KR950001909A - 산화환원식 도전성 물질을 갖는 반도체장치와 그 제조방법 - Google Patents
산화환원식 도전성 물질을 갖는 반도체장치와 그 제조방법 Download PDFInfo
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- KR950001909A KR950001909A KR1019940012702A KR19940012702A KR950001909A KR 950001909 A KR950001909 A KR 950001909A KR 1019940012702 A KR1019940012702 A KR 1019940012702A KR 19940012702 A KR19940012702 A KR 19940012702A KR 950001909 A KR950001909 A KR 950001909A
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- metal oxide
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- 239000004065 semiconductor Substances 0.000 title claims abstract 8
- 239000004020 conductor Substances 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
- 229910052751 metal Inorganic materials 0.000 claims abstract description 10
- 239000002184 metal Substances 0.000 claims abstract description 10
- 229910044991 metal oxide Inorganic materials 0.000 claims abstract description 10
- 150000004706 metal oxides Chemical class 0.000 claims abstract description 10
- 239000003990 capacitor Substances 0.000 claims abstract 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract 2
- 230000004888 barrier function Effects 0.000 claims abstract 2
- 229910052710 silicon Inorganic materials 0.000 claims abstract 2
- 239000010703 silicon Substances 0.000 claims abstract 2
- 238000006722 reduction reaction Methods 0.000 claims 3
- 238000006243 chemical reaction Methods 0.000 claims 2
- 238000007254 oxidation reaction Methods 0.000 claims 2
- 230000002441 reversible effect Effects 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- 230000003647 oxidation Effects 0.000 claims 1
- 238000006479 redox reaction Methods 0.000 claims 1
- HTXDPTMKBJXEOW-UHFFFAOYSA-N dioxoiridium Chemical compound O=[Ir]=O HTXDPTMKBJXEOW-UHFFFAOYSA-N 0.000 abstract 2
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 abstract 2
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 abstract 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 abstract 1
- 229910000457 iridium oxide Inorganic materials 0.000 abstract 1
- 150000002739 metals Chemical class 0.000 abstract 1
- SYQBFIAQOQZEGI-UHFFFAOYSA-N osmium atom Chemical compound [Os] SYQBFIAQOQZEGI-UHFFFAOYSA-N 0.000 abstract 1
- 229910000487 osmium oxide Inorganic materials 0.000 abstract 1
- 229910000489 osmium tetroxide Inorganic materials 0.000 abstract 1
- 229910052702 rhenium Inorganic materials 0.000 abstract 1
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 abstract 1
- WXBOMIKEWRRKBB-UHFFFAOYSA-N rhenium(iv) oxide Chemical compound O=[Re]=O WXBOMIKEWRRKBB-UHFFFAOYSA-N 0.000 abstract 1
- 229910001925 ruthenium oxide Inorganic materials 0.000 abstract 1
- 150000002736 metal compounds Chemical class 0.000 description 1
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Abstract
본 발명은 원소금속과 그 도전성 산화금속을 포함하는 층(21,161,61,81,121, 125,133,137)을 갖는 반도체장치를 포함하며, 거기에서, 상기 층이 산화되거나 환원되는 것이 상기 반도체장치의 인접구역이 산화 또는 환원되는 것보다 더 우세할 수 있다. 또한, 본 발명은 상기 반도체장치를 형성하기 위한 방법을 포함한다. 기층구역(11)과 실리콘함유층(132)과, 유전층(41,101,122,134)과, 전극(135)과, 장벽층(141,144)과, 접촉플러그 및 경유플러그(13,141; 34,132)와, 상호접속부(145) 및 페로일렉트릭축전기가 층에 의해 보호되고 층으로 형성될 수 있다. 본 발명에 이용될 수도 있는 원소금속과 그 도전성 산화금속의 예로는 루테늄과 이산화루테늄, 레늄과 이산화레늄, 이리듐과 이산화이리듐, 오스뮴과 사산화오스뮴 등이 있다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도 및 제2도는 본 발명의 한 실시예에 따라 접촉플러그위에 있는 원소금속과 그 도전성 산화금속을 포함하는 금속 화합물을 갖는 층을 형성하는 여러 단계에서의 기층의 일부를 각각 도시한 단면도.
Claims (3)
- 주면(primary surface)을 갖는 기층(10,80)과, 상기 주면에 인접한 기층내에 있는 위치(11)와 상기 기층위에 중첩된 위치(132,41,101,122,134,41,101,122,135, 141,144,145)들로 이루어진 그룹에서 선택된 하나의 위치에 있는 제1구역 및, 상기 제1구역위에 중첩된 제1층(21,161,61,81,111,121,125,133,137)을 포함하는 반도체장치에 있어서, 상기 제1층이 원소금속과 그 도전성 산화금속을 포함하고, 상기 원소금속이 도전성 산화금속으로 산화될 수 있으며, 상기 도전성 산화금속이 원소금속으로 환원될 수 있고, 그러한 산화반응과 환원반응이 서로 가역적인 것이며, 상기 제1층이 제1반응, 즉, 가역적인 산화반응과 환원반응 중 우세한 한 반응으로 반응할 수 있게 구성된 것을 특징으로 하는 반도체 장치.
- 주면을 갖는 기층과, 한기층(11)내의 구역과, 또 다른 기층(132)위에 적층된 실리콘함유층과, 전극(135)과, 또 다른 기층(141,144)위에 적층된 장벽층과, 또 다른 기층(13,142,34,132)위에 적층된 접촉플러그(contact plug)와, 그러한 기층위에 적층된 경유플러그(via plug) 및, 또 다른 기층(145)위에 적층된 상호접속부로 이루어진 그룹에서 선택된 제1구역 및, 상기 제1구역위에 적층된 제1층(21,161,121, 133,137)를 포함하는 반도체장치에 있어서, 상기 제1층은 원소금속과 그 도전성 산화금속을 포함하며, 상기 원소금속이 그 도전성 산화금속으로 산화되는 것이 상기 제1구역이 산화되는 것보다 더 우세할 수 있게 구성된 것을 특징으로 하는 반도체 장치.
- 페로일렉트릭층(41,101,122,134) 및, 상기 페로일렉트릭층위에 적층된 제1층 (61,111,125,137)을 포함하는 페로일렉트릭축전기에 있어서, 상기 제1층이 원소금속과 그 도전성 산화금속을 포함하고, 상기 도전성 산화금속이 원소금속으로 환원되는 것이 상기 페로일렉트리층이 환원되는 것보다 더 우세할 수 있게 구성된 것을 특징으로 하는 페로일렉트릭축전기.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/072,012 US5407855A (en) | 1993-06-07 | 1993-06-07 | Process for forming a semiconductor device having a reducing/oxidizing conductive material |
US072,012 | 1993-06-07 |
Publications (2)
Publication Number | Publication Date |
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KR950001909A true KR950001909A (ko) | 1995-01-04 |
KR100354578B1 KR100354578B1 (ko) | 2002-12-18 |
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Application Number | Title | Priority Date | Filing Date |
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KR1019940012702A KR100354578B1 (ko) | 1993-06-07 | 1994-06-07 | 환원/산화되는도전성물질을갖는반도체소자와그제조방법 |
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Country | Link |
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US (2) | US5407855A (ko) |
EP (1) | EP0629002B1 (ko) |
JP (1) | JPH0799290A (ko) |
KR (1) | KR100354578B1 (ko) |
CN (1) | CN1093319C (ko) |
DE (1) | DE69433582T2 (ko) |
SG (1) | SG69959A1 (ko) |
TW (1) | TW278208B (ko) |
Families Citing this family (124)
Publication number | Priority date | Publication date | Assignee | Title |
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US5407855A (en) * | 1993-06-07 | 1995-04-18 | Motorola, Inc. | Process for forming a semiconductor device having a reducing/oxidizing conductive material |
US5439840A (en) * | 1993-08-02 | 1995-08-08 | Motorola, Inc. | Method of forming a nonvolatile random access memory capacitor cell having a metal-oxide dielectric |
US6052271A (en) * | 1994-01-13 | 2000-04-18 | Rohm Co., Ltd. | Ferroelectric capacitor including an iridium oxide layer in the lower electrode |
JP2956485B2 (ja) * | 1994-09-07 | 1999-10-04 | 日本電気株式会社 | 半導体装置の製造方法 |
US5563762A (en) * | 1994-11-28 | 1996-10-08 | Northern Telecom Limited | Capacitor for an integrated circuit and method of formation thereof, and a method of adding on-chip capacitors to an integrated circuit |
US6271077B1 (en) | 1995-03-27 | 2001-08-07 | Fujitsu Limited | Thin film deposition method, capacitor device and method for fabricating the same, and semiconductor device and method for fabricating the same |
US5874364A (en) | 1995-03-27 | 1999-02-23 | Fujitsu Limited | Thin film deposition method, capacitor device and method for fabricating the same, and semiconductor device and method for fabricating the same |
JP3526651B2 (ja) * | 1995-04-28 | 2004-05-17 | ローム株式会社 | 半導体装置および配線方法 |
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US5631804A (en) * | 1995-11-13 | 1997-05-20 | Micron Technology, Inc. | Contact fill capacitor having a sidewall that connects the upper and lower surfaces of the dielectric and partially surrounds an insulating layer |
KR100200299B1 (ko) * | 1995-11-30 | 1999-06-15 | 김영환 | 반도체 소자 캐패시터 형성방법 |
US5929523A (en) * | 1996-03-07 | 1999-07-27 | 3C Semiconductor Corporation | Os rectifying Schottky and ohmic junction and W/WC/TiC ohmic contacts on SiC |
US6388272B1 (en) | 1996-03-07 | 2002-05-14 | Caldus Semiconductor, Inc. | W/WC/TAC ohmic and rectifying contacts on SiC |
US5926359A (en) * | 1996-04-01 | 1999-07-20 | International Business Machines Corporation | Metal-insulator-metal capacitor |
US6100196A (en) * | 1996-04-08 | 2000-08-08 | Chartered Semiconductor Manufacturing Ltd. | Method of making a copper interconnect with top barrier layer |
US5744376A (en) * | 1996-04-08 | 1998-04-28 | Chartered Semiconductor Manufacturing Pte, Ltd | Method of manufacturing copper interconnect with top barrier layer |
JP3388089B2 (ja) * | 1996-04-25 | 2003-03-17 | シャープ株式会社 | 不揮発性半導体メモリ素子の製造方法 |
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-
1993
- 1993-06-07 US US08/072,012 patent/US5407855A/en not_active Expired - Lifetime
-
1994
- 1994-04-21 TW TW083103556A patent/TW278208B/zh not_active IP Right Cessation
- 1994-06-04 CN CN94106509A patent/CN1093319C/zh not_active Expired - Lifetime
- 1994-06-06 EP EP94108641A patent/EP0629002B1/en not_active Expired - Lifetime
- 1994-06-06 DE DE69433582T patent/DE69433582T2/de not_active Expired - Lifetime
- 1994-06-06 SG SG1996003545A patent/SG69959A1/en unknown
- 1994-06-07 KR KR1019940012702A patent/KR100354578B1/ko not_active IP Right Cessation
- 1994-06-07 JP JP6147041A patent/JPH0799290A/ja active Pending
- 1994-11-18 US US08/342,293 patent/US5510651A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
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JPH0799290A (ja) | 1995-04-11 |
CN1107611A (zh) | 1995-08-30 |
EP0629002A1 (en) | 1994-12-14 |
DE69433582D1 (de) | 2004-04-08 |
DE69433582T2 (de) | 2005-02-17 |
KR100354578B1 (ko) | 2002-12-18 |
EP0629002B1 (en) | 2004-03-03 |
CN1093319C (zh) | 2002-10-23 |
SG69959A1 (en) | 2000-01-25 |
TW278208B (ko) | 1996-06-11 |
US5407855A (en) | 1995-04-18 |
US5510651A (en) | 1996-04-23 |
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