JP7353185B2 - 熱安定性が改善された分子インク - Google Patents
熱安定性が改善された分子インク Download PDFInfo
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- JP7353185B2 JP7353185B2 JP2019563709A JP2019563709A JP7353185B2 JP 7353185 B2 JP7353185 B2 JP 7353185B2 JP 2019563709 A JP2019563709 A JP 2019563709A JP 2019563709 A JP2019563709 A JP 2019563709A JP 7353185 B2 JP7353185 B2 JP 7353185B2
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
- C09D11/037—Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/12—Stencil printing; Silk-screen printing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/22—Metallic printing; Printing with powdered inks
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
- C09D11/033—Printing inks characterised by features other than the chemical nature of the binder characterised by the solvent
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/102—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/102—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
- C09D11/104—Polyesters
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/0257—Nanoparticles
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1131—Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1136—Conversion of insulating material into conductive material, e.g. by pyrolysis
Description
例1:ネオデカン酸銀インク
ネオデカン酸銀(AgND)ベースのインクを表1に記載のように配合した。インクI1を本発明に従って配合し、インクC1はAgNDベースのインクの他の配合物の比較例である。インクは、すべての成分を混合し、溶液が均一になるまでプレナリーミキサーで混合することによって調製した。2つのポリマーバインダーのうちの1つを次のインク:Rokrapol(商標)7075(ポリエステル)またはエチルセルロース46cPに添加した。
Claims (15)
- カルボン酸銀と;溶媒と;ヒドロキシルおよび/またはカルボキシル末端ポリエステルを含むポリマーバインダーとを含む分子インクであって、
前記カルボン酸銀が、前記インクの総重量に基づいて、前記インク中に24重量%以上の銀装填量を提供する量で前記インク中に存在する、
分子インク。 - 前記カルボン酸銀が、インクの総重量に基づいて、60重量%以上の量でネオデカン酸銀を含む、請求項1に記載のインク。
- 前記ネオデカン酸銀が、インクの総重量に基づいて、80重量%以上の量でインク中に存在する、請求項2に記載のインク。
- 前記ポリマーバインダーが、インクの総重量に基づいて、0.5重量%~3重量%の量で存在する、請求項1~3のいずれか一項に記載のインク。
- 前記溶媒がテルペンアルコールを含む、請求項1~4のいずれか一項に記載のインク。
- 前記溶媒がα-テルピネオールを含む、請求項1~4のいずれか一項に記載のインク。
- 前記溶媒が、インクの総重量に基づいて、10重量%~40重量%の範囲の量でインク中に存在する、請求項5又は6に記載のインク。
- 31000cPから180000cPの範囲の粘度を有する、請求項1~7のいずれか一項に記載のインク。
- 基板上に導電性銀トレースを生成する方法であって、請求項1~8のいずれか一項に記載のインクを基板上に堆積させて、基板上にインクの非導電性トレースを形成し、基板上のインクの非導電性トレースを焼結して、導電性銀トレースを形成することを含む、方法。
- 前記焼結が、1分~180分の範囲内の時間で180℃以上の温度で行われる、請求項9に記載の方法。
- 前記基板が、ポリエチレンテレフタレート、ポリオレフィン、ポリジメチルシロキサン、ポリスチレン、アクリロニトリル/ブタジエン/スチレン、ポリカーボネート、ポリイミド、熱可塑性ポリウレタン、シリコーンメンブレン、ウール、シルク、コットン、亜麻、ジュート、モーダル、竹、ナイロン、ポリエステル、アクリル、アラミド、スパンデックス、ポリラクチド、紙、ガラス、金属または誘電体コーティングを含む、請求項9又は10に記載の方法。
- 前記堆積がスクリーン印刷を含む、請求項9~11のいずれか一項に記載の方法。
- 請求項1~8のいずれか一項に記載のインクから生成した導電性銀トレースを含む基板。
- 前記トレースが、少なくとも1時間、230℃を超える温度にさらされた後の、ASTM F1683-09に従った折り曲げ試験および折り目試験で10%以下の抵抗変化を示す、請求項13に記載の基板。
- 請求項13又は14に記載の基板を含む電子装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201762456300P | 2017-02-08 | 2017-02-08 | |
US62/456,300 | 2017-02-08 | ||
PCT/IB2018/050789 WO2018146617A1 (en) | 2017-02-08 | 2018-02-08 | Molecular ink with improved thermal stability |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2020507669A JP2020507669A (ja) | 2020-03-12 |
JP2020507669A5 JP2020507669A5 (ja) | 2021-03-11 |
JP7353185B2 true JP7353185B2 (ja) | 2023-09-29 |
Family
ID=63107342
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019563709A Active JP7353185B2 (ja) | 2017-02-08 | 2018-02-08 | 熱安定性が改善された分子インク |
Country Status (9)
Country | Link |
---|---|
US (1) | US11472980B2 (ja) |
EP (1) | EP3580283B1 (ja) |
JP (1) | JP7353185B2 (ja) |
KR (1) | KR102605046B1 (ja) |
CN (1) | CN110382636B (ja) |
CA (1) | CA3052749A1 (ja) |
FI (1) | FI3580283T3 (ja) |
TW (1) | TW201842087A (ja) |
WO (1) | WO2018146617A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3597707B1 (de) * | 2018-07-19 | 2021-10-06 | Heraeus Deutschland GmbH & Co. KG | Formulierung zum applizieren auf glas, porzellan, fliesen, metallen und kunststofffolien |
US11970627B2 (en) | 2020-01-21 | 2024-04-30 | Heraeus Deutschland GmbH & Co. KG | Formulation for application onto glass, porcelain, tiles, metals and plastic foil |
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KR102605046B1 (ko) | 2023-11-22 |
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US20200010706A1 (en) | 2020-01-09 |
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