KR20010015342A - 개선된 산 구리 전기도금액 - Google Patents

개선된 산 구리 전기도금액 Download PDF

Info

Publication number
KR20010015342A
KR20010015342A KR1020000040658A KR20000040658A KR20010015342A KR 20010015342 A KR20010015342 A KR 20010015342A KR 1020000040658 A KR1020000040658 A KR 1020000040658A KR 20000040658 A KR20000040658 A KR 20000040658A KR 20010015342 A KR20010015342 A KR 20010015342A
Authority
KR
South Korea
Prior art keywords
acid
poly
mercapto
leveling agent
copper
Prior art date
Application number
KR1020000040658A
Other languages
English (en)
Korean (ko)
Inventor
왕킹민
후앙웨이지
라우미우링
리우캐롤흐시우친
마세
챵에드워드케이
호웬핀
파시에즈리차드씨
Original Assignee
페이스 살바토르 피
더 비오씨 그룹 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 페이스 살바토르 피, 더 비오씨 그룹 인코포레이티드 filed Critical 페이스 살바토르 피
Publication of KR20010015342A publication Critical patent/KR20010015342A/ko

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
KR1020000040658A 1999-07-15 2000-07-14 개선된 산 구리 전기도금액 KR20010015342A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US14415999P 1999-07-15 1999-07-15
US60/144,159 1999-07-15
US58359900A 2000-05-31 2000-05-31
US09/583,599 2000-05-31

Publications (1)

Publication Number Publication Date
KR20010015342A true KR20010015342A (ko) 2001-02-26

Family

ID=26841728

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020000040658A KR20010015342A (ko) 1999-07-15 2000-07-14 개선된 산 구리 전기도금액

Country Status (4)

Country Link
US (1) US20040187731A1 (ja)
EP (1) EP1069211A3 (ja)
JP (1) JP2001073182A (ja)
KR (1) KR20010015342A (ja)

Families Citing this family (78)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004531640A (ja) * 2001-02-07 2004-10-14 マイクロリス・コーポレイシヨン 水性めっき液の脱気方法
KR20020092444A (ko) * 2001-02-23 2002-12-11 가부시키 가이샤 에바라 세이사꾸쇼 구리-도금 용액, 도금 방법 및 도금 장치
JP4793530B2 (ja) * 2001-07-02 2011-10-12 上村工業株式会社 硫酸銅めっき浴
US6736954B2 (en) * 2001-10-02 2004-05-18 Shipley Company, L.L.C. Plating bath and method for depositing a metal layer on a substrate
US7316772B2 (en) * 2002-03-05 2008-01-08 Enthone Inc. Defect reduction in electrodeposited copper for semiconductor applications
US8002962B2 (en) * 2002-03-05 2011-08-23 Enthone Inc. Copper electrodeposition in microelectronics
JP3789107B2 (ja) * 2002-07-23 2006-06-21 株式会社日鉱マテリアルズ 特定骨格を有するアミン化合物及び有機硫黄化合物を添加剤として含む銅電解液並びにそれにより製造される電解銅箔
JP4115240B2 (ja) * 2002-10-21 2008-07-09 日鉱金属株式会社 特定骨格を有する四級アミン化合物及び有機硫黄化合物を添加剤として含む銅電解液並びにそれにより製造される電解銅箔
JP4534460B2 (ja) * 2002-11-11 2010-09-01 凸版印刷株式会社 銅めっき硬度維持剤及び銅めっき方法並びにそれを用いたグラビア版、レンズ金型
JP4510369B2 (ja) 2002-11-28 2010-07-21 日本リーロナール有限会社 電解銅めっき方法
WO2004059040A1 (ja) * 2002-12-25 2004-07-15 Nikko Materials Co., Ltd. 特定骨格を有する四級アミン化合物重合体及び有機硫黄化合物を添加剤として含む銅電解液並びにそれにより製造される電解銅箔
EP1477588A1 (en) * 2003-02-19 2004-11-17 Rohm and Haas Electronic Materials, L.L.C. Copper Electroplating composition for wafers
US7128822B2 (en) 2003-06-04 2006-10-31 Shipley Company, L.L.C. Leveler compounds
JP2005029818A (ja) * 2003-07-09 2005-02-03 Ebara Corp めっき方法
US20050211564A1 (en) * 2004-03-29 2005-09-29 Taiwan Semiconductor Manufacturing Co., Ltd. Method and composition to enhance wetting of ECP electrolyte to copper seed
TW200613586A (en) 2004-07-22 2006-05-01 Rohm & Haas Elect Mat Leveler compounds
WO2006018872A1 (ja) * 2004-08-18 2006-02-23 Ebara-Udylite Co., Ltd. 銅めっき用添加剤およびこれを用いる電子回路基板の製造方法
US7442634B2 (en) * 2004-12-21 2008-10-28 Intel Corporation Method for constructing contact formations
JP4976725B2 (ja) * 2005-03-31 2012-07-18 三井金属鉱業株式会社 銅電解液及びその銅電解液を用いた電析銅皮膜の形成方法
US7662981B2 (en) 2005-07-16 2010-02-16 Rohm And Haas Electronic Materials Llc Leveler compounds
TWI328622B (en) * 2005-09-30 2010-08-11 Rohm & Haas Elect Mat Leveler compounds
JP2007146289A (ja) * 2005-10-31 2007-06-14 Mitsui Mining & Smelting Co Ltd 電解銅箔の製造方法、該製造方法で得られる電解銅箔、該電解銅箔を用いて得られる表面処理銅箔及び該電解銅箔又は該表面処理銅箔を用いて得られる銅張積層板
JP4816901B2 (ja) * 2005-11-21 2011-11-16 上村工業株式会社 電気銅めっき浴
US20070158199A1 (en) * 2005-12-30 2007-07-12 Haight Scott M Method to modulate the surface roughness of a plated deposit and create fine-grained flat bumps
JP4895734B2 (ja) * 2006-09-08 2012-03-14 荏原ユージライト株式会社 めっき用レベリング剤、酸性銅めっき浴用添加剤組成物、酸性銅めっき浴および該めっき浴を用いるめっき方法
CN101517131B (zh) * 2006-10-03 2011-02-16 三井金属矿业株式会社 硫酸酸性铜电解液制备方法及使用该制备方法制备的硫酸酸性铜电解液及电析铜薄膜
JP2008088524A (ja) * 2006-10-04 2008-04-17 Ebara Udylite Kk プリント基板用硫酸銅めっき液
US20080181813A1 (en) * 2007-01-26 2008-07-31 Baker Hughes Incorporated Novel Mercaptan-Based Corrosion Inhibitors
EP2161355A4 (en) * 2007-05-21 2012-01-25 Uyemura C & Co Ltd ELECTROLYTIC COPPER BATH
US20090188805A1 (en) * 2008-01-25 2009-07-30 Government Of The United States Of America, As Represented By The Superconformal electrodeposition of nickel iron and cobalt magnetic alloys
ES2624637T3 (es) * 2008-05-30 2017-07-17 Atotech Deutschland Gmbh Aditivo de electrogalvanoplastia para la deposición de una aleación de un metal del grupo IB/binaria o ternaria del grupo IB-grupo IIIA/ternaria, cuaternaria o quinaria del grupo IB, el grupo IIIA-grupo VIA
JP5525762B2 (ja) * 2008-07-01 2014-06-18 上村工業株式会社 無電解めっき液及びそれを用いた無電解めっき方法、並びに配線基板の製造方法
US8388824B2 (en) 2008-11-26 2013-03-05 Enthone Inc. Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelers
EP2199315B1 (en) 2008-12-19 2013-12-11 Basf Se Composition for metal electroplating comprising leveling agent
JP5578697B2 (ja) * 2009-04-03 2014-08-27 公立大学法人大阪府立大学 銅充填方法
JP5568250B2 (ja) * 2009-05-18 2014-08-06 公立大学法人大阪府立大学 銅を充填する方法
EP2504396B1 (en) 2009-11-27 2021-02-24 Basf Se Composition for copper electroplating comprising leveling agent
US9834677B2 (en) 2010-03-18 2017-12-05 Basf Se Composition for metal electroplating comprising leveling agent
TWI572750B (zh) 2010-05-24 2017-03-01 安頌股份有限公司 直通矽穿孔之銅充填
EP2392692A1 (en) 2010-06-01 2011-12-07 Basf Se Composition for metal electroplating comprising leveling agent
KR101829866B1 (ko) 2010-06-01 2018-02-20 바스프 에스이 레벨링제를 포함하는 금속 전기도금용 조성물
JP5505153B2 (ja) * 2010-07-16 2014-05-28 上村工業株式会社 電気銅めっき浴及び電気銅めっき方法
JP2012127003A (ja) 2010-12-15 2012-07-05 Rohm & Haas Electronic Materials Llc 銅層を均一にする電気めっき方法
GB201100447D0 (en) * 2011-01-12 2011-02-23 Johnson Matthey Plc Improvements in coating technology
KR101705734B1 (ko) * 2011-02-18 2017-02-14 삼성전자주식회사 구리 도금 용액 및 이것을 이용한 구리 도금 방법
EP2537962A1 (en) * 2011-06-22 2012-12-26 Atotech Deutschland GmbH Method for copper plating
EP2735627A1 (en) 2012-11-26 2014-05-28 ATOTECH Deutschland GmbH Copper plating bath composition
US20140238868A1 (en) * 2013-02-25 2014-08-28 Dow Global Technologies Llc Electroplating bath
CN103469260A (zh) * 2013-09-27 2013-12-25 昆山纯柏精密五金有限公司 一种五金件的酸性镀铜的方法
EP2865787A1 (en) * 2013-10-22 2015-04-29 ATOTECH Deutschland GmbH Copper electroplating method
KR102312018B1 (ko) * 2013-12-09 2021-10-13 아베니 전기화학적 불활성 양이온을 함유하는 구리 전착 배쓰
TWI710671B (zh) * 2014-09-15 2020-11-21 美商麥德美樂思公司 微電子技術中銅沈積用之平整劑
US10450667B2 (en) 2014-10-27 2019-10-22 International Business Machines Corporation System for treating solution for use in electroplating application and method for treating solution for use in electroplating application
TWI689630B (zh) 2014-11-05 2020-04-01 美商康寧公司 底部向上電解質通孔鍍覆方法
US9783905B2 (en) 2014-12-30 2017-10-10 Rohm and Haas Electronic Mateirals LLC Reaction products of amino acids and epoxies
US9725816B2 (en) 2014-12-30 2017-08-08 Rohm And Haas Electronic Materials Llc Amino sulfonic acid based polymers for copper electroplating
US9611560B2 (en) 2014-12-30 2017-04-04 Rohm And Haas Electronic Materials Llc Sulfonamide based polymers for copper electroplating
CN107771227B (zh) 2015-04-20 2019-04-02 埃托特克德国有限公司 电解铜镀液组合物及其用法
CN107636209B (zh) * 2015-06-26 2021-07-02 住友金属矿山股份有限公司 导电性基板
EP3135709B1 (en) 2015-08-31 2018-01-10 ATOTECH Deutschland GmbH Imidazoyl urea polymers and their use in metal or metal alloy plating bath compositions
EP3344800B1 (en) 2015-08-31 2019-03-13 ATOTECH Deutschland GmbH Aqueous copper plating baths and a method for deposition of copper or copper alloy onto a substrate
CN105239109A (zh) * 2015-10-28 2016-01-13 福州瑞华印制线路板有限公司 一种哈林槽镀铜方法
CN105200467B (zh) * 2015-11-02 2019-01-29 江苏梦得新材料科技有限公司 一种凹版硬铜添加剂及镀液
WO2017090161A1 (ja) * 2015-11-26 2017-06-01 近藤　和夫 酸性銅めっき液、酸性銅めっき物および半導体デバイスの製造方法
EP3360988B1 (en) 2017-02-09 2019-06-26 ATOTECH Deutschland GmbH Pyridinium compounds, a synthesis method therefor, metal or metal alloy plating baths containing said pyridinium compounds and a method for use of said metal or metal alloy plating baths
PT3508620T (pt) 2018-01-09 2021-07-12 Atotech Deutschland Gmbh Aditivo de ureileno, a sua utilização e um método de preparação para esse fim
US10917966B2 (en) 2018-01-29 2021-02-09 Corning Incorporated Articles including metallized vias
JP6645609B2 (ja) 2018-07-27 2020-02-14 三菱マテリアル株式会社 錫合金めっき液
CN112236548B (zh) * 2018-07-27 2022-03-04 三菱综合材料株式会社 锡合金镀液
US11746433B2 (en) 2019-11-05 2023-09-05 Macdermid Enthone Inc. Single step electrolytic method of filling through holes in printed circuit boards and other substrates
CN110938848B (zh) * 2019-12-26 2021-05-11 江苏艾森半导体材料股份有限公司 一种用于电解沉积铜的组合物及酸铜电镀液
EP3933073B1 (en) 2020-06-29 2023-11-29 Atotech Deutschland GmbH & Co. KG Copper electroplating bath
CN112144083B (zh) * 2020-09-22 2021-12-10 广州三孚新材料科技股份有限公司 一种太阳能电池用无氰镀铜电镀液及制备方法
WO2022158277A1 (ja) * 2021-01-20 2022-07-28 富士フイルム株式会社 めっき液、および、金属充填構造体の製造方法
EP4032930B1 (en) 2021-01-22 2023-08-30 Atotech Deutschland GmbH & Co. KG Biuret-based quaternized polymers and their use in metal or metal alloy plating baths
CN113430598B (zh) * 2021-08-27 2021-11-16 深圳市板明科技股份有限公司 一种线路板盲孔填充电镀铜溶液及其应用
CN113956479B (zh) * 2021-11-26 2022-12-02 电子科技大学 电镀铜加速剂及合成方法和应用
CN116751362B (zh) * 2023-08-21 2024-01-09 广东腐蚀科学与技术创新研究院 一种水溶性二胺基脲聚合物及其制备方法和应用

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2954331A (en) * 1958-08-14 1960-09-27 Dayton Bright Copper Company Bright copper plating bath
NL291575A (ja) * 1962-04-16
US3328273A (en) * 1966-08-15 1967-06-27 Udylite Corp Electro-deposition of copper from acidic baths
US3615736A (en) * 1969-01-06 1971-10-26 Enthone Electroless copper plating bath
BE755019A (fr) * 1969-08-19 1971-02-19 Kuraray Co Materiau en feuille utilisable comme succedane du cuir.
US3715289A (en) * 1971-02-08 1973-02-06 Stauffer Chemical Co Brightener composition for acid copper electroplating baths
US4004956A (en) * 1974-08-14 1977-01-25 Enthone, Incorporated Selectively stripping tin or tin-lead alloys from copper substrates
US4134803A (en) * 1977-12-21 1979-01-16 R. O. Hull & Company, Inc. Nitrogen and sulfur compositions and acid copper plating baths
JPS6021240B2 (ja) * 1980-01-12 1985-05-25 株式会社小糸製作所 堆積される銅をメッキ液に補給する方法及び装置
US4304646A (en) * 1980-10-27 1981-12-08 Enthone, Incorporated Method for selective removal of copper contaminants from activator solutions containing palladium and tin
US4376685A (en) * 1981-06-24 1983-03-15 M&T Chemicals Inc. Acid copper electroplating baths containing brightening and leveling additives
FR2510145B1 (fr) * 1981-07-24 1986-02-07 Rhone Poulenc Spec Chim Additif pour bain de cuivrage electrolytique acide, son procede de preparation et son application au cuivrage des circuits imprimes
US4384930A (en) * 1981-08-21 1983-05-24 Mcgean-Rohco, Inc. Electroplating baths, additives therefor and methods for the electrodeposition of metals
US4490220A (en) * 1982-09-30 1984-12-25 Learonal, Inc. Electrolytic copper plating solutions
US4555315A (en) * 1984-05-29 1985-11-26 Omi International Corporation High speed copper electroplating process and bath therefor
US4790912A (en) * 1985-06-06 1988-12-13 Techno-Instruments Investments Ltd. Selective plating process for the electrolytic coating of circuit boards without an electroless metal coating
US4717439A (en) * 1985-10-24 1988-01-05 Enthone, Incorporated Process for the treatment of copper oxide in the preparation of printed circuit boards
US4808481A (en) * 1986-10-31 1989-02-28 American Cyanamid Company Injection molding granules comprising copper coated fibers
US4786746A (en) * 1987-09-18 1988-11-22 Pennsylvania Research Corporation Copper electroplating solutions and methods of making and using them
US4948474A (en) * 1987-09-18 1990-08-14 Pennsylvania Research Corporation Copper electroplating solutions and methods
US5051154A (en) * 1988-08-23 1991-09-24 Shipley Company Inc. Additive for acid-copper electroplating baths to increase throwing power
US4897165A (en) * 1988-08-23 1990-01-30 Shipley Company Inc. Electroplating composition and process for plating through holes in printed circuit boards
US4954226A (en) * 1988-12-21 1990-09-04 International Business Machines Corporation Additive plating bath and process
US5215645A (en) * 1989-09-13 1993-06-01 Gould Inc. Electrodeposited foil with controlled properties for printed circuit board applications and procedures and electrolyte bath solutions for preparing the same
US5147905A (en) * 1991-05-01 1992-09-15 The Dow Chemical Company Advanced and unadvanced compositions, nucleophilic derivatives thereof and curable and coating compositions thereof
US5849171A (en) * 1990-10-13 1998-12-15 Atotech Deutschland Gmbh Acid bath for copper plating and process with the use of this combination
US5174886A (en) * 1991-02-22 1992-12-29 Mcgean-Rohco, Inc. High-throw acid copper plating using inert electrolyte
DE4126502C1 (ja) * 1991-08-07 1993-02-11 Schering Ag Berlin Und Bergkamen, 1000 Berlin, De
US5151170A (en) * 1991-12-19 1992-09-29 Mcgean-Rohco, Inc. Acid copper electroplating bath containing brightening additive
US5266212A (en) * 1992-10-13 1993-11-30 Enthone-Omi, Inc. Purification of cyanide-free copper plating baths
US5328589A (en) * 1992-12-23 1994-07-12 Enthone-Omi, Inc. Functional fluid additives for acid copper electroplating baths
US5630950A (en) * 1993-07-09 1997-05-20 Enthone-Omi, Inc. Copper brightening process and bath
US5402465A (en) * 1993-12-02 1995-03-28 Foltz; Jack D. Telephone trouble isolator
US5730854A (en) * 1996-05-30 1998-03-24 Enthone-Omi, Inc. Alkoxylated dimercaptans as copper additives and de-polarizing additives
US5733429A (en) * 1996-09-10 1998-03-31 Enthone-Omi, Inc. Polyacrylic acid additives for copper electrorefining and electrowinning
US5750018A (en) * 1997-03-18 1998-05-12 Learonal, Inc. Cyanide-free monovalent copper electroplating solutions
US5863410A (en) * 1997-06-23 1999-01-26 Circuit Foil Usa, Inc. Process for the manufacture of high quality very low profile copper foil and copper foil produced thereby
KR100616198B1 (ko) * 1998-04-21 2006-08-25 어플라이드 머티어리얼스, 인코포레이티드 기판상에 전기도금하는 전기화학적 증착 시스템 및 방법

Also Published As

Publication number Publication date
EP1069211A2 (en) 2001-01-17
JP2001073182A (ja) 2001-03-21
US20040187731A1 (en) 2004-09-30
EP1069211A3 (en) 2003-12-17

Similar Documents

Publication Publication Date Title
KR20010015342A (ko) 개선된 산 구리 전기도금액
JP4651906B2 (ja) 基体上に金属層を堆積させるためのメッキ浴および方法
EP2723921B1 (en) Method for copper plating
KR101522543B1 (ko) 구리 도금조 제제
JP4342294B2 (ja) 逆パルスめっき組成物および逆パルスメッキ方法
ES2421189T3 (es) Proceso para galvanizado electrolítico de cobre.
AU2004239226B2 (en) High purity electrolytic sulfonic acid solutions
US20040045832A1 (en) Electrolytic copper plating solutions
JP2003113490A (ja) 基体上に金属層を堆積させるためのメッキ浴および方法
JP2003113491A (ja) 基体上に金属層を堆積させるためのメッキ浴および方法
KR100738824B1 (ko) 반도체 장치의 마이크론 또는 서브마이크론 치수의 트렌치 또는 비어 금속화용 구리 전기도금액 및 이를 사용한 금속화 방법
KR102127642B1 (ko) 아민과 폴리아크릴아미드와 비스에폭시드의 반응 생성물을 함유하는 구리 전기도금욕
EP1148156A2 (en) Copper Electroplating
TWI659131B (zh) 含有胺與聚丙烯醯胺之反應產物的化合物的銅電鍍浴
KR102125237B1 (ko) 아민과 퀴논의 반응 생성물의 화합물을 함유하는 구리 전기도금욕
KR102125240B1 (ko) 아민과 폴리아크릴아미드와 설톤의 반응 생성물의 화합물을 함유하는 구리 전기도금욕
KR100711426B1 (ko) 인쇄회로기판 스루홀 도금용 산성 동전해 용액의 조성물
KR20030029004A (ko) 기판상에 금속층을 침착시키기 위한 도금조 및 방법
CS241666B1 (cs) Leskutvorná přísada pro elektrolytické vylučování lesklých niklových povlaků o tloušťkách do 10 uin
CS241664B1 (cs) Leskutvarná přísada pro elektrolytické vylučování lesklých niklových povlaků o tloušťkách do .25 μΐη

Legal Events

Date Code Title Description
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid