KR20030070126A - 전자 디바이스 재료의 제조 방법 - Google Patents
전자 디바이스 재료의 제조 방법 Download PDFInfo
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- KR20030070126A KR20030070126A KR10-2003-7009626A KR20037009626A KR20030070126A KR 20030070126 A KR20030070126 A KR 20030070126A KR 20037009626 A KR20037009626 A KR 20037009626A KR 20030070126 A KR20030070126 A KR 20030070126A
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- film
- electronic device
- sio
- gas
- device material
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 59
- 239000000463 material Substances 0.000 title claims description 49
- 239000007789 gas Substances 0.000 claims abstract description 133
- 229910004298 SiO 2 Inorganic materials 0.000 claims abstract description 77
- 238000012545 processing Methods 0.000 claims abstract description 72
- 239000004065 semiconductor Substances 0.000 claims abstract description 40
- 229910052814 silicon oxide Inorganic materials 0.000 claims abstract description 20
- 229910021417 amorphous silicon Inorganic materials 0.000 claims abstract description 13
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims abstract description 13
- 229920005591 polysilicon Polymers 0.000 claims abstract description 13
- 229910000577 Silicon-germanium Inorganic materials 0.000 claims abstract description 12
- 238000000034 method Methods 0.000 claims description 51
- 239000000758 substrate Substances 0.000 claims description 35
- 238000005121 nitriding Methods 0.000 claims description 34
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 26
- 230000008569 process Effects 0.000 claims description 23
- 238000010438 heat treatment Methods 0.000 claims description 19
- 229910052786 argon Inorganic materials 0.000 claims description 15
- 150000004767 nitrides Chemical class 0.000 claims description 15
- 229910052743 krypton Inorganic materials 0.000 claims description 13
- 229910052734 helium Inorganic materials 0.000 claims description 11
- DNNSSWSSYDEUBZ-UHFFFAOYSA-N krypton atom Chemical compound [Kr] DNNSSWSSYDEUBZ-UHFFFAOYSA-N 0.000 claims description 11
- 239000001307 helium Substances 0.000 claims description 10
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims description 10
- 238000002360 preparation method Methods 0.000 claims 1
- 239000010408 film Substances 0.000 abstract description 239
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 abstract description 18
- 229910052757 nitrogen Inorganic materials 0.000 abstract description 9
- 230000001678 irradiating effect Effects 0.000 abstract description 5
- 239000010409 thin film Substances 0.000 abstract description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract description 3
- 239000001301 oxygen Substances 0.000 abstract description 3
- 229910052760 oxygen Inorganic materials 0.000 abstract description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 abstract 1
- 239000001257 hydrogen Substances 0.000 abstract 1
- 229910052739 hydrogen Inorganic materials 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 32
- 230000015572 biosynthetic process Effects 0.000 description 25
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 15
- 229910052710 silicon Inorganic materials 0.000 description 15
- 239000010703 silicon Substances 0.000 description 15
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 9
- 230000007246 mechanism Effects 0.000 description 6
- 238000005229 chemical vapour deposition Methods 0.000 description 5
- 150000002831 nitrogen free-radicals Chemical class 0.000 description 5
- 230000003647 oxidation Effects 0.000 description 5
- 238000007254 oxidation reaction Methods 0.000 description 5
- 238000012546 transfer Methods 0.000 description 5
- 230000006866 deterioration Effects 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 230000002542 deteriorative effect Effects 0.000 description 2
- 239000002019 doping agent Substances 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000008280 blood Substances 0.000 description 1
- 210000004369 blood Anatomy 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45563—Gas nozzles
- C23C16/45565—Shower nozzles
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C8/00—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C8/02—Pretreatment of the material to be coated
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C8/00—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C8/06—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using gases
- C23C8/34—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using gases more than one element being applied in more than one step
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C8/00—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C8/06—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using gases
- C23C8/36—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using gases using ionised gases, e.g. ionitriding
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
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- H01L21/02107—Forming insulating materials on a substrate
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- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02126—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
- H01L21/0214—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC the material being a silicon oxynitride, e.g. SiON or SiON:H
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- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
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- H01L21/02164—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material being a silicon oxide, e.g. SiO2
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
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- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/02227—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process
- H01L21/0223—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate
- H01L21/02233—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate of the semiconductor substrate or a semiconductor layer
- H01L21/02236—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate of the semiconductor substrate or a semiconductor layer group IV semiconductor
- H01L21/02238—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate of the semiconductor substrate or a semiconductor layer group IV semiconductor silicon in uncombined form, i.e. pure silicon
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
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- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
- H01L21/02318—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment
- H01L21/02321—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment introduction of substances into an already existing insulating layer
- H01L21/02329—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment introduction of substances into an already existing insulating layer introduction of nitrogen
- H01L21/02332—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment introduction of substances into an already existing insulating layer introduction of nitrogen into an oxide layer, e.g. changing SiO to SiON
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
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- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
- H01L21/02318—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment
- H01L21/02337—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment treatment by exposure to a gas or vapour
- H01L21/0234—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment treatment by exposure to a gas or vapour treatment by exposure to a plasma
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/28008—Making conductor-insulator-semiconductor electrodes
- H01L21/28017—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
- H01L21/28158—Making the insulator
- H01L21/28167—Making the insulator on single crystalline silicon, e.g. using a liquid, i.e. chemical oxidation
- H01L21/28194—Making the insulator on single crystalline silicon, e.g. using a liquid, i.e. chemical oxidation by deposition, e.g. evaporation, ALD, CVD, sputtering, laser deposition
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/28008—Making conductor-insulator-semiconductor electrodes
- H01L21/28017—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
- H01L21/28158—Making the insulator
- H01L21/28167—Making the insulator on single crystalline silicon, e.g. using a liquid, i.e. chemical oxidation
- H01L21/28202—Making the insulator on single crystalline silicon, e.g. using a liquid, i.e. chemical oxidation in a nitrogen-containing ambient, e.g. nitride deposition, growth, oxynitridation, NH3 nitridation, N2O oxidation, thermal nitridation, RTN, plasma nitridation, RPN
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
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- H01L21/314—Inorganic layers
- H01L21/3143—Inorganic layers composed of alternated layers or of mixtures of nitrides and oxides or of oxinitrides, e.g. formation of oxinitride by oxidation of nitride layers
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/314—Inorganic layers
- H01L21/316—Inorganic layers composed of oxides or glassy oxides or oxide based glass
- H01L21/3165—Inorganic layers composed of oxides or glassy oxides or oxide based glass formed by oxidation
- H01L21/31654—Inorganic layers composed of oxides or glassy oxides or oxide based glass formed by oxidation of semiconductor materials, e.g. the body itself
- H01L21/31658—Inorganic layers composed of oxides or glassy oxides or oxide based glass formed by oxidation of semiconductor materials, e.g. the body itself by thermal oxidation, e.g. of SiGe
- H01L21/31662—Inorganic layers composed of oxides or glassy oxides or oxide based glass formed by oxidation of semiconductor materials, e.g. the body itself by thermal oxidation, e.g. of SiGe of silicon in uncombined form
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
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Abstract
Description
Claims (26)
- 적어도 O2및 희가스를 함유하는 처리 가스의 존재 하에서, 복수의 슬릿을 갖는 평면 안테나 부재를 통한 마이크로파 조사에 기초한 플라즈마를 이용하여, Si를 주성분으로 하는 피처리 기판의 표면에 산화막(SiO2막)을 형성하는 것을 특징으로 하는 전자 디바이스 재료의 제조 방법.
- 제1항에 있어서, 상기 전자 디바이스는 반도체 장치인 것을 특징으로 하는 전자 디바이스 재료의 제조 방법.
- 제2항에 있어서, 상기 산화막은 게이트 산화막(SiO2막) 또는 게이트 산질화막용 하지 산화막(하지 SiO2막)인 것을 특징으로 하는 전자 디바이스 재료의 제조 방법.
- 제1항 내지 제3항 중 어느 한 항에 있어서, 상기 산화막의 막 두께는 2.5 nm 이하인 것을 특징으로 하는 전자 디바이스 재료의 제조 방법.
- 제1항 내지 제4항 중 어느 한 항에 있어서, 상기 희가스는 크립톤, 아르곤 또는 헬륨으로부터 선택된 1 종 이상의 가스인 것을 특징으로 하는 전자 디바이스재료의 제조 방법.
- 제1항 내지 제5항 중 어느 한 항에 있어서, 상기 처리 가스는 유량 5∼500 sccm의 O2및 유량 500∼3000 sccm의 크립톤, 아르곤 또는 헬륨을 함유하는 가스인 것을 특징으로 하는 전자 디바이스 재료의 제조 방법.
- 제1항 내지 제6항 중 어느 한 항에 있어서, 상기 SiO2막의 형성은 실온∼700 ℃의 온도 하에서 행해지는 것을 특징으로 하는 전자 디바이스 재료의 제조 방법.
- 제1항 내지 제4항 중 어느 한 항에 있어서, 상기 SiO2막의 형성은 20∼5000 mTorr의 압력 하에서 행해지는 것을 특징으로 하는 전자 디바이스 재료의 제조 방법.
- 제1항 내지 제8항 중 어느 한 항에 있어서, 상기 플라즈마는 0.5∼5 W/cm2의 출력으로 형성되는 것을 특징으로 하는 전자 디바이스 재료의 제조 방법.
- 적어도 O2및 희가스를 함유하는 처리 가스의 존재 하에서, 복수의 슬릿을 갖는 평면 안테나 부재를 통한 마이크로파 조사에 기초한 플라즈마를 이용하여, Si를주성분으로 하는 피처리 기판의 표면에 하지 산화막(SiO2막)을 형성하는 공정과;적어도 N2와 희가스를 함유하는 처리 가스의 존재 하에서, 복수의 슬릿을 갖는 평면 안테나 부재를 통한 마이크로파 조사에 기초한 질화 플라즈마를 이용하여, 상기 하지 SiO2막 표면을 질화하는 공정을 포함하는 것을 특징으로 하는 전자 디바이스 재료의 제조 방법.
- 제10항에 있어서, 상기 전자 디바이스는 반도체 장치인 것을 특징으로 하는 전자 디바이스 재료의 제조 방법.
- 제10항 또는 제11항에 있어서, 상기 처리 가스는 H2를 더 함유하는 것을 특징으로 하는 전자 디바이스 재료의 제조 방법.
- 제10항 내지 제12항 중 어느 한 항에 있어서, 상기 산화막은 게이트 산화막(SiO2막) 또는 게이트 산질화막용 하지 산화막(하지 SiO2막)인 것을 특징으로 하는 전자 디바이스 재료의 제조 방법.
- 제10항 내지 제13항 중 어느 한 항에 있어서, 상기 산화막의 막 두께는 2.5 nm 이하인 것을 특징으로 하는 전자 디바이스 재료의 제조 방법.
- 제10항 내지 제14항 중 어느 한 항에 있어서, 상기 희가스는 크립톤, 아르곤 또는 헬륨인 것을 특징으로 하는 전자 디바이스 재료의 제조 방법.
- 제10항 내지 제15항 중 어느 한 항에 있어서, 상기 처리 가스는 유량 2∼500 sccm의 N2및 유량 200∼2000 sccm의 크립톤, 아르곤 또는 헬륨을 함유하는 가스; 또는 유량 2∼500 sccm의 N2, 유량 200∼2000 sccm의 크립톤, 아르곤 또는 헬륨 및 유량 1∼100 sccm의 H2를 함유하는 가스인 것을 특징으로 하는 전자 디바이스 재료의 제조 방법.
- 제10항 내지 제16항 중 어느 한 항에 있어서, 상기 하지 SiO2막의 질화는 실온∼700 ℃의 온도 하에서 행해지는 것을 특징으로 하는 전자 디바이스 재료의 제조 방법.
- 제10항 내지 제18항 중 어느 한 항에 있어서, 상기 하지 SiO2막의 질화는 10∼3000 mTorr의 압력 하에서 행해지는 것을 특징으로 하는 전자 디바이스 재료의 제조 방법.
- 제10항 내지 제18항 중 어느 한 항에 있어서, 상기 질화 플라즈마는 0.5∼4 W/cm2의 출력으로 형성되는 것을 특징으로 하는 전자 디바이스 재료의 제조 방법.
- 적어도 O2및 희가스를 함유하는 처리 가스의 존재 하에서, 복수의 슬릿을 갖는 평면 안테나 부재를 통한 마이크로파 조사에 기초한 플라즈마를 이용하여, Si를 주성분으로 하는 피처리 기판의 표면에 하지 산화막(SiO2막)을 형성하는 공정과;적어도 N2와 희가스를 함유하는 처리 가스의 존재 하에서, 복수의 슬릿을 갖는 평면 안테나 부재를 통한 마이크로파 조사에 기초한 질화 플라즈마를 이용하여, 상기 하지 SiO2막 표면을 질화하는 공정과;상기 SiO2막 또는 표면 질화한 하지 SiO2막(SiON막)을 갖는 피처리 기판을 층형성 가스의 존재 하에 가열하여 상기 SiO2막 또는 SiON막 상에 전극층을 형성하는 공정을 포함하는 것을 특징으로 하는 전자 디바이스 재료의 제조 방법.
- 제20항에 있어서, 상기 전극층은 폴리실리콘 또는 비결정질 실리콘 또는 SiGe로 이루어지는 전극층인 것을 특징으로 하는 전자 디바이스 재료의 제조 방법.
- 제20항 또는 제21항에 있어서, 상기 전자 디바이스는 반도체 장치인 것을 특징으로 하는 전자 디바이스 재료의 제조 방법.
- 제20항 내지 제22항 중 어느 한 항에 있어서, 상기 전극층은 게이트 전극인 것을 특징으로 하는 전자 디바이스 재료의 제조 방법.
- 제20항 내지 제23항 중 어느 한 항에 있어서, 상기 층 형성 가스는 SiH4이고, 압력은 20.0∼40 Pa(150∼300 mTorr)이고, 온도는 570∼650 ℃이며, 형성되는 게이트 전극은 폴리실리콘으로 이루어지는 것을 특징으로 하는 전자 디바이스 재료의 제조 방법.
- 제20항 내지 제23항 중 어느 한 항에 있어서, 상기 층 형성 가스는 SiH4이고, 압력은 20.0∼66.7 Pa(150∼500 mTorr)이고, 온도는 520∼570 ℃이며, 형성되는 게이트 전극은 비결정질 실리콘으로 이루어지는 것을 특징으로 하는 전자 디바이스 재료의 제조 방법.
- 제20항 내지 제23항 중 어느 한 항에 있어서, 상기 층 형성 가스는 GeH4/SiH4= 10/90∼60/40 %의 혼합 가스이고, 압력은 20∼60 Pa이고, 온도는 460∼560 ℃이며, 형성되는 게이트 전극은 SiGe로 이루어지는 것을 특징으로 하는 전자 디바이스 재료의 제조 방법.
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KR100966927B1 (ko) * | 2005-03-30 | 2010-06-29 | 도쿄엘렉트론가부시키가이샤 | 절연막의 제조 방법 및 반도체 장치의 제조 방법 |
KR101123442B1 (ko) * | 2005-04-15 | 2012-03-23 | 도쿄엘렉트론가부시키가이샤 | 반도체 장치의 제조 방법, 반도체 장치, 플라즈마 질화처리 방법, 제어 프로그램 및 컴퓨터 기억 매체 |
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US20070224837A1 (en) | 2007-09-27 |
US20040142577A1 (en) | 2004-07-22 |
KR100994387B1 (ko) | 2010-11-16 |
JP4926219B2 (ja) | 2012-05-09 |
JPWO2002058130A1 (ja) | 2004-05-27 |
JP4401375B2 (ja) | 2010-01-20 |
JP3916565B2 (ja) | 2007-05-16 |
EP1361605A1 (en) | 2003-11-12 |
CN1860596A (zh) | 2006-11-08 |
US20050233599A1 (en) | 2005-10-20 |
KR100746120B1 (ko) | 2007-08-13 |
KR20090053965A (ko) | 2009-05-28 |
JP2010050462A (ja) | 2010-03-04 |
JP2007013200A (ja) | 2007-01-18 |
WO2002058130A1 (fr) | 2002-07-25 |
EP1361605A4 (en) | 2006-02-15 |
KR20060061404A (ko) | 2006-06-07 |
CN100477113C (zh) | 2009-04-08 |
CN101399198A (zh) | 2009-04-01 |
KR100837707B1 (ko) | 2008-06-13 |
KR20070116696A (ko) | 2007-12-10 |
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