TW201842088A - 可印刷分子油墨 - Google Patents
可印刷分子油墨 Download PDFInfo
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- TW201842088A TW201842088A TW107104324A TW107104324A TW201842088A TW 201842088 A TW201842088 A TW 201842088A TW 107104324 A TW107104324 A TW 107104324A TW 107104324 A TW107104324 A TW 107104324A TW 201842088 A TW201842088 A TW 201842088A
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- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
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- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 239000002964 rayon Substances 0.000 description 1
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- 150000003839 salts Chemical class 0.000 description 1
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- CQLFBEKRDQMJLZ-UHFFFAOYSA-M silver acetate Chemical compound [Ag+].CC([O-])=O CQLFBEKRDQMJLZ-UHFFFAOYSA-M 0.000 description 1
- 229940071536 silver acetate Drugs 0.000 description 1
- 229940071575 silver citrate Drugs 0.000 description 1
- KZJPVUDYAMEDRM-UHFFFAOYSA-M silver;2,2,2-trifluoroacetate Chemical compound [Ag+].[O-]C(=O)C(F)(F)F KZJPVUDYAMEDRM-UHFFFAOYSA-M 0.000 description 1
- XAYJXAUUXJTOSI-UHFFFAOYSA-M silver;2,2,3,3,3-pentafluoropropanoate Chemical compound [Ag+].[O-]C(=O)C(F)(F)C(F)(F)F XAYJXAUUXJTOSI-UHFFFAOYSA-M 0.000 description 1
- RUJQWQMCBPWFDO-UHFFFAOYSA-M silver;2-hydroxyacetate Chemical compound [Ag+].OCC([O-])=O RUJQWQMCBPWFDO-UHFFFAOYSA-M 0.000 description 1
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- YCPUVKXPVYSBAJ-UHFFFAOYSA-M silver;2-phenylacetate Chemical class [Ag+].[O-]C(=O)CC1=CC=CC=C1 YCPUVKXPVYSBAJ-UHFFFAOYSA-M 0.000 description 1
- RQZVTOHLJOBKCW-UHFFFAOYSA-M silver;7,7-dimethyloctanoate Chemical compound [Ag+].CC(C)(C)CCCCCC([O-])=O RQZVTOHLJOBKCW-UHFFFAOYSA-M 0.000 description 1
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- CYLMOXYXYHNGHZ-UHFFFAOYSA-M silver;propanoate Chemical compound [Ag+].CCC([O-])=O CYLMOXYXYHNGHZ-UHFFFAOYSA-M 0.000 description 1
- 238000009450 smart packaging Methods 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 150000003871 sulfonates Chemical class 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- CXWXQJXEFPUFDZ-UHFFFAOYSA-N tetralin Chemical compound C1=CC=C2CCCCC2=C1 CXWXQJXEFPUFDZ-UHFFFAOYSA-N 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 210000003813 thumb Anatomy 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- QUTYHQJYVDNJJA-UHFFFAOYSA-K trisilver;2-hydroxypropane-1,2,3-tricarboxylate Chemical compound [Ag+].[Ag+].[Ag+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O QUTYHQJYVDNJJA-UHFFFAOYSA-K 0.000 description 1
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Classifications
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- C—CHEMISTRY; METALLURGY
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- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
- C09D11/037—Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
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- C09D11/00—Inks
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- C09D11/00—Inks
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- C09D11/14—Printing inks based on carbohydrates
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- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
- C09D11/38—Inkjet printing inks characterised by non-macromolecular additives other than solvents, pigments or dyes
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- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
-
- D—TEXTILES; PAPER
- D02—YARNS; MECHANICAL FINISHING OF YARNS OR ROPES; WARPING OR BEAMING
- D02G—CRIMPING OR CURLING FIBRES, FILAMENTS, THREADS, OR YARNS; YARNS OR THREADS
- D02G3/00—Yarns or threads, e.g. fancy yarns; Processes or apparatus for the production thereof, not otherwise provided for
- D02G3/02—Yarns or threads characterised by the material or by the materials from which they are made
- D02G3/12—Threads containing metallic filaments or strips
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- D—TEXTILES; PAPER
- D02—YARNS; MECHANICAL FINISHING OF YARNS OR ROPES; WARPING OR BEAMING
- D02G—CRIMPING OR CURLING FIBRES, FILAMENTS, THREADS, OR YARNS; YARNS OR THREADS
- D02G3/00—Yarns or threads, e.g. fancy yarns; Processes or apparatus for the production thereof, not otherwise provided for
- D02G3/22—Yarns or threads characterised by constructional features, e.g. blending, filament/fibre
- D02G3/36—Cored or coated yarns or threads
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- D02—YARNS; MECHANICAL FINISHING OF YARNS OR ROPES; WARPING OR BEAMING
- D02G—CRIMPING OR CURLING FIBRES, FILAMENTS, THREADS, OR YARNS; YARNS OR THREADS
- D02G3/00—Yarns or threads, e.g. fancy yarns; Processes or apparatus for the production thereof, not otherwise provided for
- D02G3/44—Yarns or threads characterised by the purpose for which they are designed
- D02G3/441—Yarns or threads with antistatic, conductive or radiation-shielding properties
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
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- H05K1/0283—Stretchable printed circuits
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
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Abstract
分子油墨含有羧酸銀、有機胺化合物、有機聚合物黏結劑、表面張力改質劑及溶劑。油墨可用於在基板上製造導電銀跡線,以供電子裝置製造所用。油墨特別可用於以低溫燒結方法在可塑形(如可拉伸)基板上製造導電銀跡線。又,在塑形基板上製造導電銀跡線的方法涉及沉積分子油墨至可塑形基板、乾燥可塑形基板上的油墨,以於可塑形基板上形成含羧酸銀的不導電跡線、將可塑形基板成形以製造塑形基板,使至少一部分的不導電跡線位於塑形基板的塑形部分,及燒結塑形基板,使羧酸銀分解成金屬銀,從而在塑形基板的至少塑形部分上製造導電銀跡線。該方法可降低塑形基板上的導電銀跡線斷裂的可能性。
Description
本申請案係關於油墨,特別係可在較低溫度下燒結及/或能在可塑形基板(如可拉伸基板)上製造導電跡線的油墨。
網版印刷係在撓性基板上製造導電特徵時最常用的技術,印刷電子產業最常見的使用油墨為金屬片狀(flake-based)油墨。片狀油墨會產生厚跡線(>10微米(μm)),所得跡線的線寬一般>100μm。製造導電跡線所需溫度通常超過120℃,然近來已開發兩種市售銀片狀油墨,其可在低至60℃的溫度下燒結,片電阻值分別為20-25和50-60毫歐姆(mΩ)/□/密耳。開發可熱成形或拉伸並保持導電性的油墨也越來越受到關注。然熱成形片狀導電油墨會導致跡線電阻增加(高達10倍)或造成斷裂和不導電跡線。至於可拉伸導電油墨,線性跡線通常無法拉伸超過20%、又不斷線,若需拉伸更多,則必須依曲折圖案印刷。至此所述所有油墨都採用銀片做為導電組分,但印刷技術日益關注使用銀前驅物油墨(即銀分子油墨),因其有潛力能開發非常薄、窄且機械性穩健的跡線。
已知甲酸銀-烷基胺錯合物可在低至25-80℃的溫度下轉化成銀跡線。包含此鹽的噴墨與噴霧基配方據證能製造次100μm的跡線,但甲酸銀只在與特定濃度的胺(即氨、烷基胺等)混合時才穩定,缺少胺時會在室溫下分解。因此,源自甲酸銀鹽的油墨不太適用網版、凹版和柔版印刷,其中油墨散佈於大表面積且易受水蒸發和揮發胺影響,以致在網版或網紋輥/轉移輥上轉化成銀。此外,存在氨會使其不適於在開放製造環境中印刷。有益的是開發室溫穩定且不含有害氣體(如氨)和揮發溶劑的油墨,使油墨得以由更多產業相關方法印刷,例如網版、凹版和柔版印刷。
一選項為使用草酸銀鹽與烷基胺混合,部分係因草酸銀在室溫下穩定得多,直到溫度超過100℃才開始熱分解。然草酸銀與烷基胺混合物據示在120-130℃下燒結後會產生導電性差的浸塗膜。所得膜經光燒結後明顯變得更導電。其他例子顯示在130℃下燒結5分鐘後,噴墨印刷草酸銀鹽/烷基胺混合物可製造體積電阻值約350微歐姆(μΩ).公分(cm)的跡線,若長時間燒結(30-60分鐘),此值將降至25-50μΩ.cm。此外,燒結溫度提高至170℃亦可降低體積電阻率(8-9μΩ.cm)。然溫度高於140℃不適用低溫基板,例如聚對苯二甲酸乙二酯(PET)、聚碳酸酯(PC)、丙烯腈/丁二烯/苯乙烯(ABS)、熱塑性聚胺酯(TPU)和許多織物。
開發適用低溫基板的油墨可導向熱成形和可拉伸導體應用,其通常在具低玻璃轉化溫度的基板上施行。儘管數種片狀銀油墨已特別配製以耐受熱成形/拉伸及保持導電性,但此類油墨在伸長率大於10-20%時易斷裂,導致電阻明顯增加,特別係小於500μm寬的跡線。
最近已開發分子銀油墨平台,其可配製用於網版印刷(國際專利公開案WO 2015/192248,西元2015年12月23日公告)。可網版印刷的分子油墨具有優異印刷性,可用加熱或脈衝光處理而製造具高導電率、穩健機械性質和線寬窄至76μm、分隔36μm的跡線。分子油墨的可貴特徵在於其可印刷、乾燥及隨後燒結(利用熱或脈衝光),以將不導電分子前驅物轉化成導電金屬跡線。
然仍需開發可在較低溫度下形成導電跡線的印刷油墨,特別係用於可低溫熱成形、可拉伸及織物基基板和絲線/紗線。分子油墨用於熱成形應用特別有利,藉此可選擇網版印刷、乾燥、熱成形及隨後光燒結形成跡線,使之變導電。
在一態樣中,提供分子油墨,其包含羧酸銀、有機胺化合物、有機聚合物黏結劑、表面張力改質劑及溶劑。
在另一態樣中,提供在基板上製造導電銀跡線的方法,方法包含沉積分子油墨至基板,以於基板上形成不導電油墨跡線,及 燒結基板上的不導電油墨跡線,以形成導電銀跡線。
在又一態樣中,提供在基板上製造導電銀跡線的方法,方法包含:沉積分子油墨至可塑形基板;乾燥可塑形基板上的油墨,以於可塑形基板上形成含羧酸銀的不導電跡線;將可塑形基板成形以製造塑形基板,使至少一部分的不導電跡線位於塑形基板的塑形部分;及燒結(如光燒結)塑形基板,使羧酸銀分解成金屬銀,從而在塑形基板的至少塑形部分上製造導電銀跡線。
在再一態樣中,提供在基板上製造導電銀跡線的方法,方法包含:沉積分子油墨至可塑形基板上;乾燥及燒結可塑形基板上的油墨,以形成含銀金屬的導電跡線;將可塑形基板成形以製造塑形基板,使至少一部分的導電跡線位於塑形基板的塑形部分,從而在塑形基板的至少塑形部分上製造導電銀跡線。
在另一態樣中,提供在基板上製造導電銀跡線的方法,方法包含:沉積分子油墨至可拉伸基板上;乾燥及燒結可拉伸基板上的油墨,以形成含銀金屬的導電跡線。
在又一態樣中,提供製造導電銀絲線/紗線的方法,方法包含:把絲線/紗線浸泡於分子油墨、移除過量油墨,及熱燒結塗覆絲線/紗線,以形成導電絲線/紗線。
在再一態樣中,提供基板,其包含由上述方法製造的導電銀跡線。
在另一態樣中,提供製造導電銀紗線或絲線的方法,方法包含沉積分子油墨至紗線或絲線上,以形成不導電塗覆紗線或絲線,及燒結不導電紗線/絲線,以形成導電銀絲線/紗線。
在又一態樣中,提供電子裝置,其包含基板並具有由上述方法製造的導電銀跡線。
在再一態樣中,提供電子裝置或服裝,其包含絲線/紗線並塗覆由上述方法製造的導電銀塗料或塗層。
其他特徵將描述於以下詳細實施方式說明或將變得顯而易見。應理解所述每一特徵可任意結合任一或更多其他描述特徵使用,除非對具有通常知識者而言很明確,否則各特徵未必依賴另一特徵存在。
為能更清楚理解,現將參照附圖舉例詳述較佳具體實例,其中:圖1A圖示由本發明低溫分子油墨(NRC-848A3a)製得印刷及燒結跡線的三維輪廓儀映像及由此產生截面,其突顯油墨可達成線寬與線間距(L/S)。
圖1B圖示由低溫分子油墨(NRC-848A3a)製得印刷及燒結跡線的另一三維輪廓儀映像及由此產生截面,其進一步突顯油墨可達成線寬與線間距(L/S)。
圖2A圖示線寬約512μm的導電銀跡線的片電阻(mΩ/□/密耳)對溫度(℃)的曲線圖,其由本發明另一油墨(NRC-849A1)在不同溫度下處理製得。
圖2B圖示線寬約444μm的導電銀跡線的片電阻(mΩ/□/密耳)對溫度(℃)的曲線圖,其由本發明又一油墨(NRC-850A)在不同溫度下處理製得。
圖3圖示由油墨NRC-849A1製造的網版印刷跡線,其在120℃下熱燒結5分鐘,證明當油墨不包括觸變劑且油墨在高溼度(>50%)下印刷時,對跡線形狀的影響。
圖4圖示由油墨NRC-850A1製造的網版印刷跡線,其在120℃下熱燒結5分鐘,證明當油墨包括觸變劑且油墨在高溼度(>50%)下印刷時,對跡線形狀的影響。
圖5圖示油墨NRC-850A2的跡線上視圖,其印刷於甘醇改質聚對苯二甲酸乙二酯(PET-G)基板上、在75℃下乾燥、在梯形上面熱成形,並用15焦耳/平方公分的能量光燒結,以將油墨轉化成銀跡線。
圖6圖示油墨NRC-850A3的跡線上視圖,其印刷於甘醇改質聚對苯二甲酸乙二酯(PET-G)基板上、在75℃下乾燥、在120℃下燒結而將油墨轉化成銀跡線,及隨後在圓頂與半圓柱形上面熱成形。
圖7A圖示由油墨NRC-850A和杜邦(Dupont)的PE873油墨印刷銀線的正規化電阻隨施加應變變化,其中線印刷於臭氧處理 聚酯聚胺酯(American Polyfilm VLM-4001)上。
圖7B圖示由油墨NRC-850A和杜邦的PE873油墨印刷銀線的正規化電阻隨施加應變變化,其中線印刷於聚胺酯軟性熱封膠帶(Bemis ST604)上。
圖8A圖示蛇形圖案,其用於將油墨NRC-850A印刷至聚胺酯上。
圖8B圖示由油墨NRC-850A印刷銀線的正規化電阻隨施加應變變化,其中線印刷於臭氧處理聚酯聚胺酯(American Polyfilm VLM-4001)上。對於”預應變”樣品,當油墨沉積於基板時,聚胺酯基板朝線方向拉伸10%。
圖9A圖示功能性LED的照片,其由本申請案所述分子油墨製備的導電絲線供電。
圖9B圖示單一LED的特寫照片,其利用導電絲線接通穿戴式平台,導電絲線縫合通過平台的電極及通過LED的正(+)電極。注意出自負(-)電極的絲線通向布料背面的穿戴式裝置接地。
銀羧酸較佳為包含銀離子和含羧酸基元之有機基團的有機銀鹽。羧酸鹽較佳包含1至20個碳原子。羧酸鹽較佳為C1-20烷酸鹽。羧酸銀較佳為C1-20烷酸銀鹽。一些非限定羧酸銀實例為甲酸銀、乙酸銀、草酸銀、丙酸銀、丁酸銀、乙基己酸銀、新癸酸銀、五氟丙酸銀、檸檬酸銀、甘醇酸銀、乳酸銀、苯甲酸銀、苯甲酸銀衍生物、三氟乙酸銀、苯乙酸銀、苯乙酸銀衍生物、六氟乙醯丙酮酸銀、異丁醯乙酸銀、苯甲醯乙酸銀、丙醯乙酸銀、乙醯乙酸銀、α-甲基乙醯乙酸銀、α-乙基乙醯乙酸銀和其任何混合物。草酸銀尤佳。一或更多羧酸銀可存於油墨。羧酸銀較佳分散於油墨中。較佳地,油墨不含含銀材料片。
羧酸銀可依任何適量存於油墨,基於油墨總重量計,較佳為約5重量%至約75重量%。更佳地,存在的量為約5重量%至約60重量%、或約5重量%至約50重量%、或約10重量%至約75重量%、或約10重量%至約60重量%、或約10重量%至約45重量%或約25重量%至約40重量%。在特佳具體實例中,存在的量為約30重量%至約35重量%。就 銀含量而論,基於油墨總重量計,銀本身存在的量較佳為約3重量%至約30重量%。更佳地,存在的量為約6重量%至約30重量%或約15重量%至約25重量%。在特佳具體實例中,存在的量為約18重量%至約24重量%。
有機胺化合物可為脂族及/或芳族胺,例如C1-20烷基胺及/或C6-20芳基胺。有機胺化合物可被一或更多其他官能基取代,較佳為極性官能基。其他一些非限定官能基實例包括-OH、-SH、=O、-CHO、-COOH和鹵素(如F、Cl、Br)。較佳地,其他官能基係-OH。特佳有機胺化合物為胺醇,特別係羥烷基胺。羥烷基胺較佳包含2至8個碳原子。一些非限定羥烷基胺實例為1,2-乙醇胺、胺基-2-丙醇、1,3-丙醇胺、1,4-丁醇胺、2-(丁基胺基)乙醇、2-胺基-1-丁醇等。胺基-2-丙醇尤佳。一或更多有機胺化合物可存於油墨。
有機胺可依任何適量存於油墨,基於油墨總重量計,較佳為約10重量%至約75重量%。更佳地,存在的量為約20重量%至約60重量%或約25重量%至約55重量%。在特佳具體實例中,存在的量為約40重量%至約50重量%。
羧酸銀和有機胺化合物會在油墨中形成錯合物。錯合物可包含1:1至1:4的羧酸銀與有機胺化合物莫耳比,例如1:1或1:2或1:3或1:4。羧酸銀與有機胺錯合及交互作用可提供銀金屬前驅物,其可與其他組分配製成分子油墨。
有機聚合物黏結劑可為任何適合聚合物,較佳為熱塑性或彈性聚合物。有機聚合物黏結劑較佳與有機胺化合物相容,是以有機胺化合物混入有機聚合物黏結劑中的混合物不會產生明顯相分離。一些非限定實例為纖維素聚合物、聚丙烯酸酯、聚苯乙烯、聚烯烴、聚乙烯縮醛、聚酯、聚醯亞胺、聚醇、聚胺酯、氟聚合物、氟彈性體和其混合物。有機聚合物黏結劑可為均聚物或共聚物。纖維素聚合物尤佳,例如甲基纖維素、乙基纖維素、乙基甲基纖維素、羥乙基纖維素、羥丙基纖維素、羥乙基甲基纖維素、羥丙基甲基纖維素、乙基羥乙基纖維素、羧甲基纖維素或其混合物。羥乙基纖維素尤佳。
有機聚合物黏結劑可依任何適量存於油墨,基於油墨總 重量計,較佳為約0.05重量%至約10重量%。更佳地,存在的量為約0.1重量%至約5重量%、或約0.2重量%至約2重量%或約0.2重量%至約1重量%。在特佳具體實例中,存在的量為約0.3重量%至約0.95重量%。
表面張力改質劑可為任何適合添加劑,其改善油墨的流動與均塗性質。一些非限定實例為界面活性劑(如陽離子、非離子或陰離子界面活性劑)、醇(如丙醇)、甘醇酸、乳酸和其混合物。乳酸尤佳。若無表面張力改質劑,則油墨製得跡線形狀保持不佳,特別係在潮溼環境,以致產生不均勻特徵。
表面張力改質劑可依任何適量存於油墨,基於油墨總重量計,較佳為約0.1重量%至約5重量%。更佳地,存在的量為約0.5重量%至約4重量%或約0.8重量%至約3重量%。在特佳具體實例中,存在的量為約1重量%至約2.7重量%。
溶劑可為水性或有機溶劑。較佳為有機溶劑或有機溶劑混合物。在一些情況下,可使用一或更多有機溶劑與水性溶劑的混合物。溶劑較佳與有機胺化合物及/或有機聚合物黏結劑相容。溶劑較佳均與有機胺化合物和有機聚合物黏結劑相容。有機胺化合物及/或有機聚合物黏結劑較佳可分散於(如溶於)溶劑中。有機溶劑可為芳族、非芳族、或芳族與非芳族溶劑混合物。芳族溶劑包括如苯、甲苯、乙苯、二甲苯、氯苯、芐醚、苯甲醚、苯甲腈、吡啶、二乙苯、丙苯、異丙苯、異丁苯、對異丙基甲苯、四氫萘、三甲苯(如對稱三甲苯)、四甲苯、對異丙苯或其任何混合物。非芳族溶劑包括如萜、甘醇醚(如二丙二醇甲醚、甲卡必醇、乙卡必醇、丁卡必醇、三伸甘醇與其衍生物)、醇(如甲基環己醇、辛醇、庚醇、異丙醇)或其任何混合物。二丙二醇甲醚尤佳。
溶劑可依任何適量存於油墨,基於油墨總重量計,較佳為約1重量%至約50重量%。更佳地,存在的量為約2重量%至約35重量%或約5重量%至約25重量%。在特佳具體實例中,存在的量為約10重量%至約20重量%。溶劑通常補足油墨的剩餘部分(balance)。
油墨亦可包含消泡劑。消泡劑可為任何適合防沫添加劑。一些非限定實例為氟矽酮、礦物油、植物油、聚矽氧烷、酯蠟、 脂肪醇、甘油、硬脂酸酯、矽酮、聚丙烯系聚醚和其混合物。甘油和聚丙烯系聚醚尤佳。在無消泡劑的情況下,一些印刷跡線在印刷後易保留氣泡,以致產生不均勻跡線。
消泡劑可依任何適量存於油墨,基於油墨總重量計,較佳為約0.0001重量%至約1重量%。更佳地,存在的量為約0.001重量%至約0.1重量%或約0.002重量%至約0.05重量%。在特佳具體實例中,存在的量為約0.005重量%至約0.01重量%。
油墨亦可包含觸變改質劑。觸變改質劑可為任何適合觸變性改良添加劑。一些非限定實例為聚羥基羧酸醯胺、聚胺酯、丙烯酸聚合物、乳膠、聚乙烯醇、苯乙烯/丁二烯、黏土、黏土衍生物、磺酸鹽、膠豆、三仙膠、纖維素、刺槐膠、阿拉伯膠、醣、醣衍生物、酪蛋白、膠原、改質蓖麻油、有機矽酮和其混合物。
觸變改質劑可依任何適量存於油墨,基於油墨總重量計,較佳為約0.05重量%至約1重量%。更佳地,存在的量為約0.1重量%至約0.8重量%。在特佳具體實例中,存在的量為約0.2重量%至約0.5重量%。
油墨的各種組分相對量及/或特定組成在最佳化油墨性能方面扮演很重要的角色。較佳組分量與組成具體實例容許調整油墨的燒結溫度,以適應高溫較不穩健的可塑形基板,同時保持油墨形成導電跡線的高導電率。
油墨可以任何適合方法沉積至基板,以於基板上形成不導電油墨跡線。油墨特別適合用於印刷,例如網版印刷、噴墨印刷、柔版印刷、凹版印刷、平版印刷、噴刷、氣溶膠印刷、排版、打印或任何其他方法。網版印刷尤佳。
沉積至基板後,乾燥及分解不導電跡線內的銀鹽,以形成導電跡線。乾燥及分解可以任何適合技術達成,其中技術和條件取決於待沉積跡線於上的基板類型和油墨中的銀鹽種類。例如,乾燥油墨及分解銀鹽可利用強脈衝UV(紫外)光來加熱及/或光燒結而達成。
在一技術中,加熱基板來乾燥及燒結跡線,以形成導電跡線。燒結將分解銀鹽而形成銀導電粒子(如奈米粒子)。有利地,製 造較薄且高導電銀跡線時,可在約80-140℃的較低溫度範圍進行加熱,特別係約85-140℃,更特別係約90-130℃。雖然低溫燒結能力係油墨的優點,但若有需要,可在更高溫度下進行加熱,例如150℃或以上或高達約250℃。
加熱較佳進行約1小時或以下,更佳為約30分鐘或以下,例如約1-30分鐘或約2-20分鐘,特別係約5-20分鐘。加熱係在溫度與時間充分權衡下進行,以燒結基板上的跡線而形成導電跡線。例如,高導電窄跡線可藉由在120℃下只燒結5分鐘或在90℃下燒結20-40分鐘而形成。加熱設備類型也是燒結所需溫度和時間的因素。燒結可偕同基板在氧化大氣(如空氣)或惰性大氣(如氮及/或氬氣)中進行,但以周圍大氣為佳。
在另一技術中,光燒結系統特徵在於高強度燈具(如脈衝氙燈),其傳送寬頻光譜。燈具可傳送約5-20焦耳/平方公分(J/cm2)的能量至跡線。脈寬較佳為約0.58-1.5毫秒。光燒結可在周圍條件下(如在空氣中)進行。光燒結特別適於聚對苯二甲酸乙二酯、聚碳酸酯和聚醯亞胺基板。
在其他技術中,燒結可利用微波或近紅外(NIR)法進行。
乾燥及燒結基板上油墨所形成的導電跡線可具有任何預定厚度和寬度。有利地,油墨可乾燥及燒結形成較薄及/或窄的導電跡線,同時保持較高導電率(即較低電阻率)。在一些具體實例中,導電跡線的平均厚度為約4微米或以下、或甚至約1.5微米或以下、或甚至約1微米或以下,例如約0.3-1.5微米或約0.4-1微米。在一些具體實例中,導電跡線的標稱線寬為約30密耳或以下、或甚至約20密耳或以下,例如約2-20密耳。片電阻值可小於約30mΩ/□/密耳、或甚至約20mΩ/□/密耳或以下,例如約5-20mΩ/□/密耳。此外,油墨可於基板上提供具較小線寬/間距(L/S)值的導電跡線,此有利其本身用於小型化電子電路。例如,L/S值可小於約100/70μm、甚至小至約42/38μm。
基板可為任何適合表面,特別係可印刷表面。表面例如包括聚對苯二甲酸乙二酯(PET)(如MelinexTM)、非晶聚對苯二甲酸 乙二酯(APET)、甘醇改質聚對苯二甲酸乙二酯(PET-G)、聚萘二甲酸乙二酯、聚烯烴(如二氧化矽填充聚烯烴(TeslinTM))、聚二甲基矽氧烷(PDMS)、聚苯乙烯、聚碳酸酯、聚醯亞胺(如KaptonTM)、熱塑性聚胺酯(TPU)、丙烯腈/丁二烯/苯乙烯、聚苯乙烯、矽酮膜、毛料、絲綢、棉花、亞麻、黃麻、莫代爾、竹子、尼龍、聚酯、壓克力、聚芳醯胺、彈性絲、聚乳交酯、乳膠、織物(如纖維素織物與絲線/紗線)、紙張、玻璃、金屬、介電塗層等。
紗線或絲線可由任何適合材料製成。一些非限定實例為未處理棉花、尼龍、聚酯、乳膠、絲綢、毛料、毛絨、麻布、人造絲、壓克力、竹子、彈性絲等。
較佳為可塑形基板。因油墨可在100℃以下乾燥及燒結形成導電跡線,故油墨適用目前一系列市售可塑形基板。在特定成形條件下,可塑形基板為可撓(如可彎折、可拉伸、可扭轉等)。在一些情況下,可塑形基板在成形後可保持塑形外形,在其他情況下,需要外力使塑形基材保持塑形外形。可塑形基板可以任何適合方式成形成塑形基板,例如熱成形、冷成形、押出、吹塑等。
可塑形基板為可拉伸時,導電銀跡線可拉伸達至少約1.2或至少約0.8的應變,同時保持導電。例如,導電銀跡線可拉伸達約0.1至至少約1.2的應變,同時保持導電。導電銀跡線可拉伸、同時保持導電的應變限度至少部分取決於基板。
油墨有利地提供在塑形基板上製造導電銀跡線的獨特方法。將油墨沉積至可塑形基板,然後乾燥而於可塑形基板上形成含羧酸銀的不導電跡線。接著將可塑形基板成形成得製造塑形基板的預定形狀,使至少一部分的不導電跡線位於塑形基板的塑形部分。接著燒結塑形基板,使羧酸銀分解成金屬銀,以在塑形基板的至少塑形部分上製造導電銀跡線。在此方法中,當基板塑形時,跡線不導電且含有羧酸銀或羧酸銀/有機胺錯合物分散於有機聚合物黏結劑基質中。當利用如熱成形將基板成形成預定形狀時,羧酸銀或羧酸銀/有機胺錯合物和有機聚合物黏結劑基質一起變形,而不會在跡線中產生裂痕。在塑形基板後燒結跡線,所形成的導電銀網質將無或很少裂痕,從而保 持高導電率。
反之,在塑形基板上製造導電銀跡線的先前方法涉及在基板上印刷銀基油墨、硬化油墨以乾燥及燒結基板上的油墨,從而於基板上製造導電銀跡線,然後將基板成形成預定形狀。當油墨硬化時,導電網質已在基板成形前締結。因此,隨著成形方法進行,跡線中的銀粒子(如片狀或奈米粒子)將分開(如因基板形狀改變而拉開),以致在跡線中形成裂痕而降低導電性。此係因基板成形成預定形狀時,伴隨跡線厚度改變所致。拉伸跡線變得更長、更窄、更薄。片狀跡線通常對撓曲與皺摺的機械穩健性較差,且當厚度小於10μm時,較不導電。反之,儘管很薄(如1μm以下),本發明的分子油墨在撓曲及皺摺後仍保持穩健機械性並具高導電性。
亦可沉積油墨至可塑形基板、乾燥油墨,接著將油墨轉化成導電銀跡線,例如利用加熱。接著將可塑形基板成形成得製造塑形基板的預定形狀,使至少一部分的導電跡線位於塑形基板的塑形部分。當基板塑形時,銀跡線保持導電。
基板上的沉積導電跡線可併入電子裝置,例如電路、導電匯流排(如用於光伏電池)、感測器(如觸控感測器、穿戴式感測器)、天線(如RFID天線)、薄膜電晶體、二極體、智慧型包裝(如智慧型藥物包裝)、裝備及/或車輛的適型嵌件,及多層電路和MIM裝置,包括低通濾波器、頻率選擇表面、電晶體和適型表面的天線,其可耐受高溫。油墨能讓電子裝置小型化。
依據表1-6所列組成,配製可低溫處理的分子油墨。依據表4所列組成,配製可低溫處理並具改善可靠印刷性(即除潤和線均勻度改善)的分子油墨。
油墨較佳在配製後不久便使用,但在約-4℃至約4℃的溫度下可儲放更長時間而無明顯分解。此外,倘若儲放於上述溫度範圍,則油墨可從網版回收再利用,以供進一步印刷。
在MelinexTM ST505板上網版印刷油墨NRC-848A3a(不銹鋼,網目數/吋=400;乳化厚度=22.5μm),並在75℃下熱處理6分鐘及在120℃下20分鐘,以於基板上製造幾組四條平行導電銀跡線,如圖1A所示,線寬約42μm、線間距約38μm,如圖1B所示,線寬約85μm、線間距約60μm。定義為線寬與線間距(L/S)的節距分別為42/38和85/65μm。跡線的3D輪廓儀映像及光學輪廓測繪測量的相應截面提供於圖1A和圖1B。
以實施例2所述方式,將二油墨(NRC-849A1和NRC-850A)網版印刷至五個個別Melinex® ST505基板樣品上。每一基板上的跡線在五個不同溫度(91℃、102℃、111℃、121℃、131℃)下熱處理20分鐘,以於各基板上形成導電銀跡線。計算由NRC-849A1和NRC-850A製得導電銀跡線的片電阻值,結果分別繪示於圖2A和圖2B。結果指出,熱處理溫度低至約90℃可獲得小於約40mΩ/□/密耳的片電阻值。使用油墨在可熱成形基板上製造導電銀跡線時,油墨可在 低至約90℃的溫度下熱處理,同時保持良好、趨於極佳的導電電性。導電跡線亦可在低至81℃的溫度下製造,然片電阻值頗高(約650mΩ/□/密耳)。
從表8可知,油墨(NRC-850A)可網版印刷及在120℃下熱處理,以製造測量線寬小至2.8密耳(71μm)與線厚度約0.9μm或以下的導電銀跡線,同時保持片電阻率小於約20mΩ/□/密耳。特別值得注意的是,所測5.5密耳(141μm)至18.9密耳(408μm)跡線的片電阻值為約10mΩ/□/密耳。
在高溼度環境中(溼度>50%),以實施例2所述方式,將油墨NRC-849A1和NRC-850A1網版印刷至Melinex® ST505基板上。每一基板上的跡線在121℃下熱處理20分鐘,以形成導電銀跡線(分別為圖3和圖4)。在無觸變劑的情況下(NRC-849A1,圖3),油墨明顯自表面除潤而產生不均勻斷線的跡線。反之,添加觸變劑時(NRC-850A1,圖4),跡線未自基板表面除潤且保持均勻。
含胺基-2-丙醇與2-胺基-1-丁醇的配方(NRC-850A4) 能在-10至-4℃下儲放而無油墨固化,同時保持類似NRC-850A2和NRC-850A3的電性,其只含胺基-2-丙醇。注意儘管NRC-850A2和NRC-850A3在冷藏期間固化,但隨時間升溫至室溫後可還原成液態油墨。
利用網版印刷,將油墨NRC-850A2網版印刷至甘醇改質聚對苯二甲酸乙二酯(PET-G)(508μm、20密耳厚)板上,以製造各種10公分長、線寬約100μm至約590μm的跡線。印刷後,不導電跡線經乾燥及圍繞不同形狀熱成形,包括梯形、半圓柱形和半球形特徵。熱成形跡線隨後經光燒結(Xenon Sinteron 2000系統),以製造導電跡線。代表性熱成形跡線的照片提供於圖5,橫越導電特徵跡線測量的相應電阻列於表9,證明形成連續銀金屬跡線而不斷裂,其中不導電油墨在熱成形期間、但在燒結前遭變形。表9突顯對照組跡線(即未熱成形者)的測量電阻幾乎和熱成形者一樣,表示跡線的電性不受熱成形處理影響。在一些情況下,橫越熱成形跡線測量電阻實際上小於對照組跡線。此可能係因部分熱成形跡線高於對照組樣品,使該部分更靠近燈具及曝照更強脈衝光。
將油墨NRC-850A3網版印刷至PET-G板上,以製造各種10公分長、測量線寬約100μm至約550μm的跡線。印刷後,跡線在75℃下熱燒結6分鐘及在125℃下15分鐘,以製造一系列導電跡線。跡線隨後圍繞不同形狀熱成形,包括半圓柱和圓頂。代表性熱成形跡線提供於圖6,熱成形跡線的相應電阻列於表10並與對照組跡線相比。雖然熱成形後,跡線的電阻確實增加(1.6至4.5倍,視伸長量而定),但分子油墨製造的熱成形跡線仍為導電。
將油墨NRC-850A和市售油墨Dupont PE873(配製用於可拉伸電子裝置)網版印刷至二熱塑性聚胺酯基板(Bemis軟性熱封膠帶ST604和American Polyfilm,Inc VLM-4001)上。印刷前,以反應臭氧處理VLM-4001聚胺酯基板。印刷跡線呈線性,在150℃下熱燒結15分鐘,寬度為20密耳,長度為4公分。施加應變至樣品,及測量遭受應變的電阻變化。圖7A圖示二油墨在American Polyfilm VLM-4001上的正規化電阻(R/R0,其中R0代表遭受零應變的樣品電阻)隨施加應變變化。圖7B圖示二油墨在Bemis軟性熱封膠帶ST604上的正規化電阻隨施加應變變化。在二基板上,油墨NRC-850A顯示比Dupont PE873更小的正規化電阻隨施加應變變化。此外,NRC-850A在遭受比Dupont PE873更高的應變時仍為導電。
在另一實施例中,聚胺酯基板American Polyfilm VLM-4001經臭氧處理。在兩種條件下,將油墨NRC-850A印刷至聚胺酯基板上。在其一情況下,基板未遭受應變。在第二情況下,基板朝某一方向預應變10%(即在印刷期間,基板拉伸10%)。印刷圖案在電氣接觸墊間包括寬20密耳、長4公分的線性和蛇形跡線。圖8A圖示由270°圓圈重複單元組成的蛇形線。如圖8B所示,測量線性和蛇形跡線的正規化電阻隨施加應變變化。直至超過120%的施加應變,印刷於預應變聚胺酯上的銀蛇形跡線仍為導電,且在120%應變下的電阻比未遭受應變的電阻高150倍。表11比較所有四個條件(蛇形跡線、線性跡線、預應變和未預應變)在40%施加應變下的正規化電阻。
為賦予絲線電性,乃將未處理棉花、尼龍和聚酯絲線浸泡在油墨(NRC-850A3),計1-60分鐘。用拇指與手指擰壓絲線並往上拉,以自絲線移除過量油墨。隨後將所得草酸銀分子油墨浸泡絲線固定到閂在金屬框的扣夾、放入烘箱,及在120-150℃下加熱20分鐘。測量絲線的電阻,以監測製造導電絲線的塗佈進展成效(表12)。實際應用時,絲線可用於將LED(由Adafruit Gemma穿戴式電子平台驅動)併入布料。如圖9A及圖9B所示,就各LED,功率由尼龍線供應至LED的+ve端。棉線用於將接地端附接至左上方LED的-ve端,聚酯絲線用於將接地端附接至右下方LED的-ve端。此證明改質導電絲線儘管遭拉扯穿過布料及縫在LED的眼孔和Gemma穿戴式平台周圍(圖9A及圖9B),但仍強健又保持功能。
具有通常知識者在檢閱說明書後將清楚明白新穎特徵。然應理解申請專利範圍的範圍不應限於具體實例,而當整體觀之給予與申請專利範圍和說明書用字一致的最廣泛解釋。
Claims (38)
- 一種分子油墨,其包含:羧酸銀;有機胺化合物;有機聚合物黏結劑;表面張力改質劑;及溶劑。
- 如申請專利範圍第1項之油墨,其中該羧酸銀包含草酸銀。
- 如申請專利範圍第1或2項之油墨,其中基於該油墨總重量計,該羧酸銀以約10重量%至約60重量%的量存在。
- 如申請專利範圍第1至3項中任一項之油墨,其中該有機胺化合物包含胺基-2-丙醇。
- 如申請專利範圍第1至4項中任一項之油墨,其中該有機胺化合物包含胺基-2-丙醇與2-胺基-1-丁醇的混合物。
- 如申請專利範圍第1至5項中任一項之油墨,其中基於該油墨總重量計,該有機胺化合物以約10重量%至約75重量%的量存在。
- 如申請專利範圍第1至6項中任一項之油墨,其中該羧酸銀和該有機胺化合物形成錯合物或在該油墨中交互作用。
- 如申請專利範圍第1至7項中任一項之油墨,其中該有機聚合物黏結劑與該有機胺化合物相容,是以該有機胺化合物混入該有機聚合物黏結劑中的混合物不會產生明顯相分離。
- 如申請專利範圍第1至8項中任一項之油墨,其中該有機聚合物黏結劑包含羥乙基纖維素。
- 如申請專利範圍第1至9項中任一項之油墨,其中基於該油墨總重量計,該有機聚合物黏結劑以約0.1重量%至約5重量%的量存在。
- 如申請專利範圍第1至10項中任一項之油墨,其中該表面張力改質劑包含甘醇酸或乳酸。
- 如申請專利範圍第1至11項中任一項之油墨,其中基於該油墨總重量計,該表面張力改質劑以約0.5重量%至約4重量%的量存在。
- 如申請專利範圍第1至12項中任一項之油墨,其中該有機胺化合物和該有機聚合物黏結劑可分散於該溶劑中。
- 如申請專利範圍第1至13項中任一項之油墨,其中該溶劑包含二丙二醇甲醚。
- 如申請專利範圍第1至14項中任一項之油墨,其中該溶劑係以提供該油墨之重量剩餘部分(weight balance)的量存在。
- 如申請專利範圍第1至15項中任一項之油墨,更包含消泡劑。
- 如申請專利範圍第16項之油墨,其中該消泡劑包含甘油。
- 如申請專利範圍第16或17項之油墨,其中基於該油墨總重量計,該消泡劑以約0.5重量%至約8重量%的量存在。
- 如申請專利範圍第1至18項中任一項之油墨,更包含觸變改質劑。
- 如申請專利範圍第19項之油墨,其中該觸變改質劑包含聚羥基羧酸醯胺。
- 如申請專利範圍第19或20項之油墨,其中基於該油墨總重量計,該觸變改質劑以約0.1重量%至約0.5重量%的量存在。
- 一種在基板上製造導電銀跡線的方法,該方法包含沉積如申請專利範圍第1至21項中任一項定義之油墨至基板上,以於該基板上形成該油墨的不導電跡線,及燒結該基板上該油墨的不導電跡線,以形成該導電銀跡線。
- 一種在塑形基板上製造導電銀跡線的方法,該方法包含:沉積如申請專利範圍第1至21項中任一項定義之分子油墨至可塑形基板上;乾燥該可塑形基板上的該油墨,以於該可塑形基板上形成含該羧酸銀的不導電跡線;使該可塑形基板成形以製造塑形基板,使至少一部分的該不導電跡線位於該塑形基板的塑形部分;及燒結該塑形基板,使該羧酸銀分解成金屬銀,從而在該塑形基板的至少該塑形部分上製造導電銀跡線。
- 一種在塑形基板上製造導電銀跡線的方法,該方法包含:沉積如申請專利範圍第1至21項中任一項定義之分子油墨至可塑形基板上;乾燥及燒結該可塑形基板上的該油墨,以形成含銀金屬的導電跡線;及使該可塑形基板成形以製造塑形基板,使至少一部分的該導電跡線 位於該塑形基板的塑形部分,從而在該塑形基板的至少該塑形部分上製造導電銀跡線。
- 如申請專利範圍第23或24項之方法,其中該成形包含熱成形。
- 如申請專利範圍第22至25項中任一項之方法、其中該基板包含聚對苯二甲酸乙二酯(PET)、非晶聚對苯二甲酸乙二酯(APET)、甘醇改質聚對苯二甲酸乙二酯(PET-G)、聚烯烴、聚二甲基矽氧烷(PDMS)、聚苯乙烯、聚碳酸酯、聚醯亞胺、熱塑性聚胺酯(TPU)或矽酮膜。
- 如申請專利範圍第23或24項之方法,其中該可塑形基板係可拉伸基板,且當拉伸至約0.1至至少約1.2的應變時,該可拉伸基板上的該導電銀跡線保持導電。
- 如申請專利範圍第22至27項中任一項之方法,其中該燒結係以光燒結進行。
- 如申請專利範圍第22至27項中任一項之方法,其中該燒結係以微波或近紅外(NIR)法進行。
- 如申請專利範圍第22至27項中任一項之方法,其中該燒結係在約80℃至約140℃的溫度下進行。
- 如申請專利範圍第22至30項中任一項之方法,其中該燒結進行約1分鐘至30分鐘的時間。
- 如申請專利範圍第22至31項中任一項之方法,其中該沉積包含網版印刷。
- 一種基板,其包含由如申請專利範圍第1至21項中任一項定義之油墨製造的導電銀跡線。
- 一種電子裝置,其包含如申請專利範圍第33項定義之基板。
- 一種製造導電銀絲線/紗線的方法,該方法包含:把絲線/紗線浸泡於如申請專利範圍第1至21項中任一項定義之油墨,自塗覆絲線/紗線移除過量油墨,及熱燒結該塗覆之絲線/紗線,以形成該導電絲線/紗線。
- 一種製造導電銀絲線/紗線的方法,該方法包含:沉積如申請專利範圍第1至21項中任一項定義之油墨至紗線或絲線上,以形成不導電經塗覆之紗線或絲線,及燒結該不導電紗線/絲線, 以形成該導電銀絲線/紗線。
- 一種紗線或絲線,其包含由如申請專利範圍第1至21項中任一項定義之油墨製造的導電銀塗料或塗層。
- 一種電子裝置或服裝,其包含如申請專利範圍第37項定義之紗線或絲線。
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- 2018-02-08 FI FIEP18751731.3T patent/FI3580284T3/fi active
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- 2018-02-08 CA CA3052742A patent/CA3052742A1/en active Pending
- 2018-02-08 JP JP2019563708A patent/JP7277383B2/ja active Active
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- 2018-02-08 EP EP18751731.3A patent/EP3580284B1/en active Active
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Cited By (1)
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CN113498427A (zh) * | 2019-03-11 | 2021-10-12 | 卡尔斯鲁厄技术研究所 | 用于高度可拉伸的软电子器件的高传导性可印刷油墨及可由其获得的高传导性超可拉伸导体 |
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JP2020510739A (ja) | 2020-04-09 |
EP3580284B1 (en) | 2023-10-25 |
FI3580284T3 (fi) | 2023-12-28 |
JP7277383B2 (ja) | 2023-05-18 |
KR20190108175A (ko) | 2019-09-23 |
WO2018146616A2 (en) | 2018-08-16 |
KR20240005153A (ko) | 2024-01-11 |
US20200017697A1 (en) | 2020-01-16 |
CA3052742A1 (en) | 2018-08-16 |
EP3580284A2 (en) | 2019-12-18 |
US11873409B2 (en) | 2024-01-16 |
CN110382637A (zh) | 2019-10-25 |
EP3580284A4 (en) | 2020-12-09 |
WO2018146616A3 (en) | 2018-09-27 |
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