TWI852730B - 發光裝置以及使用該發光裝置的電子裝置 - Google Patents
發光裝置以及使用該發光裝置的電子裝置 Download PDFInfo
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- TWI852730B TWI852730B TW112130767A TW112130767A TWI852730B TW I852730 B TWI852730 B TW I852730B TW 112130767 A TW112130767 A TW 112130767A TW 112130767 A TW112130767 A TW 112130767A TW I852730 B TWI852730 B TW I852730B
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- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
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- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/421—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer
- H10D86/423—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer comprising semiconductor materials not belonging to the Group IV, e.g. InGaZnO
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- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
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- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/01—Manufacture or treatment
- H10D86/021—Manufacture or treatment of multiple TFTs
- H10D86/0214—Manufacture or treatment of multiple TFTs using temporary substrates
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- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
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- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/411—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs characterised by materials, geometry or structure of the substrates
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- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
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- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8515—Wavelength conversion means not being in contact with the bodies
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
- H10K50/125—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers specially adapted for multicolour light emission, e.g. for emitting white light
- H10K50/13—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers specially adapted for multicolour light emission, e.g. for emitting white light comprising stacked EL layers within one EL unit
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
- H10K59/1213—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/124—Insulating layers formed between TFT elements and OLED elements
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/311—Flexible OLED
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
- H10K50/125—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers specially adapted for multicolour light emission, e.g. for emitting white light
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Geometry (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Optical Filters (AREA)
- Thin Film Transistor (AREA)
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Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008-180229 | 2008-07-10 | ||
| JP2008180229 | 2008-07-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202416545A TW202416545A (zh) | 2024-04-16 |
| TWI852730B true TWI852730B (zh) | 2024-08-11 |
Family
ID=41504328
Family Applications (7)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW112130767A TWI852730B (zh) | 2008-07-10 | 2009-07-08 | 發光裝置以及使用該發光裝置的電子裝置 |
| TW106115161A TWI635777B (zh) | 2008-07-10 | 2009-07-08 | 發光裝置以及使用該發光裝置的電子裝置 |
| TW098123071A TWI528861B (zh) | 2008-07-10 | 2009-07-08 | 發光裝置以及使用該發光裝置的電子裝置 |
| TW107114062A TWI688105B (zh) | 2008-07-10 | 2009-07-08 | 發光裝置以及使用該發光裝置的電子裝置 |
| TW109104772A TWI727661B (zh) | 2008-07-10 | 2009-07-08 | 發光裝置以及使用該發光裝置的電子裝置 |
| TW110115111A TWI813984B (zh) | 2008-07-10 | 2009-07-08 | 發光裝置以及使用該發光裝置的電子裝置 |
| TW104135419A TWI613934B (zh) | 2008-07-10 | 2009-07-08 | 發光裝置以及使用該發光裝置的電子裝置 |
Family Applications After (6)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW106115161A TWI635777B (zh) | 2008-07-10 | 2009-07-08 | 發光裝置以及使用該發光裝置的電子裝置 |
| TW098123071A TWI528861B (zh) | 2008-07-10 | 2009-07-08 | 發光裝置以及使用該發光裝置的電子裝置 |
| TW107114062A TWI688105B (zh) | 2008-07-10 | 2009-07-08 | 發光裝置以及使用該發光裝置的電子裝置 |
| TW109104772A TWI727661B (zh) | 2008-07-10 | 2009-07-08 | 發光裝置以及使用該發光裝置的電子裝置 |
| TW110115111A TWI813984B (zh) | 2008-07-10 | 2009-07-08 | 發光裝置以及使用該發光裝置的電子裝置 |
| TW104135419A TWI613934B (zh) | 2008-07-10 | 2009-07-08 | 發光裝置以及使用該發光裝置的電子裝置 |
Country Status (5)
| Country | Link |
|---|---|
| US (8) | US8760046B2 (enExample) |
| JP (13) | JP2010040520A (enExample) |
| KR (12) | KR102112799B1 (enExample) |
| TW (7) | TWI852730B (enExample) |
| WO (1) | WO2010004944A1 (enExample) |
Families Citing this family (50)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0723917B2 (ja) | 1991-04-08 | 1995-03-15 | 日揮株式会社 | 核燃料再処理工程からの回収硝酸の処理方法 |
| KR102112799B1 (ko) | 2008-07-10 | 2020-05-19 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 발광장치 및 전자기기 |
| JP5216716B2 (ja) | 2008-08-20 | 2013-06-19 | 株式会社半導体エネルギー研究所 | 発光装置及びその作製方法 |
| TWI616707B (zh) | 2008-11-28 | 2018-03-01 | 半導體能源研究所股份有限公司 | 液晶顯示裝置 |
| US8441790B2 (en) | 2009-08-17 | 2013-05-14 | Apple Inc. | Electronic device housing as acoustic input device |
| IN2012DN01823A (enExample) * | 2009-10-16 | 2015-06-05 | Semiconductor Energy Lab | |
| KR101082254B1 (ko) * | 2009-11-04 | 2011-11-09 | 삼성모바일디스플레이주식회사 | 유기전계발광 표시 장치 및 그의 제조 방법 |
| KR101073272B1 (ko) * | 2009-11-04 | 2011-10-12 | 삼성모바일디스플레이주식회사 | 유기전계발광 표시 장치의 제조 방법 |
| KR101125570B1 (ko) * | 2009-12-04 | 2012-03-22 | 삼성모바일디스플레이주식회사 | 유기 발광 장치 |
| US8624878B2 (en) * | 2010-01-20 | 2014-01-07 | Apple Inc. | Piezo-based acoustic and capacitive detection |
| US8890187B2 (en) * | 2010-04-16 | 2014-11-18 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device with an insulating partition |
| KR101845480B1 (ko) * | 2010-06-25 | 2018-04-04 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치의 제작 방법 |
| US8629472B2 (en) * | 2010-12-02 | 2014-01-14 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device, electronic device, and lighting device |
| TWI562422B (en) | 2010-12-16 | 2016-12-11 | Semiconductor Energy Lab Co Ltd | Light-emitting device and lighting device |
| KR102109009B1 (ko) * | 2011-02-25 | 2020-05-11 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 발광 장치 및 발광 장치를 사용한 전자 기기 |
| US9866660B2 (en) | 2011-03-21 | 2018-01-09 | Apple Inc. | Electronic devices with concave displays |
| US9178970B2 (en) | 2011-03-21 | 2015-11-03 | Apple Inc. | Electronic devices with convex displays |
| US8816977B2 (en) | 2011-03-21 | 2014-08-26 | Apple Inc. | Electronic devices with flexible displays |
| JP2013012477A (ja) | 2011-06-28 | 2013-01-17 | Cbrite Inc | ハイブリッドのフルカラー・アクティブ・マトリクス有機発光ディスプレイ |
| US9400576B2 (en) | 2011-07-19 | 2016-07-26 | Apple Inc. | Touch sensor arrangements for organic light-emitting diode displays |
| US20140231787A1 (en) * | 2011-09-22 | 2014-08-21 | Canon Kabushiki Kaisha | White organic el element and illuminating apparatus and display apparatus using the same |
| JP6076038B2 (ja) * | 2011-11-11 | 2017-02-08 | 株式会社半導体エネルギー研究所 | 表示装置の作製方法 |
| US9419146B2 (en) | 2012-01-26 | 2016-08-16 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| JP2013251255A (ja) | 2012-05-04 | 2013-12-12 | Semiconductor Energy Lab Co Ltd | 発光装置の作製方法 |
| TWI645578B (zh) | 2012-07-05 | 2018-12-21 | 半導體能源研究所股份有限公司 | 發光裝置及發光裝置的製造方法 |
| KR102133158B1 (ko) | 2012-08-10 | 2020-07-14 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 발광 장치의 제작 방법 |
| KR101908514B1 (ko) * | 2012-08-22 | 2018-10-17 | 엘지디스플레이 주식회사 | 유기 발광 표시 장치 및 이의 제조 방법 |
| TWI596751B (zh) * | 2012-08-30 | 2017-08-21 | 財團法人工業技術研究院 | 軟性顯示器與其製法 |
| KR101962944B1 (ko) * | 2012-09-14 | 2019-03-29 | 삼성디스플레이 주식회사 | 유기 전계 표시 패널 및 이를 포함하는 표시 장치 |
| KR101982073B1 (ko) * | 2012-10-12 | 2019-05-27 | 삼성디스플레이 주식회사 | 유기 발광 소자 및 유기 발광 표시 장치 |
| US9203045B2 (en) * | 2012-11-29 | 2015-12-01 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting element, light-emitting device, electronic device, and lighting device |
| KR101795194B1 (ko) * | 2012-12-28 | 2017-11-07 | 가부시키가이샤 고베 세이코쇼 | 박막 트랜지스터 및 그의 제조 방법 |
| WO2015000095A1 (en) | 2013-07-05 | 2015-01-08 | Industrial Technology Research Institute | Flexible display and method for fabricating the same |
| US9269914B2 (en) | 2013-08-01 | 2016-02-23 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device, electronic device, and lighting device |
| KR102090276B1 (ko) * | 2013-08-08 | 2020-03-18 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 광학 필름 |
| US20150295134A1 (en) * | 2014-04-09 | 2015-10-15 | Adam Khan | Transparent electronic system and method |
| JP6020521B2 (ja) | 2014-07-16 | 2016-11-02 | 横河電機株式会社 | 光ファイバ温度分布測定装置 |
| WO2016059497A1 (en) | 2014-10-17 | 2016-04-21 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device, module, electronic device, and method for manufacturing light-emitting device |
| US12402466B2 (en) | 2015-01-23 | 2025-08-26 | Vuereal Inc. | Micro device integration into system substrate |
| US10700120B2 (en) * | 2015-01-23 | 2020-06-30 | Vuereal Inc. | Micro device integration into system substrate |
| CN107851586B (zh) | 2015-01-23 | 2021-07-06 | 维耶尔公司 | 到受体衬底的选择性微型器件转移 |
| US10134803B2 (en) | 2015-01-23 | 2018-11-20 | Vuereal Inc. | Micro device integration into system substrate |
| TWI696108B (zh) | 2015-02-13 | 2020-06-11 | 日商半導體能源研究所股份有限公司 | 功能面板、功能模組、發光模組、顯示模組、位置資料輸入模組、發光裝置、照明設備、顯示裝置、資料處理裝置、功能面板的製造方法 |
| KR102632066B1 (ko) | 2015-07-30 | 2024-02-02 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 발광 장치의 제작 방법, 발광 장치, 모듈, 및 전자 기기 |
| CN106373489A (zh) * | 2015-11-16 | 2017-02-01 | 北京智谷睿拓技术服务有限公司 | 基于弯曲显示屏的显示方法、显示装置和用户设备 |
| US20170215280A1 (en) | 2016-01-21 | 2017-07-27 | Vuereal Inc. | Selective transfer of micro devices |
| US10797113B2 (en) * | 2016-01-25 | 2020-10-06 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device with layered electrode structures |
| KR102583619B1 (ko) | 2018-06-29 | 2023-09-26 | 엘지디스플레이 주식회사 | 유기발광표시장치 |
| WO2021240621A1 (ja) * | 2020-05-26 | 2021-12-02 | シャープ株式会社 | 表示装置、及び表示装置の製造方法 |
| CN113138487B (zh) | 2021-04-13 | 2022-08-05 | 深圳市华星光电半导体显示技术有限公司 | 显示面板及显示装置 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001175198A (ja) * | 1999-12-14 | 2001-06-29 | Semiconductor Energy Lab Co Ltd | 半導体装置およびその作製方法 |
| JP2003308976A (ja) * | 2002-02-13 | 2003-10-31 | Semiconductor Energy Lab Co Ltd | 発光装置 |
| JP2004094236A (ja) * | 2002-08-09 | 2004-03-25 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
| US20040061438A1 (en) * | 1999-06-04 | 2004-04-01 | Semiconductor Energy Laboratory Co., Ltd. | Electro-optical device and electronic device |
Family Cites Families (210)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60198861A (ja) | 1984-03-23 | 1985-10-08 | Fujitsu Ltd | 薄膜トランジスタ |
| JPH0244256B2 (ja) | 1987-01-28 | 1990-10-03 | Kagaku Gijutsucho Mukizaishitsu Kenkyushocho | Ingazn2o5deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho |
| JPH0244260B2 (ja) | 1987-02-24 | 1990-10-03 | Kagaku Gijutsucho Mukizaishitsu Kenkyushocho | Ingazn5o8deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho |
| JPH0244258B2 (ja) | 1987-02-24 | 1990-10-03 | Kagaku Gijutsucho Mukizaishitsu Kenkyushocho | Ingazn3o6deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho |
| JPS63210023A (ja) | 1987-02-24 | 1988-08-31 | Natl Inst For Res In Inorg Mater | InGaZn↓4O↓7で示される六方晶系の層状構造を有する化合物およびその製造法 |
| JPH0244262B2 (ja) | 1987-02-27 | 1990-10-03 | Kagaku Gijutsucho Mukizaishitsu Kenkyushocho | Ingazn6o9deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho |
| JPH0244263B2 (ja) | 1987-04-22 | 1990-10-03 | Kagaku Gijutsucho Mukizaishitsu Kenkyushocho | Ingazn7o10deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho |
| US5032883A (en) * | 1987-09-09 | 1991-07-16 | Casio Computer Co., Ltd. | Thin film transistor and method of manufacturing the same |
| JPH05251705A (ja) | 1992-03-04 | 1993-09-28 | Fuji Xerox Co Ltd | 薄膜トランジスタ |
| US5821622A (en) * | 1993-03-12 | 1998-10-13 | Kabushiki Kaisha Toshiba | Liquid crystal display device |
| JPH07131030A (ja) * | 1993-11-05 | 1995-05-19 | Sony Corp | 表示用薄膜半導体装置及びその製造方法 |
| JP3293736B2 (ja) * | 1996-02-28 | 2002-06-17 | キヤノン株式会社 | 半導体基板の作製方法および貼り合わせ基体 |
| JP3479375B2 (ja) | 1995-03-27 | 2003-12-15 | 科学技術振興事業団 | 亜酸化銅等の金属酸化物半導体による薄膜トランジスタとpn接合を形成した金属酸化物半導体装置およびそれらの製造方法 |
| US5994721A (en) * | 1995-06-06 | 1999-11-30 | Ois Optical Imaging Systems, Inc. | High aperture LCD with insulating color filters overlapping bus lines on active substrate |
| EP0820644B1 (en) | 1995-08-03 | 2005-08-24 | Koninklijke Philips Electronics N.V. | Semiconductor device provided with transparent switching element |
| TW309633B (enExample) * | 1995-12-14 | 1997-07-01 | Handotai Energy Kenkyusho Kk | |
| JP3625598B2 (ja) | 1995-12-30 | 2005-03-02 | 三星電子株式会社 | 液晶表示装置の製造方法 |
| EP1655633A3 (en) * | 1996-08-27 | 2006-06-21 | Seiko Epson Corporation | Exfoliating method, transferring method of thin film device, thin film integrated circuit device, and liquid crystal display device |
| JP3856889B2 (ja) * | 1997-02-06 | 2006-12-13 | 株式会社半導体エネルギー研究所 | 反射型表示装置および電子デバイス |
| JP3275764B2 (ja) * | 1997-03-24 | 2002-04-22 | セイコーエプソン株式会社 | 液晶表示パネル、液晶表示装置及びそれを用いた電子機器 |
| JPH1126733A (ja) * | 1997-07-03 | 1999-01-29 | Seiko Epson Corp | 薄膜デバイスの転写方法、薄膜デバイス、薄膜集積回路装置,アクティブマトリクス基板、液晶表示装置および電子機器 |
| US6011274A (en) * | 1997-10-20 | 2000-01-04 | Ois Optical Imaging Systems, Inc. | X-ray imager or LCD with bus lines overlapped by pixel electrodes and dual insulating layers therebetween |
| JP4170454B2 (ja) | 1998-07-24 | 2008-10-22 | Hoya株式会社 | 透明導電性酸化物薄膜を有する物品及びその製造方法 |
| JP2000111952A (ja) * | 1998-10-07 | 2000-04-21 | Sony Corp | 電気光学装置、電気光学装置用の駆動基板、及びこれらの製造方法 |
| US7022556B1 (en) * | 1998-11-11 | 2006-04-04 | Semiconductor Energy Laboratory Co., Ltd. | Exposure device, exposure method and method of manufacturing semiconductor device |
| JP2000150861A (ja) | 1998-11-16 | 2000-05-30 | Tdk Corp | 酸化物薄膜 |
| JP3276930B2 (ja) | 1998-11-17 | 2002-04-22 | 科学技術振興事業団 | トランジスタ及び半導体装置 |
| JP2000353809A (ja) | 1999-03-02 | 2000-12-19 | Semiconductor Energy Lab Co Ltd | 半導体装置およびその作製方法 |
| US7821065B2 (en) * | 1999-03-02 | 2010-10-26 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device comprising a thin film transistor comprising a semiconductor thin film and method of manufacturing the same |
| US6392778B1 (en) * | 1999-03-17 | 2002-05-21 | Koninklijke Philips Electronics N.V. | Opto-electronic element |
| EP1041624A1 (en) * | 1999-04-02 | 2000-10-04 | Interuniversitair Microelektronica Centrum Vzw | Method of transferring ultra-thin substrates and application of the method to the manufacture of a multilayer thin film device |
| JP4730994B2 (ja) * | 1999-06-04 | 2011-07-20 | 株式会社半導体エネルギー研究所 | 電気光学装置及びその作製方法並びに電子装置 |
| TW460731B (en) | 1999-09-03 | 2001-10-21 | Ind Tech Res Inst | Electrode structure and production method of wide viewing angle LCD |
| TW522453B (en) * | 1999-09-17 | 2003-03-01 | Semiconductor Energy Lab | Display device |
| KR100628679B1 (ko) * | 1999-11-15 | 2006-09-28 | 엘지.필립스 엘시디 주식회사 | 어레이 패널, 액정 표시장치 제조방법 및 그 제조방법에따른액정표시장치 |
| TW494447B (en) | 2000-02-01 | 2002-07-11 | Semiconductor Energy Lab | Semiconductor device and manufacturing method thereof |
| JP4712198B2 (ja) | 2000-02-01 | 2011-06-29 | 株式会社半導体エネルギー研究所 | 表示装置の作製方法 |
| US7525165B2 (en) * | 2000-04-17 | 2009-04-28 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting device and manufacturing method thereof |
| US6492026B1 (en) * | 2000-04-20 | 2002-12-10 | Battelle Memorial Institute | Smoothing and barrier layers on high Tg substrates |
| US7579203B2 (en) * | 2000-04-25 | 2009-08-25 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting device |
| JP4727024B2 (ja) * | 2000-07-17 | 2011-07-20 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP4089858B2 (ja) | 2000-09-01 | 2008-05-28 | 国立大学法人東北大学 | 半導体デバイス |
| SG143972A1 (en) * | 2000-09-14 | 2008-07-29 | Semiconductor Energy Lab | Semiconductor device and manufacturing method thereof |
| KR20020038482A (ko) | 2000-11-15 | 2002-05-23 | 모리시타 요이찌 | 박막 트랜지스터 어레이, 그 제조방법 및 그것을 이용한표시패널 |
| JP3997731B2 (ja) | 2001-03-19 | 2007-10-24 | 富士ゼロックス株式会社 | 基材上に結晶性半導体薄膜を形成する方法 |
| JP2002289859A (ja) | 2001-03-23 | 2002-10-04 | Minolta Co Ltd | 薄膜トランジスタ |
| JP4035372B2 (ja) | 2001-06-15 | 2008-01-23 | キヤノン株式会社 | 発光素子 |
| EP1399002A4 (en) | 2001-06-15 | 2007-11-21 | Canon Kk | ORGANIC ELECTROLUMINESCENCE DEVICE |
| JP4027740B2 (ja) | 2001-07-16 | 2007-12-26 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| US8415208B2 (en) * | 2001-07-16 | 2013-04-09 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and peeling off method and method of manufacturing semiconductor device |
| US7701130B2 (en) * | 2001-08-24 | 2010-04-20 | Semiconductor Energy Laboratory Co., Ltd. | Luminous device with conductive film |
| JP3925839B2 (ja) | 2001-09-10 | 2007-06-06 | シャープ株式会社 | 半導体記憶装置およびその試験方法 |
| JP4090716B2 (ja) | 2001-09-10 | 2008-05-28 | 雅司 川崎 | 薄膜トランジスタおよびマトリクス表示装置 |
| JP4166455B2 (ja) * | 2001-10-01 | 2008-10-15 | 株式会社半導体エネルギー研究所 | 偏光フィルム及び発光装置 |
| KR100944886B1 (ko) | 2001-10-30 | 2010-03-03 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치의 제조 방법 |
| WO2003040441A1 (fr) | 2001-11-05 | 2003-05-15 | Japan Science And Technology Agency | Film mince monocristallin homologue a super-reseau naturel, procede de preparation et dispositif dans lequel est utilise ledit film mince monocristallin |
| JP4164562B2 (ja) | 2002-09-11 | 2008-10-15 | 独立行政法人科学技術振興機構 | ホモロガス薄膜を活性層として用いる透明薄膜電界効果型トランジスタ |
| SG194237A1 (en) | 2001-12-05 | 2013-11-29 | Semiconductor Energy Lab | Organic semiconductor element |
| US6933520B2 (en) * | 2002-02-13 | 2005-08-23 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting device |
| JP4083486B2 (ja) | 2002-02-21 | 2008-04-30 | 独立行政法人科学技術振興機構 | LnCuO(S,Se,Te)単結晶薄膜の製造方法 |
| CN1445821A (zh) | 2002-03-15 | 2003-10-01 | 三洋电机株式会社 | ZnO膜和ZnO半导体层的形成方法、半导体元件及其制造方法 |
| JP3933591B2 (ja) | 2002-03-26 | 2007-06-20 | 淳二 城戸 | 有機エレクトロルミネッセント素子 |
| EP1363319B1 (en) * | 2002-05-17 | 2009-01-07 | Semiconductor Energy Laboratory Co., Ltd. | Method of transferring an object and method of manufacturing a semiconductor device |
| US7339187B2 (en) | 2002-05-21 | 2008-03-04 | State Of Oregon Acting By And Through The Oregon State Board Of Higher Education On Behalf Of Oregon State University | Transistor structures |
| US6911772B2 (en) * | 2002-06-12 | 2005-06-28 | Eastman Kodak Company | Oled display having color filters for improving contrast |
| JP2004022625A (ja) | 2002-06-13 | 2004-01-22 | Murata Mfg Co Ltd | 半導体デバイス及び該半導体デバイスの製造方法 |
| US7105868B2 (en) | 2002-06-24 | 2006-09-12 | Cermet, Inc. | High-electron mobility transistor with zinc oxide |
| US7081704B2 (en) | 2002-08-09 | 2006-07-25 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| US7067843B2 (en) | 2002-10-11 | 2006-06-27 | E. I. Du Pont De Nemours And Company | Transparent oxide semiconductor thin film transistors |
| WO2004040648A1 (ja) | 2002-10-30 | 2004-05-13 | Semiconductor Energy Laboratory Co., Ltd. | 半導体装置および半導体装置の作製方法 |
| US7397485B2 (en) | 2002-12-16 | 2008-07-08 | Eastman Kodak Company | Color OLED display system having improved performance |
| US7230594B2 (en) | 2002-12-16 | 2007-06-12 | Eastman Kodak Company | Color OLED display with improved power efficiency |
| US7075242B2 (en) | 2002-12-16 | 2006-07-11 | Eastman Kodak Company | Color OLED display system having improved performance |
| US7184067B2 (en) | 2003-03-13 | 2007-02-27 | Eastman Kodak Company | Color OLED display system |
| JP2004288624A (ja) | 2003-03-03 | 2004-10-14 | Sanyo Electric Co Ltd | エレクトロルミネッセンス表示装置 |
| JP4166105B2 (ja) | 2003-03-06 | 2008-10-15 | シャープ株式会社 | 半導体装置およびその製造方法 |
| JP2004273732A (ja) | 2003-03-07 | 2004-09-30 | Sharp Corp | アクティブマトリクス基板およびその製造方法 |
| KR100490322B1 (ko) | 2003-04-07 | 2005-05-17 | 삼성전자주식회사 | 유기전계발광 표시장치 |
| TWI363573B (en) | 2003-04-07 | 2012-05-01 | Semiconductor Energy Lab | Electronic apparatus |
| JP4477400B2 (ja) * | 2003-04-07 | 2010-06-09 | 株式会社半導体エネルギー研究所 | 発光装置及び電子機器 |
| US6771028B1 (en) | 2003-04-30 | 2004-08-03 | Eastman Kodak Company | Drive circuitry for four-color organic light-emitting device |
| JP4108633B2 (ja) | 2003-06-20 | 2008-06-25 | シャープ株式会社 | 薄膜トランジスタおよびその製造方法ならびに電子デバイス |
| KR20050000129A (ko) * | 2003-06-23 | 2005-01-03 | 삼성전자주식회사 | 액정 표시 장치 |
| JP4010286B2 (ja) | 2003-07-02 | 2007-11-21 | 富士電機ホールディングス株式会社 | 有機elディスプレイの製造方法 |
| US7262463B2 (en) | 2003-07-25 | 2007-08-28 | Hewlett-Packard Development Company, L.P. | Transistor including a deposited channel region having a doped portion |
| JP2005063781A (ja) * | 2003-08-11 | 2005-03-10 | Fuji Xerox Co Ltd | 表示装置及びその製造方法 |
| US7230374B2 (en) | 2003-09-22 | 2007-06-12 | Samsung Sdi Co., Ltd. | Full color organic light-emitting device having color modulation layer |
| US20080081105A1 (en) | 2003-09-22 | 2008-04-03 | Samsung Sdi Co., Ltd. | Method of fabricating full color organic light-emtting device having color modulation layer using liti method |
| US20050093435A1 (en) | 2003-09-22 | 2005-05-05 | Suh Min-Chul | Full color organic light-emtting device having color modulation layer |
| KR20050029426A (ko) | 2003-09-22 | 2005-03-28 | 삼성에스디아이 주식회사 | 칼라필터층 또는 색변환층을 갖는 풀칼라 유기전계발광소자 |
| KR20050039674A (ko) | 2003-10-24 | 2005-04-29 | 펜탁스 가부시키가이샤 | 백색 유기 전자 발광 소자 |
| JP2006040856A (ja) * | 2003-10-24 | 2006-02-09 | Pentax Corp | 白色有機エレクトロルミネセンス素子 |
| JP4939742B2 (ja) | 2003-10-28 | 2012-05-30 | 株式会社半導体エネルギー研究所 | 光学フィルムの作製方法 |
| US7229900B2 (en) * | 2003-10-28 | 2007-06-12 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, method of manufacturing thereof, and method of manufacturing base material |
| WO2005041249A2 (en) * | 2003-10-28 | 2005-05-06 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing optical film |
| JP4181013B2 (ja) | 2003-11-04 | 2008-11-12 | シャープ株式会社 | 表示装置およびその製造方法 |
| US7145174B2 (en) | 2004-03-12 | 2006-12-05 | Hewlett-Packard Development Company, Lp. | Semiconductor device |
| US7282782B2 (en) | 2004-03-12 | 2007-10-16 | Hewlett-Packard Development Company, L.P. | Combined binary oxide semiconductor device |
| US7297977B2 (en) | 2004-03-12 | 2007-11-20 | Hewlett-Packard Development Company, L.P. | Semiconductor device |
| CN1998087B (zh) | 2004-03-12 | 2014-12-31 | 独立行政法人科学技术振兴机构 | 非晶形氧化物和薄膜晶体管 |
| JP4408382B2 (ja) | 2004-03-18 | 2010-02-03 | 株式会社 日立ディスプレイズ | 有機発光表示装置 |
| JP2005308849A (ja) | 2004-04-19 | 2005-11-04 | Sony Corp | 薄膜デバイス、薄膜デバイスの製造方法、液晶表示装置およびエレクトロルミネッセンス表示装置 |
| EP1749423A4 (en) | 2004-04-28 | 2010-09-22 | Semiconductor Energy Lab | LIGHT EMITTING ELEMENT AND METHOD FOR MANUFACTURING THE SAME, AND LIGHT EMITTING DEVICE USING THE LIGHT EMITTING ELEMENT |
| US7692378B2 (en) * | 2004-04-28 | 2010-04-06 | Semiconductor Energy Laboratory Co., Ltd. | Display device including an insulating layer with an opening |
| US7663140B2 (en) | 2004-05-21 | 2010-02-16 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting element and light emitting device using the element |
| US7211825B2 (en) | 2004-06-14 | 2007-05-01 | Yi-Chi Shih | Indium oxide-based thin film transistors and circuits |
| JP2006100760A (ja) | 2004-09-02 | 2006-04-13 | Casio Comput Co Ltd | 薄膜トランジスタおよびその製造方法 |
| US7285501B2 (en) | 2004-09-17 | 2007-10-23 | Hewlett-Packard Development Company, L.P. | Method of forming a solution processed device |
| TWI294255B (en) | 2004-10-29 | 2008-03-01 | Sanyo Electric Co | Organic electro-luminescence device |
| JP2006127985A (ja) * | 2004-10-29 | 2006-05-18 | Sanyo Electric Co Ltd | 有機エレクトロルミネッセンス装置 |
| US7298084B2 (en) | 2004-11-02 | 2007-11-20 | 3M Innovative Properties Company | Methods and displays utilizing integrated zinc oxide row and column drivers in conjunction with organic light emitting diodes |
| JP4707996B2 (ja) * | 2004-11-08 | 2011-06-22 | 共同印刷株式会社 | フレキシブルディスプレイ及びその製造方法 |
| JP4589830B2 (ja) * | 2005-06-29 | 2010-12-01 | 共同印刷株式会社 | フレキシブルディスプレイ及びその製造方法 |
| US7825582B2 (en) * | 2004-11-08 | 2010-11-02 | Kyodo Printing Co., Ltd. | Flexible display and manufacturing method thereof |
| KR20070085879A (ko) | 2004-11-10 | 2007-08-27 | 캐논 가부시끼가이샤 | 발광 장치 |
| US7829444B2 (en) | 2004-11-10 | 2010-11-09 | Canon Kabushiki Kaisha | Field effect transistor manufacturing method |
| US7791072B2 (en) | 2004-11-10 | 2010-09-07 | Canon Kabushiki Kaisha | Display |
| US7868326B2 (en) | 2004-11-10 | 2011-01-11 | Canon Kabushiki Kaisha | Field effect transistor |
| US7453065B2 (en) | 2004-11-10 | 2008-11-18 | Canon Kabushiki Kaisha | Sensor and image pickup device |
| US7863611B2 (en) | 2004-11-10 | 2011-01-04 | Canon Kabushiki Kaisha | Integrated circuits utilizing amorphous oxides |
| CA2585190A1 (en) | 2004-11-10 | 2006-05-18 | Canon Kabushiki Kaisha | Amorphous oxide and field effect transistor |
| JP4801429B2 (ja) | 2004-12-06 | 2011-10-26 | 株式会社半導体エネルギー研究所 | 発光素子、及び該発光素子を有する発光装置 |
| CN101073164B (zh) | 2004-12-06 | 2010-05-05 | 株式会社半导体能源研究所 | 发光元件和使用该元件的发光装置 |
| JP4496948B2 (ja) | 2004-12-13 | 2010-07-07 | 株式会社豊田自動織機 | 有機el素子 |
| US7579224B2 (en) | 2005-01-21 | 2009-08-25 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing a thin film semiconductor device |
| TWI472037B (zh) | 2005-01-28 | 2015-02-01 | 半導體能源研究所股份有限公司 | 半導體裝置,電子裝置,和半導體裝置的製造方法 |
| TWI569441B (zh) | 2005-01-28 | 2017-02-01 | 半導體能源研究所股份有限公司 | 半導體裝置,電子裝置,和半導體裝置的製造方法 |
| US7858451B2 (en) | 2005-02-03 | 2010-12-28 | Semiconductor Energy Laboratory Co., Ltd. | Electronic device, semiconductor device and manufacturing method thereof |
| US7948171B2 (en) | 2005-02-18 | 2011-05-24 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting device |
| JP5256486B2 (ja) | 2005-02-23 | 2013-08-07 | コニカミノルタ株式会社 | 有機エレクトロルミネッセンス素子、発光パネル、液晶表示装置及び照明装置 |
| WO2006093007A1 (ja) * | 2005-03-02 | 2006-09-08 | Konica Minolta Holdings, Inc. | 有機エレクトロルミネッセンス素子、画像表示装置および照明装置 |
| US20060197092A1 (en) | 2005-03-03 | 2006-09-07 | Randy Hoffman | System and method for forming conductive material on a substrate |
| US8681077B2 (en) | 2005-03-18 | 2014-03-25 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, and display device, driving method and electronic apparatus thereof |
| US8030643B2 (en) * | 2005-03-28 | 2011-10-04 | Semiconductor Energy Laboratory Co., Ltd. | Memory device and manufacturing method the same |
| US7544967B2 (en) | 2005-03-28 | 2009-06-09 | Massachusetts Institute Of Technology | Low voltage flexible organic/transparent transistor for selective gas sensing, photodetecting and CMOS device applications |
| US7645478B2 (en) | 2005-03-31 | 2010-01-12 | 3M Innovative Properties Company | Methods of making displays |
| US9070884B2 (en) | 2005-04-13 | 2015-06-30 | Universal Display Corporation | Hybrid OLED having phosphorescent and fluorescent emitters |
| US8300031B2 (en) | 2005-04-20 | 2012-10-30 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device comprising transistor having gate and drain connected through a current-voltage conversion element |
| JP2006344849A (ja) | 2005-06-10 | 2006-12-21 | Casio Comput Co Ltd | 薄膜トランジスタ |
| US7402506B2 (en) | 2005-06-16 | 2008-07-22 | Eastman Kodak Company | Methods of making thin film transistors comprising zinc-oxide-based semiconductor materials and transistors made thereby |
| US7691666B2 (en) | 2005-06-16 | 2010-04-06 | Eastman Kodak Company | Methods of making thin film transistors comprising zinc-oxide-based semiconductor materials and transistors made thereby |
| US7507618B2 (en) | 2005-06-27 | 2009-03-24 | 3M Innovative Properties Company | Method for making electronic devices using metal oxide nanoparticles |
| JP2007012369A (ja) | 2005-06-29 | 2007-01-18 | Sony Corp | 有機発光素子および有機発光装置 |
| JP4999291B2 (ja) | 2005-06-30 | 2012-08-15 | 三洋電機株式会社 | 有機エレクトロルミネッセンス素子およびそれを備える表示装置又は発光装置 |
| KR100711890B1 (ko) | 2005-07-28 | 2007-04-25 | 삼성에스디아이 주식회사 | 유기 발광표시장치 및 그의 제조방법 |
| JP2007059128A (ja) | 2005-08-23 | 2007-03-08 | Canon Inc | 有機el表示装置およびその製造方法 |
| JP2007059310A (ja) | 2005-08-26 | 2007-03-08 | Konica Minolta Holdings Inc | 有機エレクトロルミネッセンス素子、照明装置 |
| JP4280736B2 (ja) | 2005-09-06 | 2009-06-17 | キヤノン株式会社 | 半導体素子 |
| JP5116225B2 (ja) | 2005-09-06 | 2013-01-09 | キヤノン株式会社 | 酸化物半導体デバイスの製造方法 |
| JP2007073705A (ja) | 2005-09-06 | 2007-03-22 | Canon Inc | 酸化物半導体チャネル薄膜トランジスタおよびその製造方法 |
| JP4850457B2 (ja) | 2005-09-06 | 2012-01-11 | キヤノン株式会社 | 薄膜トランジスタ及び薄膜ダイオード |
| JP5188182B2 (ja) | 2005-09-27 | 2013-04-24 | 出光興産株式会社 | スパッタリングターゲット、透明導電膜及びタッチパネル用透明電極 |
| EP1998373A3 (en) * | 2005-09-29 | 2012-10-31 | Semiconductor Energy Laboratory Co, Ltd. | Semiconductor device having oxide semiconductor layer and manufacturing method thereof |
| US7982215B2 (en) | 2005-10-05 | 2011-07-19 | Idemitsu Kosan Co., Ltd. | TFT substrate and method for manufacturing TFT substrate |
| EP1777689B1 (en) | 2005-10-18 | 2016-08-10 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, and display device and electronic equipment each having the same |
| JP5142507B2 (ja) | 2005-10-18 | 2013-02-13 | 株式会社半導体エネルギー研究所 | 半導体装置及び当該半導体装置を具備する表示装置並びに電子機器 |
| JP5037808B2 (ja) | 2005-10-20 | 2012-10-03 | キヤノン株式会社 | アモルファス酸化物を用いた電界効果型トランジスタ、及び該トランジスタを用いた表示装置 |
| JP5224676B2 (ja) * | 2005-11-08 | 2013-07-03 | キヤノン株式会社 | 表示装置の製造方法 |
| WO2007058329A1 (en) | 2005-11-15 | 2007-05-24 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| JP4742835B2 (ja) * | 2005-12-05 | 2011-08-10 | セイコーエプソン株式会社 | 発光装置および電子機器 |
| KR100732849B1 (ko) | 2005-12-21 | 2007-06-27 | 삼성에스디아이 주식회사 | 유기 발광 표시장치 |
| TWI292281B (en) | 2005-12-29 | 2008-01-01 | Ind Tech Res Inst | Pixel structure of active organic light emitting diode and method of fabricating the same |
| US7867636B2 (en) | 2006-01-11 | 2011-01-11 | Murata Manufacturing Co., Ltd. | Transparent conductive film and method for manufacturing the same |
| EP1974590B1 (en) | 2006-01-18 | 2020-03-04 | LG Display Co., Ltd. | Oled having stacked organic light-emitting units |
| JP4977478B2 (ja) | 2006-01-21 | 2012-07-18 | 三星電子株式会社 | ZnOフィルム及びこれを用いたTFTの製造方法 |
| US7576394B2 (en) | 2006-02-02 | 2009-08-18 | Kochi Industrial Promotion Center | Thin film transistor including low resistance conductive thin films and manufacturing method thereof |
| US7977169B2 (en) | 2006-02-15 | 2011-07-12 | Kochi Industrial Promotion Center | Semiconductor device including active layer made of zinc oxide with controlled orientations and manufacturing method thereof |
| JP2007227288A (ja) | 2006-02-27 | 2007-09-06 | Seiko Epson Corp | 有機el装置および電子機器 |
| JP4770519B2 (ja) * | 2006-03-01 | 2011-09-14 | セイコーエプソン株式会社 | 有機発光装置、有機発光装置の製造方法および電子機器 |
| JP2007265973A (ja) * | 2006-03-03 | 2007-10-11 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
| JP2007250982A (ja) | 2006-03-17 | 2007-09-27 | Canon Inc | 酸化物半導体を用いた薄膜トランジスタ及び表示装置 |
| JP5016831B2 (ja) | 2006-03-17 | 2012-09-05 | キヤノン株式会社 | 酸化物半導体薄膜トランジスタを用いた発光素子及びこれを用いた画像表示装置 |
| KR101230316B1 (ko) * | 2006-03-21 | 2013-02-06 | 삼성디스플레이 주식회사 | 표시장치와 그 제조방법 |
| KR20070101595A (ko) | 2006-04-11 | 2007-10-17 | 삼성전자주식회사 | ZnO TFT |
| TWI306723B (en) | 2006-04-11 | 2009-02-21 | Chunghwa Picture Tubes Ltd | Method for fabricating active matrix organic light emitting diode display device and structure of such device |
| US20070252928A1 (en) | 2006-04-28 | 2007-11-01 | Toppan Printing Co., Ltd. | Structure, transmission type liquid crystal display, reflection type display and manufacturing method thereof |
| JP4494369B2 (ja) * | 2006-05-24 | 2010-06-30 | 株式会社半導体エネルギー研究所 | 液晶表示装置 |
| JP5028033B2 (ja) | 2006-06-13 | 2012-09-19 | キヤノン株式会社 | 酸化物半導体膜のドライエッチング方法 |
| JP4833748B2 (ja) | 2006-06-14 | 2011-12-07 | パナソニック電工株式会社 | 有機発光素子 |
| WO2007144995A1 (ja) * | 2006-06-15 | 2007-12-21 | Sharp Kabushiki Kaisha | 表示装置及びその製造方法 |
| JP4609797B2 (ja) | 2006-08-09 | 2011-01-12 | Nec液晶テクノロジー株式会社 | 薄膜デバイス及びその製造方法 |
| JP4999400B2 (ja) | 2006-08-09 | 2012-08-15 | キヤノン株式会社 | 酸化物半導体膜のドライエッチング方法 |
| US7651896B2 (en) | 2006-08-30 | 2010-01-26 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| JP2008059824A (ja) | 2006-08-30 | 2008-03-13 | Fuji Electric Holdings Co Ltd | アクティブマトリックス型有機elパネルおよびその製造方法 |
| JP4332545B2 (ja) | 2006-09-15 | 2009-09-16 | キヤノン株式会社 | 電界効果型トランジスタ及びその製造方法 |
| JP4274219B2 (ja) | 2006-09-27 | 2009-06-03 | セイコーエプソン株式会社 | 電子デバイス、有機エレクトロルミネッセンス装置、有機薄膜半導体装置 |
| JP5164357B2 (ja) | 2006-09-27 | 2013-03-21 | キヤノン株式会社 | 半導体装置及び半導体装置の製造方法 |
| US7622371B2 (en) | 2006-10-10 | 2009-11-24 | Hewlett-Packard Development Company, L.P. | Fused nanocrystal thin film semiconductor and method |
| TWI442368B (zh) | 2006-10-26 | 2014-06-21 | Semiconductor Energy Lab | 電子裝置,顯示裝置,和半導體裝置,以及其驅動方法 |
| US7772021B2 (en) | 2006-11-29 | 2010-08-10 | Samsung Electronics Co., Ltd. | Flat panel displays comprising a thin-film transistor having a semiconductive oxide in its channel and methods of fabricating the same for use in flat panel displays |
| JP5030742B2 (ja) * | 2006-11-30 | 2012-09-19 | 株式会社半導体エネルギー研究所 | 発光素子 |
| JP2008140684A (ja) * | 2006-12-04 | 2008-06-19 | Toppan Printing Co Ltd | カラーelディスプレイおよびその製造方法 |
| KR20080052107A (ko) | 2006-12-07 | 2008-06-11 | 엘지전자 주식회사 | 산화물 반도체층을 구비한 박막 트랜지스터 |
| KR20080055243A (ko) * | 2006-12-15 | 2008-06-19 | 삼성전자주식회사 | 유기 발광 표시 장치 및 그 제조방법 |
| KR101303578B1 (ko) | 2007-01-05 | 2013-09-09 | 삼성전자주식회사 | 박막 식각 방법 |
| US8207063B2 (en) | 2007-01-26 | 2012-06-26 | Eastman Kodak Company | Process for atomic layer deposition |
| KR100851215B1 (ko) | 2007-03-14 | 2008-08-07 | 삼성에스디아이 주식회사 | 박막 트랜지스터 및 이를 이용한 유기 전계 발광표시장치 |
| US7795613B2 (en) | 2007-04-17 | 2010-09-14 | Toppan Printing Co., Ltd. | Structure with transistor |
| KR101325053B1 (ko) | 2007-04-18 | 2013-11-05 | 삼성디스플레이 주식회사 | 박막 트랜지스터 기판 및 이의 제조 방법 |
| KR20080094300A (ko) | 2007-04-19 | 2008-10-23 | 삼성전자주식회사 | 박막 트랜지스터 및 그 제조 방법과 박막 트랜지스터를포함하는 평판 디스플레이 |
| KR101334181B1 (ko) | 2007-04-20 | 2013-11-28 | 삼성전자주식회사 | 선택적으로 결정화된 채널층을 갖는 박막 트랜지스터 및 그제조 방법 |
| CN101663762B (zh) | 2007-04-25 | 2011-09-21 | 佳能株式会社 | 氧氮化物半导体 |
| KR101345376B1 (ko) | 2007-05-29 | 2013-12-24 | 삼성전자주식회사 | ZnO 계 박막 트랜지스터 및 그 제조방법 |
| US8083956B2 (en) * | 2007-10-11 | 2011-12-27 | Semiconductor Energy Laboratory Co., Ltd. | Display device and method for manufacturing display device |
| JP2009129711A (ja) | 2007-11-22 | 2009-06-11 | Seiko Epson Corp | 発光素子、表示装置および電子機器 |
| JP5215158B2 (ja) | 2007-12-17 | 2013-06-19 | 富士フイルム株式会社 | 無機結晶性配向膜及びその製造方法、半導体デバイス |
| KR100936874B1 (ko) * | 2007-12-18 | 2010-01-14 | 삼성모바일디스플레이주식회사 | 박막 트랜지스터의 제조 방법 및 박막 트랜지스터를구비하는 유기전계발광 표시 장치의 제조 방법 |
| KR102112799B1 (ko) * | 2008-07-10 | 2020-05-19 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 발광장치 및 전자기기 |
| JP4623179B2 (ja) | 2008-09-18 | 2011-02-02 | ソニー株式会社 | 薄膜トランジスタおよびその製造方法 |
| JP5451280B2 (ja) | 2008-10-09 | 2014-03-26 | キヤノン株式会社 | ウルツ鉱型結晶成長用基板およびその製造方法ならびに半導体装置 |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040061438A1 (en) * | 1999-06-04 | 2004-04-01 | Semiconductor Energy Laboratory Co., Ltd. | Electro-optical device and electronic device |
| JP2001175198A (ja) * | 1999-12-14 | 2001-06-29 | Semiconductor Energy Lab Co Ltd | 半導体装置およびその作製方法 |
| JP2003308976A (ja) * | 2002-02-13 | 2003-10-31 | Semiconductor Energy Lab Co Ltd | 発光装置 |
| JP2004094236A (ja) * | 2002-08-09 | 2004-03-25 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
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