TW200707799A - Bonded intermediate substrate and method of making same - Google Patents

Bonded intermediate substrate and method of making same

Info

Publication number
TW200707799A
TW200707799A TW095114397A TW95114397A TW200707799A TW 200707799 A TW200707799 A TW 200707799A TW 095114397 A TW095114397 A TW 095114397A TW 95114397 A TW95114397 A TW 95114397A TW 200707799 A TW200707799 A TW 200707799A
Authority
TW
Taiwan
Prior art keywords
substrate
thin layer
intermediate substrate
handle
making same
Prior art date
Application number
TW095114397A
Other languages
English (en)
Chinese (zh)
Inventor
Thomas Henry Pinnington
James M Zahler
Young-Bae Park
Charles Tsai
Corinne Ladous
Harry A Atwater Jr
Sean Olson
Original Assignee
Aonex Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aonex Technologies Inc filed Critical Aonex Technologies Inc
Publication of TW200707799A publication Critical patent/TW200707799A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
    • H01L21/2003—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy characterised by the substrate
    • H01L21/2007—Bonding of semiconductor wafers to insulating substrates or to semiconducting substrates using an intermediate insulating layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/018—Bonding of wafers
    • H10P90/1914—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/816—Bodies having carrier transport control structures, e.g. highly-doped semiconductor layers or current-blocking structures
    • H10H20/8162—Current-blocking structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/822—Materials of the light-emitting regions
    • H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
    • H10H20/825—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H10H20/832—Electrodes characterised by their material
    • H10H20/835—Reflective materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biophysics (AREA)
  • Optics & Photonics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Recrystallisation Techniques (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Led Devices (AREA)
TW095114397A 2005-04-21 2006-04-21 Bonded intermediate substrate and method of making same TW200707799A (en)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US67336705P 2005-04-21 2005-04-21
US68282305P 2005-05-20 2005-05-20
US70035705P 2005-07-19 2005-07-19
US70388905P 2005-08-01 2005-08-01
US71141605P 2005-08-26 2005-08-26
US75130805P 2005-12-19 2005-12-19
US76249006P 2006-01-27 2006-01-27

Publications (1)

Publication Number Publication Date
TW200707799A true TW200707799A (en) 2007-02-16

Family

ID=37215279

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095114397A TW200707799A (en) 2005-04-21 2006-04-21 Bonded intermediate substrate and method of making same

Country Status (4)

Country Link
US (1) US8101498B2 (enExample)
JP (1) JP5364368B2 (enExample)
TW (1) TW200707799A (enExample)
WO (1) WO2006116030A2 (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
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TWI486476B (zh) * 2011-02-28 2015-06-01 Hon Hai Prec Ind Co Ltd 殼體及其製造方法
TWI493746B (zh) * 2008-02-21 2015-07-21 日東電工股份有限公司 具有半透明陶瓷板之發光元件
US9397279B2 (en) 2013-12-27 2016-07-19 Industrial Technology Research Institute Electric conductive heat dissipation substrate
CN111741936A (zh) * 2018-12-21 2020-10-02 Ａｇｃ株式会社 层叠体和层叠体的制造方法
CN112968107A (zh) * 2020-08-26 2021-06-15 重庆康佳光电技术研究院有限公司 弱化结构的制作方法、微器件的转移方法
TWI883558B (zh) * 2023-09-27 2025-05-11 絜靜精微有限公司 晶種層植入之晶圓載板製造方法及其晶圓結構

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* Cited by examiner, † Cited by third party
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