KR900008673A - 반도체집적회로장치 - Google Patents

반도체집적회로장치

Info

Publication number
KR900008673A
KR900008673A KR1019890015182A KR890015182A KR900008673A KR 900008673 A KR900008673 A KR 900008673A KR 1019890015182 A KR1019890015182 A KR 1019890015182A KR 890015182 A KR890015182 A KR 890015182A KR 900008673 A KR900008673 A KR 900008673A
Authority
KR
South Korea
Prior art keywords
integrated circuit
semiconductor integrated
circuit device
semiconductor
integrated
Prior art date
Application number
KR1019890015182A
Other languages
English (en)
Other versions
KR0158871B1 (ko
Inventor
가즈히로 고모리
도시아끼 니시모또
사또시 메구로
히또시 구메
요시아끼 가미가끼
Original Assignee
가부시끼가이샤 히다찌세이사꾸쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시끼가이샤 히다찌세이사꾸쇼 filed Critical 가부시끼가이샤 히다찌세이사꾸쇼
Publication of KR900008673A publication Critical patent/KR900008673A/ko
Priority to KR1019940026092A priority Critical patent/KR0158939B1/ko
Application granted granted Critical
Publication of KR0158871B1 publication Critical patent/KR0158871B1/ko

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/788Field effect transistors with field effect produced by an insulated gate with floating gate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007Multistep manufacturing processes
    • H01L29/66075Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409Unipolar field-effect transistors
    • H01L29/66477Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/66568Lateral single gate silicon transistors
    • H01L29/66659Lateral single gate silicon transistors with asymmetry in the channel direction, e.g. lateral high-voltage MISFETs with drain offset region, extended drain MISFETs
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/7833Field effect transistors with field effect produced by an insulated gate with lightly doped drain or source extension, e.g. LDD MOSFET's; DDD MOSFET's
    • H01L29/7835Field effect transistors with field effect produced by an insulated gate with lightly doped drain or source extension, e.g. LDD MOSFET's; DDD MOSFET's with asymmetrical source and drain regions, e.g. lateral high-voltage MISFETs with drain offset region, extended drain MISFETs
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/788Field effect transistors with field effect produced by an insulated gate with floating gate
    • H01L29/7881Programmable transistors with only two possible levels of programmation
    • H01L29/7884Programmable transistors with only two possible levels of programmation charging by hot carrier injection
    • H01L29/7885Hot carrier injection from the channel
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/788Field effect transistors with field effect produced by an insulated gate with floating gate
    • H01L29/7881Programmable transistors with only two possible levels of programmation
    • H01L29/7884Programmable transistors with only two possible levels of programmation charging by hot carrier injection
    • H01L29/7886Hot carrier produced by avalanche breakdown of a PN junction, e.g. FAMOS
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B41/00Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
    • H10B41/40Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the peripheral circuit region
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B41/00Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
    • H10B41/40Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the peripheral circuit region
    • H10B41/42Simultaneous manufacture of periphery and memory cells
    • H10B41/49Simultaneous manufacture of periphery and memory cells comprising different types of peripheral transistor
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B69/00Erasable-and-programmable ROM [EPROM] devices not provided for in groups H10B41/00 - H10B63/00, e.g. ultraviolet erasable-and-programmable ROM [UVEPROM] devices
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C16/00Erasable programmable read-only memories
    • G11C16/02Erasable programmable read-only memories electrically programmable
    • G11C16/04Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
    • G11C16/0408Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors
    • G11C16/0416Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors comprising cells containing a single floating gate transistor and no select transistor, e.g. UV EPROM
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/06Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
    • H01L27/0688Integrated circuits having a three-dimensional layout

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Volatile Memory (AREA)
  • Semiconductor Memories (AREA)
KR1019890015182A 1988-11-09 1989-10-23 반도체집적회로장치 KR0158871B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019940026092A KR0158939B1 (ko) 1988-11-09 1994-10-12 반도체직접회로장치의 제조방법

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP63-284587 1988-11-09
JP63284587A JP3059442B2 (ja) 1988-11-09 1988-11-09 半導体記憶装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1019940026092A Division KR0158939B1 (ko) 1988-11-09 1994-10-12 반도체직접회로장치의 제조방법

Publications (2)

Publication Number Publication Date
KR900008673A true KR900008673A (ko) 1990-06-03
KR0158871B1 KR0158871B1 (ko) 1998-12-01

Family

ID=17680388

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019890015182A KR0158871B1 (ko) 1988-11-09 1989-10-23 반도체집적회로장치

Country Status (3)

Country Link
US (13) US5300802A (ko)
JP (1) JP3059442B2 (ko)
KR (1) KR0158871B1 (ko)

Families Citing this family (80)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3059442B2 (ja) * 1988-11-09 2000-07-04 株式会社日立製作所 半導体記憶装置
JP2545762B2 (ja) * 1990-04-13 1996-10-23 日本電装株式会社 高耐圧misトランジスタおよびこのトランジスタを有する相補型トランジスタの製造方法
US5424567A (en) * 1991-05-15 1995-06-13 North American Philips Corporation Protected programmable transistor with reduced parasitic capacitances and method of fabrication
KR960012303B1 (ko) * 1992-08-18 1996-09-18 삼성전자 주식회사 불휘발성 반도체메모리장치 및 그 제조방법
JP3522788B2 (ja) * 1992-10-29 2004-04-26 株式会社ルネサステクノロジ 半導体集積回路装置
US5592003A (en) * 1992-12-28 1997-01-07 Nippon Steel Corporation Nonvolatile semiconductor memory and method of rewriting data thereto
JP3813638B2 (ja) 1993-01-14 2006-08-23 株式会社ルネサステクノロジ 半導体集積回路装置およびその製造方法
JP3297173B2 (ja) * 1993-11-02 2002-07-02 三菱電機株式会社 半導体記憶装置およびその製造方法
TW360980B (en) * 1994-05-04 1999-06-11 Nippon Precision Circuits Single transistor EEPROM memory device
US5650960A (en) * 1994-05-18 1997-07-22 United Microelectronics Corporation Polysilicon programming memory cell
US5468981A (en) * 1994-09-01 1995-11-21 Advanced Micro Devices, Inc. Self-aligned buried channel/junction stacked gate flash memory cell
US5574685A (en) * 1994-09-01 1996-11-12 Advanced Micro Devices, Inc. Self-aligned buried channel/junction stacked gate flash memory cell
JP4070249B2 (ja) * 1994-11-22 2008-04-02 株式会社ルネサステクノロジ 半導体集積回路装置の製造方法
US5631178A (en) * 1995-01-31 1997-05-20 Motorola, Inc. Method for forming a stable semiconductor device having an arsenic doped ROM portion
US6475846B1 (en) 1995-05-18 2002-11-05 Texas Instruments Incorporated Method of making floating-gate memory-cell array with digital logic transistors
DE69528971D1 (de) * 1995-06-30 2003-01-09 St Microelectronics Srl Herstellungsverfahren eines Schaltkreises, der nichtflüchtige Speicherzellen und Randtransistoren von mindestens zwei unterschiedlichen Typen enthält, und entsprechender IC
JP3419597B2 (ja) * 1995-07-11 2003-06-23 株式会社日立製作所 半導体集積回路装置の製造方法
KR0183730B1 (ko) * 1995-08-24 1999-04-15 김광호 소자 분리 특성을 향상시킨 반도체 기억 장치 및 그 제조방법
US5834948A (en) * 1995-09-21 1998-11-10 Matsushita Electric Industrial Co.,Ltd. Output circuit
US6787844B2 (en) * 1995-09-29 2004-09-07 Nippon Steel Corporation Semiconductor device including transistor with composite gate structure and transistor with single gate structure, and method for manufacturing the same
JP3498116B2 (ja) 1995-10-26 2004-02-16 株式会社ルネサステクノロジ 不揮発性半導体記憶装置
KR100207504B1 (ko) * 1996-03-26 1999-07-15 윤종용 불휘발성 메모리소자, 그 제조방법 및 구동방법
EP0821414A1 (en) * 1996-07-23 1998-01-28 Lucent Technologies Inc. CMOS compatible EPROM device
US6236085B1 (en) 1996-11-11 2001-05-22 Denso Corporation Semiconductor memory device having high-concentration region around electric-field moderating layer in substrate
JP2956633B2 (ja) * 1997-01-24 1999-10-04 日本電気株式会社 相補型mos半導体の製造方法
GB2326748B (en) * 1997-02-12 2001-09-12 Hyundai Electronics America A nonvolatile memory structure
US6288423B1 (en) 1997-04-18 2001-09-11 Nippon Steel Corporation Composite gate structure memory cell having increased capacitance
JP3149937B2 (ja) * 1997-12-08 2001-03-26 日本電気株式会社 半導体装置およびその製造方法
US6023085A (en) 1997-12-18 2000-02-08 Advanced Micro Devices, Inc. Core cell structure and corresponding process for NAND-type high performance flash memory device
US6667511B1 (en) 1997-12-18 2003-12-23 Advanced Micro Devices, Inc. NAND type core cell structure for a high density flash memory device having a unique select gate transistor configuration
US6121655A (en) 1997-12-30 2000-09-19 Matsushita Electric Industrial Co., Ltd. Nonvolatile semiconductor memory device and method for fabricating the same and semiconductor integrated circuit
KR100258881B1 (ko) * 1998-02-27 2000-06-15 김영환 반도체 소자의 제조 방법
US6124157A (en) * 1998-03-20 2000-09-26 Cypress Semiconductor Corp. Integrated non-volatile and random access memory and method of forming the same
US6207991B1 (en) 1998-03-20 2001-03-27 Cypress Semiconductor Corp. Integrated non-volatile and CMOS memories having substantially the same thickness gates and methods of forming the same
JPH11289061A (ja) 1998-04-02 1999-10-19 Mitsubishi Electric Corp 半導体装置の製造方法
KR100270958B1 (ko) 1998-07-10 2000-11-01 윤종용 비휘발성 반도체 소자 및 그 제조방법
US6879340B1 (en) * 1998-08-19 2005-04-12 Micron Technology Inc. CMOS imager with integrated non-volatile memory
KR100278661B1 (ko) * 1998-11-13 2001-02-01 윤종용 비휘발성 메모리소자 및 그 제조방법
JP2000164736A (ja) * 1998-11-30 2000-06-16 Toshiba Corp 不揮発性半導体メモリ及びその製造方法
TW451427B (en) * 1999-02-19 2001-08-21 Mitsubishi Electric Corp Non-volatile semiconductor memory device and the driving method, operation method and manufacturing method of the same
KR100716074B1 (ko) * 1999-06-17 2007-05-08 가부시키가이샤 히타치세이사쿠쇼 반도체 기억 장치 및 그 제조 방법
US6808996B1 (en) * 1999-08-18 2004-10-26 Advanced Micro Devices, Inc. Method for protecting gate edges from charge gain/loss in semiconductor device
US6465835B1 (en) * 1999-09-27 2002-10-15 Advanced Micro Devices, Inc. Charge gain/charge loss junction leakage prevention for flash technology by using double isolation/capping layer between lightly doped drain and gate
EP1107309B1 (en) * 1999-12-06 2010-10-13 STMicroelectronics Srl Manufacturing process for non-volatile floating gate memory cells and control circuitry
US6518122B1 (en) * 1999-12-17 2003-02-11 Chartered Semiconductor Manufacturing Ltd. Low voltage programmable and erasable flash EEPROM
KR20010063021A (ko) * 1999-12-21 2001-07-09 윤종용 불휘발성 반도체 메모리소자 및 그 제조방법
JP2003518742A (ja) * 1999-12-21 2003-06-10 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 不揮発性のメモリーセルと周辺部
US6660585B1 (en) * 2000-03-21 2003-12-09 Aplus Flash Technology, Inc. Stacked gate flash memory cell with reduced disturb conditions
TW497270B (en) * 2000-06-09 2002-08-01 Sanyo Electric Co Method for making semiconductors
JP2002009168A (ja) 2000-06-19 2002-01-11 Nec Corp 半導体装置及びその製造方法
US6774429B2 (en) * 2000-08-10 2004-08-10 Matsushita Electric Industrial Co., Ltd. Hybrid semiconductor device with a poly-metal gate structure
JP3686318B2 (ja) * 2000-08-31 2005-08-24 松下電器産業株式会社 半導体記憶装置の製造方法
JP2002118177A (ja) * 2000-10-11 2002-04-19 Toshiba Corp 半導体装置及びその製造方法
JP2002184879A (ja) 2000-12-19 2002-06-28 Hitachi Ltd 半導体装置およびその製造方法
JP4325972B2 (ja) * 2001-01-30 2009-09-02 セイコーエプソン株式会社 不揮発性半導体記憶装置を含む半導体集積回路装置の製造方法
JP2002231833A (ja) * 2001-02-02 2002-08-16 Mitsubishi Electric Corp 半導体装置、不揮発性半導体記憶装置およびそれらの製造方法
JP3921363B2 (ja) * 2001-08-20 2007-05-30 松下電器産業株式会社 不揮発性半導体記憶装置の製造方法
US20060007772A1 (en) * 2002-03-19 2006-01-12 O2Ic, Inc. Non-volatile memory device
US7232717B1 (en) 2002-05-28 2007-06-19 O2Ic, Inc. Method of manufacturing non-volatile DRAM
JP4572500B2 (ja) * 2002-12-27 2010-11-04 ソニー株式会社 不揮発性半導体メモリ装置およびその動作方法
KR100532352B1 (ko) * 2003-08-21 2005-12-01 삼성전자주식회사 반도체 장치 및 반도체 장치의 제조 방법
US6972229B2 (en) * 2003-12-23 2005-12-06 02Ic, Inc. Method of manufacturing self-aligned non-volatile memory device
US7186612B2 (en) * 2004-01-28 2007-03-06 O2Ic, Inc. Non-volatile DRAM and a method of making thereof
US20050170586A1 (en) * 2004-01-29 2005-08-04 O2Ic, Inc., (A California Corporation) Method of manufacturing non-volatile DRAM
ES2400910T3 (es) * 2004-02-25 2013-04-15 Dow Global Technologies Llc Aparato para tratar soluciones de resistencia osmótica alta
US20050219913A1 (en) * 2004-04-06 2005-10-06 O2Ic, Inc. Non-volatile memory array
JP2006054283A (ja) * 2004-08-11 2006-02-23 Nec Electronics Corp 不揮発性半導体記憶装置,及びその製造方法
US20060193174A1 (en) * 2005-02-25 2006-08-31 O2Ic Non-volatile and static random access memory cells sharing the same bitlines
US7759727B2 (en) * 2006-08-21 2010-07-20 Intersil Americas Inc. Method and apparatus for shielding tunneling circuit and floating gate for integration of a floating gate voltage reference in a general purpose CMOS technology
US8320191B2 (en) 2007-08-30 2012-11-27 Infineon Technologies Ag Memory cell arrangement, method for controlling a memory cell, memory array and electronic device
JP2009099722A (ja) * 2007-10-16 2009-05-07 Oki Semiconductor Co Ltd 半導体受光素子および照度センサ
JP2009206492A (ja) * 2008-01-31 2009-09-10 Toshiba Corp 半導体装置
JP5274878B2 (ja) * 2008-04-15 2013-08-28 パナソニック株式会社 半導体装置及びその製造方法
US8436411B2 (en) * 2009-01-06 2013-05-07 United Microelectronics Corp. Non-volatile memory
JP2010206163A (ja) * 2009-02-06 2010-09-16 Seiko Instruments Inc 半導体装置
US20120014183A1 (en) * 2010-07-16 2012-01-19 Pavel Poplevine 3 transistor (n/p/n) non-volatile memory cell without program disturb
JP5610930B2 (ja) * 2010-08-30 2014-10-22 三菱電機株式会社 半導体装置
US9437555B2 (en) * 2011-06-07 2016-09-06 Verisiti, Inc. Semiconductor device having features to prevent reverse engineering
JP2015056472A (ja) * 2013-09-11 2015-03-23 株式会社東芝 半導体装置
KR101788459B1 (ko) 2016-07-11 2017-10-20 매그나칩 반도체 유한회사 디스플레이 드라이버 ic 구조물

Family Cites Families (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3868187A (en) * 1972-08-31 1975-02-25 Tokyo Shibaura Electric Co Avalanche injection type mos memory
US4062699A (en) * 1976-02-20 1977-12-13 Western Digital Corporation Method for fabricating diffusion self-aligned short channel MOS device
JPS5397381A (en) * 1977-02-07 1978-08-25 Toshiba Corp Nonvoltile semiconductor memory
US4142926A (en) * 1977-02-24 1979-03-06 Intel Corporation Self-aligning double polycrystalline silicon etching process
JPS548988A (en) * 1977-06-23 1979-01-23 Fujitsu Ltd Semiconductor device
JPS5499531A (en) * 1978-01-12 1979-08-06 Nec Corp Semiconductor memory unit
DE2802838A1 (de) * 1978-01-23 1979-08-16 Siemens Ag Mis-feldeffekttransistor mit kurzer kanallaenge
US4258378A (en) * 1978-05-26 1981-03-24 Texas Instruments Incorporated Electrically alterable floating gate memory with self-aligned low-threshold series enhancement transistor
JPS6048111B2 (ja) * 1978-05-30 1985-10-25 日本電気株式会社 不揮発性半導体記憶装置
US4318216A (en) * 1978-11-13 1982-03-09 Rca Corporation Extended drain self-aligned silicon gate MOSFET
US4290077A (en) * 1979-05-30 1981-09-15 Xerox Corporation High voltage MOSFET with inter-device isolation structure
US4376947A (en) * 1979-09-04 1983-03-15 Texas Instruments Incorporated Electrically programmable floating gate semiconductor memory device
JPS5669866A (en) * 1979-11-09 1981-06-11 Fujitsu Ltd Semiconductor element
JPS56120166A (en) * 1980-02-27 1981-09-21 Hitachi Ltd Semiconductor ic device and manufacture thereof
US4573144A (en) * 1982-09-30 1986-02-25 Motorola, Inc. Common floating gate programmable link
JPS5974677A (ja) * 1982-10-22 1984-04-27 Ricoh Co Ltd 半導体装置及びその製造方法
JPS59110158A (ja) * 1982-12-16 1984-06-26 Fujitsu Ltd 半導体記憶装置
JPS59126674A (ja) * 1983-01-10 1984-07-21 Toshiba Corp 情報記憶用半導体装置
JPS60110171A (ja) * 1983-11-21 1985-06-15 Toshiba Corp 半導体記憶装置の製造方法
JP2515715B2 (ja) 1984-02-24 1996-07-10 株式会社日立製作所 半導体集積回路装置の製造方法
JPS60182174A (ja) * 1984-02-28 1985-09-17 Nec Corp 不揮発性半導体メモリ
JPH07112018B2 (ja) 1984-03-31 1995-11-29 株式会社東芝 半導体記憶装置
EP0164605B1 (en) * 1984-05-17 1990-02-28 Kabushiki Kaisha Toshiba Method of manufacturing nonvolatile semiconductor eeprom device
US5352620A (en) * 1984-05-23 1994-10-04 Hitachi, Ltd. Method of making semiconductor device with memory cells and peripheral transistors
JPH0722194B2 (ja) * 1984-07-24 1995-03-08 工業技術院長 不揮発性メモリ
US4698787A (en) * 1984-11-21 1987-10-06 Exel Microelectronics, Inc. Single transistor electrically programmable memory device and method
KR890004962B1 (ko) * 1985-02-08 1989-12-02 가부시끼가이샤 도오시바 반도체장치 및 그 제조방법
JPS61185363A (ja) * 1985-02-12 1986-08-19 Daiichi Denko Kk 着色被覆金属線の製造法
JPS622570A (ja) 1985-04-30 1987-01-08 テキサス インスツルメンツ インコ−ポレイテツド フロ−テイング・ゲ−ト電界効果トランジスタ
US4804637A (en) * 1985-09-27 1989-02-14 Texas Instruments Incorporated EEPROM memory cell and driving circuitry
JPS6298765A (ja) * 1985-10-25 1987-05-08 Fujitsu Ltd ダイナミツクランダムアクセスメモリ
JP3059442B2 (ja) * 1988-11-09 2000-07-04 株式会社日立製作所 半導体記憶装置
US5189497A (en) 1986-05-26 1993-02-23 Hitachi, Ltd. Semiconductor memory device
JP2555027B2 (ja) * 1986-05-26 1996-11-20 株式会社日立製作所 半導体記憶装置
US5472891A (en) 1986-05-26 1995-12-05 Hitachi, Ltd. Method of manufacturing a semiconductor device
US5340760A (en) * 1986-05-26 1994-08-23 Kazuhiro Komori Method of manufacturing EEPROM memory device
US4835740A (en) * 1986-12-26 1989-05-30 Kabushiki Kaisha Toshiba Floating gate type semiconductor memory device
JPH0642547B2 (ja) * 1987-05-30 1994-06-01 株式会社東芝 不揮発性半導体メモリおよびその製造方法
JPS63252481A (ja) * 1987-04-09 1988-10-19 Toshiba Corp 不揮発性半導体メモリ
JPS63284587A (ja) 1987-05-18 1988-11-21 Canon Inc 接着または粘着型ホログラム
US4784966A (en) * 1987-06-02 1988-11-15 Texas Instruments Incorporated Self-aligned NPN bipolar transistor built in a double polysilicon CMOS technology
KR890001099A (ko) * 1987-06-08 1989-03-18 미다 가쓰시게 반도체 기억장치
FR2618011B1 (fr) * 1987-07-10 1992-09-18 Commissariat Energie Atomique Procede de fabrication d'une cellule de memoire
IT1225873B (it) * 1987-07-31 1990-12-07 Sgs Microelettrica S P A Catan Procedimento per la fabbricazione di celle di memoria eprom cmos con riduzione del numero di fasi di mascheratura.
US5153144A (en) * 1988-05-10 1992-10-06 Hitachi, Ltd. Method of making tunnel EEPROM
US4859619A (en) * 1988-07-15 1989-08-22 Atmel Corporation EPROM fabrication process forming tub regions for high voltage devices
JPH04102073A (ja) * 1990-08-21 1992-04-03 Toyo Commun Equip Co Ltd 電波暗室における測定機器等の移送機構

Also Published As

Publication number Publication date
US7399667B2 (en) 2008-07-15
US5656839A (en) 1997-08-12
US20060172482A1 (en) 2006-08-03
US5629541A (en) 1997-05-13
US5904518A (en) 1999-05-18
US20080254582A1 (en) 2008-10-16
US5300802A (en) 1994-04-05
JPH02129968A (ja) 1990-05-18
US6960501B2 (en) 2005-11-01
US6451643B2 (en) 2002-09-17
US6777282B2 (en) 2004-08-17
US20010038119A1 (en) 2001-11-08
JP3059442B2 (ja) 2000-07-04
US20020179963A1 (en) 2002-12-05
US5407853A (en) 1995-04-18
US5656522A (en) 1997-08-12
US6255690B1 (en) 2001-07-03
US7071050B2 (en) 2006-07-04
KR0158871B1 (ko) 1998-12-01
US20040191979A1 (en) 2004-09-30
US20060014347A1 (en) 2006-01-19

Similar Documents

Publication Publication Date Title
KR900010988A (ko) 반도체 집적회로장치
KR900008673A (ko) 반도체집적회로장치
KR890017789A (ko) 반도체 집적회로장치
KR890015413A (ko) 반도체 집적회로
KR900017269A (ko) 반도체 집적회로 장치
DE69026164D1 (de) Halbleitende integrierte Schaltung
KR900011017A (ko) 반도체장치
DE3879804D1 (de) Integrierte halbleiterschaltungsvorrichtung.
DE68926256D1 (de) Komplementäre Halbleiteranordnung
DE3855797D1 (de) Integrierte Halbleiterschaltung
KR900007100A (ko) 반도체장치
KR890004421A (ko) 반도체집적회로장치
KR850007157A (ko) 반도체 집적 회로장치
KR900008703A (ko) 반도체 장치
KR890012388A (ko) Mis형 반도체 집적회로장치
KR900001037A (ko) 반도체 장치
DE69031671D1 (de) Integrierte Halbleiterschaltung
DE68929104D1 (de) Integrierte Halbleiterschaltung
KR900011093A (ko) 집적 회로형 반도체 소자
DE69026226D1 (de) Integrierte Halbleiterschaltung
KR860006136A (ko) 반도체 집적 회로 장치
DE68928760D1 (de) Halbleitervorrichtung
KR900702572A (ko) 반도체 장치
KR890015422A (ko) 반도체 장치
DE68910445D1 (de) Integrierter Halbleiterschaltkreis.

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20120801

Year of fee payment: 15

EXPY Expiration of term