EP1069211A3 - Solutions pour l'électroplacage - Google Patents

Solutions pour l'électroplacage Download PDF

Info

Publication number
EP1069211A3
EP1069211A3 EP00305941A EP00305941A EP1069211A3 EP 1069211 A3 EP1069211 A3 EP 1069211A3 EP 00305941 A EP00305941 A EP 00305941A EP 00305941 A EP00305941 A EP 00305941A EP 1069211 A3 EP1069211 A3 EP 1069211A3
Authority
EP
European Patent Office
Prior art keywords
compound
acid
electroplating solutions
organic
leveller
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP00305941A
Other languages
German (de)
English (en)
Other versions
EP1069211A2 (fr
Inventor
Qing Min Wang
Weiji Huang
Miu Ling Lau
Carol Hsiuchin Liu
Ce Ma
Edward K. Chang
Wenpin Ho
Richard C. Paciej
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Messer LLC
Original Assignee
BOC Group Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BOC Group Inc filed Critical BOC Group Inc
Publication of EP1069211A2 publication Critical patent/EP1069211A2/fr
Publication of EP1069211A3 publication Critical patent/EP1069211A3/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
EP00305941A 1999-07-15 2000-07-13 Solutions pour l'électroplacage Withdrawn EP1069211A3 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US14415999P 1999-07-15 1999-07-15
US144159P 1999-07-15
US58359900A 2000-05-31 2000-05-31
US583599 2000-05-31

Publications (2)

Publication Number Publication Date
EP1069211A2 EP1069211A2 (fr) 2001-01-17
EP1069211A3 true EP1069211A3 (fr) 2003-12-17

Family

ID=26841728

Family Applications (1)

Application Number Title Priority Date Filing Date
EP00305941A Withdrawn EP1069211A3 (fr) 1999-07-15 2000-07-13 Solutions pour l'électroplacage

Country Status (4)

Country Link
US (1) US20040187731A1 (fr)
EP (1) EP1069211A3 (fr)
JP (1) JP2001073182A (fr)
KR (1) KR20010015342A (fr)

Families Citing this family (80)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1357989A4 (fr) * 2001-02-07 2005-05-18 Mykrolis Corp Procede de degazage d'un bain de depot galvanoplastique aqueux
CN1253606C (zh) * 2001-02-23 2006-04-26 株式会社荏原制作所 镀铜溶液、镀敷方法和镀敷装置
JP4793530B2 (ja) * 2001-07-02 2011-10-12 上村工業株式会社 硫酸銅めっき浴
US6736954B2 (en) * 2001-10-02 2004-05-18 Shipley Company, L.L.C. Plating bath and method for depositing a metal layer on a substrate
US8002962B2 (en) * 2002-03-05 2011-08-23 Enthone Inc. Copper electrodeposition in microelectronics
US7316772B2 (en) * 2002-03-05 2008-01-08 Enthone Inc. Defect reduction in electrodeposited copper for semiconductor applications
JP3789107B2 (ja) 2002-07-23 2006-06-21 株式会社日鉱マテリアルズ 特定骨格を有するアミン化合物及び有機硫黄化合物を添加剤として含む銅電解液並びにそれにより製造される電解銅箔
JP4115240B2 (ja) 2002-10-21 2008-07-09 日鉱金属株式会社 特定骨格を有する四級アミン化合物及び有機硫黄化合物を添加剤として含む銅電解液並びにそれにより製造される電解銅箔
JP4534460B2 (ja) * 2002-11-11 2010-09-01 凸版印刷株式会社 銅めっき硬度維持剤及び銅めっき方法並びにそれを用いたグラビア版、レンズ金型
JP4510369B2 (ja) * 2002-11-28 2010-07-21 日本リーロナール有限会社 電解銅めっき方法
EP1607495A4 (fr) * 2002-12-25 2006-07-12 Nikko Materials Co Ltd Solution electrolytique de cuivre contenant un compose polymere amine quaternaire presentant un squelette specifique et un compose de soufre organique en tant qu'additifs et feuille de cuivre electrolytique produite avec cette solution
KR20040073974A (ko) * 2003-02-14 2004-08-21 롬 앤드 하스 일렉트로닉 머트어리얼즈, 엘.엘.씨. 전기도금 조성물
US7128822B2 (en) 2003-06-04 2006-10-31 Shipley Company, L.L.C. Leveler compounds
JP2005029818A (ja) * 2003-07-09 2005-02-03 Ebara Corp めっき方法
US20050211564A1 (en) * 2004-03-29 2005-09-29 Taiwan Semiconductor Manufacturing Co., Ltd. Method and composition to enhance wetting of ECP electrolyte to copper seed
TW200613586A (en) 2004-07-22 2006-05-01 Rohm & Haas Elect Mat Leveler compounds
JPWO2006018872A1 (ja) * 2004-08-18 2008-05-01 荏原ユージライト株式会社 銅めっき用添加剤およびこれを用いる電子回路基板の製造方法
US7442634B2 (en) 2004-12-21 2008-10-28 Intel Corporation Method for constructing contact formations
JP4976725B2 (ja) * 2005-03-31 2012-07-18 三井金属鉱業株式会社 銅電解液及びその銅電解液を用いた電析銅皮膜の形成方法
US7662981B2 (en) 2005-07-16 2010-02-16 Rohm And Haas Electronic Materials Llc Leveler compounds
TWI328622B (en) 2005-09-30 2010-08-11 Rohm & Haas Elect Mat Leveler compounds
JP2007146289A (ja) * 2005-10-31 2007-06-14 Mitsui Mining & Smelting Co Ltd 電解銅箔の製造方法、該製造方法で得られる電解銅箔、該電解銅箔を用いて得られる表面処理銅箔及び該電解銅箔又は該表面処理銅箔を用いて得られる銅張積層板
JP4816901B2 (ja) * 2005-11-21 2011-11-16 上村工業株式会社 電気銅めっき浴
US20070158199A1 (en) * 2005-12-30 2007-07-12 Haight Scott M Method to modulate the surface roughness of a plated deposit and create fine-grained flat bumps
JP4895734B2 (ja) * 2006-09-08 2012-03-14 荏原ユージライト株式会社 めっき用レベリング剤、酸性銅めっき浴用添加剤組成物、酸性銅めっき浴および該めっき浴を用いるめっき方法
US8419920B2 (en) * 2006-10-03 2013-04-16 Mitsui Mining & Smelting Co., Ltd. Method of preparing electrolytic copper solution acidified with sulfuric acid, sulfuric-acid-acidified electrolytic copper solution prepared by the preparation method, and electrodeposited copper film
JP2008088524A (ja) * 2006-10-04 2008-04-17 Ebara Udylite Kk プリント基板用硫酸銅めっき液
US20080181813A1 (en) * 2007-01-26 2008-07-31 Baker Hughes Incorporated Novel Mercaptan-Based Corrosion Inhibitors
TWI441955B (zh) 2007-05-21 2014-06-21 上村工業股份有限公司 Electroplating copper bath
US20090188805A1 (en) * 2008-01-25 2009-07-30 Government Of The United States Of America, As Represented By The Superconformal electrodeposition of nickel iron and cobalt magnetic alloys
ES2624637T3 (es) * 2008-05-30 2017-07-17 Atotech Deutschland Gmbh Aditivo de electrogalvanoplastia para la deposición de una aleación de un metal del grupo IB/binaria o ternaria del grupo IB-grupo IIIA/ternaria, cuaternaria o quinaria del grupo IB, el grupo IIIA-grupo VIA
JP5525762B2 (ja) * 2008-07-01 2014-06-18 上村工業株式会社 無電解めっき液及びそれを用いた無電解めっき方法、並びに配線基板の製造方法
WO2011149965A2 (fr) 2010-05-24 2011-12-01 Enthone Inc. Remplissage par du cuivre d'intra-connexions traversantes dans un substrat de silicium
US8388824B2 (en) 2008-11-26 2013-03-05 Enthone Inc. Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelers
EP2199315B1 (fr) 2008-12-19 2013-12-11 Basf Se Composition comprenant un agent égalisant pour électrodeposition
JP5578697B2 (ja) * 2009-04-03 2014-08-27 公立大学法人大阪府立大学 銅充填方法
JP5568250B2 (ja) 2009-05-18 2014-08-06 公立大学法人大阪府立大学 銅を充填する方法
EP3848417B1 (fr) 2009-11-27 2025-01-08 Basf Se Composition pour électroplaquage de cuivre comprenant un agent de nivellement
WO2011113908A1 (fr) 2010-03-18 2011-09-22 Basf Se Composition pour l'électrodéposition de métaux comprenant un agent de nivellement
KR101829866B1 (ko) 2010-06-01 2018-02-20 바스프 에스이 레벨링제를 포함하는 금속 전기도금용 조성물
EP2392692A1 (fr) 2010-06-01 2011-12-07 Basf Se Composition pour dépôt électrique métallique comportant un agent de nivellement
JP5505153B2 (ja) * 2010-07-16 2014-05-28 上村工業株式会社 電気銅めっき浴及び電気銅めっき方法
JP2012127003A (ja) 2010-12-15 2012-07-05 Rohm & Haas Electronic Materials Llc 銅層を均一にする電気めっき方法
GB201100447D0 (en) * 2011-01-12 2011-02-23 Johnson Matthey Plc Improvements in coating technology
KR101705734B1 (ko) * 2011-02-18 2017-02-14 삼성전자주식회사 구리 도금 용액 및 이것을 이용한 구리 도금 방법
EP2537962A1 (fr) * 2011-06-22 2012-12-26 Atotech Deutschland GmbH Procédé pour plaquage de cuivre
EP2735627A1 (fr) 2012-11-26 2014-05-28 ATOTECH Deutschland GmbH Composition de bain de placage de cuivre
US20140238868A1 (en) * 2013-02-25 2014-08-28 Dow Global Technologies Llc Electroplating bath
CN103469260A (zh) * 2013-09-27 2013-12-25 昆山纯柏精密五金有限公司 一种五金件的酸性镀铜的方法
EP2865787A1 (fr) * 2013-10-22 2015-04-29 ATOTECH Deutschland GmbH Procédé d'électrodéposition de cuivre
SG11201604646TA (en) * 2013-12-09 2016-07-28 Aveni Copper electrodeposition bath containing an electrochemically inert cation
TWI710671B (zh) * 2014-09-15 2020-11-21 美商麥德美樂思公司 微電子技術中銅沈積用之平整劑
US10450667B2 (en) * 2014-10-27 2019-10-22 International Business Machines Corporation System for treating solution for use in electroplating application and method for treating solution for use in electroplating application
JP6723236B2 (ja) 2014-11-05 2020-07-15 コーニング インコーポレイテッド バイアボトムアップ電解メッキ方法
US9725816B2 (en) 2014-12-30 2017-08-08 Rohm And Haas Electronic Materials Llc Amino sulfonic acid based polymers for copper electroplating
US9783905B2 (en) 2014-12-30 2017-10-10 Rohm and Haas Electronic Mateirals LLC Reaction products of amino acids and epoxies
US9611560B2 (en) 2014-12-30 2017-04-04 Rohm And Haas Electronic Materials Llc Sulfonamide based polymers for copper electroplating
KR102426521B1 (ko) 2015-04-20 2022-07-27 아토테크 도이칠란트 게엠베하 운트 콤파니 카게 전해 구리 도금 배쓰 조성물 및 그 사용 방법
US20180142369A1 (en) * 2015-06-26 2018-05-24 Sumitimo Metal Mining Co., Ltd. Electrically conductive substrate
EP3135709B1 (fr) 2015-08-31 2018-01-10 ATOTECH Deutschland GmbH Polymères d'urée imidazoyle et leur utilisation dans des compositions de bains de placage de métaux ou d'alliages de métaux
JP6790075B2 (ja) 2015-08-31 2020-11-25 アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツングＡｔｏｔｅｃｈ Ｄｅｕｔｓｃｈｌａｎｄ ＧｍｂＨ 水性銅めっき浴および基板上での銅または銅合金の析出方法
CN105239109A (zh) * 2015-10-28 2016-01-13 福州瑞华印制线路板有限公司 一种哈林槽镀铜方法
CN105200467B (zh) * 2015-11-02 2019-01-29 江苏梦得新材料科技有限公司 一种凹版硬铜添加剂及镀液
WO2017090161A1 (fr) * 2015-11-26 2017-06-01 近藤　和夫 Solution de cuivrage acide, produit à cuivrage acide, et procédé de fabrication de dispositif à semi-conducteurs
EP3360988B1 (fr) 2017-02-09 2019-06-26 ATOTECH Deutschland GmbH Composés de pyridinium, procédé de synthèse associé, bains de placage métallique ou d'alliage métallique contenant lesdits composés de pyridinium et procédé d'utilisation desdits bains de placage métallique ou d'alliage métallique
EP3508620B1 (fr) 2018-01-09 2021-05-19 ATOTECH Deutschland GmbH Additif d'uréylène, son utilisation et un procédé de préparation associé
US10917966B2 (en) 2018-01-29 2021-02-09 Corning Incorporated Articles including metallized vias
WO2020021965A1 (fr) * 2018-07-27 2020-01-30 三菱マテリアル株式会社 Solution de placage en alliage d'étain
JP6645609B2 (ja) 2018-07-27 2020-02-14 三菱マテリアル株式会社 錫合金めっき液
KR102662397B1 (ko) * 2018-10-23 2024-05-02 솔브레인 주식회사 전기도금 조성물 및 전기도금 방법
US11746433B2 (en) * 2019-11-05 2023-09-05 Macdermid Enthone Inc. Single step electrolytic method of filling through holes in printed circuit boards and other substrates
CN110938848B (zh) * 2019-12-26 2021-05-11 江苏艾森半导体材料股份有限公司 一种用于电解沉积铜的组合物及酸铜电镀液
EP3933073B1 (fr) 2020-06-29 2023-11-29 Atotech Deutschland GmbH & Co. KG Bain d'électrodéposition de cuivre
CN112144083B (zh) * 2020-09-22 2021-12-10 广州三孚新材料科技股份有限公司 一种太阳能电池用无氰镀铜电镀液及制备方法
CN116710599A (zh) * 2021-01-20 2023-09-05 富士胶片株式会社 镀敷液及金属填充结构体的制造方法
EP4032930B1 (fr) 2021-01-22 2023-08-30 Atotech Deutschland GmbH & Co. KG Polymères quaternisés à base de biuret et leur utilisation dans des bains de placage de métal ou d'alliage métallique
CN113430598B (zh) * 2021-08-27 2021-11-16 深圳市板明科技股份有限公司 一种线路板盲孔填充电镀铜溶液及其应用
CN113956479B (zh) * 2021-11-26 2022-12-02 电子科技大学 电镀铜加速剂及合成方法和应用
CN116555848A (zh) * 2023-06-05 2023-08-08 厦门大学 一种用于硅通孔铜填充的酸性镀铜液添加剂、酸性镀铜液及硅通孔的铜金属填充方法
CN116751362B (zh) * 2023-08-21 2024-01-09 广东腐蚀科学与技术创新研究院 一种水溶性二胺基脲聚合物及其制备方法和应用

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4430173A (en) * 1981-07-24 1984-02-07 Rhone-Poulenc Specialties Chimiques Additive composition, bath and process for acid copper electroplating
US5051154A (en) * 1988-08-23 1991-09-24 Shipley Company Inc. Additive for acid-copper electroplating baths to increase throwing power
US5174886A (en) * 1991-02-22 1992-12-29 Mcgean-Rohco, Inc. High-throw acid copper plating using inert electrolyte
US5433840A (en) * 1991-08-07 1995-07-18 Atotech Deutschland Gmbh Acid bath for the galvanic deposition of copper, and the use of such a bath
US5849171A (en) * 1990-10-13 1998-12-15 Atotech Deutschland Gmbh Acid bath for copper plating and process with the use of this combination

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2954331A (en) * 1958-08-14 1960-09-27 Dayton Bright Copper Company Bright copper plating bath
NL291575A (fr) * 1962-04-16
US3328273A (en) * 1966-08-15 1967-06-27 Udylite Corp Electro-deposition of copper from acidic baths
US3615736A (en) * 1969-01-06 1971-10-26 Enthone Electroless copper plating bath
BE755019A (fr) * 1969-08-19 1971-02-19 Kuraray Co Materiau en feuille utilisable comme succedane du cuir.
US3715289A (en) * 1971-02-08 1973-02-06 Stauffer Chemical Co Brightener composition for acid copper electroplating baths
US4004956A (en) * 1974-08-14 1977-01-25 Enthone, Incorporated Selectively stripping tin or tin-lead alloys from copper substrates
US4134803A (en) * 1977-12-21 1979-01-16 R. O. Hull & Company, Inc. Nitrogen and sulfur compositions and acid copper plating baths
JPS6021240B2 (ja) * 1980-01-12 1985-05-25 株式会社小糸製作所 堆積される銅をメッキ液に補給する方法及び装置
US4304646A (en) * 1980-10-27 1981-12-08 Enthone, Incorporated Method for selective removal of copper contaminants from activator solutions containing palladium and tin
US4376685A (en) * 1981-06-24 1983-03-15 M&T Chemicals Inc. Acid copper electroplating baths containing brightening and leveling additives
US4384930A (en) * 1981-08-21 1983-05-24 Mcgean-Rohco, Inc. Electroplating baths, additives therefor and methods for the electrodeposition of metals
US4490220A (en) * 1982-09-30 1984-12-25 Learonal, Inc. Electrolytic copper plating solutions
US4555315A (en) * 1984-05-29 1985-11-26 Omi International Corporation High speed copper electroplating process and bath therefor
US4790912A (en) * 1985-06-06 1988-12-13 Techno-Instruments Investments Ltd. Selective plating process for the electrolytic coating of circuit boards without an electroless metal coating
US4717439A (en) * 1985-10-24 1988-01-05 Enthone, Incorporated Process for the treatment of copper oxide in the preparation of printed circuit boards
US4808481A (en) * 1986-10-31 1989-02-28 American Cyanamid Company Injection molding granules comprising copper coated fibers
US4786746A (en) * 1987-09-18 1988-11-22 Pennsylvania Research Corporation Copper electroplating solutions and methods of making and using them
US4948474A (en) * 1987-09-18 1990-08-14 Pennsylvania Research Corporation Copper electroplating solutions and methods
US4897165A (en) * 1988-08-23 1990-01-30 Shipley Company Inc. Electroplating composition and process for plating through holes in printed circuit boards
US4954226A (en) * 1988-12-21 1990-09-04 International Business Machines Corporation Additive plating bath and process
US5215645A (en) * 1989-09-13 1993-06-01 Gould Inc. Electrodeposited foil with controlled properties for printed circuit board applications and procedures and electrolyte bath solutions for preparing the same
US5147905A (en) * 1991-05-01 1992-09-15 The Dow Chemical Company Advanced and unadvanced compositions, nucleophilic derivatives thereof and curable and coating compositions thereof
US5151170A (en) * 1991-12-19 1992-09-29 Mcgean-Rohco, Inc. Acid copper electroplating bath containing brightening additive
US5266212A (en) * 1992-10-13 1993-11-30 Enthone-Omi, Inc. Purification of cyanide-free copper plating baths
US5328589A (en) * 1992-12-23 1994-07-12 Enthone-Omi, Inc. Functional fluid additives for acid copper electroplating baths
US5630950A (en) * 1993-07-09 1997-05-20 Enthone-Omi, Inc. Copper brightening process and bath
US5402465A (en) * 1993-12-02 1995-03-28 Foltz; Jack D. Telephone trouble isolator
US5730854A (en) * 1996-05-30 1998-03-24 Enthone-Omi, Inc. Alkoxylated dimercaptans as copper additives and de-polarizing additives
US5733429A (en) * 1996-09-10 1998-03-31 Enthone-Omi, Inc. Polyacrylic acid additives for copper electrorefining and electrowinning
US5750018A (en) * 1997-03-18 1998-05-12 Learonal, Inc. Cyanide-free monovalent copper electroplating solutions
US5863410A (en) * 1997-06-23 1999-01-26 Circuit Foil Usa, Inc. Process for the manufacture of high quality very low profile copper foil and copper foil produced thereby
JP2002506488A (ja) * 1998-04-21 2002-02-26 アプライド マテリアルズ インコーポレイテッド 電気化学堆積システム及び基体の電気めっき方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4430173A (en) * 1981-07-24 1984-02-07 Rhone-Poulenc Specialties Chimiques Additive composition, bath and process for acid copper electroplating
US5051154A (en) * 1988-08-23 1991-09-24 Shipley Company Inc. Additive for acid-copper electroplating baths to increase throwing power
US5849171A (en) * 1990-10-13 1998-12-15 Atotech Deutschland Gmbh Acid bath for copper plating and process with the use of this combination
US5174886A (en) * 1991-02-22 1992-12-29 Mcgean-Rohco, Inc. High-throw acid copper plating using inert electrolyte
US5433840A (en) * 1991-08-07 1995-07-18 Atotech Deutschland Gmbh Acid bath for the galvanic deposition of copper, and the use of such a bath

Also Published As

Publication number Publication date
JP2001073182A (ja) 2001-03-21
KR20010015342A (ko) 2001-02-26
US20040187731A1 (en) 2004-09-30
EP1069211A2 (fr) 2001-01-17

Similar Documents

Publication Publication Date Title
EP1069211A3 (fr) Solutions pour l'électroplacage
EP1054080A3 (fr) Placage du cuivre par solutions électrolytiques
CA2374999A1 (fr) Procede de separation de composes organiques analogues
EP1138805A3 (fr) Electrolyte en étain
MY126221A (en) Direct electrolytic metallization of non-conducting substrates.
ATE292634T1 (de) Inhibitoren der alpha-l beta-2 vermittelten zelladhäsion
EP1189504A4 (fr) Biocides de pyrithione renforces a l'aide d'ions argent, cuivre, ou zinc
CA2001185A1 (fr) Bain d'acide aqueux pour deposition galvanique de revetements de cuivre brillants sans fissures, et utilisation dudit bain
CA2277947A1 (fr) Derives de pyrrolidine ayant une activite inhibant la phospholipase a2
WO2004016829A3 (fr) Solutions de cuivrage electrolytique
MXPA03011501A (es) Derivados aromaticos de acidos dicarboxilicos.
CA2384283A1 (fr) Procede de preparation d'un derive 4-trifluoromethylsulfinylpyrazole
EP1286409A4 (fr) Solution electrolytique non aqueuse et batterie secondaire la contenant
EP1342817A3 (fr) Limitation de la perte d'étain par oxydation dans des solutions pour des bains d'électrodéposition d'étain ou d'alliage d'étain
CA2237546A1 (fr) Compositions d'acide organique dans lesquelles la corrosion a ete inhibee et methodes connexes
AU4140199A (en) Double metal cyanide catalysts containing cyclic, bidentate complexing agents
WO2002045104A3 (fr) Procede et electrolyte pour anodiser des substrats en aluminium destines a des condensateurs solides
TWI341200B (en) Telmisartan acid addition salt
WO2005093134A3 (fr) Bain et procede electrolytiques fer-phosphore
EP0900789A3 (fr) Dérivés substitués de quinolone et agents pharmaceutiques les contenant
AU6077798A (en) A condensed piperidine compound
AU3643099A (en) Cathode blank for copper plating
AU2001294204A1 (en) Copper electroplating using insoluble anode
IL144306A0 (en) New process for preparing pesticidal intermediates
FR2768933B1 (fr) Agent d'elimination des metaux lourds comprenant un compose du type phosphate

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

AX Request for extension of the european patent

Free format text: AL;LT;LV;MK;RO;SI

PUAL Search report despatched

Free format text: ORIGINAL CODE: 0009013

AK Designated contracting states

Kind code of ref document: A3

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

AX Request for extension of the european patent

Extension state: AL LT LV MK RO SI

AKX Designation fees paid
REG Reference to a national code

Ref country code: DE

Ref legal event code: 8566

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20041218