EP1069211A3 - Electroplating solutions - Google Patents

Electroplating solutions Download PDF

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Publication number
EP1069211A3
EP1069211A3 EP00305941A EP00305941A EP1069211A3 EP 1069211 A3 EP1069211 A3 EP 1069211A3 EP 00305941 A EP00305941 A EP 00305941A EP 00305941 A EP00305941 A EP 00305941A EP 1069211 A3 EP1069211 A3 EP 1069211A3
Authority
EP
European Patent Office
Prior art keywords
compound
acid
electroplating solutions
organic
leveller
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP00305941A
Other languages
German (de)
French (fr)
Other versions
EP1069211A2 (en
Inventor
Qing Min Wang
Weiji Huang
Miu Ling Lau
Carol Hsiuchin Liu
Ce Ma
Edward K. Chang
Wenpin Ho
Richard C. Paciej
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Messer LLC
Original Assignee
BOC Group Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BOC Group Inc filed Critical BOC Group Inc
Publication of EP1069211A2 publication Critical patent/EP1069211A2/en
Publication of EP1069211A3 publication Critical patent/EP1069211A3/en
Withdrawn legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)

Abstract

An acid copper electroplating composition comprising an aqueous solution of an acid and a copper salt, wherein at least one carrier compound, a water-soluble, mercapto-containing organic brightener compound and a leveller compound which comprises an organic compound containing single or multiple charged centres are present.
EP00305941A 1999-07-15 2000-07-13 Electroplating solutions Withdrawn EP1069211A3 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US14415999P 1999-07-15 1999-07-15
US144159P 1999-07-15
US58359900A 2000-05-31 2000-05-31
US583599 2000-05-31

Publications (2)

Publication Number Publication Date
EP1069211A2 EP1069211A2 (en) 2001-01-17
EP1069211A3 true EP1069211A3 (en) 2003-12-17

Family

ID=26841728

Family Applications (1)

Application Number Title Priority Date Filing Date
EP00305941A Withdrawn EP1069211A3 (en) 1999-07-15 2000-07-13 Electroplating solutions

Country Status (4)

Country Link
US (1) US20040187731A1 (en)
EP (1) EP1069211A3 (en)
JP (1) JP2001073182A (en)
KR (1) KR20010015342A (en)

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TWI572750B (en) 2010-05-24 2017-03-01 安頌股份有限公司 Copper filling of through silicon vias
WO2011151785A1 (en) 2010-06-01 2011-12-08 Basf Se Composition for metal electroplating comprising leveling agent
EP2392692A1 (en) 2010-06-01 2011-12-07 Basf Se Composition for metal electroplating comprising leveling agent
JP5505153B2 (en) * 2010-07-16 2014-05-28 上村工業株式会社 Electro copper plating bath and electro copper plating method
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JP6474410B2 (en) * 2013-12-09 2019-02-27 アヴニ Copper electrodeposition bath containing electrochemically inert cations
TWI710671B (en) * 2014-09-15 2020-11-21 美商麥德美樂思公司 Levelers for copper deposition in microelectronics
US10450667B2 (en) 2014-10-27 2019-10-22 International Business Machines Corporation System for treating solution for use in electroplating application and method for treating solution for use in electroplating application
EP3216050B1 (en) 2014-11-05 2021-09-08 Corning Incorporated Bottom-up electrolytic via plating method
US9611560B2 (en) 2014-12-30 2017-04-04 Rohm And Haas Electronic Materials Llc Sulfonamide based polymers for copper electroplating
US9783905B2 (en) 2014-12-30 2017-10-10 Rohm and Haas Electronic Mateirals LLC Reaction products of amino acids and epoxies
US9725816B2 (en) 2014-12-30 2017-08-08 Rohm And Haas Electronic Materials Llc Amino sulfonic acid based polymers for copper electroplating
CN107771227B (en) 2015-04-20 2019-04-02 埃托特克德国有限公司 Electrolytic copper plating bath composition and usage thereof
CN107636209B (en) * 2015-06-26 2021-07-02 住友金属矿山股份有限公司 conductive substrate
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US10767275B2 (en) 2015-08-31 2020-09-08 Atotech Deutschland Gmbh Aqueous copper plating baths and a method for deposition of copper or copper alloy onto a substrate
CN105239109A (en) * 2015-10-28 2016-01-13 福州瑞华印制线路板有限公司 Haring cell copper electroplating method
CN105200467B (en) * 2015-11-02 2019-01-29 江苏梦得新材料科技有限公司 A kind of Gravure hard copper additive and plating solution
WO2017090161A1 (en) * 2015-11-26 2017-06-01 近藤　和夫 Acidic copper plating solution, acidic copper plated product, and method for producing semiconductor device
EP3360988B1 (en) 2017-02-09 2019-06-26 ATOTECH Deutschland GmbH Pyridinium compounds, a synthesis method therefor, metal or metal alloy plating baths containing said pyridinium compounds and a method for use of said metal or metal alloy plating baths
EP3508620B1 (en) 2018-01-09 2021-05-19 ATOTECH Deutschland GmbH Ureylene additive, its use and a preparation method therefor
US10917966B2 (en) 2018-01-29 2021-02-09 Corning Incorporated Articles including metallized vias
WO2020021965A1 (en) * 2018-07-27 2020-01-30 三菱マテリアル株式会社 Tin alloy plating solution
JP6645609B2 (en) 2018-07-27 2020-02-14 三菱マテリアル株式会社 Tin alloy plating solution
KR102662397B1 (en) * 2018-10-23 2024-05-02 솔브레인 주식회사 Electroplating composition and electroplating method
US11746433B2 (en) 2019-11-05 2023-09-05 Macdermid Enthone Inc. Single step electrolytic method of filling through holes in printed circuit boards and other substrates
CN110938848B (en) * 2019-12-26 2021-05-11 江苏艾森半导体材料股份有限公司 Composition for electrolytic deposition of copper and acid copper electroplating solution
EP3933073B1 (en) 2020-06-29 2023-11-29 Atotech Deutschland GmbH & Co. KG Copper electroplating bath
CN112144083B (en) * 2020-09-22 2021-12-10 广州三孚新材料科技股份有限公司 Cyanide-free copper plating electroplating solution for solar cell and preparation method thereof
CN116710599A (en) * 2021-01-20 2023-09-05 富士胶片株式会社 Plating solution and method for producing metal-filled structure
EP4032930B1 (en) 2021-01-22 2023-08-30 Atotech Deutschland GmbH & Co. KG Biuret-based quaternized polymers and their use in metal or metal alloy plating baths
CN113430598B (en) * 2021-08-27 2021-11-16 深圳市板明科技股份有限公司 Circuit board blind hole filling electro-coppering solution and application thereof
CN113956479B (en) * 2021-11-26 2022-12-02 电子科技大学 Accelerator for electroplating copper, synthesis method and application
CN116751362B (en) * 2023-08-21 2024-01-09 广东腐蚀科学与技术创新研究院 Water-soluble diaminourea polymer and preparation method and application thereof

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Also Published As

Publication number Publication date
US20040187731A1 (en) 2004-09-30
EP1069211A2 (en) 2001-01-17
JP2001073182A (en) 2001-03-21
KR20010015342A (en) 2001-02-26

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