TW200636027A - Conductive ink - Google Patents
Conductive inkInfo
- Publication number
- TW200636027A TW200636027A TW094146506A TW94146506A TW200636027A TW 200636027 A TW200636027 A TW 200636027A TW 094146506 A TW094146506 A TW 094146506A TW 94146506 A TW94146506 A TW 94146506A TW 200636027 A TW200636027 A TW 200636027A
- Authority
- TW
- Taiwan
- Prior art keywords
- conductive ink
- dispersion medium
- film density
- conductor
- metal oxide
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0239—Coupling agent for particles
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Dispersion Chemistry (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Nanotechnology (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Conductive Materials (AREA)
- Ink Jet (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
- Powder Metallurgy (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004375893 | 2004-12-27 | ||
JP2005048662A JP4799881B2 (ja) | 2004-12-27 | 2005-02-24 | 導電性インク |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200636027A true TW200636027A (en) | 2006-10-16 |
TWI377237B TWI377237B (zh) | 2012-11-21 |
Family
ID=36614864
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094146506A TW200636027A (en) | 2004-12-27 | 2005-12-26 | Conductive ink |
Country Status (6)
Country | Link |
---|---|
US (1) | US8043535B2 (zh) |
EP (1) | EP1847575A4 (zh) |
JP (1) | JP4799881B2 (zh) |
KR (1) | KR20070097055A (zh) |
TW (1) | TW200636027A (zh) |
WO (1) | WO2006070747A1 (zh) |
Cited By (3)
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US8475867B2 (en) | 2008-11-27 | 2013-07-02 | Fukui Precision Component (Shenzhen) Co., Ltd. | Method for forming electrical traces on substrate |
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TWI678711B (zh) * | 2018-11-01 | 2019-12-01 | 磐采股份有限公司 | 導電漿料組合物及應用該導電漿料組合物之太陽能電池 |
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JP2004277627A (ja) * | 2003-03-18 | 2004-10-07 | Asahi Kasei Corp | インクジェット用インクおよびこれを用いた金属含有薄膜の形成方法 |
US7683107B2 (en) * | 2004-02-09 | 2010-03-23 | E.I. Du Pont De Nemours And Company | Ink jet printable thick film compositions and processes |
US20050173680A1 (en) * | 2004-02-10 | 2005-08-11 | Haixin Yang | Ink jet printable thick film ink compositions and processes |
EP2052043B1 (en) * | 2006-08-07 | 2016-10-12 | Inktec Co., Ltd. | Process for preparation of silver nanoparticles, and the compositions of silver ink containing the same |
-
2005
- 2005-02-24 JP JP2005048662A patent/JP4799881B2/ja active Active
- 2005-12-26 EP EP05819587A patent/EP1847575A4/en not_active Withdrawn
- 2005-12-26 KR KR20077015677A patent/KR20070097055A/ko not_active Application Discontinuation
- 2005-12-26 TW TW094146506A patent/TW200636027A/zh not_active IP Right Cessation
- 2005-12-26 WO PCT/JP2005/023795 patent/WO2006070747A1/ja active Application Filing
- 2005-12-26 US US11/722,897 patent/US8043535B2/en not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8475867B2 (en) | 2008-11-27 | 2013-07-02 | Fukui Precision Component (Shenzhen) Co., Ltd. | Method for forming electrical traces on substrate |
TWI603342B (zh) * | 2013-03-29 | 2017-10-21 | 富士軟片股份有限公司 | 導電膜形成用組成物及使用其的導電膜的製造方法 |
TWI678711B (zh) * | 2018-11-01 | 2019-12-01 | 磐采股份有限公司 | 導電漿料組合物及應用該導電漿料組合物之太陽能電池 |
Also Published As
Publication number | Publication date |
---|---|
KR20070097055A (ko) | 2007-10-02 |
EP1847575A4 (en) | 2008-05-07 |
WO2006070747A1 (ja) | 2006-07-06 |
US8043535B2 (en) | 2011-10-25 |
EP1847575A1 (en) | 2007-10-24 |
TWI377237B (zh) | 2012-11-21 |
JP2006210301A (ja) | 2006-08-10 |
JP4799881B2 (ja) | 2011-10-26 |
US20080134936A1 (en) | 2008-06-12 |
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