JP7242557B2 - 低粘度及び低処理温度を有する銀分子インク - Google Patents
低粘度及び低処理温度を有する銀分子インク Download PDFInfo
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- JP7242557B2 JP7242557B2 JP2019563711A JP2019563711A JP7242557B2 JP 7242557 B2 JP7242557 B2 JP 7242557B2 JP 2019563711 A JP2019563711 A JP 2019563711A JP 2019563711 A JP2019563711 A JP 2019563711A JP 7242557 B2 JP7242557 B2 JP 7242557B2
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- CLDWGXZGFUNWKB-UHFFFAOYSA-M silver;benzoate Chemical compound [Ag+].[O-]C(=O)C1=CC=CC=C1 CLDWGXZGFUNWKB-UHFFFAOYSA-M 0.000 description 1
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- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/22—Metallic printing; Printing with powdered inks
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
- C09D11/037—Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/102—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/102—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
- C09D11/104—Polyesters
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Nanotechnology (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Conductive Materials (AREA)
Description
一連のネオデカン酸銀(AgND)系インクを、表1に記載のように配合した。インクI1、I2及びI3は本発明に従って配合され、インクC1及びC2はAgND系インクの他の配合物の比較試料である。インクは、インクの分解温度に影響を与える様々な種類の担体を有する。各インクは、担体の最大重量分率を構成する異なる成分、すなわちオクタノール(インクI1及びインクC2)、アルキルアミン(インクI2)、オキサゾリン(インクI3)並びにテルペンアルコール(インクC1)を有する。
Claims (15)
- 分子インクであって、
インクの総重量を基準として、インク中に23重量%以上の銀充填量をもたらす量でインク中に存在する、カルボン酸銀;
インクの総重量を基準として5重量%~50重量%の有機アミンであって、アルキルアミン、ヒドロキシアルキルアミン又は環状アミンを含む、有機アミン;並びに
インクの総重量を基準として0.1重量%~10重量%の高分子バインダーであって、ポリエステル、ポリイミド、ポリエーテルイミド又はそれらの任意の混合物を含み、当該高分子バインダーを前記有機アミンと相溶性にする官能基を有し、当該官能基は、ヒドロキシル基、カルボキシル基、アミノ基及びスルホニル基のうちの1つ又は複数である、高分子バインダー、
を含み、前記カルボン酸銀はネオデカン酸銀である、分子インク。 - 前記ネオデカン酸銀が、前記インクの総重量を基準として70重量%以上の量で存在する、請求項1に記載のインク。
- 前記有機アミンが、ピリジン、ピリミジン、ピロール、ピロリジン、オキサゾリン、ピペリジン、イソオキサゾール又はモルホリンを含む、請求項1又は2に記載のインク。
- 前記有機アミンが、アミノ-2-プロパノール、2-エチル-1-ヘキシルアミン又は2-エチル-2-オキサゾリンを含む、請求項1又は2に記載のインク。
- 前記高分子バインダーが、ヒドロキシル末端及び/又はカルボキシル末端ポリエステルを含む、請求項1~4のいずれか一項に記載のインク。
- 前記高分子バインダーが、前記インクの総重量を基準として0.5重量%~10重量%の量で存在する、請求項1~5のいずれか一項に記載のインク。
- 溶媒を、前記インクの総重量を基準として5重量%から40重量%の範囲内の量でさらに含む、請求項1~6のいずれか一項に記載のインク。
- 前記溶媒が、オクタノールを含む、請求項7に記載のインク。
- 20.5℃でULアダプターを有するBrookfield RV-DV-IIIウルトラレオメータを使用して測定された、1cP~15,000cPの粘度を有する、請求項1~8のいずれか一項に記載のインク。
- 基板上に導電性銀トレースを製造する方法であって、請求項1~9のいずれか一項に定義のインクを基板上に堆積させて、前記基板上に前記インクの非導電性トレースを形成する工程と、前記基板上の前記インクの前記非導電性トレースを焼結して、前記導電性銀トレースを形成する工程とを含む方法。
- 前記焼結が、150℃~175℃の範囲内の温度で、1分~120分の範囲内の時間にわたって行われる、請求項10に記載の方法。
- 前記基板が、ポリエチレンテレフタラート、ポリオレフィン、ポリジメチルシロキサン、ポリスチレン、アクリロニトリル/ブタジエン/スチレン、ポリカーボネート、ポリイミド、熱可塑性ポリウレタン、シリコーン膜、ウール、シルク、綿、亜麻、ジュート、モーダル、竹、ナイロン、ポリエステル、アクリル、アラミド、スパンデックス、ポリラクチド、紙、ガラス、コーティングガラス、金属又は誘電体コーティングを含む、請求項10又は11に記載の方法。
- 前記堆積が、印刷を含む、請求項10~12のいずれか一項に記載の方法。
- 請求項1~9のいずれか一項に定義のインクから製造された導電性銀トレースを備える基板。
- 請求項14に定義の基板を備える電子デバイス。
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