DK1142921T3 - Phosphorholdige epoxyharpikspræparater, flammehæmmende harpiksark eller bane under anvendelse af den phosphorholdige epoxyharpiks, harpiksbelagt metalfolie, prepreg og lamineret plade, flerlagsplade - Google Patents

Phosphorholdige epoxyharpikspræparater, flammehæmmende harpiksark eller bane under anvendelse af den phosphorholdige epoxyharpiks, harpiksbelagt metalfolie, prepreg og lamineret plade, flerlagsplade

Info

Publication number
DK1142921T3
DK1142921T3 DK00126572T DK00126572T DK1142921T3 DK 1142921 T3 DK1142921 T3 DK 1142921T3 DK 00126572 T DK00126572 T DK 00126572T DK 00126572 T DK00126572 T DK 00126572T DK 1142921 T3 DK1142921 T3 DK 1142921T3
Authority
DK
Denmark
Prior art keywords
resin
epoxy resin
phosphorous epoxy
prepreg
web
Prior art date
Application number
DK00126572T
Other languages
Danish (da)
English (en)
Inventor
Takashi Sagara
Toshiharu Takata
Kiyoaki Ihara
Hidetaka Kakiuchi
Kazuo Ishihara
Chiaki Asano
Masao Gunji
Hiroshi Sato
Original Assignee
Matsushita Electric Works Ltd
Toto Kasei Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd, Toto Kasei Kk filed Critical Matsushita Electric Works Ltd
Application granted granted Critical
Publication of DK1142921T3 publication Critical patent/DK1142921T3/da

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/304—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing phosphorus
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249924—Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
    • Y10T428/24994—Fiber embedded in or on the surface of a polymeric matrix
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31522—Next to metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31529—Next to metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Fireproofing Substances (AREA)
DK00126572T 2000-04-06 2000-12-12 Phosphorholdige epoxyharpikspræparater, flammehæmmende harpiksark eller bane under anvendelse af den phosphorholdige epoxyharpiks, harpiksbelagt metalfolie, prepreg og lamineret plade, flerlagsplade DK1142921T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000104284A JP4588834B2 (ja) 2000-04-06 2000-04-06 リン含有エポキシ樹脂組成物及び、該リン含有エポキシ樹脂を用いる難燃性の樹脂シート、樹脂付き金属箔、プリプレグ及び積層板、多層板

Publications (1)

Publication Number Publication Date
DK1142921T3 true DK1142921T3 (da) 2008-01-28

Family

ID=18617859

Family Applications (1)

Application Number Title Priority Date Filing Date
DK00126572T DK1142921T3 (da) 2000-04-06 2000-12-12 Phosphorholdige epoxyharpikspræparater, flammehæmmende harpiksark eller bane under anvendelse af den phosphorholdige epoxyharpiks, harpiksbelagt metalfolie, prepreg og lamineret plade, flerlagsplade

Country Status (9)

Country Link
US (2) US6524709B1 (https=)
EP (1) EP1142921B1 (https=)
JP (1) JP4588834B2 (https=)
KR (1) KR100564814B1 (https=)
CN (2) CN100432130C (https=)
AT (1) ATE376565T1 (https=)
DE (1) DE60036856T2 (https=)
DK (1) DK1142921T3 (https=)
TW (1) TW555809B (https=)

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JPWO2016121758A1 (ja) * 2015-01-29 2017-11-09 日立化成株式会社 エポキシ樹脂組成物、半硬化エポキシ樹脂組成物、樹脂シート及びプリプレグ
CN104987664B (zh) * 2015-06-26 2018-02-09 四川东材科技集团股份有限公司 一种特高压直流输变电用绝缘层、模压结构件及其制备方法
US10233365B2 (en) 2015-11-25 2019-03-19 Rogers Corporation Bond ply materials and circuit assemblies formed therefrom
JP6793517B2 (ja) * 2016-10-17 2020-12-02 株式会社ダイセル シート状プリプレグ
JP2019178233A (ja) 2018-03-30 2019-10-17 日鉄ケミカル＆マテリアル株式会社 リン含有ビニル樹脂を含む低誘電難燃性組成物
JP2020122034A (ja) 2019-01-29 2020-08-13 日鉄ケミカル＆マテリアル株式会社 エポキシ樹脂組成物及びその硬化物
WO2021044946A1 (ja) 2019-09-06 2021-03-11 パナソニックＩｐマネジメント株式会社 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及びプリント配線板
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Also Published As

Publication number Publication date
DE60036856T2 (de) 2008-07-31
DE60036856D1 (de) 2007-12-06
ATE376565T1 (de) 2007-11-15
KR100564814B1 (ko) 2006-03-27
TW555809B (en) 2003-10-01
US6933050B2 (en) 2005-08-23
HK1040410A1 (en) 2002-06-07
CN1737056A (zh) 2006-02-22
JP2001288247A (ja) 2001-10-16
EP1142921A1 (en) 2001-10-10
KR20010096506A (ko) 2001-11-07
CN100432130C (zh) 2008-11-12
US20030162935A1 (en) 2003-08-28
US6524709B1 (en) 2003-02-25
CN1316463A (zh) 2001-10-10
CN1240772C (zh) 2006-02-08
EP1142921B1 (en) 2007-10-24
JP4588834B2 (ja) 2010-12-01

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