TW200636027A - Conductive ink - Google Patents

Conductive ink

Info

Publication number
TW200636027A
TW200636027A TW094146506A TW94146506A TW200636027A TW 200636027 A TW200636027 A TW 200636027A TW 094146506 A TW094146506 A TW 094146506A TW 94146506 A TW94146506 A TW 94146506A TW 200636027 A TW200636027 A TW 200636027A
Authority
TW
Taiwan
Prior art keywords
conductive ink
dispersion medium
film density
conductor
metal oxide
Prior art date
Application number
TW094146506A
Other languages
English (en)
Chinese (zh)
Other versions
TWI377237B (enExample
Inventor
Yoichi Kamikoriyama
Sumikazu Ogata
Kei Anai
Hiroki Sawamoto
Mikimasa Horiuchi
Mukuno Takashi
Original Assignee
Mitsui Mining & Smelting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co filed Critical Mitsui Mining & Smelting Co
Publication of TW200636027A publication Critical patent/TW200636027A/zh
Application granted granted Critical
Publication of TWI377237B publication Critical patent/TWI377237B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0239—Coupling agent for particles

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Dispersion Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Nanotechnology (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Conductive Materials (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Powder Metallurgy (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Ink Jet (AREA)
TW094146506A 2004-12-27 2005-12-26 Conductive ink TW200636027A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004375893 2004-12-27
JP2005048662A JP4799881B2 (ja) 2004-12-27 2005-02-24 導電性インク

Publications (2)

Publication Number Publication Date
TW200636027A true TW200636027A (en) 2006-10-16
TWI377237B TWI377237B (enExample) 2012-11-21

Family

ID=36614864

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094146506A TW200636027A (en) 2004-12-27 2005-12-26 Conductive ink

Country Status (6)

Country Link
US (1) US8043535B2 (enExample)
EP (1) EP1847575A4 (enExample)
JP (1) JP4799881B2 (enExample)
KR (1) KR20070097055A (enExample)
TW (1) TW200636027A (enExample)
WO (1) WO2006070747A1 (enExample)

Cited By (3)

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US8475867B2 (en) 2008-11-27 2013-07-02 Fukui Precision Component (Shenzhen) Co., Ltd. Method for forming electrical traces on substrate
TWI603342B (zh) * 2013-03-29 2017-10-21 富士軟片股份有限公司 導電膜形成用組成物及使用其的導電膜的製造方法
TWI678711B (zh) * 2018-11-01 2019-12-01 磐采股份有限公司 導電漿料組合物及應用該導電漿料組合物之太陽能電池

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JP5151150B2 (ja) * 2006-12-28 2013-02-27 株式会社日立製作所 導電性焼結層形成用組成物、これを用いた導電性被膜形成法および接合法
JP4994086B2 (ja) * 2007-04-03 2012-08-08 旭化成イーマテリアルズ株式会社 金属薄膜前駆体分散液
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US9384868B2 (en) * 2011-03-08 2016-07-05 Dic Corporation Water-based conductive ink for inkjet recording
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JP5957187B2 (ja) * 2011-06-23 2016-07-27 株式会社アルバック 金属微粒子の製造方法
WO2013059948A1 (en) 2011-10-28 2013-05-02 Nanograde Ag Solution-processable tungsten oxide buffer layers and organic electronics comprising same
EP2820093B1 (en) 2012-02-29 2024-09-18 Singapore Asahi Chemical & Solder Ind. Pte. Ltd. Inks containing metal precursors nanoparticles
JP2015110682A (ja) * 2012-03-21 2015-06-18 旭硝子株式会社 導電インク、導体付き基材、および導体付き基材の製造方法
KR101908738B1 (ko) 2012-04-17 2018-10-16 헤레우스 프레셔스 메탈즈 노스 아메리카 콘쇼호켄 엘엘씨 태양 전지 접촉용 전도성 후막 페이스트
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US10329444B2 (en) 2012-12-28 2019-06-25 Printed Energy Pty Ltd Nickel inks and oxidation resistant and conductive coatings
KR101639411B1 (ko) * 2012-12-31 2016-07-14 주식회사 아모그린텍 연성인쇄회로기판
JP6032110B2 (ja) * 2013-04-17 2016-11-24 株式会社豊田中央研究所 金属ナノ粒子材料、それを含有する接合材料、およびそれを用いた半導体装置
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8475867B2 (en) 2008-11-27 2013-07-02 Fukui Precision Component (Shenzhen) Co., Ltd. Method for forming electrical traces on substrate
TWI603342B (zh) * 2013-03-29 2017-10-21 富士軟片股份有限公司 導電膜形成用組成物及使用其的導電膜的製造方法
TWI678711B (zh) * 2018-11-01 2019-12-01 磐采股份有限公司 導電漿料組合物及應用該導電漿料組合物之太陽能電池

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JP4799881B2 (ja) 2011-10-26
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US8043535B2 (en) 2011-10-25
EP1847575A1 (en) 2007-10-24

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