TWI338196B - - Google Patents

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Publication number
TWI338196B
TWI338196B TW095132736A TW95132736A TWI338196B TW I338196 B TWI338196 B TW I338196B TW 095132736 A TW095132736 A TW 095132736A TW 95132736 A TW95132736 A TW 95132736A TW I338196 B TWI338196 B TW I338196B
Authority
TW
Taiwan
Prior art keywords
photoresist
film
forming composition
pattern
group
Prior art date
Application number
TW095132736A
Other languages
English (en)
Chinese (zh)
Other versions
TW200728923A (en
Inventor
Yoshinori Sakamoto
Naoki Yamashita
Kiyoshi Ishikawa
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Publication of TW200728923A publication Critical patent/TW200728923A/zh
Application granted granted Critical
Publication of TWI338196B publication Critical patent/TWI338196B/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/035—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyurethanes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82B—NANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS, MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES AS DISCRETE UNITS; MANUFACTURE OR TREATMENT THEREOF
    • B82B1/00—Nanostructures formed by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82B—NANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS, MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES AS DISCRETE UNITS; MANUFACTURE OR TREATMENT THEREOF
    • B82B3/00—Manufacture or treatment of nanostructures by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1002—Methods of surface bonding and/or assembly therefor with permanent bending or reshaping or surface deformation of self sustaining lamina
    • Y10T156/1039—Surface deformation only of sandwich or lamina [e.g., embossed panels]
    • Y10T156/1041—Subsequent to lamination
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Nanotechnology (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Power Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Silicon Polymers (AREA)
TW095132736A 2005-09-09 2006-09-05 Film forming composition for nanoimprint and pattern forming method TW200728923A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005262009A JP5000112B2 (ja) 2005-09-09 2005-09-09 ナノインプリントリソグラフィによるパターン形成方法

Publications (2)

Publication Number Publication Date
TW200728923A TW200728923A (en) 2007-08-01
TWI338196B true TWI338196B (enExample) 2011-03-01

Family

ID=37835663

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095132736A TW200728923A (en) 2005-09-09 2006-09-05 Film forming composition for nanoimprint and pattern forming method

Country Status (6)

Country Link
US (1) US20090263631A1 (enExample)
JP (1) JP5000112B2 (enExample)
KR (1) KR20080034983A (enExample)
CN (1) CN101258018B (enExample)
TW (1) TW200728923A (enExample)
WO (1) WO2007029542A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI505925B (zh) * 2011-07-21 2015-11-01 Toshiba Kk 壓印方法及壓印系統

Families Citing this family (80)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2087403B1 (en) 2006-11-01 2012-02-01 Koninklijke Philips Electronics N.V. Imprint method for forming a relief layer and use of it as an etch mask
JP5269449B2 (ja) * 2007-03-24 2013-08-21 株式会社ダイセル ナノインプリント用硬化性樹脂組成物
JP5362186B2 (ja) * 2007-03-24 2013-12-11 株式会社ダイセル ナノインプリント用樹脂組成物
JP2009020962A (ja) 2007-07-12 2009-01-29 Canon Inc 微細パターンの形成方法及びスタンパ
JP2009037696A (ja) * 2007-08-02 2009-02-19 Toshiba Corp インプリント方法
JP5387814B2 (ja) * 2007-08-30 2014-01-15 学校法人東京理科大学 ３次元モールドの製造方法
WO2009060862A1 (ja) 2007-11-07 2009-05-14 Showa Denko K.K. エポキシ基含有オルガノシロキサン化合物、転写材料用硬化性組成物および該組成物を用いた微細パターン形成方法
WO2009069465A1 (ja) * 2007-11-30 2009-06-04 Showa Denko K.K. 転写材料用硬化性組成物および該組成物を用いた微細パターン形成方法
JP5328263B2 (ja) 2008-03-18 2013-10-30 昭和電工株式会社 磁気記録媒体の製造方法、磁気記録媒体、及び磁気記録再生装置
JP2009226660A (ja) * 2008-03-21 2009-10-08 Fujifilm Corp ドライエッチングによるパターニング方法及びそれに用いるモールド並びにインクジェットヘッドの製造方法
US9429837B2 (en) * 2008-05-20 2016-08-30 Asml Netherlands B.V. Aqueous curable imprintable medium and patterned layer forming method
JP5438285B2 (ja) * 2008-05-23 2014-03-12 昭和電工株式会社 転写材料用硬化性組成物および微細パターン形成方法
JP2010093218A (ja) * 2008-09-11 2010-04-22 Fujifilm Corp 感光性組成物および基板の加工基板の製造方法。
JP4990866B2 (ja) 2008-10-08 2012-08-01 昭和電工株式会社 磁気記録媒体の製造方法および磁気記録再生装置
KR101457185B1 (ko) * 2008-10-09 2014-10-31 서울대학교산학협력단 진공효과를 이용한 고분자 전구체의 나노기공 내 삽입방법 및 이를 이용한 나노패턴의 정밀 복제방법
WO2010050379A1 (ja) 2008-10-31 2010-05-06 昭和電工株式会社 転写材料用硬化性組成物およびパターン形成方法
US20110281025A1 (en) 2009-01-29 2011-11-17 Showa Denko K.K. Curable composition for transfer materials, and (meth) acryloyl group-containing urea compound
KR101425706B1 (ko) * 2009-04-10 2014-08-01 도꾸리쯔교세이호징 가가꾸 기쥬쯔 신꼬 기꼬 패턴의 형성 방법, 패턴 및 장치
JP5445743B2 (ja) * 2009-04-14 2014-03-19 日産化学工業株式会社 光インプリント用被膜形成用組成物
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US9321214B2 (en) 2011-07-13 2016-04-26 University Of Utah Research Foundation Maskless nanoimprint lithography
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US8829514B2 (en) * 2011-12-14 2014-09-09 E Ink Holdings Inc. Thin film transistor and method for manufacturing the same
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KR102712660B1 (ko) * 2016-07-28 2024-10-04 삼성디스플레이 주식회사 패터닝된 경화물의 제조 방법 및 패터닝된 경화물
WO2018061891A1 (ja) 2016-09-27 2018-04-05 富士フイルム株式会社 分散液、組成物、膜、膜の製造方法および分散剤
CN106595727B (zh) * 2016-11-30 2019-06-11 华中科技大学 基于纳米复制成型的光子晶体纳米流体传感器及制备方法
JP7425602B2 (ja) * 2017-03-08 2024-01-31 キヤノン株式会社 パターン形成方法、ならびに加工基板、光学部品及び石英モールドレプリカの製造方法、ならびにインプリント前処理コーティング材料及びそれとインプリントレジストとのセット
JP6869838B2 (ja) * 2017-07-14 2021-05-12 キヤノン株式会社 インプリント方法、インプリント装置および物品の製造方法
JP6926939B2 (ja) * 2017-10-23 2021-08-25 東京エレクトロン株式会社 半導体装置の製造方法
CN107817547B (zh) * 2017-12-08 2020-06-16 深圳市华星光电技术有限公司 光栅的制造方法
KR102358171B1 (ko) * 2018-01-30 2022-02-03 동우 화인켐 주식회사 하드마스크용 조성물
JP7081337B2 (ja) * 2018-06-27 2022-06-07 Dic株式会社 光硬化性組成物及びその製造方法
US10690831B2 (en) * 2018-11-20 2020-06-23 Facebook Technologies, Llc Anisotropically formed diffraction grating device
JP7583603B2 (ja) * 2020-12-18 2024-11-14 フジコピアン株式会社 樹脂組成物
JPWO2023037941A1 (enExample) * 2021-09-10 2023-03-16
JPWO2025004499A1 (enExample) * 2023-06-29 2025-01-02

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0425530A (ja) * 1990-05-21 1992-01-29 Nippon Telegr & Teleph Corp <Ntt> シロキサンポリマー及びレジスト組成物
JP3140102B2 (ja) * 1991-09-03 2001-03-05 キヤノン株式会社 ピッチ工具の製造方法およびその装置
US6268089B1 (en) * 1998-02-23 2001-07-31 Agere Systems Guardian Corp. Photorecording medium and process for forming medium
DE10001135A1 (de) * 2000-01-13 2001-07-19 Inst Neue Mat Gemein Gmbh Verfahren zur Herstellung eines mikrostrukturierten Oberflächenreliefs durch Prägen thixotroper Schichten
JP4208447B2 (ja) * 2001-09-26 2009-01-14 独立行政法人科学技術振興機構 Ｓｏｇを用いた室温ナノ−インプリント−リソグラフィー
DE10217151A1 (de) * 2002-04-17 2003-10-30 Clariant Gmbh Nanoimprint-Resist
JP4340086B2 (ja) * 2003-03-20 2009-10-07 株式会社日立製作所 ナノプリント用スタンパ、及び微細構造転写方法
JP2004319762A (ja) * 2003-04-16 2004-11-11 Canon Inc ナノ構造体の製造方法及びナノ構造体
JP2005008909A (ja) * 2003-06-16 2005-01-13 Canon Inc 構造体の製造方法
JP2005092099A (ja) * 2003-09-19 2005-04-07 Fuji Photo Film Co Ltd 硬化性樹脂組成物、及び光学物品、並びにそれを用いた画像表示装置
KR100853054B1 (ko) * 2003-10-07 2008-08-19 히다치 가세고교 가부시끼가이샤 방사선 경화성 조성물, 그 보존방법, 경화막 형성방법,패턴 형성방법, 패턴 사용방법, 전자부품 및 광도파로
JP2005136106A (ja) * 2003-10-29 2005-05-26 Kyocera Corp 単結晶サファイア基板とその製造方法及び半導体発光素子
EP1538482B1 (en) * 2003-12-05 2016-02-17 Obducat AB Device and method for large area lithography
US8076386B2 (en) * 2004-02-23 2011-12-13 Molecular Imprints, Inc. Materials for imprint lithography

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI505925B (zh) * 2011-07-21 2015-11-01 Toshiba Kk 壓印方法及壓印系統
US9541847B2 (en) 2011-07-21 2017-01-10 Kabushiki Kaisha Toshiba Imprint method and imprint system

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