KR100976303B1 - 마이크로캡슐형 에폭시 수지용 경화제, 마스터배치형에폭시 수지용 경화제 조성물, 일액성 에폭시 수지 조성물,및 가공품 - Google Patents

마이크로캡슐형 에폭시 수지용 경화제, 마스터배치형에폭시 수지용 경화제 조성물, 일액성 에폭시 수지 조성물,및 가공품 Download PDF

Info

Publication number
KR100976303B1
KR100976303B1 KR1020087019075A KR20087019075A KR100976303B1 KR 100976303 B1 KR100976303 B1 KR 100976303B1 KR 1020087019075 A KR1020087019075 A KR 1020087019075A KR 20087019075 A KR20087019075 A KR 20087019075A KR 100976303 B1 KR100976303 B1 KR 100976303B1
Authority
KR
South Korea
Prior art keywords
epoxy resin
curing agent
hardening
epoxy resins
type epoxy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020087019075A
Other languages
English (en)
Korean (ko)
Other versions
KR20080083054A (ko
Inventor
요시끼미 곤도
히로시 우찌다
가즈히로 다이까이
Original Assignee
아사히 가세이 케미칼즈 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아사히 가세이 케미칼즈 가부시키가이샤 filed Critical 아사히 가세이 케미칼즈 가부시키가이샤
Publication of KR20080083054A publication Critical patent/KR20080083054A/ko
Application granted granted Critical
Publication of KR100976303B1 publication Critical patent/KR100976303B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
    • C08G59/184—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/188—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using encapsulated compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2989—Microcapsule with solid core [includes liposome]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
KR1020087019075A 2006-02-03 2007-01-31 마이크로캡슐형 에폭시 수지용 경화제, 마스터배치형에폭시 수지용 경화제 조성물, 일액성 에폭시 수지 조성물,및 가공품 Active KR100976303B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPJP-P-2006-00027073 2006-02-03
JP2006027073 2006-02-03
JPJP-P-2006-00169786 2006-06-20
JP2006169786 2006-06-20

Publications (2)

Publication Number Publication Date
KR20080083054A KR20080083054A (ko) 2008-09-12
KR100976303B1 true KR100976303B1 (ko) 2010-08-16

Family

ID=38327460

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020087019075A Active KR100976303B1 (ko) 2006-02-03 2007-01-31 마이크로캡슐형 에폭시 수지용 경화제, 마스터배치형에폭시 수지용 경화제 조성물, 일액성 에폭시 수지 조성물,및 가공품

Country Status (8)

Country Link
US (1) US7927514B2 (enExample)
EP (1) EP1980580A1 (enExample)
JP (1) JP5148292B2 (enExample)
KR (1) KR100976303B1 (enExample)
CN (1) CN101379108B (enExample)
CA (1) CA2641409A1 (enExample)
TW (1) TW200734368A (enExample)
WO (1) WO2007088889A1 (enExample)

Families Citing this family (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5258018B2 (ja) * 2005-09-29 2013-08-07 旭化成イーマテリアルズ株式会社 高安定性マイクロカプセル型エポキシ樹脂用硬化剤及びエポキシ樹脂組成物
JP5138685B2 (ja) * 2007-07-05 2013-02-06 旭化成イーマテリアルズ株式会社 エポキシ樹脂用硬化剤及びエポキシ樹脂用硬化剤組成物
KR20100072030A (ko) * 2007-09-20 2010-06-29 히다치 가세고교 가부시끼가이샤 에폭시 수지용 마이크로캡슐형 잠재성 경화제 및 그의 제조 방법, 및 일액성 에폭시 수지 조성물 및 그의 경화물
EP2242629A1 (en) * 2008-02-11 2010-10-27 MEMC Electronic Materials, Inc. Carbon nanotube reinforced wiresaw beam used in wiresaw slicing of ingots into wafers
KR101310593B1 (ko) * 2009-02-27 2013-09-23 아사히 가세이 이-매터리얼즈 가부시키가이샤 마이크로 캡슐형 에폭시 수지용 경화제, 마스터 배치형 에폭시 수지용 경화제 조성물, 일액성 에폭시 수지 조성물 및 가공품
JP5561949B2 (ja) * 2009-04-08 2014-07-30 日東電工株式会社 熱硬化型ダイボンドフィルム
WO2010122995A1 (ja) * 2009-04-24 2010-10-28 旭化成イーマテリアルズ株式会社 イミダゾール化合物含有マイクロカプセル化組成物、それを用いた硬化性組成物及びマスターバッチ型硬化剤
US8044154B2 (en) 2009-06-12 2011-10-25 Trillion Science, Inc. Latent hardener for epoxy compositions
US8067484B2 (en) 2010-03-12 2011-11-29 Trillion Science, Inc. Latent hardener with improved barrier properties and compatibility
JP5565931B2 (ja) * 2009-10-01 2014-08-06 株式会社Ａｄｅｋａ シリコンウエハ接着性樹脂組成物
JP5691219B2 (ja) * 2010-03-30 2015-04-01 住友ベークライト株式会社 半導体封止用樹脂組成物の製造方法および粉砕装置
JP5166495B2 (ja) * 2010-08-11 2013-03-21 株式会社日立製作所 ドライマイカテープ及びこれを用いた電気絶縁線輪
RU2478670C1 (ru) * 2011-08-03 2013-04-10 Татьяна Валентиновна Лапицкая Способ получения отвердителей эпоксидных смол
JP2014528982A (ja) * 2011-08-18 2014-10-30 ダウ グローバル テクノロジーズ エルエルシー 硬化型樹脂組成物
WO2013047853A1 (ja) * 2011-09-26 2013-04-04 住友化学株式会社 二次電池用接着樹脂組成物
US8986578B2 (en) 2011-12-28 2015-03-24 King Fahd University Of Petroleum And Minerals High impact strength conductive adhesives
US9243164B1 (en) 2012-02-21 2016-01-26 Park Electrochemical Corporation Thermosetting resin composition containing a polyphenylene ether and a brominated fire retardant compound
US9051465B1 (en) 2012-02-21 2015-06-09 Park Electrochemical Corporation Thermosetting resin composition containing a polyphenylene ether and a brominated fire retardant compound
US8753924B2 (en) 2012-03-08 2014-06-17 Texas Instruments Incorporated Grown carbon nanotube die attach structures, articles, devices, and processes for making them
US10301488B2 (en) * 2012-03-29 2019-05-28 Dic Corporation Conductive ink composition, method for producing conductive patterns, and conductive circuit
JP6085130B2 (ja) * 2012-09-07 2017-02-22 旭化成株式会社 液状樹脂組成物、及び加工品
US20140103572A1 (en) * 2012-10-15 2014-04-17 Asustek Computer Inc. Casing molding method
JP6063304B2 (ja) * 2013-03-04 2017-01-18 旭化成株式会社 エポキシ樹脂用マイクロカプセル型硬化剤
JP2014185296A (ja) * 2013-03-25 2014-10-02 Asahi Kasei E-Materials Corp 液状樹脂組成物及び加工品
CN103194164B (zh) * 2013-04-26 2014-05-21 中国电子科技集团公司第三十八研究所 一种高温自修复型导电银胶及其制备方法
CN103446966A (zh) * 2013-09-09 2013-12-18 华东理工大学 制备贮存稳定的用于不饱和聚酯固化的微胶囊及其制备方法
JP6331526B2 (ja) * 2014-03-14 2018-05-30 オムロン株式会社 樹脂組成物およびその硬化物
JP6283568B2 (ja) * 2014-05-22 2018-02-21 旭化成株式会社 エポキシ樹脂用硬化剤、マイクロカプセル型エポキシ樹脂用硬化剤、マスターバッチ型エポキシ樹脂用硬化剤組成物、一液性エポキシ樹脂組成物及び加工品
WO2016004608A1 (zh) * 2014-07-10 2016-01-14 吴琴芬 耐腐蚀金属门窗
CN105047256B (zh) * 2015-06-30 2017-07-14 株洲时代新材料科技股份有限公司 含微胶囊固化促进剂的云母带及其制备方法
JP6619628B2 (ja) * 2015-11-20 2019-12-11 旭化成株式会社 接着フィルム用エポキシ樹脂組成物。
KR101646531B1 (ko) * 2016-01-18 2016-08-08 회명산업 주식회사 에폭시 수지용 잠재성 경화제, 그 제조방법, 이를 포함하는 일액형 에폭시 수지 조성물
WO2017189388A1 (en) 2016-04-25 2017-11-02 3M Innovative Properties Company Composite particles for curing epoxy resin compositions and curable and cured epoxy resin compositions prepared using the particles
CN107418121A (zh) * 2016-05-24 2017-12-01 上海羽迪新材料科技有限公司 一种高性能阻燃母粒
US11059967B2 (en) 2016-12-13 2021-07-13 3M Innovative Properties Company Epoxy stabilization using acid-coated nitrogen containing catalysts, particles, and methods
KR102361346B1 (ko) * 2017-05-24 2022-02-10 도레이 카부시키가이샤 섬유 강화 복합 재료용 에폭시 수지 조성물, 및 섬유 강화 복합 재료
JPWO2019078044A1 (ja) * 2017-10-18 2020-11-05 株式会社スリーボンド 熱伝導性樹脂組成物、硬化物および放熱方法
JP2022526958A (ja) 2019-03-28 2022-05-27 スリーエム イノベイティブ プロパティズ カンパニー エポキシドマイクロカプセルを有する構造接着テープ
JP2022526956A (ja) 2019-03-28 2022-05-27 スリーエム イノベイティブ プロパティズ カンパニー ピッカリング乳化剤を有するエポキシドマイクロカプセル
KR102311179B1 (ko) * 2020-02-26 2021-10-13 한국과학기술원 솔더 도전 입자와 플럭스 첨가제를 함유하는 열압착 접합용 이방성 전도성 접착제 및 이를 이용한 전자부품 간 접속방법
JP7643845B2 (ja) * 2020-08-18 2025-03-11 旭化成株式会社 マスターバッチ型熱硬化性樹脂組成物、及び熱硬化性樹脂組成物
JP7687960B2 (ja) * 2020-09-29 2025-06-03 古河電気工業株式会社 透明接着剤用組成物及びフィルム状透明接着剤、並びに、透明接着剤硬化層付部材の製造方法、電子部品及びその製造方法
WO2022123498A1 (en) 2020-12-10 2022-06-16 3M Innovative Properties Company Crosslinked polymer particles and related compositions and processes
EP4349906A4 (en) * 2021-06-21 2025-05-21 Tomoegawa Co., Ltd. Solid polymer fuel cell sealing material
JP2023008549A (ja) * 2021-07-06 2023-01-19 旭化成株式会社 エポキシ樹脂組成物

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005095486A1 (ja) * 2004-03-31 2005-10-13 Asahi Kasei Chemicals Corporation エポキシ樹脂用硬化剤及びエポキシ樹脂組成物

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0765023B2 (ja) 1985-12-13 1995-07-12 ソニーケミカル株式会社 フィルム状導電異方性接着剤
US4833226A (en) * 1987-08-26 1989-05-23 Asahi Kasei Kogyo Kabushiki Kaisha Hardener for curable one-package epoxy resin system
JP2610900B2 (ja) 1987-10-27 1997-05-14 ソニーケミカル 株式会社 熱硬化型異方性導電接着シート及びその製造方法
JPH046116A (ja) 1990-04-25 1992-01-10 Olympus Optical Co Ltd 光学素子成形用型
US5548058A (en) * 1990-05-28 1996-08-20 W. R. Grace & Co.-Conn. Spherical curing agent for epoxy resin, curing agent masterbatch for epoxy resin and their preparation
JP3196245B2 (ja) 1991-08-14 2001-08-06 松下電器産業株式会社 一液型熱硬化性エポキシ樹脂組成物
US5357008A (en) * 1992-01-22 1994-10-18 W. R. Grace & Co.-Conn. Latent curing agent for epoxy resin and its preparation
JP3039126B2 (ja) 1992-04-20 2000-05-08 日立化成工業株式会社 フィルム状接着剤の製造方法
JP3454437B2 (ja) * 1992-10-02 2003-10-06 ナショナル スターチ アンド ケミカル インベストメント ホールディング コーポレイション 低粘度無溶媒の一液型エポキシ樹脂接着性組成物
JPH06136244A (ja) 1992-10-23 1994-05-17 Furukawa Electric Co Ltd:The エポキシ樹脂組成物
TW305860B (enExample) * 1994-03-15 1997-05-21 Toray Industries
JP3290296B2 (ja) 1994-05-13 2002-06-10 太陽インキ製造株式会社 多層プリント配線板及びその製造方法
JP3373058B2 (ja) 1994-08-22 2003-02-04 住友ベークライト株式会社 多層プリント配線板の製造方法
JP3634902B2 (ja) 1995-09-07 2005-03-30 三菱レイヨン株式会社 プリプレグ用エポキシ樹脂組成物
JP3908312B2 (ja) * 1996-12-13 2007-04-25 日東電工株式会社 エポキシ樹脂組成物およびそれを用いた半導体装置
JP3559137B2 (ja) 1997-02-27 2004-08-25 日立化成工業株式会社 熱伝導性接着剤組成物及び該組成物を用いた熱伝導性接着フィルム
EP0970980B1 (en) 1997-03-27 2005-03-23 Mitsubishi Rayon Co., Ltd. Epoxy resin composition for frp, prepreg, and tubular molding produced therefrom
JP4150104B2 (ja) 1998-05-13 2008-09-17 新日本石油株式会社 防食塗料組成物
JP3412518B2 (ja) 1998-06-16 2003-06-03 住友金属鉱山株式会社 熱伝導性樹脂ペースト
WO2000064960A1 (fr) 1999-04-22 2000-11-02 Ajinomoto Co., Inc. Composition de resine thermodurcissable et materiau d'enrobage de circuit flexible comprenant cette composition
JP3736603B2 (ja) * 1999-08-19 2006-01-18 信越化学工業株式会社 半導体封止用エポキシ樹脂組成物及び半導体装置
MY126953A (en) * 1999-10-06 2006-11-30 Nitto Denko Corp Resin composition for semiconductor encapsulation, semiconductor device comprising the same and process for the production of semiconductor device using the same
JP4423779B2 (ja) * 1999-10-13 2010-03-03 味の素株式会社 エポキシ樹脂組成物並びに該組成物を用いた接着フィルム及びプリプレグ、及びこれらを用いた多層プリント配線板及びその製造法
JP2002226675A (ja) 2001-02-05 2002-08-14 Toshiba Chem Corp 絶縁性ペースト
JP2002332328A (ja) 2001-05-10 2002-11-22 Nisshinbo Ind Inc 射出成形用コンパウンドおよび燃料電池セパレータの製造方法
JP4013118B2 (ja) 2002-02-27 2007-11-28 荒川化学工業株式会社 エポキシ樹脂組成物、電子材料用樹脂組成物、電子材料用樹脂、コーティング剤およびコーティング剤硬化膜の製造方法
JP2004075954A (ja) 2002-08-22 2004-03-11 Sumitomo Bakelite Co Ltd 燃料電池セパレーター用エポキシ樹脂組成物
US20060128835A1 (en) * 2002-10-25 2006-06-15 Taketoshi Usui Capsule type hardener and composition
JP4283642B2 (ja) 2003-10-06 2009-06-24 東邦化学工業株式会社 エポキシ塗料組成物
JP4463208B2 (ja) * 2003-10-10 2010-05-19 旭化成イーマテリアルズ株式会社 潜在性硬化剤および組成物
JP4567377B2 (ja) 2004-06-04 2010-10-20 旭化成イーマテリアルズ株式会社 潜在性硬化剤および組成物
JP4707998B2 (ja) 2004-11-11 2011-06-22 株式会社フジクラ フレキシブルプリント回路基板用エポキシ樹脂系接着剤組成物、フレキシブルプリント回路基板用カバーレイ、フレキシブルプリント回路基板用銅張積層板およびフレキシブルプリント回路基板
WO2006090794A1 (ja) * 2005-02-23 2006-08-31 Asahi Kasei Chemicals Corporation エポキシ樹脂用潜在性硬化剤およびエポキシ樹脂組成物
JP4667117B2 (ja) * 2005-05-17 2011-04-06 キヤノン株式会社 シート材搬送装置及び画像形成装置
JP5258018B2 (ja) * 2005-09-29 2013-08-07 旭化成イーマテリアルズ株式会社 高安定性マイクロカプセル型エポキシ樹脂用硬化剤及びエポキシ樹脂組成物

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005095486A1 (ja) * 2004-03-31 2005-10-13 Asahi Kasei Chemicals Corporation エポキシ樹脂用硬化剤及びエポキシ樹脂組成物

Also Published As

Publication number Publication date
KR20080083054A (ko) 2008-09-12
JP5148292B2 (ja) 2013-02-20
CN101379108A (zh) 2009-03-04
TW200734368A (en) 2007-09-16
TWI344473B (enExample) 2011-07-01
US7927514B2 (en) 2011-04-19
CN101379108B (zh) 2011-11-30
CA2641409A1 (en) 2007-08-09
US20090186962A1 (en) 2009-07-23
WO2007088889A1 (ja) 2007-08-09
JPWO2007088889A1 (ja) 2009-06-25
EP1980580A1 (en) 2008-10-15

Similar Documents

Publication Publication Date Title
KR100976303B1 (ko) 마이크로캡슐형 에폭시 수지용 경화제, 마스터배치형에폭시 수지용 경화제 조성물, 일액성 에폭시 수지 조성물,및 가공품
JP5258018B2 (ja) 高安定性マイクロカプセル型エポキシ樹脂用硬化剤及びエポキシ樹脂組成物
CN102333808B (zh) 微囊型环氧树脂用固化剂、母料型环氧树脂用固化剂组合物、单剂型环氧树脂组合物、以及加工品
KR100938523B1 (ko) 에폭시 수지용 잠재성 경화제 및 에폭시 수지 조성물
JP5558118B2 (ja) マイクロカプセル型エポキシ樹脂用硬化剤、及びそれを含むマスターバッチ型エポキシ樹脂用硬化剤組成物
JP5543879B2 (ja) エポキシ樹脂用硬化剤組成物及び一液性エポキシ樹脂組成物
JP6085130B2 (ja) 液状樹脂組成物、及び加工品
JP5763527B2 (ja) イミダゾール化合物含有マイクロカプセル化組成物、それを用いた硬化性組成物及びマスターバッチ型硬化剤
EP1731545A1 (en) Hardener for epoxy resin and epoxy resin composition
JP2009132931A (ja) カプセル型硬化剤及び組成物
JP2007204669A (ja) 特定小粒径粒度分布エポキシ樹脂用硬化剤およびエポキシ樹脂組成物
JP2007091899A (ja) 高安定性エポキシ樹脂用硬化剤およびエポキシ樹脂組成物
JP4911981B2 (ja) 高含水含溶剤エポキシ樹脂用硬化剤およびエポキシ樹脂組成物
JP5596385B2 (ja) マスターバッチ型エポキシ樹脂用硬化剤
JP4877717B2 (ja) 緩反応性エポキシ樹脂用硬化剤およびエポキシ樹脂組成物
JP4877716B2 (ja) 速硬化性エポキシ樹脂用硬化剤およびエポキシ樹脂組成物
JP6505428B2 (ja) マイクロカプセル型アミン系硬化剤、硬化性樹脂組成物、ファイン化学品及び組成物

Legal Events

Date Code Title Description
A201 Request for examination
PA0105 International application

Patent event date: 20080801

Patent event code: PA01051R01D

Comment text: International Patent Application

PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20080801

Comment text: Request for Examination of Application

PG1501 Laying open of application
E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20091214

Patent event code: PE09021S01D

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 20100616

GRNT Written decision to grant
PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 20100810

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 20100810

End annual number: 3

Start annual number: 1

PG1601 Publication of registration
FPAY Annual fee payment

Payment date: 20130719

Year of fee payment: 4

PR1001 Payment of annual fee

Payment date: 20130719

Start annual number: 4

End annual number: 4

FPAY Annual fee payment

Payment date: 20140721

Year of fee payment: 5

PR1001 Payment of annual fee

Payment date: 20140721

Start annual number: 5

End annual number: 5

FPAY Annual fee payment

Payment date: 20150716

Year of fee payment: 6

PR1001 Payment of annual fee

Payment date: 20150716

Start annual number: 6

End annual number: 6

FPAY Annual fee payment

Payment date: 20160721

Year of fee payment: 7

PR1001 Payment of annual fee

Payment date: 20160721

Start annual number: 7

End annual number: 7

FPAY Annual fee payment

Payment date: 20170720

Year of fee payment: 8

PR1001 Payment of annual fee

Payment date: 20170720

Start annual number: 8

End annual number: 8

FPAY Annual fee payment

Payment date: 20180719

Year of fee payment: 9

PR1001 Payment of annual fee

Payment date: 20180719

Start annual number: 9

End annual number: 9

PR1001 Payment of annual fee

Payment date: 20200720

Start annual number: 11

End annual number: 11

PR1001 Payment of annual fee

Payment date: 20220701

Start annual number: 13

End annual number: 13

PR1001 Payment of annual fee

Payment date: 20230705

Start annual number: 14

End annual number: 14