EP1069211A3 - Solutions pour l'électroplacage - Google Patents

Solutions pour l'électroplacage Download PDF

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Publication number
EP1069211A3
EP1069211A3 EP00305941A EP00305941A EP1069211A3 EP 1069211 A3 EP1069211 A3 EP 1069211A3 EP 00305941 A EP00305941 A EP 00305941A EP 00305941 A EP00305941 A EP 00305941A EP 1069211 A3 EP1069211 A3 EP 1069211A3
Authority
EP
European Patent Office
Prior art keywords
compound
acid
electroplating solutions
organic
leveller
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP00305941A
Other languages
German (de)
English (en)
Other versions
EP1069211A2 (fr
Inventor
Qing Min Wang
Weiji Huang
Miu Ling Lau
Carol Hsiuchin Liu
Ce Ma
Edward K. Chang
Wenpin Ho
Richard C. Paciej
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Messer LLC
Original Assignee
BOC Group Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BOC Group Inc filed Critical BOC Group Inc
Publication of EP1069211A2 publication Critical patent/EP1069211A2/fr
Publication of EP1069211A3 publication Critical patent/EP1069211A3/fr
Withdrawn legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
EP00305941A 1999-07-15 2000-07-13 Solutions pour l'électroplacage Withdrawn EP1069211A3 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US14415999P 1999-07-15 1999-07-15
US144159P 1999-07-15
US58359900A 2000-05-31 2000-05-31
US583599 2000-05-31

Publications (2)

Publication Number Publication Date
EP1069211A2 EP1069211A2 (fr) 2001-01-17
EP1069211A3 true EP1069211A3 (fr) 2003-12-17

Family

ID=26841728

Family Applications (1)

Application Number Title Priority Date Filing Date
EP00305941A Withdrawn EP1069211A3 (fr) 1999-07-15 2000-07-13 Solutions pour l'électroplacage

Country Status (4)

Country Link
US (1) US20040187731A1 (fr)
EP (1) EP1069211A3 (fr)
JP (1) JP2001073182A (fr)
KR (1) KR20010015342A (fr)

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JP4816901B2 (ja) * 2005-11-21 2011-11-16 上村工業株式会社 電気銅めっき浴
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KR101086931B1 (ko) * 2006-10-03 2011-11-29 미쓰이 긴조꾸 고교 가부시키가이샤 황산 산성 동전해액의 제조 방법 및 그 제조 방법을 이용하여 제조한 황산 산성 동전해액, 그리고 전해석출 동피막
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TWI572750B (zh) 2010-05-24 2017-03-01 安頌股份有限公司 直通矽穿孔之銅充填
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CN112236548B (zh) * 2018-07-27 2022-03-04 三菱综合材料株式会社 锡合金镀液
KR102662397B1 (ko) * 2018-10-23 2024-05-02 솔브레인 주식회사 전기도금 조성물 및 전기도금 방법
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CN110938848B (zh) * 2019-12-26 2021-05-11 江苏艾森半导体材料股份有限公司 一种用于电解沉积铜的组合物及酸铜电镀液
EP3933073B1 (fr) 2020-06-29 2023-11-29 Atotech Deutschland GmbH & Co. KG Bain d'électrodéposition de cuivre
CN112144083B (zh) * 2020-09-22 2021-12-10 广州三孚新材料科技股份有限公司 一种太阳能电池用无氰镀铜电镀液及制备方法
JP7777550B2 (ja) * 2021-01-20 2025-11-28 富士フイルム株式会社 めっき液、および、金属充填構造体の製造方法
EP4032930B1 (fr) 2021-01-22 2023-08-30 Atotech Deutschland GmbH & Co. KG Polymères quaternisés à base de biuret et leur utilisation dans des bains de placage de métal ou d'alliage métallique
CN113430598B (zh) * 2021-08-27 2021-11-16 深圳市板明科技股份有限公司 一种线路板盲孔填充电镀铜溶液及其应用
CN113956479B (zh) * 2021-11-26 2022-12-02 电子科技大学 电镀铜加速剂及合成方法和应用
CN116751362B (zh) * 2023-08-21 2024-01-09 广东腐蚀科学与技术创新研究院 一种水溶性二胺基脲聚合物及其制备方法和应用

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Also Published As

Publication number Publication date
US20040187731A1 (en) 2004-09-30
EP1069211A2 (fr) 2001-01-17
KR20010015342A (ko) 2001-02-26
JP2001073182A (ja) 2001-03-21

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