CN100432130C - 含磷的环氧树脂组合物及其应用 - Google Patents

含磷的环氧树脂组合物及其应用 Download PDF

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Publication number
CN100432130C
CN100432130C CNB2005100999100A CN200510099910A CN100432130C CN 100432130 C CN100432130 C CN 100432130C CN B2005100999100 A CNB2005100999100 A CN B2005100999100A CN 200510099910 A CN200510099910 A CN 200510099910A CN 100432130 C CN100432130 C CN 100432130C
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CN
China
Prior art keywords
epoxy resin
phosphorus
composition
resin
resin composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNB2005100999100A
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English (en)
Chinese (zh)
Other versions
CN1737056A (zh
Inventor
相乐隆
高田俊治
井原清晓
垣内秀隆
石原一男
浅野千明
军司雅男
佐藤洋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Nippon Steel Chemical and Materials Co Ltd
Original Assignee
Tohto Kasei Co Ltd
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tohto Kasei Co Ltd, Matsushita Electric Works Ltd filed Critical Tohto Kasei Co Ltd
Publication of CN1737056A publication Critical patent/CN1737056A/zh
Application granted granted Critical
Publication of CN100432130C publication Critical patent/CN100432130C/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/304—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing phosphorus
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249924—Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
    • Y10T428/24994—Fiber embedded in or on the surface of a polymeric matrix
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31522—Next to metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31529—Next to metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Fireproofing Substances (AREA)
CNB2005100999100A 2000-04-06 2000-11-30 含磷的环氧树脂组合物及其应用 Expired - Lifetime CN100432130C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000104284A JP4588834B2 (ja) 2000-04-06 2000-04-06 リン含有エポキシ樹脂組成物及び、該リン含有エポキシ樹脂を用いる難燃性の樹脂シート、樹脂付き金属箔、プリプレグ及び積層板、多層板
JP104284/00 2000-04-06

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CNB001373110A Division CN1240772C (zh) 2000-04-06 2000-11-30 含磷的环氧树脂组合物及其应用

Publications (2)

Publication Number Publication Date
CN1737056A CN1737056A (zh) 2006-02-22
CN100432130C true CN100432130C (zh) 2008-11-12

Family

ID=18617859

Family Applications (2)

Application Number Title Priority Date Filing Date
CNB2005100999100A Expired - Lifetime CN100432130C (zh) 2000-04-06 2000-11-30 含磷的环氧树脂组合物及其应用
CNB001373110A Expired - Lifetime CN1240772C (zh) 2000-04-06 2000-11-30 含磷的环氧树脂组合物及其应用

Family Applications After (1)

Application Number Title Priority Date Filing Date
CNB001373110A Expired - Lifetime CN1240772C (zh) 2000-04-06 2000-11-30 含磷的环氧树脂组合物及其应用

Country Status (9)

Country Link
US (2) US6524709B1 (https=)
EP (1) EP1142921B1 (https=)
JP (1) JP4588834B2 (https=)
KR (1) KR100564814B1 (https=)
CN (2) CN100432130C (https=)
AT (1) ATE376565T1 (https=)
DE (1) DE60036856T2 (https=)
DK (1) DK1142921T3 (https=)
TW (1) TW555809B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
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CN104987664A (zh) * 2015-06-26 2015-10-21 四川东材科技集团股份有限公司 一种特高压直流输变电用绝缘层、模压结构件及其制备方法

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CN103059265A (zh) * 2013-01-20 2013-04-24 安徽善孚新材料科技有限公司 一种含萘环结构无卤阻燃环氧树脂及其制备方法
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JPWO2016121758A1 (ja) * 2015-01-29 2017-11-09 日立化成株式会社 エポキシ樹脂組成物、半硬化エポキシ樹脂組成物、樹脂シート及びプリプレグ
US10233365B2 (en) 2015-11-25 2019-03-19 Rogers Corporation Bond ply materials and circuit assemblies formed therefrom
JP6793517B2 (ja) * 2016-10-17 2020-12-02 株式会社ダイセル シート状プリプレグ
JP2019178233A (ja) 2018-03-30 2019-10-17 日鉄ケミカル＆マテリアル株式会社 リン含有ビニル樹脂を含む低誘電難燃性組成物
JP2020122034A (ja) 2019-01-29 2020-08-13 日鉄ケミカル＆マテリアル株式会社 エポキシ樹脂組成物及びその硬化物
WO2021044946A1 (ja) 2019-09-06 2021-03-11 パナソニックＩｐマネジメント株式会社 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及びプリント配線板
TW202340312A (zh) 2022-02-22 2023-10-16 日商松下知識產權經營股份有限公司 樹脂組成物、預浸體、附樹脂之薄膜、附樹脂之金屬箔、覆金屬積層板及印刷配線板
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104987664A (zh) * 2015-06-26 2015-10-21 四川东材科技集团股份有限公司 一种特高压直流输变电用绝缘层、模压结构件及其制备方法

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Publication number Publication date
DE60036856T2 (de) 2008-07-31
DE60036856D1 (de) 2007-12-06
ATE376565T1 (de) 2007-11-15
KR100564814B1 (ko) 2006-03-27
TW555809B (en) 2003-10-01
US6933050B2 (en) 2005-08-23
HK1040410A1 (en) 2002-06-07
CN1737056A (zh) 2006-02-22
JP2001288247A (ja) 2001-10-16
DK1142921T3 (da) 2008-01-28
EP1142921A1 (en) 2001-10-10
KR20010096506A (ko) 2001-11-07
US20030162935A1 (en) 2003-08-28
US6524709B1 (en) 2003-02-25
CN1316463A (zh) 2001-10-10
CN1240772C (zh) 2006-02-08
EP1142921B1 (en) 2007-10-24
JP4588834B2 (ja) 2010-12-01

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