KR20010111736A - 리드프레임의 배면에 직접 부착되는 절연방열판을구비하는 전력 모듈 패키지 - Google Patents
리드프레임의 배면에 직접 부착되는 절연방열판을구비하는 전력 모듈 패키지 Download PDFInfo
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- KR20010111736A KR20010111736A KR1020000032383A KR20000032383A KR20010111736A KR 20010111736 A KR20010111736 A KR 20010111736A KR 1020000032383 A KR1020000032383 A KR 1020000032383A KR 20000032383 A KR20000032383 A KR 20000032383A KR 20010111736 A KR20010111736 A KR 20010111736A
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- heat sink
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Abstract
Description
Claims (18)
- ① 전력회로 및 통제회로를 위한 부품들이 부착되는 제1면과,방열판(heat sink)이 부착되는 제2면과,상기 제1면의 중앙에는 다운셋(down set)이 형성되고, 가장자리에는 외부연결단자(external terminals)들이 형성된 리드프레임;② 상기 다운셋에 의해 돌출된 리드프레임의 제2면에 직접 부착되고, 상기 부착되는 면과 대향하는 면이 전력 모듈 패키지 외부로 노출되며, 열 전달 특성이 우수한 절연물질로 이루어진 방열판(heat sink);③ 상기 리드프레임의 제1면에서 다운셋이 형성된 부분에 탑재되는 전력회로를 위한 부품;④ 상기 리드프레임의 제1면에 탑재되는 통제회로를 위한 부품; 및⑤ 상기 방열판의 일면 및 상기 리드프레임의 외부 연결 단자를 제외한 나머지 리드프레임 및 방열판을 감싸는 봉합수지를 구비하는 것을 특징으로 하는 전력 모듈 패키지.
- 제1항에 있어서,상기 열 전달 특성이 우수하고 절연물질로 된 방열판(heat sink)은 플라스틱 혹은 세라믹을 재질로 하는 것을 특징으로 하는 전력 모듈 패키지.
- 제2항에 있어서,상기 방열판은 산화알루미늄, 질화알루미늄, 산화규소 및 산화베릴늄 중에서 적어도 어느 하나를 포함하는 것을 특징으로 하는 전력 모듈 패키지.
- 제1항에 있어서,상기 방열판은 패키지 휨(warpage)을 방지하기 위한 프리밴트 플레이트(pre-bent plate)형인 것을 특징으로 하는 전력 모듈 패키지.
- 제4항에 있어서,상기 방열판의 프리밴트(pre-bent) 정도는 100㎛ 이하 범위인 것을 특징으로 하는 전력 모듈 패키지.
- 제1항에 있어서,상기 방열판은 상기 봉합수지보다 약간 돌출된 형상인 것을 특징으로 하는 전력 모듈 패키지.
- 제6항에 있어서,상기 방열판이 상기 봉합수지보다 돌출된 정도는 0.05∼0.1㎜ 범위인 것을 특징으로 하는 전력 모듈 패키지.
- 중앙에 다운셋이 형성되고, 가장자리에는 외부연결단자가 있는 리드프레임을 준비하는 단계;상기 리드프레임에 제1면에 전력회로 및 통제회로의 기능을 수행하는 복수의 칩을 부착하고 와이어 본딩을 수행하는 단계;상기 리드프레임을 몰딩장비로 위치시키되, 상기 몰딩장비는 하부 몰드다이(bottom mold die)에 절연물질로 된 방열판을 고정시킬 수 있는 몰드 장비로 상기 리드프레임을 위치시키는 단계; 및상기 몰드장비에서 상기 리드프레임을 밀봉하되, 상기 리드프레임중 다운셋(downset)이 있는 제2면에 상기 방열판이 직접 접착되고, 외부연결단자가 노출되고, 상기 방열판에서 리드프레임과 접착된 면과 대향하는 면이 외부로 노출되도록 봉합수지를 사용하여 상기 리드프레임을 밀봉(sealing)하는 단계를 구비하는 것을 특징으로 하는 전력 모듈 패키지 제조방법.
- 제8항에 있어서,상기 몰딩장비의 하부 몰드다이(bottom mold die)는 상기 방열판을 고정시킬 수 있는 홈(groove)이 형성된 것을 특징으로 하는 전력 모듈 패키지 제조방법.
- 제9항에 있어서,상기 홈의 깊이는 상기 하부 몰드다이의 표면으로부터 0.05∼0.1㎜ 범위로 파인 것을 특징으로 하는 전력 모듈 패키지 제조방법.
- 제8항에 있어서,상기 방열판은 플라스틱 혹은 세라믹을 재질로서 산화알루미늄, 질화알루미늄, 산화규소 및 산화베릴늄 중에서 어느 하나를 포함하는 것을 특징으로 하는 전력 모듈 패키지 제조방법.
- 제8항에 있어서,상기 방열판은 프리밴트 플레이트형을 사용하는 것을 특징으로 하는 전력 모듈 패키지 제조방법.
- 중앙에는 다운셋이 형성되고, 가장자리에는 외부연결단자가 있는 리드프레임을 준비하는 단계;상기 리드프레임에 제1면에 전력회로 및 통제회로의 기능을 수행하는 복수의 칩을 부착하고 와이어 본딩을 수행하는 단계;상기 리드프레임을 몰딩장비로 위치하되, 상기 몰딩장비는 하부 몰드다이(bottom mold die)에 절연물질로 된 방열판을 후속공정에서 부착하기 위한 돌출부가 형성된 몰드 장비로 상기 리드프레임을 위치하는 단계;상기 몰드장비에서 상기 리드프레임의 외부연결단자 및 다운셋이 형성된 리드프레임의 제2면이 단차진 형태로 노출되도록 봉합수지를 사용하여 상기 리드프레임을 밀봉(sealing)하는 단계; 및상기 단차가 형성된 채 외부로 노출된 리드프레임의 제2면에 방열판을 부착하는 단계를 구비하는 것을 특징으로 하는 전력 모듈 패키지 제조방법.
- 제13항에 있어서,상기 돌출부의 돌출 높이는 1∼3㎜의 범위인 것을 특징으로 하는 전력 모듈 패키지 제조방법.
- 제13항에 있어서,상기 방열판은 플라스틱 혹은 세라믹을 재질로서 산화알루미늄, 질화알루미늄, 산화규소 및 산화베릴늄 중에서 어느 하나를 포함하는 것을 특징으로 하는 전력 모듈 패키지 제조방법.
- 제13항에 있어서,상기 리드프레임의 제2면에 상기 방열판을 부착하는 방법은 세라믹계의 충진제를 포함하는 액상 에폭시를 이용하여 부착하는 것을 특징으로 하는 전력 모듈 패키지 제조방법.
- 제13항에 있어서,상기 방열판은 패키지 휨을 방지하기 위해 프리밴트 플레이트형을 사용하는 것을 특징으로 하는 것을 특징으로 하는 전력 모듈 패키지 제조방법.
- 제8항에 있어서,상기 방열판은 접착제에 의해 부착된 복수개의 층으로 이루어진 것을 특징으로 하는 전력 모듈 패키지 제조방법.
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US09/789,557 US6432750B2 (en) | 2000-06-13 | 2001-02-22 | Power module package having insulator type heat sink attached to rear surface of lead frame and manufacturing method thereof |
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US6060772A (en) * | 1997-06-30 | 2000-05-09 | Kabushiki Kaisha Toshiba | Power semiconductor module with a plurality of semiconductor chips |
JP4037589B2 (ja) * | 2000-03-07 | 2008-01-23 | 三菱電機株式会社 | 樹脂封止形電力用半導体装置 |
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2000
- 2000-06-13 KR KR10-2000-0032383A patent/KR100370231B1/ko active IP Right Grant
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2001
- 2001-02-22 US US09/789,557 patent/US6432750B2/en not_active Expired - Lifetime
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US20010052639A1 (en) | 2001-12-20 |
KR100370231B1 (ko) | 2003-01-29 |
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