KR970072362A - Bga 반도체 패키지의 솔더 볼 랜드 메탈 구조 - Google Patents
Bga 반도체 패키지의 솔더 볼 랜드 메탈 구조 Download PDFInfo
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- KR970072362A KR970072362A KR1019960009778A KR19960009778A KR970072362A KR 970072362 A KR970072362 A KR 970072362A KR 1019960009778 A KR1019960009778 A KR 1019960009778A KR 19960009778 A KR19960009778 A KR 19960009778A KR 970072362 A KR970072362 A KR 970072362A
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Abstract
본 발명은 BGA 반도체 패키지의 랜드 메탈 구조에 관한 것으로, 종래에는, SMD형 랜드 메탈에서는 솔더볼과 니켈 도금층위에 형성된 금과의 혼합층에서 솔더 볼이 쉽게 분리 및 이탈되는 현상이 발생하였고, NSMD형 랜드 메탈의 구조에서는 솔더 볼과 랜드 메탈이 함께 BT 섭스트레이트 표면으로부터 쉽게 분리 및 이탈되는 문제가 있었는데, SMD형 랜드 메탈의 구조에서는 솔더 볼이 융착될 때 그 접착 면적을 되도록 크게 해주기위해, 그리고 솔더 볼이 융착된 후에는 솔더 볼을 고정시켜 주는 락킹 홀이 되도록, 랜드 메탈 표면의 중앙 또는 외각에 다양한 형상과 위치에, BT 섭스트레이트를 완전히 관통시키거나 아니면 절반만 관통시킨 다수의 에칭 홀을 형성함으로서 상기 솔더 볼이 랜드 메탈과 분리 및 이탈되지 않도록 하였고, NSMD형 랜드 메탈의 구조에서는 기존의 랜드 메탈 주변부에 톱니 모양으로 랜드 메탈을 더 형성하여 솔더 마스크와 BT섭스트레이트상에 끼워지게 함으로서 융착된 솔더 볼이 랜드 메탈과 함께 BT 섭스트레이트상에서 분리 및 이탈되지 않도록 하여 BGA 반도체 패키지의 신뢰성을 향상시켰다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제3A도 내지 제3E도는 본 발명의 제1실시예인 솔더 볼 랜드 메탈의 구조를 도시한 평면도 및 단면도.
Claims (13)
- 반도체 칩과, 상기 반도체 칩의 저면에 접착제로 접착된 BT 섭스트레이트와, 상기 BT 섭스트레이트의 상면 외곽에 형성된 메탈 트레이스 및 솔더 마스크와, 상기 메탈 트레이스와 반도체 칩의 입/출력 패드를 연결하는 와이어와, 상기 BT 섭스트레이트 저면에 형성된 메탈 트레이스와 상기 메탈 트레이스에 연결된 랜드 메탈과, 상기 랜드 메탈에 융착된 솔더 볼과, 상기 메탈 트레이스의 표면에 형성된 솔더 마스크로 이루어지는 BGA 반도체 패키지에 있어서, 상기 랜드 메탈 표면에 솔더 볼과의 접착 면적을 넓히기 위해 적어도 1개 이상의 홀이 형성됨을 특징으로 하는 BGA반도체 패키지의 솔더 볼 랜드 메탈 구조.
- 제1항에 있어서, 상기의 홀은 화학 반응에 의한 에칭으로서 형성됨을 특징으로 하는 BGA 반도체 패키지의 솔더 볼 랜드 메탈 구조.
- 제1항에 있어서, 상기의 홀은 랜드 메탈의 표면 중앙에 원형, 사각형 또는 십자형으로 형성됨을 특징으로하는 BGA 반도체 패키지의 솔더 볼 랜드 메탈 구조.
- 제1, 2항 또는 제3항에 있어서, 상기의 홀을 랜드 메탈의 표면 중앙에서부터 BT 섭스트레이트 표면까지 관통시켜 형성됨을 특징으로 하는 BGA 반도체 패키지의 솔더 볼 랜드 메탈 구조.
- 제1, 2항 또는 제3항에 있어서, 상기의 홀은 랜드 메탈의 표면 중앙에서부터 절반 정도만 관통시켜 형성됨을 특징으로 하는 BGA 반도체 패키지의 솔더 볼 랜드 메탈 구조.
- 제1항에 있어서, 상기의 홀은 랜드 메탈의 표면 외곽에 일자형, 반달형 또는 삼각형으로 형성됨을 특징으로 하는 BGA반도체 패키지의 솔더 볼 랜드 메탈 구조.
- 제1항 또는 제6항에 있어서, 상기의 홀은 랜드 메탈의 표면 외곽에서부터 BT 섭스트레이트의 표면까지 관통시켜 형성됨을 특징으로 하는 BGA 반도체 패키지의 솔더 볼 랜드 메탈 구조.
- 제1항 또는 제6항에 있어서, 상기의 홀은 랜드 메탈의 표면 외곽에서부터 절반 정도만 관통시켜 형성됨을 특징으로 하는 BGA 반도체 패키지의 솔더 볼 랜드 메탈 구조.
- 제1항에 있어서, 상기 홀은 랜드 메탈의 표면 중앙과 외곽에 함께 형성됨을 특징으로 하는 BGA 반도체 패키지의 솔더 볼 랜드 메탈 구조.
- 제1항 또는 제9항에 있어서, 상기의 홀은 랜드 메탈의 표면 중앙과 외곽에서부터 BT 섭스트레이트의 표면까지 관통시켜 형성됨을 특징으로 하는 BGA 반도체 패키지의 솔더 볼랜드 메탈 구조.
- 제1항 또는 제9항에 있어서, 상기의 홀은 랜드 메탈의 표면 중앙과 외곽에서부터 절반 정도만 관통시켜 형성됨을 특징으로하는 BGA 반도체 패키지의 솔더 볼 랜드 메탈 구조.
- 제1항에 있어서, 상기 랜드 메탈은 그 주변부에 톱니 형성의 랜드 메탈을 더 형성하여 BT 섭스트레이트와 솔더 마스크에 상기 톱니 형상의 랜드 메탈이 끼워지도록 함을 특징으로 하는 BGA 반도체 패키지의 솔더 볼 랜드 메탈 구조.
- 제1항에 있어서, 상기 랜드 메탈의 표면에는 니켈((Ni)과 금(Au)이 도금됨을 특징으로 하는 BGA반도체 패키지의 솔더 볼 랜드 메탈 구조.※ 참고사항: 최초출원 내용에 의하여 공개하는 것임.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019960009778A KR100216839B1 (ko) | 1996-04-01 | 1996-04-01 | Bga 반도체 패키지의 솔더 볼 랜드 메탈 구조 |
JP9098041A JP2860648B2 (ja) | 1996-04-01 | 1997-03-31 | Bga半導体パッケージのソルダボールランドメタル構造 |
US08/825,945 US5872399A (en) | 1996-04-01 | 1997-04-01 | Solder ball land metal structure of ball grid semiconductor package |
Applications Claiming Priority (1)
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KR1019960009778A KR100216839B1 (ko) | 1996-04-01 | 1996-04-01 | Bga 반도체 패키지의 솔더 볼 랜드 메탈 구조 |
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KR970072362A true KR970072362A (ko) | 1997-11-07 |
KR100216839B1 KR100216839B1 (ko) | 1999-09-01 |
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Country Status (3)
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JP (1) | JP2860648B2 (ko) |
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WO2017199712A1 (ja) * | 2016-05-16 | 2017-11-23 | 株式会社村田製作所 | セラミック電子部品 |
TWI636533B (zh) | 2017-09-15 | 2018-09-21 | Industrial Technology Research Institute | 半導體封裝結構 |
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JPS6235650A (ja) * | 1985-08-09 | 1987-02-16 | Mitsubishi Electric Corp | 半導体装置の電極構造 |
US5442852A (en) * | 1993-10-26 | 1995-08-22 | Pacific Microelectronics Corporation | Method of fabricating solder ball array |
JPH07169872A (ja) * | 1993-12-13 | 1995-07-04 | Fujitsu Ltd | 半導体装置及びその製造方法 |
JP3667786B2 (ja) * | 1994-03-17 | 2005-07-06 | インテル・コーポレーション | Icソケットおよびそのプリント基板との導通接続状態の検査方法 |
JP2595909B2 (ja) * | 1994-09-14 | 1997-04-02 | 日本電気株式会社 | 半導体装置 |
US5487218A (en) * | 1994-11-21 | 1996-01-30 | International Business Machines Corporation | Method for making printed circuit boards with selectivity filled plated through holes |
-
1996
- 1996-04-01 KR KR1019960009778A patent/KR100216839B1/ko not_active IP Right Cessation
-
1997
- 1997-03-31 JP JP9098041A patent/JP2860648B2/ja not_active Expired - Fee Related
- 1997-04-01 US US08/825,945 patent/US5872399A/en not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100618685B1 (ko) * | 2000-07-29 | 2006-09-06 | 주식회사 하이닉스반도체 | 반도체소자의 패드영역 형성방법 |
KR100586697B1 (ko) * | 2003-12-12 | 2006-06-08 | 삼성전자주식회사 | 솔더 조인트 특성이 개선된 반도체 패키지 |
Also Published As
Publication number | Publication date |
---|---|
JP2860648B2 (ja) | 1999-02-24 |
JPH1032280A (ja) | 1998-02-03 |
KR100216839B1 (ko) | 1999-09-01 |
US5872399A (en) | 1999-02-16 |
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