |
Family Cites Families (36)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0765023B2 (ja) | 1985-12-13 | 1995-07-12 | ソニーケミカル株式会社 | フィルム状導電異方性接着剤 |
| US4833226A (en) * | 1987-08-26 | 1989-05-23 | Asahi Kasei Kogyo Kabushiki Kaisha | Hardener for curable one-package epoxy resin system |
| JP2610900B2 (ja) | 1987-10-27 | 1997-05-14 | ソニーケミカル 株式会社 | 熱硬化型異方性導電接着シート及びその製造方法 |
| JPH046116A (ja) | 1990-04-25 | 1992-01-10 | Olympus Optical Co Ltd | 光学素子成形用型 |
| US5567792A (en) * | 1990-05-28 | 1996-10-22 | W. R. Grace & Co.-Conn. | Spherical curing agent for epoxy resin, curing agent masterbatch for epoxy resin and their preparation |
| JP3196245B2 (ja) | 1991-08-14 | 2001-08-06 | 松下電器産業株式会社 | 一液型熱硬化性エポキシ樹脂組成物 |
| US5357008A (en) * | 1992-01-22 | 1994-10-18 | W. R. Grace & Co.-Conn. | Latent curing agent for epoxy resin and its preparation |
| JP3039126B2 (ja) | 1992-04-20 | 2000-05-08 | 日立化成工業株式会社 | フィルム状接着剤の製造方法 |
| JP3454437B2 (ja) * | 1992-10-02 | 2003-10-06 | ナショナル スターチ アンド ケミカル インベストメント ホールディング コーポレイション | 低粘度無溶媒の一液型エポキシ樹脂接着性組成物 |
| JPH06136244A (ja) | 1992-10-23 | 1994-05-17 | Furukawa Electric Co Ltd:The | エポキシ樹脂組成物 |
| TW305860B (enExample) * | 1994-03-15 | 1997-05-21 | Toray Industries | |
| JP3290296B2 (ja) | 1994-05-13 | 2002-06-10 | 太陽インキ製造株式会社 | 多層プリント配線板及びその製造方法 |
| JP3373058B2 (ja) | 1994-08-22 | 2003-02-04 | 住友ベークライト株式会社 | 多層プリント配線板の製造方法 |
| JP3634902B2 (ja) | 1995-09-07 | 2005-03-30 | 三菱レイヨン株式会社 | プリプレグ用エポキシ樹脂組成物 |
| JP3908312B2 (ja) | 1996-12-13 | 2007-04-25 | 日東電工株式会社 | エポキシ樹脂組成物およびそれを用いた半導体装置 |
| JP3559137B2 (ja) | 1997-02-27 | 2004-08-25 | 日立化成工業株式会社 | 熱伝導性接着剤組成物及び該組成物を用いた熱伝導性接着フィルム |
| US6670006B1 (en) | 1997-03-27 | 2003-12-30 | Mitsubishi Rayon Co., Ltd. | Epoxy resin composition for FRP, prepreg, and tubular molding produced therefrom |
| JP4150104B2 (ja) | 1998-05-13 | 2008-09-17 | 新日本石油株式会社 | 防食塗料組成物 |
| JP3412518B2 (ja) | 1998-06-16 | 2003-06-03 | 住友金属鉱山株式会社 | 熱伝導性樹脂ペースト |
| WO2000064960A1 (fr) | 1999-04-22 | 2000-11-02 | Ajinomoto Co., Inc. | Composition de resine thermodurcissable et materiau d'enrobage de circuit flexible comprenant cette composition |
| JP3736603B2 (ja) | 1999-08-19 | 2006-01-18 | 信越化学工業株式会社 | 半導体封止用エポキシ樹脂組成物及び半導体装置 |
| CN1156533C (zh) * | 1999-10-06 | 2004-07-07 | 日东电工株式会社 | 半导体密封用树脂组合物和使用它的半导体装置及制法 |
| JP4423779B2 (ja) * | 1999-10-13 | 2010-03-03 | 味の素株式会社 | エポキシ樹脂組成物並びに該組成物を用いた接着フィルム及びプリプレグ、及びこれらを用いた多層プリント配線板及びその製造法 |
| JP2002226675A (ja) | 2001-02-05 | 2002-08-14 | Toshiba Chem Corp | 絶縁性ペースト |
| JP2002332328A (ja) | 2001-05-10 | 2002-11-22 | Nisshinbo Ind Inc | 射出成形用コンパウンドおよび燃料電池セパレータの製造方法 |
| JP4013118B2 (ja) | 2002-02-27 | 2007-11-28 | 荒川化学工業株式会社 | エポキシ樹脂組成物、電子材料用樹脂組成物、電子材料用樹脂、コーティング剤およびコーティング剤硬化膜の製造方法 |
| JP2004075954A (ja) | 2002-08-22 | 2004-03-11 | Sumitomo Bakelite Co Ltd | 燃料電池セパレーター用エポキシ樹脂組成物 |
| CN100357336C (zh) * | 2002-10-25 | 2007-12-26 | 旭化成化学株式会社 | 胶囊型硬化剂及其组合物 |
| JP4283642B2 (ja) | 2003-10-06 | 2009-06-24 | 東邦化学工業株式会社 | エポキシ塗料組成物 |
| WO2005035617A1 (ja) | 2003-10-10 | 2005-04-21 | Asahi Kasei Chemicals Corporation | 潜在性硬化剤および組成物 |
| WO2005095486A1 (ja) * | 2004-03-31 | 2005-10-13 | Asahi Kasei Chemicals Corporation | エポキシ樹脂用硬化剤及びエポキシ樹脂組成物 |
| JP4567377B2 (ja) | 2004-06-04 | 2010-10-20 | 旭化成イーマテリアルズ株式会社 | 潜在性硬化剤および組成物 |
| JP4707998B2 (ja) | 2004-11-11 | 2011-06-22 | 株式会社フジクラ | フレキシブルプリント回路基板用エポキシ樹脂系接着剤組成物、フレキシブルプリント回路基板用カバーレイ、フレキシブルプリント回路基板用銅張積層板およびフレキシブルプリント回路基板 |
| EP1852452A1 (en) * | 2005-02-23 | 2007-11-07 | Asahi Kasei Chemicals Corporation | Latent hardener for epoxy resin and epoxy resin composition |
| JP4667117B2 (ja) * | 2005-05-17 | 2011-04-06 | キヤノン株式会社 | シート材搬送装置及び画像形成装置 |
| CN101283017B (zh) | 2005-09-29 | 2011-06-15 | 旭化成电子材料株式会社 | 高稳定性微胶囊型环氧树脂用固化剂和环氧树脂组合物 |
-
2007
- 2007-01-31 KR KR1020087019075A patent/KR100976303B1/ko active Active
- 2007-01-31 WO PCT/JP2007/051595 patent/WO2007088889A1/ja not_active Ceased
- 2007-01-31 CN CN2007800043842A patent/CN101379108B/zh active Active
- 2007-01-31 US US12/223,523 patent/US7927514B2/en active Active
- 2007-01-31 CA CA002641409A patent/CA2641409A1/en not_active Abandoned
- 2007-01-31 EP EP07713755A patent/EP1980580A1/en not_active Withdrawn
- 2007-01-31 JP JP2007556890A patent/JP5148292B2/ja active Active
- 2007-02-02 TW TW096103927A patent/TW200734368A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW200734368A (en) | 2007-09-16 |
| TWI344473B (enExample) | 2011-07-01 |
| CN101379108A (zh) | 2009-03-04 |
| EP1980580A1 (en) | 2008-10-15 |
| JPWO2007088889A1 (ja) | 2009-06-25 |
| US7927514B2 (en) | 2011-04-19 |
| CN101379108B (zh) | 2011-11-30 |
| WO2007088889A1 (ja) | 2007-08-09 |
| JP5148292B2 (ja) | 2013-02-20 |
| KR100976303B1 (ko) | 2010-08-16 |
| US20090186962A1 (en) | 2009-07-23 |
| KR20080083054A (ko) | 2008-09-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EEER | Examination request | ||
| FZDE | Discontinued |