TWI377237B - - Google Patents

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Publication number
TWI377237B
TWI377237B TW94146506A TW94146506A TWI377237B TW I377237 B TWI377237 B TW I377237B TW 94146506 A TW94146506 A TW 94146506A TW 94146506 A TW94146506 A TW 94146506A TW I377237 B TWI377237 B TW I377237B
Authority
TW
Taiwan
Prior art keywords
conductive ink
nickel
group
particles
conductive
Prior art date
Application number
TW94146506A
Other languages
English (en)
Chinese (zh)
Other versions
TW200636027A (en
Inventor
Kamikoriyama Yoichi
Ogata Sumikazu
Kei Anai
Hiroki Sawamoto
Mikimasa Horiuchi
Mukuno Takashi
Original Assignee
Mitsui Mining & Smelting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co filed Critical Mitsui Mining & Smelting Co
Publication of TW200636027A publication Critical patent/TW200636027A/zh
Application granted granted Critical
Publication of TWI377237B publication Critical patent/TWI377237B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0239—Coupling agent for particles

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Dispersion Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Nanotechnology (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Conductive Materials (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Powder Metallurgy (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Ink Jet (AREA)
TW094146506A 2004-12-27 2005-12-26 Conductive ink TW200636027A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004375893 2004-12-27
JP2005048662A JP4799881B2 (ja) 2004-12-27 2005-02-24 導電性インク

Publications (2)

Publication Number Publication Date
TW200636027A TW200636027A (en) 2006-10-16
TWI377237B true TWI377237B (enExample) 2012-11-21

Family

ID=36614864

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094146506A TW200636027A (en) 2004-12-27 2005-12-26 Conductive ink

Country Status (6)

Country Link
US (1) US8043535B2 (enExample)
EP (1) EP1847575A4 (enExample)
JP (1) JP4799881B2 (enExample)
KR (1) KR20070097055A (enExample)
TW (1) TW200636027A (enExample)
WO (1) WO2006070747A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI583264B (zh) * 2014-08-29 2017-05-11 三井金屬鑛業股份有限公司 Conductive structure and manufacturing method, conductive composition, and electronic component module

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Cited By (2)

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Publication number Priority date Publication date Assignee Title
TWI583264B (zh) * 2014-08-29 2017-05-11 三井金屬鑛業股份有限公司 Conductive structure and manufacturing method, conductive composition, and electronic component module
TWI634818B (zh) * 2014-08-29 2018-09-01 三井金屬鑛業股份有限公司 Conductor connection structure, conductive composition and electronic component module

Also Published As

Publication number Publication date
WO2006070747A1 (ja) 2006-07-06
US20080134936A1 (en) 2008-06-12
JP2006210301A (ja) 2006-08-10
JP4799881B2 (ja) 2011-10-26
KR20070097055A (ko) 2007-10-02
EP1847575A4 (en) 2008-05-07
US8043535B2 (en) 2011-10-25
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