TW200636027A - Conductive ink - Google Patents

Conductive ink

Info

Publication number
TW200636027A
TW200636027A TW094146506A TW94146506A TW200636027A TW 200636027 A TW200636027 A TW 200636027A TW 094146506 A TW094146506 A TW 094146506A TW 94146506 A TW94146506 A TW 94146506A TW 200636027 A TW200636027 A TW 200636027A
Authority
TW
Taiwan
Prior art keywords
conductive ink
dispersion medium
film density
conductor
metal oxide
Prior art date
Application number
TW094146506A
Other languages
English (en)
Chinese (zh)
Other versions
TWI377237B (enExample
Inventor
Yoichi Kamikoriyama
Sumikazu Ogata
Kei Anai
Hiroki Sawamoto
Mikimasa Horiuchi
Mukuno Takashi
Original Assignee
Mitsui Mining & Smelting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co filed Critical Mitsui Mining & Smelting Co
Publication of TW200636027A publication Critical patent/TW200636027A/zh
Application granted granted Critical
Publication of TWI377237B publication Critical patent/TWI377237B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0239—Coupling agent for particles

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Dispersion Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Nanotechnology (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Conductive Materials (AREA)
  • Ink Jet (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Powder Metallurgy (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW094146506A 2004-12-27 2005-12-26 Conductive ink TW200636027A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004375893 2004-12-27
JP2005048662A JP4799881B2 (ja) 2004-12-27 2005-02-24 導電性インク

Publications (2)

Publication Number Publication Date
TW200636027A true TW200636027A (en) 2006-10-16
TWI377237B TWI377237B (enExample) 2012-11-21

Family

ID=36614864

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094146506A TW200636027A (en) 2004-12-27 2005-12-26 Conductive ink

Country Status (6)

Country Link
US (1) US8043535B2 (enExample)
EP (1) EP1847575A4 (enExample)
JP (1) JP4799881B2 (enExample)
KR (1) KR20070097055A (enExample)
TW (1) TW200636027A (enExample)
WO (1) WO2006070747A1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8475867B2 (en) 2008-11-27 2013-07-02 Fukui Precision Component (Shenzhen) Co., Ltd. Method for forming electrical traces on substrate
TWI603342B (zh) * 2013-03-29 2017-10-21 富士軟片股份有限公司 導電膜形成用組成物及使用其的導電膜的製造方法
TWI678711B (zh) * 2018-11-01 2019-12-01 磐采股份有限公司 導電漿料組合物及應用該導電漿料組合物之太陽能電池

Families Citing this family (68)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006328532A (ja) * 2005-05-10 2006-12-07 Samsung Electro-Mechanics Co Ltd 金属ナノ粒子、これを製造する方法及び導電性インク
CN101194041B (zh) * 2005-06-17 2010-12-15 住友金属矿山株式会社 镍膜形成用涂布液与镍膜及其制造方法
JP5065613B2 (ja) 2006-04-10 2012-11-07 三井金属鉱業株式会社 ニッケルインク
US20100151267A1 (en) * 2006-06-19 2010-06-17 Cabot Corporation Metal-containing nanoparticles, their synthesis and use
TWI399759B (zh) 2006-06-30 2013-06-21 Mitsubishi Materials Corp 形成太陽電池之電極用組成物及該電極之形成方法以及使用依該形成方法所得電極之太陽電池
KR100790457B1 (ko) * 2006-07-10 2008-01-02 삼성전기주식회사 금속 나노입자의 제조방법
JP5309521B2 (ja) * 2006-10-11 2013-10-09 三菱マテリアル株式会社 電極形成用組成物及びその製造方法並びに該組成物を用いた電極の形成方法
WO2008047641A1 (en) * 2006-10-11 2008-04-24 Mitsubishi Materials Corporation Composition for electrode formation and method for forming electrode by using the composition
JP5151150B2 (ja) * 2006-12-28 2013-02-27 株式会社日立製作所 導電性焼結層形成用組成物、これを用いた導電性被膜形成法および接合法
JP4994086B2 (ja) * 2007-04-03 2012-08-08 旭化成イーマテリアルズ株式会社 金属薄膜前駆体分散液
JP5169389B2 (ja) 2007-04-19 2013-03-27 三菱マテリアル株式会社 導電性反射膜の製造方法
US8404160B2 (en) * 2007-05-18 2013-03-26 Applied Nanotech Holdings, Inc. Metallic ink
US8058195B2 (en) 2007-06-19 2011-11-15 Cabot Corporation Nanoglass and flame spray processes for producing nanoglass
KR100817856B1 (ko) * 2007-07-13 2008-03-31 주식회사 신우테크 감시카메라용 투명히터판
JP2009079239A (ja) * 2007-09-25 2009-04-16 Sumitomo Electric Ind Ltd ニッケル粉末、またはニッケルを主成分とする合金粉末およびその製造方法、導電性ペースト、並びに積層セラミックコンデンサ
KR101000684B1 (ko) * 2007-10-11 2010-12-10 세종대학교산학협력단 이산화티타늄 나노튜브분말 및 이를 이용한 고압수소저장탱크 삽입용 판형 필름의 제조방법
JP5166844B2 (ja) * 2007-12-07 2013-03-21 三井金属鉱業株式会社 Ｉｔｏインク
US8506849B2 (en) * 2008-03-05 2013-08-13 Applied Nanotech Holdings, Inc. Additives and modifiers for solvent- and water-based metallic conductive inks
US20100025848A1 (en) * 2008-08-04 2010-02-04 Infineon Technologies Ag Method of fabricating a semiconductor device and semiconductor device
JP5544774B2 (ja) * 2008-08-27 2014-07-09 三菱マテリアル株式会社 多接合型太陽電池
WO2010023920A1 (ja) * 2008-08-27 2010-03-04 三菱マテリアル株式会社 太陽電池用透明導電膜及びその透明導電膜用組成物、多接合型太陽電池
US20110139228A1 (en) * 2008-08-27 2011-06-16 Mitsubishi Materials Corporation Transparent electroconductive film for solar cell, composition for transparent electroconductive film and multi-junction solar cell
JP2010225287A (ja) * 2009-03-19 2010-10-07 Hitachi Maxell Ltd 透明導電膜形成用インク及び透明導電膜
KR101055625B1 (ko) * 2009-11-06 2011-08-10 에이비씨나노텍 주식회사 배선용 잉크 조성물 및 이를 이용한 구리 배선의 형성방법
DE102009053688A1 (de) 2009-11-19 2011-05-26 Ferro Gmbh Siebdruckfähige Zusammensetzung und Verfahren zur Herstellung einer leitfähigen und transparenten Schicht
KR20110139941A (ko) * 2010-06-24 2011-12-30 삼성전기주식회사 금속 잉크 조성물 및 이를 이용한 금속 배선 형성 방법, 그리고 상기 금속 잉크 조성물로 형성된 도전성 패턴
KR20110139942A (ko) * 2010-06-24 2011-12-30 삼성전기주식회사 금속 잉크 조성물 및 이를 이용한 금속 배선 형성 방법, 그리고 상기 금속 잉크 조성물로 형성된 도전성 패턴
KR101276237B1 (ko) * 2010-12-02 2013-06-20 한국기계연구원 저온소결 전도성 금속막 및 이의 제조방법
CN102675964B (zh) * 2011-02-02 2014-09-03 日本特殊陶业株式会社 油墨及设备
JP5689081B2 (ja) 2011-02-02 2015-03-25 日本特殊陶業株式会社 インク及びデバイス
JP5923894B2 (ja) 2011-02-17 2016-05-25 セイコーエプソン株式会社 インクジェット記録方法
WO2012118582A1 (en) 2011-02-28 2012-09-07 Nthdegree Technologies Worldwide Inc. Metallic nanofiber ink, substantially transparent conductor, and fabrication method
US10494720B2 (en) 2011-02-28 2019-12-03 Nthdegree Technologies Worldwide Inc Metallic nanofiber ink, substantially transparent conductor, and fabrication method
JP5624915B2 (ja) * 2011-03-03 2014-11-12 株式会社アルバック 金属ナノ粒子分散液
KR101853695B1 (ko) * 2011-03-08 2018-05-02 디아이씨 가부시끼가이샤 잉크젯 기록용 도전성 수성 잉크
DE102011016335B4 (de) * 2011-04-07 2013-10-02 Universität Konstanz Nickelhaltige und ätzende druckbare Paste sowie Verfahren zur Bildung von elektrischen Kontakten beim Herstellen einer Solarzelle
JP5957187B2 (ja) * 2011-06-23 2016-07-27 株式会社アルバック 金属微粒子の製造方法
CN103988330B (zh) * 2011-10-28 2016-08-24 纳米格拉德股份公司 可溶液处理的氧化钨缓冲层和包含它的有机电子设备
US10590295B2 (en) * 2012-02-29 2020-03-17 Singapore Asahi Chemical & Solder Ind. Pte. Ltd Inks containing metal precursors nanoparticles
JP2015110682A (ja) * 2012-03-21 2015-06-18 旭硝子株式会社 導電インク、導体付き基材、および導体付き基材の製造方法
TW201349254A (zh) 2012-04-17 2013-12-01 Heraeus Precious Metals North America Conshohocken Llc 用於太陽能電池接點的導電厚膜膏
JP2014028740A (ja) * 2012-04-17 2014-02-13 Heraeus Precious Metals North America Conshohocken Llc 太陽電池接点用導電性厚膜ペーストのためのテルル無機反応系
US10329444B2 (en) 2012-12-28 2019-06-25 Printed Energy Pty Ltd Nickel inks and oxidation resistant and conductive coatings
KR101796452B1 (ko) * 2012-12-31 2017-11-13 주식회사 아모그린텍 연성인쇄회로기판 및 그 제조 방법
JP6032110B2 (ja) * 2013-04-17 2016-11-24 株式会社豊田中央研究所 金属ナノ粒子材料、それを含有する接合材料、およびそれを用いた半導体装置
US9799421B2 (en) 2013-06-07 2017-10-24 Heraeus Precious Metals North America Conshohocken Llc Thick print copper pastes for aluminum nitride substrates
EP2822000B1 (en) * 2013-07-03 2020-10-21 Heraeus Precious Metals North America Conshohocken LLC Thick print copper pastes for aluminium nitride substrates
JP6132716B2 (ja) * 2013-09-10 2017-05-24 株式会社東芝 金属粒子ペースト、これを用いた硬化物、および半導体装置
CN111545770A (zh) * 2013-10-24 2020-08-18 株式会社大赛璐 含有银纳米粒子的分散液的制造方法及含有银纳米粒子的分散液
US9540734B2 (en) * 2013-11-13 2017-01-10 Xerox Corporation Conductive compositions comprising metal carboxylates
JP2015160151A (ja) * 2014-02-26 2015-09-07 セイコーエプソン株式会社 分散液およびその製造方法、製造装置
EP3188314B1 (en) * 2014-08-29 2021-07-07 Mitsui Mining & Smelting Co., Ltd. Conductor connection structure, method for producing same, conductive composition, and electronic component module
BR112017016097B1 (pt) * 2015-02-12 2021-01-19 Avantama Ag dispositivo optoeletrônico, bem intermediário, composição, seu uso, método para fabricação de bem intermediário e método para fabricação de dispositivo eletrônico
US11673289B2 (en) 2016-02-16 2023-06-13 Arizona Board Of Regents On Behalf Of Arizona State University Fabricating metal or ceramic components using 3D printing with dissolvable supports of a different material
WO2018013178A1 (en) 2016-07-15 2018-01-18 Arizona Board Of Regents On Behalf Of Arizona State University Dissolving metal supports in 3d printed metals and ceramics using sensitization
EP3287499B1 (en) * 2016-08-26 2021-04-07 Agfa-Gevaert Nv A metallic nanoparticle dispersion
US10286713B2 (en) 2016-10-11 2019-05-14 Arizona Board Of Regents On Behalf Of Arizona State University Printing using reactive inks and conductive adhesion promoters
WO2018118460A1 (en) 2016-12-24 2018-06-28 Electroninks Incorporated Copper based conductive ink composition and method of making the same
TWI874294B (zh) 2017-02-08 2025-03-01 加拿大國家研究委員會 可印刷分子油墨
TW201842087A (zh) 2017-02-08 2018-12-01 加拿大國家研究委員會 具改良之熱穩定性的分子油墨
TWI842668B (zh) 2017-02-08 2024-05-21 加拿大國家研究委員會 具低黏度與低加工溫度之銀分子油墨
JP2017162824A (ja) * 2017-04-17 2017-09-14 株式会社東芝 金属粒子ペースト、これを用いた硬化物、および半導体装置
WO2018213640A1 (en) 2017-05-17 2018-11-22 Mariana Bertoni Systems and methods for controlling the morphology and porosity of printed reactive inks for high precision printing
TWI856947B (zh) * 2017-08-01 2024-10-01 加拿大國家研究委員會 銅墨水
JP7031258B2 (ja) * 2017-11-30 2022-03-08 住友金属鉱山株式会社 ニッケルスラリー、ニッケルスラリーの製造方法およびニッケルペーストの製造方法
CA3085837A1 (en) * 2017-12-22 2019-06-27 National Research Council Of Canada Copper ink for high conductivity fine printing
JP7286404B2 (ja) * 2019-04-26 2023-06-05 キヤノン株式会社 ニッケル粒子分散液及びこれを用いた物品の製造方法
CN111496266A (zh) * 2020-05-09 2020-08-07 哈尔滨工业大学(深圳)(哈尔滨工业大学深圳科技创新研究院) 一种绿色环保的导电纳米铜墨水及其制备方法

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2111072A (en) * 1981-12-08 1983-06-29 Johnson Matthey Plc Ultra violet-curable ink or paint containing electrically conductive metal particles
DE69121449T2 (de) * 1990-04-12 1997-02-27 Matsushita Electric Ind Co Ltd Leitende Tintenzusammensetzung und Verfahren zum Herstellen eines dickschichtigen Musters
JPH0537126A (ja) * 1991-07-30 1993-02-12 Toshiba Corp 金属酸化物を用いた配線基板および情報記録媒体
JPH0818190A (ja) 1994-06-24 1996-01-19 Cmk Corp プリント配線板の製造方法
JP3229163B2 (ja) * 1995-04-04 2001-11-12 キヤノン株式会社 有機金属錯体、導電性膜形成用材料、並びにそれを用いた電子放出素子、電子源、表示パネルおよび画像形成装置の製造方法
JP2761866B2 (ja) 1996-03-04 1998-06-04 東海ゴム工業株式会社 プリント回路体及びその製造方法
US6356234B1 (en) * 1996-06-12 2002-03-12 R T Microwave Limited Electrical circuit
JP4298069B2 (ja) * 1999-06-30 2009-07-15 ハリマ化成株式会社 回路描画用導電性ペーストおよび回路印刷方法
JP2002194287A (ja) * 2000-12-27 2002-07-10 Sumitomo Osaka Cement Co Ltd 透明導電膜形成用塗料および透明導電膜と表示装置
TW507500B (en) * 2001-01-09 2002-10-21 Sumitomo Rubber Ind Electrode plate for plasma display panel and manufacturing method thereof
TW522062B (en) * 2001-02-15 2003-03-01 Mitsui Mining & Smelting Co Aqueous nickel slurry, method for preparing the same and conductive paste
JP3903374B2 (ja) * 2001-02-15 2007-04-11 三井金属鉱業株式会社 水性ニッケルスラリー、その製造方法及び導電ペースト
JP3774638B2 (ja) 2001-04-24 2006-05-17 ハリマ化成株式会社 インクジェット印刷法を利用する回路パターンの形成方法
JP3764349B2 (ja) 2001-05-07 2006-04-05 ハリマ化成株式会社 金属微粒子分散液を用いたメッキ代替導電性金属皮膜の形成方法
IL161622A0 (en) * 2001-11-01 2004-09-27 Yissum Res Dev Co Ink jet inks containing metal nanoparticles
JP2004143571A (ja) * 2001-11-22 2004-05-20 Fuji Photo Film Co Ltd 導電パターン描画用基板およびインク、ならびに導電パターンの形成方法
US20030146019A1 (en) * 2001-11-22 2003-08-07 Hiroyuki Hirai Board and ink used for forming conductive pattern, and method using thereof
WO2003051562A1 (en) * 2001-12-18 2003-06-26 Asahi Kasei Kabushiki Kaisha Metal oxide dispersion
US6780772B2 (en) * 2001-12-21 2004-08-24 Nutool, Inc. Method and system to provide electroplanarization of a workpiece with a conducting material layer
JP2003272453A (ja) * 2002-03-13 2003-09-26 Kanegafuchi Chem Ind Co Ltd 半導電性無機フィラー及びその製造方法ならびに半導電性樹脂組成物
US7566360B2 (en) * 2002-06-13 2009-07-28 Cima Nanotech Israel Ltd. Nano-powder-based coating and ink compositions
EP2154212A1 (en) * 2002-06-13 2010-02-17 Cima Nano Tech Israel Ltd A method for the production of conductive and transparent nano-coatings
KR20060012545A (ko) * 2002-07-03 2006-02-08 나노파우더스 인더스트리어스 리미티드. 저온 소결처리한 전도성 나노 잉크 및 이것의 제조 방법
JP4365075B2 (ja) 2002-08-23 2009-11-18 トッパン・フォームズ株式会社 軟ろう金属微粒子を含有する導電性インキ
JP4416080B2 (ja) * 2003-01-29 2010-02-17 富士フイルム株式会社 プリント配線基板形成用インク、プリント配線基板の形成方法及びプリント配線基板
JP2004277627A (ja) * 2003-03-18 2004-10-07 Asahi Kasei Corp インクジェット用インクおよびこれを用いた金属含有薄膜の形成方法
US7683107B2 (en) * 2004-02-09 2010-03-23 E.I. Du Pont De Nemours And Company Ink jet printable thick film compositions and processes
US20050173680A1 (en) * 2004-02-10 2005-08-11 Haixin Yang Ink jet printable thick film ink compositions and processes
JP5550904B2 (ja) * 2006-08-07 2014-07-16 インクテック カンパニー リミテッド 銀ナノ粒子の製造方法、及び薄膜形成方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8475867B2 (en) 2008-11-27 2013-07-02 Fukui Precision Component (Shenzhen) Co., Ltd. Method for forming electrical traces on substrate
TWI603342B (zh) * 2013-03-29 2017-10-21 富士軟片股份有限公司 導電膜形成用組成物及使用其的導電膜的製造方法
TWI678711B (zh) * 2018-11-01 2019-12-01 磐采股份有限公司 導電漿料組合物及應用該導電漿料組合物之太陽能電池

Also Published As

Publication number Publication date
US8043535B2 (en) 2011-10-25
US20080134936A1 (en) 2008-06-12
KR20070097055A (ko) 2007-10-02
WO2006070747A1 (ja) 2006-07-06
JP4799881B2 (ja) 2011-10-26
EP1847575A1 (en) 2007-10-24
JP2006210301A (ja) 2006-08-10
EP1847575A4 (en) 2008-05-07
TWI377237B (enExample) 2012-11-21

Similar Documents

Publication Publication Date Title
TW200636027A (en) Conductive ink
WO2009149438A8 (en) Glass compositions used in conductors for photovoltaic cells
EA200600367A1 (ru) Система и способ измерения с использованием микроэлектродов на основе алмаза
MY153335A (en) Conductive surfacing films for lightning strike and electromagnetic interferance shielding of thermoset composite materials
WO2009005134A1 (ja) ダイヤモンド半導体デバイス
CN106867298A (zh) 石墨烯类防腐涂料的制备方法
TW200643125A (en) Electrically conductive ink, electrically conductive circuit, and noncontact-type medium
TW200742522A (en) Polymer-ceramic dielectric composition, embedded capacitor using the dielectric composition and printed circuit board having the capacitor embedded therein
WO2008108300A1 (ja) シールドシェル
RU2014141995A (ru) Смеси, способы и композиции, относящиеся к проводящим материалам
EP1460644A4 (en) ELECTROPROCESSING COMPOSITION, ELECTROPROOF COATING AND METHOD FOR FORMING AN ELECTROPROCESS COATING
MY148106A (en) Electrolytic solution for electrolytic capacitor, and electrolytic capacitor using the same
Kim et al. Effect of pH in Ru slurry with sodium periodate on Ru CMP
WO2009066719A1 (ja) ペースト組成物と太陽電池素子
DE60305928D1 (de) Niedrigspannungsenergiekabel mit Isolierschicht aus Polyolefin mit polaren Gruppen
TW200620545A (en) Robust copper interconnection structire and fabrication method thereof
MXPA05009635A (es) Aleacion basada en cobre.
TW200602140A (en) Tantalum powder, and solid electrolyte capacitor using it
Bian et al. Electrolyte composition and galvanic corrosion for ruthenium/copper electrochemical mechanical polishing
CN202340822U (zh) 一种电子烟电路保护结构
JP2017027906A (ja) コネクタ用樹脂組成物及びコネクタ
Lin et al. Void defect reduction after chemical mechanical planarization of trenches filled by direct/pulse plating
CN205051963U (zh) 一种复合电路板
DE60309601D1 (de) Druckträger mit einer guten elektrischen leitfähigkeit und einer guten bedruckbarkeit
Sugimoto et al. Extrinsic and Intrinsic Methods to Increase the Rate Performance of MnO2 Electrodes

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees