KR20070097055A - 도전성 잉크 - Google Patents

도전성 잉크 Download PDF

Info

Publication number
KR20070097055A
KR20070097055A KR20077015677A KR20077015677A KR20070097055A KR 20070097055 A KR20070097055 A KR 20070097055A KR 20077015677 A KR20077015677 A KR 20077015677A KR 20077015677 A KR20077015677 A KR 20077015677A KR 20070097055 A KR20070097055 A KR 20070097055A
Authority
KR
South Korea
Prior art keywords
conductive ink
nickel
powder
metal
preferable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR20077015677A
Other languages
English (en)
Korean (ko)
Inventor
요이치 카미코리야마
스미카즈 오가타
케이 아나이
히로키 사와모토
미키마사 호리우치
타카시 무쿠노
카츠히코 요시마루
Original Assignee
미쓰이 긴조꾸 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 미쓰이 긴조꾸 고교 가부시키가이샤 filed Critical 미쓰이 긴조꾸 고교 가부시키가이샤
Publication of KR20070097055A publication Critical patent/KR20070097055A/ko
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0239—Coupling agent for particles

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Dispersion Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Nanotechnology (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Conductive Materials (AREA)
  • Ink Jet (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Powder Metallurgy (AREA)
  • Manufacturing Of Printed Wiring (AREA)
KR20077015677A 2004-12-27 2005-12-26 도전성 잉크 Withdrawn KR20070097055A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2004375893 2004-12-27
JPJP-P-2004-00375893 2004-12-27
JP2005048662A JP4799881B2 (ja) 2004-12-27 2005-02-24 導電性インク
JPJP-P-2005-00048662 2005-02-24

Publications (1)

Publication Number Publication Date
KR20070097055A true KR20070097055A (ko) 2007-10-02

Family

ID=36614864

Family Applications (1)

Application Number Title Priority Date Filing Date
KR20077015677A Withdrawn KR20070097055A (ko) 2004-12-27 2005-12-26 도전성 잉크

Country Status (6)

Country Link
US (1) US8043535B2 (enExample)
EP (1) EP1847575A4 (enExample)
JP (1) JP4799881B2 (enExample)
KR (1) KR20070097055A (enExample)
TW (1) TW200636027A (enExample)
WO (1) WO2006070747A1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100817856B1 (ko) * 2007-07-13 2008-03-31 주식회사 신우테크 감시카메라용 투명히터판
KR101300215B1 (ko) * 2008-03-05 2013-09-02 이시하라 야쿠힌 가부시끼가이샤 용매­ 및 수­기재 금속계 전도성 잉크용 첨가제 및 변형제
KR20140085551A (ko) * 2011-10-28 2014-07-07 나노그레이드 아게 용액-처리 가능한 산화 텅스텐 완충 층 및 이를 포함하는 유기 전자 기기

Families Citing this family (68)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006328532A (ja) * 2005-05-10 2006-12-07 Samsung Electro-Mechanics Co Ltd 金属ナノ粒子、これを製造する方法及び導電性インク
CN101194041B (zh) * 2005-06-17 2010-12-15 住友金属矿山株式会社 镍膜形成用涂布液与镍膜及其制造方法
JP5065613B2 (ja) 2006-04-10 2012-11-07 三井金属鉱業株式会社 ニッケルインク
US20100151267A1 (en) * 2006-06-19 2010-06-17 Cabot Corporation Metal-containing nanoparticles, their synthesis and use
TWI399759B (zh) 2006-06-30 2013-06-21 Mitsubishi Materials Corp 形成太陽電池之電極用組成物及該電極之形成方法以及使用依該形成方法所得電極之太陽電池
KR100790457B1 (ko) * 2006-07-10 2008-01-02 삼성전기주식회사 금속 나노입자의 제조방법
JP5309521B2 (ja) * 2006-10-11 2013-10-09 三菱マテリアル株式会社 電極形成用組成物及びその製造方法並びに該組成物を用いた電極の形成方法
WO2008047641A1 (en) * 2006-10-11 2008-04-24 Mitsubishi Materials Corporation Composition for electrode formation and method for forming electrode by using the composition
JP5151150B2 (ja) * 2006-12-28 2013-02-27 株式会社日立製作所 導電性焼結層形成用組成物、これを用いた導電性被膜形成法および接合法
JP4994086B2 (ja) * 2007-04-03 2012-08-08 旭化成イーマテリアルズ株式会社 金属薄膜前駆体分散液
JP5169389B2 (ja) 2007-04-19 2013-03-27 三菱マテリアル株式会社 導電性反射膜の製造方法
US8404160B2 (en) * 2007-05-18 2013-03-26 Applied Nanotech Holdings, Inc. Metallic ink
US8058195B2 (en) 2007-06-19 2011-11-15 Cabot Corporation Nanoglass and flame spray processes for producing nanoglass
JP2009079239A (ja) * 2007-09-25 2009-04-16 Sumitomo Electric Ind Ltd ニッケル粉末、またはニッケルを主成分とする合金粉末およびその製造方法、導電性ペースト、並びに積層セラミックコンデンサ
KR101000684B1 (ko) * 2007-10-11 2010-12-10 세종대학교산학협력단 이산화티타늄 나노튜브분말 및 이를 이용한 고압수소저장탱크 삽입용 판형 필름의 제조방법
JP5166844B2 (ja) * 2007-12-07 2013-03-21 三井金属鉱業株式会社 Ｉｔｏインク
US20100025848A1 (en) * 2008-08-04 2010-02-04 Infineon Technologies Ag Method of fabricating a semiconductor device and semiconductor device
JP5544774B2 (ja) * 2008-08-27 2014-07-09 三菱マテリアル株式会社 多接合型太陽電池
WO2010023920A1 (ja) * 2008-08-27 2010-03-04 三菱マテリアル株式会社 太陽電池用透明導電膜及びその透明導電膜用組成物、多接合型太陽電池
US20110139228A1 (en) * 2008-08-27 2011-06-16 Mitsubishi Materials Corporation Transparent electroconductive film for solar cell, composition for transparent electroconductive film and multi-junction solar cell
CN101754585B (zh) 2008-11-27 2011-09-21 富葵精密组件(深圳)有限公司 导电线路的制作方法
JP2010225287A (ja) * 2009-03-19 2010-10-07 Hitachi Maxell Ltd 透明導電膜形成用インク及び透明導電膜
KR101055625B1 (ko) * 2009-11-06 2011-08-10 에이비씨나노텍 주식회사 배선용 잉크 조성물 및 이를 이용한 구리 배선의 형성방법
DE102009053688A1 (de) 2009-11-19 2011-05-26 Ferro Gmbh Siebdruckfähige Zusammensetzung und Verfahren zur Herstellung einer leitfähigen und transparenten Schicht
KR20110139941A (ko) * 2010-06-24 2011-12-30 삼성전기주식회사 금속 잉크 조성물 및 이를 이용한 금속 배선 형성 방법, 그리고 상기 금속 잉크 조성물로 형성된 도전성 패턴
KR20110139942A (ko) * 2010-06-24 2011-12-30 삼성전기주식회사 금속 잉크 조성물 및 이를 이용한 금속 배선 형성 방법, 그리고 상기 금속 잉크 조성물로 형성된 도전성 패턴
KR101276237B1 (ko) * 2010-12-02 2013-06-20 한국기계연구원 저온소결 전도성 금속막 및 이의 제조방법
CN102675964B (zh) * 2011-02-02 2014-09-03 日本特殊陶业株式会社 油墨及设备
JP5689081B2 (ja) 2011-02-02 2015-03-25 日本特殊陶業株式会社 インク及びデバイス
JP5923894B2 (ja) 2011-02-17 2016-05-25 セイコーエプソン株式会社 インクジェット記録方法
WO2012118582A1 (en) 2011-02-28 2012-09-07 Nthdegree Technologies Worldwide Inc. Metallic nanofiber ink, substantially transparent conductor, and fabrication method
US10494720B2 (en) 2011-02-28 2019-12-03 Nthdegree Technologies Worldwide Inc Metallic nanofiber ink, substantially transparent conductor, and fabrication method
JP5624915B2 (ja) * 2011-03-03 2014-11-12 株式会社アルバック 金属ナノ粒子分散液
KR101853695B1 (ko) * 2011-03-08 2018-05-02 디아이씨 가부시끼가이샤 잉크젯 기록용 도전성 수성 잉크
DE102011016335B4 (de) * 2011-04-07 2013-10-02 Universität Konstanz Nickelhaltige und ätzende druckbare Paste sowie Verfahren zur Bildung von elektrischen Kontakten beim Herstellen einer Solarzelle
JP5957187B2 (ja) * 2011-06-23 2016-07-27 株式会社アルバック 金属微粒子の製造方法
US10590295B2 (en) * 2012-02-29 2020-03-17 Singapore Asahi Chemical & Solder Ind. Pte. Ltd Inks containing metal precursors nanoparticles
JP2015110682A (ja) * 2012-03-21 2015-06-18 旭硝子株式会社 導電インク、導体付き基材、および導体付き基材の製造方法
TW201349254A (zh) 2012-04-17 2013-12-01 Heraeus Precious Metals North America Conshohocken Llc 用於太陽能電池接點的導電厚膜膏
JP2014028740A (ja) * 2012-04-17 2014-02-13 Heraeus Precious Metals North America Conshohocken Llc 太陽電池接点用導電性厚膜ペーストのためのテルル無機反応系
US10329444B2 (en) 2012-12-28 2019-06-25 Printed Energy Pty Ltd Nickel inks and oxidation resistant and conductive coatings
KR101796452B1 (ko) * 2012-12-31 2017-11-13 주식회사 아모그린텍 연성인쇄회로기판 및 그 제조 방법
JP2014199720A (ja) * 2013-03-29 2014-10-23 富士フイルム株式会社 導電膜形成用組成物およびこれを用いる導電膜の製造方法
JP6032110B2 (ja) * 2013-04-17 2016-11-24 株式会社豊田中央研究所 金属ナノ粒子材料、それを含有する接合材料、およびそれを用いた半導体装置
US9799421B2 (en) 2013-06-07 2017-10-24 Heraeus Precious Metals North America Conshohocken Llc Thick print copper pastes for aluminum nitride substrates
EP2822000B1 (en) * 2013-07-03 2020-10-21 Heraeus Precious Metals North America Conshohocken LLC Thick print copper pastes for aluminium nitride substrates
JP6132716B2 (ja) * 2013-09-10 2017-05-24 株式会社東芝 金属粒子ペースト、これを用いた硬化物、および半導体装置
CN111545770A (zh) * 2013-10-24 2020-08-18 株式会社大赛璐 含有银纳米粒子的分散液的制造方法及含有银纳米粒子的分散液
US9540734B2 (en) * 2013-11-13 2017-01-10 Xerox Corporation Conductive compositions comprising metal carboxylates
JP2015160151A (ja) * 2014-02-26 2015-09-07 セイコーエプソン株式会社 分散液およびその製造方法、製造装置
EP3188314B1 (en) * 2014-08-29 2021-07-07 Mitsui Mining & Smelting Co., Ltd. Conductor connection structure, method for producing same, conductive composition, and electronic component module
BR112017016097B1 (pt) * 2015-02-12 2021-01-19 Avantama Ag dispositivo optoeletrônico, bem intermediário, composição, seu uso, método para fabricação de bem intermediário e método para fabricação de dispositivo eletrônico
US11673289B2 (en) 2016-02-16 2023-06-13 Arizona Board Of Regents On Behalf Of Arizona State University Fabricating metal or ceramic components using 3D printing with dissolvable supports of a different material
WO2018013178A1 (en) 2016-07-15 2018-01-18 Arizona Board Of Regents On Behalf Of Arizona State University Dissolving metal supports in 3d printed metals and ceramics using sensitization
EP3287499B1 (en) * 2016-08-26 2021-04-07 Agfa-Gevaert Nv A metallic nanoparticle dispersion
US10286713B2 (en) 2016-10-11 2019-05-14 Arizona Board Of Regents On Behalf Of Arizona State University Printing using reactive inks and conductive adhesion promoters
WO2018118460A1 (en) 2016-12-24 2018-06-28 Electroninks Incorporated Copper based conductive ink composition and method of making the same
TWI874294B (zh) 2017-02-08 2025-03-01 加拿大國家研究委員會 可印刷分子油墨
TW201842087A (zh) 2017-02-08 2018-12-01 加拿大國家研究委員會 具改良之熱穩定性的分子油墨
TWI842668B (zh) 2017-02-08 2024-05-21 加拿大國家研究委員會 具低黏度與低加工溫度之銀分子油墨
JP2017162824A (ja) * 2017-04-17 2017-09-14 株式会社東芝 金属粒子ペースト、これを用いた硬化物、および半導体装置
WO2018213640A1 (en) 2017-05-17 2018-11-22 Mariana Bertoni Systems and methods for controlling the morphology and porosity of printed reactive inks for high precision printing
TWI856947B (zh) * 2017-08-01 2024-10-01 加拿大國家研究委員會 銅墨水
JP7031258B2 (ja) * 2017-11-30 2022-03-08 住友金属鉱山株式会社 ニッケルスラリー、ニッケルスラリーの製造方法およびニッケルペーストの製造方法
CA3085837A1 (en) * 2017-12-22 2019-06-27 National Research Council Of Canada Copper ink for high conductivity fine printing
TWI678711B (zh) * 2018-11-01 2019-12-01 磐采股份有限公司 導電漿料組合物及應用該導電漿料組合物之太陽能電池
JP7286404B2 (ja) * 2019-04-26 2023-06-05 キヤノン株式会社 ニッケル粒子分散液及びこれを用いた物品の製造方法
CN111496266A (zh) * 2020-05-09 2020-08-07 哈尔滨工业大学(深圳)(哈尔滨工业大学深圳科技创新研究院) 一种绿色环保的导电纳米铜墨水及其制备方法

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2111072A (en) * 1981-12-08 1983-06-29 Johnson Matthey Plc Ultra violet-curable ink or paint containing electrically conductive metal particles
DE69121449T2 (de) * 1990-04-12 1997-02-27 Matsushita Electric Ind Co Ltd Leitende Tintenzusammensetzung und Verfahren zum Herstellen eines dickschichtigen Musters
JPH0537126A (ja) * 1991-07-30 1993-02-12 Toshiba Corp 金属酸化物を用いた配線基板および情報記録媒体
JPH0818190A (ja) 1994-06-24 1996-01-19 Cmk Corp プリント配線板の製造方法
JP3229163B2 (ja) * 1995-04-04 2001-11-12 キヤノン株式会社 有機金属錯体、導電性膜形成用材料、並びにそれを用いた電子放出素子、電子源、表示パネルおよび画像形成装置の製造方法
JP2761866B2 (ja) 1996-03-04 1998-06-04 東海ゴム工業株式会社 プリント回路体及びその製造方法
US6356234B1 (en) * 1996-06-12 2002-03-12 R T Microwave Limited Electrical circuit
JP4298069B2 (ja) * 1999-06-30 2009-07-15 ハリマ化成株式会社 回路描画用導電性ペーストおよび回路印刷方法
JP2002194287A (ja) * 2000-12-27 2002-07-10 Sumitomo Osaka Cement Co Ltd 透明導電膜形成用塗料および透明導電膜と表示装置
TW507500B (en) * 2001-01-09 2002-10-21 Sumitomo Rubber Ind Electrode plate for plasma display panel and manufacturing method thereof
TW522062B (en) * 2001-02-15 2003-03-01 Mitsui Mining & Smelting Co Aqueous nickel slurry, method for preparing the same and conductive paste
JP3903374B2 (ja) * 2001-02-15 2007-04-11 三井金属鉱業株式会社 水性ニッケルスラリー、その製造方法及び導電ペースト
JP3774638B2 (ja) 2001-04-24 2006-05-17 ハリマ化成株式会社 インクジェット印刷法を利用する回路パターンの形成方法
JP3764349B2 (ja) 2001-05-07 2006-04-05 ハリマ化成株式会社 金属微粒子分散液を用いたメッキ代替導電性金属皮膜の形成方法
IL161622A0 (en) * 2001-11-01 2004-09-27 Yissum Res Dev Co Ink jet inks containing metal nanoparticles
JP2004143571A (ja) * 2001-11-22 2004-05-20 Fuji Photo Film Co Ltd 導電パターン描画用基板およびインク、ならびに導電パターンの形成方法
US20030146019A1 (en) * 2001-11-22 2003-08-07 Hiroyuki Hirai Board and ink used for forming conductive pattern, and method using thereof
WO2003051562A1 (en) * 2001-12-18 2003-06-26 Asahi Kasei Kabushiki Kaisha Metal oxide dispersion
US6780772B2 (en) * 2001-12-21 2004-08-24 Nutool, Inc. Method and system to provide electroplanarization of a workpiece with a conducting material layer
JP2003272453A (ja) * 2002-03-13 2003-09-26 Kanegafuchi Chem Ind Co Ltd 半導電性無機フィラー及びその製造方法ならびに半導電性樹脂組成物
US7566360B2 (en) * 2002-06-13 2009-07-28 Cima Nanotech Israel Ltd. Nano-powder-based coating and ink compositions
EP2154212A1 (en) * 2002-06-13 2010-02-17 Cima Nano Tech Israel Ltd A method for the production of conductive and transparent nano-coatings
KR20060012545A (ko) * 2002-07-03 2006-02-08 나노파우더스 인더스트리어스 리미티드. 저온 소결처리한 전도성 나노 잉크 및 이것의 제조 방법
JP4365075B2 (ja) 2002-08-23 2009-11-18 トッパン・フォームズ株式会社 軟ろう金属微粒子を含有する導電性インキ
JP4416080B2 (ja) * 2003-01-29 2010-02-17 富士フイルム株式会社 プリント配線基板形成用インク、プリント配線基板の形成方法及びプリント配線基板
JP2004277627A (ja) * 2003-03-18 2004-10-07 Asahi Kasei Corp インクジェット用インクおよびこれを用いた金属含有薄膜の形成方法
US7683107B2 (en) * 2004-02-09 2010-03-23 E.I. Du Pont De Nemours And Company Ink jet printable thick film compositions and processes
US20050173680A1 (en) * 2004-02-10 2005-08-11 Haixin Yang Ink jet printable thick film ink compositions and processes
JP5550904B2 (ja) * 2006-08-07 2014-07-16 インクテック カンパニー リミテッド 銀ナノ粒子の製造方法、及び薄膜形成方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100817856B1 (ko) * 2007-07-13 2008-03-31 주식회사 신우테크 감시카메라용 투명히터판
KR101300215B1 (ko) * 2008-03-05 2013-09-02 이시하라 야쿠힌 가부시끼가이샤 용매­ 및 수­기재 금속계 전도성 잉크용 첨가제 및 변형제
KR20140085551A (ko) * 2011-10-28 2014-07-07 나노그레이드 아게 용액-처리 가능한 산화 텅스텐 완충 층 및 이를 포함하는 유기 전자 기기

Also Published As

Publication number Publication date
US8043535B2 (en) 2011-10-25
US20080134936A1 (en) 2008-06-12
WO2006070747A1 (ja) 2006-07-06
JP4799881B2 (ja) 2011-10-26
TW200636027A (en) 2006-10-16
EP1847575A1 (en) 2007-10-24
JP2006210301A (ja) 2006-08-10
EP1847575A4 (en) 2008-05-07
TWI377237B (enExample) 2012-11-21

Similar Documents

Publication Publication Date Title
KR20070097055A (ko) 도전성 잉크
EP1835512B1 (en) Conductive ink
EP1586604B1 (en) Process for producing a conductive silver paste and conductive film
JP3774638B2 (ja) インクジェット印刷法を利用する回路パターンの形成方法
US8999204B2 (en) Conductive ink composition, method for manufacturing the same, and method for manufacturing conductive thin layer using the same
US20100025639A1 (en) Silver particle composite powder and process production thereof
EP2774962B1 (en) Viscosity modifier for high concentration dispersion of inorganic fine particles and high concentration dispersion of inorganic fine particles containing the same
KR20080069606A (ko) 니켈 잉크 및 그 니켈 잉크로 형성한 도체막
WO2018169012A1 (ja) 分散体並びにこれを用いた導電性パターン付構造体の製造方法及び導電性パターン付構造体
KR102260398B1 (ko) 금속 나노 미립자의 제조 방법
EP3246115B1 (en) Silver powder
CN101036199A (zh) 导电性油墨
JP2006348160A (ja) 導電性インク
JP6060225B1 (ja) 銅粉及びその製造方法
KR20140047663A (ko) 은미립자 및 이 은미립자를 함유하는 도전성 페이스트, 도전성 막 및 전자 디바이스
CN101316902A (zh) 镍油墨及用该镍油墨形成的导体膜
JP2019210469A (ja) インクジェット用酸化銅インク及びこれを用いて導電性パターンを付与した導電性基板の製造方法
JP4756628B2 (ja) 水系ｉｔｏインク
KR101116752B1 (ko) 이산화루테늄 나노분말 및 이의 제조방법

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

PC1203 Withdrawal of no request for examination

St.27 status event code: N-1-6-B10-B12-nap-PC1203

WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid
P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000