EP1069211A3 - Electroplating solutions - Google Patents
Electroplating solutions Download PDFInfo
- Publication number
- EP1069211A3 EP1069211A3 EP00305941A EP00305941A EP1069211A3 EP 1069211 A3 EP1069211 A3 EP 1069211A3 EP 00305941 A EP00305941 A EP 00305941A EP 00305941 A EP00305941 A EP 00305941A EP 1069211 A3 EP1069211 A3 EP 1069211A3
- Authority
- EP
- European Patent Office
- Prior art keywords
- compound
- acid
- electroplating solutions
- organic
- leveller
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrodes Of Semiconductors (AREA)
Abstract
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14415999P | 1999-07-15 | 1999-07-15 | |
US144159P | 1999-07-15 | ||
US58359900A | 2000-05-31 | 2000-05-31 | |
US583599 | 2000-05-31 |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1069211A2 EP1069211A2 (en) | 2001-01-17 |
EP1069211A3 true EP1069211A3 (en) | 2003-12-17 |
Family
ID=26841728
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP00305941A Withdrawn EP1069211A3 (en) | 1999-07-15 | 2000-07-13 | Electroplating solutions |
Country Status (4)
Country | Link |
---|---|
US (1) | US20040187731A1 (en) |
EP (1) | EP1069211A3 (en) |
JP (1) | JP2001073182A (en) |
KR (1) | KR20010015342A (en) |
Families Citing this family (79)
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---|---|---|---|---|
EP1357989A4 (en) * | 2001-02-07 | 2005-05-18 | Mykrolis Corp | Process for degassing an aqueous plating solution |
WO2002068727A2 (en) * | 2001-02-23 | 2002-09-06 | Ebara Corporation | Copper-plating solution, plating method and plating apparatus |
JP4793530B2 (en) * | 2001-07-02 | 2011-10-12 | 上村工業株式会社 | Copper sulfate plating bath |
US6736954B2 (en) * | 2001-10-02 | 2004-05-18 | Shipley Company, L.L.C. | Plating bath and method for depositing a metal layer on a substrate |
US8002962B2 (en) * | 2002-03-05 | 2011-08-23 | Enthone Inc. | Copper electrodeposition in microelectronics |
US7316772B2 (en) * | 2002-03-05 | 2008-01-08 | Enthone Inc. | Defect reduction in electrodeposited copper for semiconductor applications |
JP3789107B2 (en) * | 2002-07-23 | 2006-06-21 | 株式会社日鉱マテリアルズ | Copper electrolytic solution containing amine compound and organic sulfur compound having specific skeleton as additive, and electrolytic copper foil produced thereby |
JP4115240B2 (en) | 2002-10-21 | 2008-07-09 | 日鉱金属株式会社 | Copper electrolytic solution containing quaternary amine compound having specific skeleton and organic sulfur compound as additive, and electrolytic copper foil produced thereby |
JP4534460B2 (en) * | 2002-11-11 | 2010-09-01 | 凸版印刷株式会社 | Copper plating hardness maintenance agent, copper plating method, and gravure plate and lens mold using the same |
JP4510369B2 (en) | 2002-11-28 | 2010-07-21 | 日本リーロナール有限会社 | Electrolytic copper plating method |
JP4083171B2 (en) * | 2002-12-25 | 2008-04-30 | 日鉱金属株式会社 | Copper electrolyte containing quaternary amine compound polymer having specific skeleton and organic sulfur compound as additive, and electrolytic copper foil produced thereby |
KR20040073974A (en) * | 2003-02-14 | 2004-08-21 | 롬 앤드 하스 일렉트로닉 머트어리얼즈, 엘.엘.씨. | Electroplating composition |
US7128822B2 (en) | 2003-06-04 | 2006-10-31 | Shipley Company, L.L.C. | Leveler compounds |
JP2005029818A (en) * | 2003-07-09 | 2005-02-03 | Ebara Corp | Plating method |
US20050211564A1 (en) * | 2004-03-29 | 2005-09-29 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method and composition to enhance wetting of ECP electrolyte to copper seed |
TW200613586A (en) | 2004-07-22 | 2006-05-01 | Rohm & Haas Elect Mat | Leveler compounds |
KR101134610B1 (en) | 2004-08-18 | 2012-04-09 | 에바라 유지라이토 가부시키가이샤 | Additive for copper plating and process for producing electronic circuit substrate therewith |
US7442634B2 (en) | 2004-12-21 | 2008-10-28 | Intel Corporation | Method for constructing contact formations |
JP4976725B2 (en) * | 2005-03-31 | 2012-07-18 | 三井金属鉱業株式会社 | Copper electrolyte and method for forming electrodeposited copper film using the copper electrolyte |
US7662981B2 (en) | 2005-07-16 | 2010-02-16 | Rohm And Haas Electronic Materials Llc | Leveler compounds |
TWI328622B (en) * | 2005-09-30 | 2010-08-11 | Rohm & Haas Elect Mat | Leveler compounds |
JP2007146289A (en) * | 2005-10-31 | 2007-06-14 | Mitsui Mining & Smelting Co Ltd | Method for manufacture of electrolytic copper foil, electrolytic copper foil manufactured by the method, surface-treated copper foil manufactured using the electrolytic copper foil, and copper-clad laminate manufactured using the electrolytic copper foil or surface-treated copper foil |
JP4816901B2 (en) * | 2005-11-21 | 2011-11-16 | 上村工業株式会社 | Electro copper plating bath |
US20070158199A1 (en) * | 2005-12-30 | 2007-07-12 | Haight Scott M | Method to modulate the surface roughness of a plated deposit and create fine-grained flat bumps |
JP4895734B2 (en) * | 2006-09-08 | 2012-03-14 | 荏原ユージライト株式会社 | Leveling agent for plating, additive composition for acidic copper plating bath, acidic copper plating bath, and plating method using the plating bath |
EP2072642B1 (en) * | 2006-10-03 | 2013-09-04 | Mitsui Mining & Smelting Co., Ltd. | Method of preparing electrolytic copper solution acidified with sulfuric acid |
JP2008088524A (en) * | 2006-10-04 | 2008-04-17 | Ebara Udylite Kk | Copper sulfate plating solution for printed board |
US20080181813A1 (en) * | 2007-01-26 | 2008-07-31 | Baker Hughes Incorporated | Novel Mercaptan-Based Corrosion Inhibitors |
TWI441955B (en) | 2007-05-21 | 2014-06-21 | Uyemura C & Co Ltd | Electroplating copper bath |
US20090188805A1 (en) * | 2008-01-25 | 2009-07-30 | Government Of The United States Of America, As Represented By The | Superconformal electrodeposition of nickel iron and cobalt magnetic alloys |
EP2128903B1 (en) * | 2008-05-30 | 2017-02-22 | ATOTECH Deutschland GmbH | Electroplating additive for the deposition of a metal, a binary, ternary, quaternary or pentanary alloy of elements of group 11 (IB)-group 13 (IIIA)-group 16 (VIA) |
JP5525762B2 (en) * | 2008-07-01 | 2014-06-18 | 上村工業株式会社 | Electroless plating solution, electroless plating method using the same, and method for manufacturing wiring board |
WO2011149965A2 (en) | 2010-05-24 | 2011-12-01 | Enthone Inc. | Copper filling of through silicon vias |
US8388824B2 (en) * | 2008-11-26 | 2013-03-05 | Enthone Inc. | Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelers |
EP2199315B1 (en) | 2008-12-19 | 2013-12-11 | Basf Se | Composition for metal electroplating comprising leveling agent |
JP5578697B2 (en) * | 2009-04-03 | 2014-08-27 | 公立大学法人大阪府立大学 | Copper filling method |
JP5568250B2 (en) * | 2009-05-18 | 2014-08-06 | 公立大学法人大阪府立大学 | How to fill copper |
KR101072338B1 (en) | 2009-11-27 | 2011-10-11 | 바스프 에스이 | Composition for metal electroplating comprising leveling agent |
SG183821A1 (en) | 2010-03-18 | 2012-10-30 | Basf Se | Composition for metal electroplating comprising leveling agent |
EP2392692A1 (en) | 2010-06-01 | 2011-12-07 | Basf Se | Composition for metal electroplating comprising leveling agent |
CN102939339B (en) | 2010-06-01 | 2016-02-17 | 巴斯夫欧洲公司 | Comprise the composition for metal electroplating of levelling reagent |
JP5505153B2 (en) * | 2010-07-16 | 2014-05-28 | 上村工業株式会社 | Electro copper plating bath and electro copper plating method |
JP2012127003A (en) | 2010-12-15 | 2012-07-05 | Rohm & Haas Electronic Materials Llc | Method of electroplating uniform copper layer |
GB201100447D0 (en) * | 2011-01-12 | 2011-02-23 | Johnson Matthey Plc | Improvements in coating technology |
KR101705734B1 (en) * | 2011-02-18 | 2017-02-14 | 삼성전자주식회사 | Copper electroplating solution and method of copper electroplating using the same |
EP2537962A1 (en) | 2011-06-22 | 2012-12-26 | Atotech Deutschland GmbH | Method for copper plating |
EP2735627A1 (en) * | 2012-11-26 | 2014-05-28 | ATOTECH Deutschland GmbH | Copper plating bath composition |
US20140238868A1 (en) * | 2013-02-25 | 2014-08-28 | Dow Global Technologies Llc | Electroplating bath |
CN103469260A (en) * | 2013-09-27 | 2013-12-25 | 昆山纯柏精密五金有限公司 | Acid copper plating method of hardware |
EP2865787A1 (en) * | 2013-10-22 | 2015-04-29 | ATOTECH Deutschland GmbH | Copper electroplating method |
CN105899715B (en) * | 2013-12-09 | 2019-05-31 | 阿文尼公司 | Copper electrodeposition bath containing electrochemicaUy inert cation |
TWI710671B (en) * | 2014-09-15 | 2020-11-21 | 美商麥德美樂思公司 | Levelers for copper deposition in microelectronics |
US10450667B2 (en) | 2014-10-27 | 2019-10-22 | International Business Machines Corporation | System for treating solution for use in electroplating application and method for treating solution for use in electroplating application |
EP3216050B1 (en) | 2014-11-05 | 2021-09-08 | Corning Incorporated | Bottom-up electrolytic via plating method |
US9611560B2 (en) | 2014-12-30 | 2017-04-04 | Rohm And Haas Electronic Materials Llc | Sulfonamide based polymers for copper electroplating |
US9725816B2 (en) | 2014-12-30 | 2017-08-08 | Rohm And Haas Electronic Materials Llc | Amino sulfonic acid based polymers for copper electroplating |
US9783905B2 (en) | 2014-12-30 | 2017-10-10 | Rohm and Haas Electronic Mateirals LLC | Reaction products of amino acids and epoxies |
KR102426521B1 (en) | 2015-04-20 | 2022-07-27 | 아토테크 도이칠란트 게엠베하 운트 콤파니 카게 | Electrolytic copper plating bath compositions and a method for their use |
CN107636209B (en) * | 2015-06-26 | 2021-07-02 | 住友金属矿山股份有限公司 | Conductive substrate |
EP3135709B1 (en) | 2015-08-31 | 2018-01-10 | ATOTECH Deutschland GmbH | Imidazoyl urea polymers and their use in metal or metal alloy plating bath compositions |
CN107923060B (en) | 2015-08-31 | 2020-03-10 | 埃托特克德国有限公司 | Aqueous copper plating bath and method for depositing copper or copper alloy onto a substrate |
CN105239109A (en) * | 2015-10-28 | 2016-01-13 | 福州瑞华印制线路板有限公司 | Haring cell copper electroplating method |
CN105200467B (en) * | 2015-11-02 | 2019-01-29 | 江苏梦得新材料科技有限公司 | A kind of Gravure hard copper additive and plating solution |
WO2017090161A1 (en) * | 2015-11-26 | 2017-06-01 | 近藤 和夫 | Acidic copper plating solution, acidic copper plated product, and method for producing semiconductor device |
EP3360988B1 (en) | 2017-02-09 | 2019-06-26 | ATOTECH Deutschland GmbH | Pyridinium compounds, a synthesis method therefor, metal or metal alloy plating baths containing said pyridinium compounds and a method for use of said metal or metal alloy plating baths |
EP3508620B1 (en) | 2018-01-09 | 2021-05-19 | ATOTECH Deutschland GmbH | Ureylene additive, its use and a preparation method therefor |
US10917966B2 (en) | 2018-01-29 | 2021-02-09 | Corning Incorporated | Articles including metallized vias |
JP6645609B2 (en) | 2018-07-27 | 2020-02-14 | 三菱マテリアル株式会社 | Tin alloy plating solution |
EP3835458B1 (en) * | 2018-07-27 | 2023-08-16 | Mitsubishi Materials Corporation | Tin alloy plating solution |
KR102662397B1 (en) * | 2018-10-23 | 2024-05-02 | 솔브레인 주식회사 | Electroplating composition and electroplating method |
US11746433B2 (en) | 2019-11-05 | 2023-09-05 | Macdermid Enthone Inc. | Single step electrolytic method of filling through holes in printed circuit boards and other substrates |
CN110938848B (en) * | 2019-12-26 | 2021-05-11 | 江苏艾森半导体材料股份有限公司 | Composition for electrolytic deposition of copper and acid copper electroplating solution |
EP3933073B1 (en) | 2020-06-29 | 2023-11-29 | Atotech Deutschland GmbH & Co. KG | Copper electroplating bath |
CN112144083B (en) * | 2020-09-22 | 2021-12-10 | 广州三孚新材料科技股份有限公司 | Cyanide-free copper plating electroplating solution for solar cell and preparation method thereof |
WO2022158277A1 (en) * | 2021-01-20 | 2022-07-28 | 富士フイルム株式会社 | Plating solution and method for producing metal-filled structure |
EP4032930B1 (en) | 2021-01-22 | 2023-08-30 | Atotech Deutschland GmbH & Co. KG | Biuret-based quaternized polymers and their use in metal or metal alloy plating baths |
CN113430598B (en) * | 2021-08-27 | 2021-11-16 | 深圳市板明科技股份有限公司 | Circuit board blind hole filling electro-coppering solution and application thereof |
CN113956479B (en) * | 2021-11-26 | 2022-12-02 | 电子科技大学 | Copper electroplating accelerator and synthesis method and application thereof |
CN116751362B (en) * | 2023-08-21 | 2024-01-09 | 广东腐蚀科学与技术创新研究院 | Water-soluble diaminourea polymer and preparation method and application thereof |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4430173A (en) * | 1981-07-24 | 1984-02-07 | Rhone-Poulenc Specialties Chimiques | Additive composition, bath and process for acid copper electroplating |
US5051154A (en) * | 1988-08-23 | 1991-09-24 | Shipley Company Inc. | Additive for acid-copper electroplating baths to increase throwing power |
US5174886A (en) * | 1991-02-22 | 1992-12-29 | Mcgean-Rohco, Inc. | High-throw acid copper plating using inert electrolyte |
US5433840A (en) * | 1991-08-07 | 1995-07-18 | Atotech Deutschland Gmbh | Acid bath for the galvanic deposition of copper, and the use of such a bath |
US5849171A (en) * | 1990-10-13 | 1998-12-15 | Atotech Deutschland Gmbh | Acid bath for copper plating and process with the use of this combination |
Family Cites Families (33)
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US2954331A (en) * | 1958-08-14 | 1960-09-27 | Dayton Bright Copper Company | Bright copper plating bath |
NL291575A (en) * | 1962-04-16 | |||
US3328273A (en) * | 1966-08-15 | 1967-06-27 | Udylite Corp | Electro-deposition of copper from acidic baths |
US3615736A (en) * | 1969-01-06 | 1971-10-26 | Enthone | Electroless copper plating bath |
BE755019A (en) * | 1969-08-19 | 1971-02-19 | Kuraray Co | SHEET MATERIAL USABLE AS A SUCCEDANE FOR LEATHER. |
US3715289A (en) * | 1971-02-08 | 1973-02-06 | Stauffer Chemical Co | Brightener composition for acid copper electroplating baths |
US4004956A (en) * | 1974-08-14 | 1977-01-25 | Enthone, Incorporated | Selectively stripping tin or tin-lead alloys from copper substrates |
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JPS6021240B2 (en) * | 1980-01-12 | 1985-05-25 | 株式会社小糸製作所 | Method and apparatus for replenishing plating solution with deposited copper |
US4304646A (en) * | 1980-10-27 | 1981-12-08 | Enthone, Incorporated | Method for selective removal of copper contaminants from activator solutions containing palladium and tin |
US4376685A (en) * | 1981-06-24 | 1983-03-15 | M&T Chemicals Inc. | Acid copper electroplating baths containing brightening and leveling additives |
US4384930A (en) * | 1981-08-21 | 1983-05-24 | Mcgean-Rohco, Inc. | Electroplating baths, additives therefor and methods for the electrodeposition of metals |
US4490220A (en) * | 1982-09-30 | 1984-12-25 | Learonal, Inc. | Electrolytic copper plating solutions |
US4555315A (en) * | 1984-05-29 | 1985-11-26 | Omi International Corporation | High speed copper electroplating process and bath therefor |
US4790912A (en) * | 1985-06-06 | 1988-12-13 | Techno-Instruments Investments Ltd. | Selective plating process for the electrolytic coating of circuit boards without an electroless metal coating |
US4717439A (en) * | 1985-10-24 | 1988-01-05 | Enthone, Incorporated | Process for the treatment of copper oxide in the preparation of printed circuit boards |
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KR100616198B1 (en) * | 1998-04-21 | 2006-08-25 | 어플라이드 머티어리얼스, 인코포레이티드 | Electro-chemical deposition system and method of electroplating on substrates |
-
2000
- 2000-07-11 JP JP2000210188A patent/JP2001073182A/en active Pending
- 2000-07-13 EP EP00305941A patent/EP1069211A3/en not_active Withdrawn
- 2000-07-14 KR KR1020000040658A patent/KR20010015342A/en not_active Application Discontinuation
-
2004
- 2004-04-14 US US10/823,982 patent/US20040187731A1/en not_active Abandoned
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4430173A (en) * | 1981-07-24 | 1984-02-07 | Rhone-Poulenc Specialties Chimiques | Additive composition, bath and process for acid copper electroplating |
US5051154A (en) * | 1988-08-23 | 1991-09-24 | Shipley Company Inc. | Additive for acid-copper electroplating baths to increase throwing power |
US5849171A (en) * | 1990-10-13 | 1998-12-15 | Atotech Deutschland Gmbh | Acid bath for copper plating and process with the use of this combination |
US5174886A (en) * | 1991-02-22 | 1992-12-29 | Mcgean-Rohco, Inc. | High-throw acid copper plating using inert electrolyte |
US5433840A (en) * | 1991-08-07 | 1995-07-18 | Atotech Deutschland Gmbh | Acid bath for the galvanic deposition of copper, and the use of such a bath |
Also Published As
Publication number | Publication date |
---|---|
EP1069211A2 (en) | 2001-01-17 |
JP2001073182A (en) | 2001-03-21 |
KR20010015342A (en) | 2001-02-26 |
US20040187731A1 (en) | 2004-09-30 |
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