TW365596B - Semiconductor test device - Google Patents

Semiconductor test device

Info

Publication number
TW365596B
TW365596B TW086104316A TW86104316A TW365596B TW 365596 B TW365596 B TW 365596B TW 086104316 A TW086104316 A TW 086104316A TW 86104316 A TW86104316 A TW 86104316A TW 365596 B TW365596 B TW 365596B
Authority
TW
Taiwan
Prior art keywords
tst
tester
loader
carrier
tests
Prior art date
Application number
TW086104316A
Other languages
English (en)
Inventor
Yutaka Watanabe
Hiroto Nakamura
Toshio Yabe
Michirou Chiba
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=26424453&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TW365596(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Advantest Corp filed Critical Advantest Corp
Application granted granted Critical
Publication of TW365596B publication Critical patent/TW365596B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2832—Specific tests of electronic circuits not provided for elsewhere
    • G01R31/2834—Automated test systems [ATE]; using microprocessors or computers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/319—Tester hardware, i.e. output processing circuits
    • G01R31/31903—Tester hardware, i.e. output processing circuits tester configuration
    • G01R31/31907—Modular tester, e.g. controlling and coordinating instruments in a bus based architecture
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/319—Tester hardware, i.e. output processing circuits
    • G01R31/31903—Tester hardware, i.e. output processing circuits tester configuration
    • G01R31/31912—Tester/user interface
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
    • H03K19/20—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits characterised by logic function, e.g. AND, OR, NOR, NOT circuits
TW086104316A 1996-04-05 1997-04-03 Semiconductor test device TW365596B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP8343096 1996-04-05
JP32415196A JP3417528B2 (ja) 1996-04-05 1996-12-04 Ｉｃ試験装置

Publications (1)

Publication Number Publication Date
TW365596B true TW365596B (en) 1999-08-01

Family

ID=26424453

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086104316A TW365596B (en) 1996-04-05 1997-04-03 Semiconductor test device

Country Status (7)

Country Link
US (1) US6111246A (zh)
JP (1) JP3417528B2 (zh)
KR (1) KR100355422B1 (zh)
CN (1) CN1115721C (zh)
DE (1) DE19713986B4 (zh)
SG (1) SG60052A1 (zh)
TW (1) TW365596B (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI398638B (zh) * 2008-02-21 2013-06-11 Advantest Corp A method of removing the electronic component, and a control program for carrying out the method
TWI777691B (zh) * 2020-10-06 2022-09-11 日商日本航空電子工業股份有限公司 電器零件檢查器具

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US6483102B1 (en) * 2000-07-18 2002-11-19 Advanced Micro Devices, Inc. Method and apparatus for inspection of misplaced integrated circuits in a tray stack
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KR100714752B1 (ko) 2002-04-25 2007-05-07 가부시키가이샤 아드반테스트 전자부품 시험장치
JPWO2003091741A1 (ja) * 2002-04-25 2005-09-02 株式会社アドバンテスト 電子部品試験装置
WO2006009253A1 (ja) * 2004-07-23 2006-01-26 Advantest Corporation 電子部品試験装置及び電子部品試験装置の編成方法
CN100370260C (zh) * 2004-08-19 2008-02-20 思达科技股份有限公司 多晶粒针测装置
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KR100560729B1 (ko) * 2005-03-22 2006-03-14 미래산업 주식회사 반도체 소자 테스트용 핸들러
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CN1891591B (zh) * 2005-07-06 2011-05-04 上海华虹Nec电子有限公司 一种机械手自动硅片取放系统及方法
KR100946334B1 (ko) * 2008-03-25 2010-03-09 세크론 주식회사 테스트 트레이, 트레이 식별 장치 및 이를 포함하는 테스트핸들러
KR100955495B1 (ko) * 2008-10-08 2010-04-30 미래산업 주식회사 테스트 핸들러
CN101799483B (zh) * 2010-04-13 2012-03-21 北京盈和工控技术有限公司 测试机收纳装置
KR101515168B1 (ko) * 2010-04-30 2015-04-27 (주)테크윙 테스트핸들러용 개방장치
KR101499574B1 (ko) * 2010-06-15 2015-03-10 (주)테크윙 모듈아이씨 핸들러 및 모듈아이씨 핸들러에서의 로딩방법
KR102026357B1 (ko) * 2013-04-17 2019-11-04 (주)테크윙 반도체소자 테스트용 핸들러
KR101999623B1 (ko) * 2013-05-10 2019-07-16 (주)테크윙 반도체소자 테스트용 핸들러의 트레이 적재장치
KR102043633B1 (ko) * 2014-01-21 2019-11-13 (주)테크윙 반도체소자 테스트용 핸들러
TWI567409B (zh) * 2015-01-06 2017-01-21 All Ring Tech Co Ltd Blanking detection method and device
TW201632915A (zh) * 2015-03-11 2016-09-16 All Ring Tech Co Ltd 電子元件檢測方法及裝置
TWI551873B (zh) * 2015-03-13 2016-10-01 Hon Tech Inc Electronic components operating equipment
WO2018039523A1 (en) * 2016-08-26 2018-03-01 Delta Design, Inc. Offline vision assist method and apparatus for integrated circuit device vision alignment
KR101880950B1 (ko) * 2016-09-02 2018-07-23 허경삼 트레이 내 반도체 칩을 점검하기 위한 장치, 이를 위한 방법 및 이 방법을 수행하는 응용 프로그램이 기록된 컴퓨터 판독 가능한 기록매체
MX2019009399A (es) * 2017-02-10 2019-11-05 Optofidelity Oy Procedimiento, un probador todo en uno y producto de programa informatico.
JP2020012748A (ja) * 2018-07-19 2020-01-23 セイコーエプソン株式会社 電子部品搬送装置および電子部品検査装置
CN108828383A (zh) * 2018-08-13 2018-11-16 深圳市亚派光电器件有限公司 光电元件测试系统及方法
JP7245639B2 (ja) 2018-12-14 2023-03-24 株式会社アドバンテスト センサ試験装置
DE102019004463A1 (de) * 2019-06-25 2020-12-31 Yamaichi Electronics Deutschland Gmbh Testkontaktor
KR20230030767A (ko) * 2021-08-26 2023-03-07 (주)테크윙 전자부품 테스터용 핸들러 및 전자부품 테스트용 핸들러에서의 전자부품 촬영방법
KR102632531B1 (ko) * 2023-10-12 2024-01-31 김성준 핸들러 시스템에서 검사대상인 반도체 소자의 온도 변화를 감지하는 서비스 제공 장치, 방법 및 프로그램

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI398638B (zh) * 2008-02-21 2013-06-11 Advantest Corp A method of removing the electronic component, and a control program for carrying out the method
TWI777691B (zh) * 2020-10-06 2022-09-11 日商日本航空電子工業股份有限公司 電器零件檢查器具

Also Published As

Publication number Publication date
KR19980063277A (ko) 1998-10-07
CN1115721C (zh) 2003-07-23
DE19713986A1 (de) 1997-11-13
JPH09325173A (ja) 1997-12-16
KR100355422B1 (ko) 2002-11-18
DE19713986B4 (de) 2005-06-16
US6111246A (en) 2000-08-29
SG60052A1 (en) 1999-02-22
JP3417528B2 (ja) 2003-06-16
CN1169028A (zh) 1997-12-31

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