TW555809B - Epoxy resin compositions containing phosphorus, flame retardant resin sheet using said epoxy resin containing phosphorus, resin clad metal foil, prepreg and laminated board, multilayer board - Google Patents

Epoxy resin compositions containing phosphorus, flame retardant resin sheet using said epoxy resin containing phosphorus, resin clad metal foil, prepreg and laminated board, multilayer board Download PDF

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Publication number
TW555809B
TW555809B TW089121178A TW89121178A TW555809B TW 555809 B TW555809 B TW 555809B TW 089121178 A TW089121178 A TW 089121178A TW 89121178 A TW89121178 A TW 89121178A TW 555809 B TW555809 B TW 555809B
Authority
TW
Taiwan
Prior art keywords
epoxy resin
phosphorus
weight
resin
resin composition
Prior art date
Application number
TW089121178A
Other languages
English (en)
Chinese (zh)
Inventor
Takashi Sagara
Toshiharu Takada
Kiyoaki Ihara
Hidetaka Kakiuchi
Kazuo Ishihara
Original Assignee
Matsushita Electric Works Ltd
Toto Kasei Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd, Toto Kasei Kk filed Critical Matsushita Electric Works Ltd
Application granted granted Critical
Publication of TW555809B publication Critical patent/TW555809B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/304—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing phosphorus
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249924—Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
    • Y10T428/24994—Fiber embedded in or on the surface of a polymeric matrix
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31522—Next to metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31529—Next to metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Fireproofing Substances (AREA)
TW089121178A 2000-04-06 2000-10-11 Epoxy resin compositions containing phosphorus, flame retardant resin sheet using said epoxy resin containing phosphorus, resin clad metal foil, prepreg and laminated board, multilayer board TW555809B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000104284A JP4588834B2 (ja) 2000-04-06 2000-04-06 リン含有エポキシ樹脂組成物及び、該リン含有エポキシ樹脂を用いる難燃性の樹脂シート、樹脂付き金属箔、プリプレグ及び積層板、多層板

Publications (1)

Publication Number Publication Date
TW555809B true TW555809B (en) 2003-10-01

Family

ID=18617859

Family Applications (1)

Application Number Title Priority Date Filing Date
TW089121178A TW555809B (en) 2000-04-06 2000-10-11 Epoxy resin compositions containing phosphorus, flame retardant resin sheet using said epoxy resin containing phosphorus, resin clad metal foil, prepreg and laminated board, multilayer board

Country Status (9)

Country Link
US (2) US6524709B1 (https=)
EP (1) EP1142921B1 (https=)
JP (1) JP4588834B2 (https=)
KR (1) KR100564814B1 (https=)
CN (2) CN100432130C (https=)
AT (1) ATE376565T1 (https=)
DE (1) DE60036856T2 (https=)
DK (1) DK1142921T3 (https=)
TW (1) TW555809B (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
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TWI408143B (zh) * 2010-11-03 2013-09-11 Univ Nat Chunghsing 具有不對稱磷系雙酚結構之化合物、其環氧樹脂半固化物衍生物及其一鍋化製造方法
TWI457358B (zh) * 2007-03-05 2014-10-21 新日鐵住金化學股份有限公司 A novel phosphorus-containing epoxy resin, an epoxy resin composition containing the epoxy resin as an essential component and a hardened product
TWI460199B (zh) * 2009-04-01 2014-11-11 新日鐵住金化學股份有限公司 難燃性含磷環氧樹脂組成物及其硬化物

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US20030069356A1 (en) * 2000-09-12 2003-04-10 Kiyomi Yasuda Phosphorous-containing epoxy resin, flame-retardant highly heat-resistant epoxy resin composition containing the resin, and laminate
JP4783984B2 (ja) * 2001-02-15 2011-09-28 日立化成工業株式会社 樹脂組成物およびその用途ならびにそれらの製造方法
JP4837175B2 (ja) * 2001-02-23 2011-12-14 新日鐵化学株式会社 リン含有エポキシ樹脂組成物
JP2003281940A (ja) * 2002-03-25 2003-10-03 Hitachi Chem Co Ltd 絶縁樹脂組成物，銅箔付き絶縁材および銅張積層板
AU2003226414A1 (en) * 2002-05-30 2003-12-19 Dow Global Technologies, Inc. Halogen free ignition resistant thermoplastic resin compositions
US7141627B2 (en) * 2002-10-31 2006-11-28 Dainippon Ink And Chemicals, Inc. Epoxy resin composition
SG110189A1 (en) * 2003-09-26 2005-04-28 Japan Epoxy Resins Co Ltd Epoxy compound, preparation method thereof, and use thereof
TWI346111B (en) * 2004-02-09 2011-08-01 Nippon Kayaku Kk Photosensitive resin composition and products of cured product thereof
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CN100384932C (zh) * 2004-10-11 2008-04-30 广东生益科技股份有限公司 一种热固性树脂组合物以及使用它的预浸料、印刷电路用层压板
EP1814949B1 (en) * 2004-11-26 2009-11-04 LG Chem, Ltd. Non-halogen flame retardant epoxy resin composition, and prepreg and copper-clad laminate using the same
KR100587483B1 (ko) * 2005-03-11 2006-06-09 국도화학 주식회사 난연성 고내열 에폭시수지 조성물
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JP4244975B2 (ja) * 2005-08-26 2009-03-25 パナソニック電工株式会社 プリプレグ用エポキシ樹脂組成物、プリプレグ、多層プリント配線板
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JP5399733B2 (ja) * 2009-02-16 2014-01-29 新日鉄住金化学株式会社 難燃性リン含有エポキシ樹脂組成物及びその硬化物
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WO2010109948A1 (ja) * 2009-03-26 2010-09-30 パナソニック電工株式会社 エポキシ樹脂組成物、プリプレグ、樹脂付き金属箔、樹脂シート、積層板、および多層板
KR101803115B1 (ko) * 2010-05-31 2017-11-29 히타치가세이가부시끼가이샤 프리프레그, 금속 피복 적층판 및 인쇄 배선판
JP5579008B2 (ja) * 2010-09-29 2014-08-27 新日鉄住金化学株式会社 リン含有エポキシ樹脂
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JP5786839B2 (ja) * 2012-12-05 2015-09-30 株式会社デンソー エポキシ樹脂組成物および接着構造体の製造方法
CN103059265A (zh) * 2013-01-20 2013-04-24 安徽善孚新材料科技有限公司 一种含萘环结构无卤阻燃环氧树脂及其制备方法
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CN104987664B (zh) * 2015-06-26 2018-02-09 四川东材科技集团股份有限公司 一种特高压直流输变电用绝缘层、模压结构件及其制备方法
US10233365B2 (en) 2015-11-25 2019-03-19 Rogers Corporation Bond ply materials and circuit assemblies formed therefrom
JP6793517B2 (ja) * 2016-10-17 2020-12-02 株式会社ダイセル シート状プリプレグ
JP2019178233A (ja) 2018-03-30 2019-10-17 日鉄ケミカル＆マテリアル株式会社 リン含有ビニル樹脂を含む低誘電難燃性組成物
JP2020122034A (ja) 2019-01-29 2020-08-13 日鉄ケミカル＆マテリアル株式会社 エポキシ樹脂組成物及びその硬化物
WO2021044946A1 (ja) 2019-09-06 2021-03-11 パナソニックＩｐマネジメント株式会社 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及びプリント配線板
TW202340312A (zh) 2022-02-22 2023-10-16 日商松下知識產權經營股份有限公司 樹脂組成物、預浸體、附樹脂之薄膜、附樹脂之金屬箔、覆金屬積層板及印刷配線板
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI457358B (zh) * 2007-03-05 2014-10-21 新日鐵住金化學股份有限公司 A novel phosphorus-containing epoxy resin, an epoxy resin composition containing the epoxy resin as an essential component and a hardened product
TWI460199B (zh) * 2009-04-01 2014-11-11 新日鐵住金化學股份有限公司 難燃性含磷環氧樹脂組成物及其硬化物
TWI408143B (zh) * 2010-11-03 2013-09-11 Univ Nat Chunghsing 具有不對稱磷系雙酚結構之化合物、其環氧樹脂半固化物衍生物及其一鍋化製造方法

Also Published As

Publication number Publication date
DE60036856T2 (de) 2008-07-31
DE60036856D1 (de) 2007-12-06
ATE376565T1 (de) 2007-11-15
KR100564814B1 (ko) 2006-03-27
US6933050B2 (en) 2005-08-23
HK1040410A1 (en) 2002-06-07
CN1737056A (zh) 2006-02-22
JP2001288247A (ja) 2001-10-16
DK1142921T3 (da) 2008-01-28
EP1142921A1 (en) 2001-10-10
KR20010096506A (ko) 2001-11-07
CN100432130C (zh) 2008-11-12
US20030162935A1 (en) 2003-08-28
US6524709B1 (en) 2003-02-25
CN1316463A (zh) 2001-10-10
CN1240772C (zh) 2006-02-08
EP1142921B1 (en) 2007-10-24
JP4588834B2 (ja) 2010-12-01

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