FR2963982B1 - Procede de collage a basse temperature - Google Patents
Procede de collage a basse temperatureInfo
- Publication number
- FR2963982B1 FR2963982B1 FR1056696A FR1056696A FR2963982B1 FR 2963982 B1 FR2963982 B1 FR 2963982B1 FR 1056696 A FR1056696 A FR 1056696A FR 1056696 A FR1056696 A FR 1056696A FR 2963982 B1 FR2963982 B1 FR 2963982B1
- Authority
- FR
- France
- Prior art keywords
- bonding
- substrate
- annealing
- temperature
- low temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title abstract 2
- 239000010410 layer Substances 0.000 abstract 4
- 239000000758 substrate Substances 0.000 abstract 4
- 238000000137 annealing Methods 0.000 abstract 3
- 238000005728 strengthening Methods 0.000 abstract 2
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 238000007872 degassing Methods 0.000 abstract 1
- 239000002344 surface layer Substances 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C3/00—Assembling of devices or systems from individually processed components
- B81C3/001—Bonding of two components
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
- H01L21/2003—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy characterised by the substrate
- H01L21/2007—Bonding of semiconductor wafers to insulating substrates or to semiconducting substrates using an intermediate insulating layer
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- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
- H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
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- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
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- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/03—Bonding two components
- B81C2203/033—Thermal bonding
- B81C2203/036—Fusion bonding
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- H01L2224/27444—Manufacturing methods by blanket deposition of the material of the layer connector in gaseous form
- H01L2224/27452—Chemical vapour deposition [CVD], e.g. laser CVD
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- H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
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- H01L2224/83193—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body
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- H01L2224/838—Bonding techniques
- H01L2224/83894—Direct bonding, i.e. joining surfaces by means of intermolecular attracting interactions at their interfaces, e.g. covalent bonds, van der Waals forces
- H01L2224/83896—Direct bonding, i.e. joining surfaces by means of intermolecular attracting interactions at their interfaces, e.g. covalent bonds, van der Waals forces between electrically insulating surfaces, e.g. oxide or nitride layers
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- H01L2924/146—Mixed devices
- H01L2924/1461—MEMS
Priority Applications (10)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1056696A FR2963982B1 (fr) | 2010-08-20 | 2010-08-20 | Procede de collage a basse temperature |
US12/904,744 US8790992B2 (en) | 2010-08-20 | 2010-10-14 | Low-temperature bonding process |
TW100118741A TWI459480B (zh) | 2010-08-20 | 2011-05-27 | 低溫黏附製程 |
JP2011120794A JP5555957B2 (ja) | 2010-08-20 | 2011-05-30 | 低温結合プロセス |
DE102011076845.9A DE102011076845B4 (de) | 2010-08-20 | 2011-06-01 | Niedrigtemperaturbindeverfahren und Heterostruktur |
KR1020110065872A KR101272675B1 (ko) | 2010-08-20 | 2011-07-04 | 저온 본딩 공정 |
CN201610091145.6A CN105742258B (zh) | 2010-08-20 | 2011-07-12 | 低温键合方法 |
CN2011101994542A CN102376653A (zh) | 2010-08-20 | 2011-07-12 | 低温键合方法 |
SG2011059490A SG178688A1 (en) | 2010-08-20 | 2011-08-18 | Low-temperature bonding process |
US14/334,370 US9117686B2 (en) | 2010-08-20 | 2014-07-17 | 3D integrated heterostructures having low-temperature bonded interfaces with high bonding energy |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1056696A FR2963982B1 (fr) | 2010-08-20 | 2010-08-20 | Procede de collage a basse temperature |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2963982A1 FR2963982A1 (fr) | 2012-02-24 |
FR2963982B1 true FR2963982B1 (fr) | 2012-09-28 |
Family
ID=43827267
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1056696A Active FR2963982B1 (fr) | 2010-08-20 | 2010-08-20 | Procede de collage a basse temperature |
Country Status (8)
Country | Link |
---|---|
US (2) | US8790992B2 (fr) |
JP (1) | JP5555957B2 (fr) |
KR (1) | KR101272675B1 (fr) |
CN (2) | CN102376653A (fr) |
DE (1) | DE102011076845B4 (fr) |
FR (1) | FR2963982B1 (fr) |
SG (1) | SG178688A1 (fr) |
TW (1) | TWI459480B (fr) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2963982B1 (fr) * | 2010-08-20 | 2012-09-28 | Soitec Silicon On Insulator | Procede de collage a basse temperature |
JP6095903B2 (ja) * | 2012-06-15 | 2017-03-15 | 浜松ホトニクス株式会社 | 固体撮像装置の製造方法及び固体撮像装置 |
KR101947165B1 (ko) | 2012-10-16 | 2019-02-13 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치와 이의 제조 방법 및 회로 필름의 회전 장치 |
CN105874571B (zh) * | 2013-12-18 | 2019-12-17 | 英特尔公司 | 局部层转移的系统和方法 |
CN104934292A (zh) * | 2014-03-17 | 2015-09-23 | 中芯国际集成电路制造(上海)有限公司 | 一种提高晶圆间键合强度的方法 |
EP3024019A1 (fr) * | 2014-11-24 | 2016-05-25 | IMEC vzw | Procédé de liaison directe de substrats semi-conducteurs |
CN104891430B (zh) * | 2015-04-17 | 2016-09-28 | 上海华虹宏力半导体制造有限公司 | 硅片键合方法 |
CN104925749B (zh) * | 2015-04-17 | 2017-01-25 | 上海华虹宏力半导体制造有限公司 | 硅片键合方法 |
CN105185720B (zh) * | 2015-08-03 | 2018-05-08 | 武汉新芯集成电路制造有限公司 | 一种增强键合强度的超薄热氧化晶圆键合工艺 |
CN105206536B (zh) * | 2015-08-17 | 2018-03-09 | 武汉新芯集成电路制造有限公司 | 一种增强键合强度的晶圆键合方法及结构 |
CN105261586B (zh) * | 2015-08-25 | 2018-05-25 | 上海新傲科技股份有限公司 | 带有电荷陷阱和绝缘埋层衬底的制备方法 |
US9725312B1 (en) * | 2016-02-05 | 2017-08-08 | Taiwan Semiconductor Manufacturing Co., Ltd. | Preconditioning to enhance hydrophilic fusion bonding |
CN107346746B (zh) * | 2016-05-05 | 2020-09-08 | 中芯国际集成电路制造(上海)有限公司 | 一种半导体器件及其制造方法和电子装置 |
CN109671614B (zh) * | 2017-08-10 | 2020-08-21 | 长江存储科技有限责任公司 | 一种晶圆键合方法 |
CN108383080B (zh) * | 2018-03-06 | 2020-04-10 | 苏州大学 | 纳米间隙原位活化的复合阳极键合方法 |
CN112635299A (zh) * | 2020-12-17 | 2021-04-09 | 武汉新芯集成电路制造有限公司 | 低温沉积方法、半导体器件的键合方法和芯片 |
CN113380639A (zh) * | 2021-05-26 | 2021-09-10 | 西安交通大学 | 一种原子级离子清洁活化低温键合装置及方法 |
US20230026052A1 (en) * | 2021-07-22 | 2023-01-26 | Taiwan Semiconductor Manufacturing Company, Ltd. | Atomic layer deposition bonding layer for joining two semiconductor devices |
CN114420549B (zh) * | 2022-03-31 | 2022-11-18 | 深圳新声半导体有限公司 | 一种二氧化硅表面与硅表面低温键合的方法 |
CN114927538B (zh) * | 2022-07-20 | 2022-11-11 | 合肥晶合集成电路股份有限公司 | 晶圆键合方法以及背照式图像传感器的形成方法 |
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US6090687A (en) | 1998-07-29 | 2000-07-18 | Agilent Technolgies, Inc. | System and method for bonding and sealing microfabricated wafers to form a single structure having a vacuum chamber therein |
US6902987B1 (en) * | 2000-02-16 | 2005-06-07 | Ziptronix, Inc. | Method for low temperature bonding and bonded structure |
ATE310009T1 (de) | 2000-05-22 | 2005-12-15 | Monsanto Technology Llc | Reaktionssysteme zur herstellung von n- (phosphonomethyl)glyzin verbindungen |
US6475072B1 (en) | 2000-09-29 | 2002-11-05 | International Business Machines Corporation | Method of wafer smoothing for bonding using chemo-mechanical polishing (CMP) |
US20040126993A1 (en) * | 2002-12-30 | 2004-07-01 | Chan Kevin K. | Low temperature fusion bonding with high surface energy using a wet chemical treatment |
US7109092B2 (en) * | 2003-05-19 | 2006-09-19 | Ziptronix, Inc. | Method of room temperature covalent bonding |
FR2860249B1 (fr) | 2003-09-30 | 2005-12-09 | Michel Bruel | Procede de fabrication d'une structure en forme de plaque, en particulier en silicium, application de procede, et structure en forme de plaque, en particulier en silicium |
US7235812B2 (en) | 2004-09-13 | 2007-06-26 | International Business Machines Corporation | Method of creating defect free high Ge content (>25%) SiGe-on-insulator (SGOI) substrates using wafer bonding techniques |
JP5364368B2 (ja) * | 2005-04-21 | 2013-12-11 | エイオーネックス・テクノロジーズ・インコーポレイテッド | 基板の製造方法 |
FR2895420B1 (fr) | 2005-12-27 | 2008-02-22 | Tracit Technologies Sa | Procede de fabrication d'une structure demontable en forme de plaque, en particulier en silicium, et application de ce procede. |
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FR2913528B1 (fr) | 2007-03-06 | 2009-07-03 | Soitec Silicon On Insulator | Procede de fabrication d'un substrat comportant une couche d'oxyde enterree pour la realisation de composants electroniques ou analogues. |
US7795111B2 (en) * | 2007-06-27 | 2010-09-14 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of SOI substrate and manufacturing method of semiconductor device |
FR2923079B1 (fr) * | 2007-10-26 | 2017-10-27 | S O I Tec Silicon On Insulator Tech | Substrats soi avec couche fine isolante enterree |
EP2091071B1 (fr) * | 2008-02-15 | 2012-12-12 | Soitec | Procédé pour la liaison de deux substrats |
JP4947316B2 (ja) | 2008-08-15 | 2012-06-06 | 信越化学工業株式会社 | 基板の接合方法並びに3次元半導体装置 |
US8173518B2 (en) * | 2009-03-31 | 2012-05-08 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of wafer bonding |
FR2963982B1 (fr) | 2010-08-20 | 2012-09-28 | Soitec Silicon On Insulator | Procede de collage a basse temperature |
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- 2010-10-14 US US12/904,744 patent/US8790992B2/en active Active
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US9117686B2 (en) | 2015-08-25 |
US8790992B2 (en) | 2014-07-29 |
JP2012044146A (ja) | 2012-03-01 |
CN105742258B (zh) | 2020-09-29 |
CN102376653A (zh) | 2012-03-14 |
DE102011076845A1 (de) | 2012-04-12 |
SG178688A1 (en) | 2012-03-29 |
DE102011076845B4 (de) | 2020-02-06 |
US20140327113A1 (en) | 2014-11-06 |
KR20120018063A (ko) | 2012-02-29 |
TW201218289A (en) | 2012-05-01 |
JP5555957B2 (ja) | 2014-07-23 |
CN105742258A (zh) | 2016-07-06 |
KR101272675B1 (ko) | 2013-06-11 |
US20120043647A1 (en) | 2012-02-23 |
FR2963982A1 (fr) | 2012-02-24 |
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