EP1069211A3 - Elektroplattierungslösungen - Google Patents

Elektroplattierungslösungen Download PDF

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Publication number
EP1069211A3
EP1069211A3 EP00305941A EP00305941A EP1069211A3 EP 1069211 A3 EP1069211 A3 EP 1069211A3 EP 00305941 A EP00305941 A EP 00305941A EP 00305941 A EP00305941 A EP 00305941A EP 1069211 A3 EP1069211 A3 EP 1069211A3
Authority
EP
European Patent Office
Prior art keywords
compound
acid
electroplating solutions
organic
leveller
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP00305941A
Other languages
English (en)
French (fr)
Other versions
EP1069211A2 (de
Inventor
Qing Min Wang
Weiji Huang
Miu Ling Lau
Carol Hsiuchin Liu
Ce Ma
Edward K. Chang
Wenpin Ho
Richard C. Paciej
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Messer LLC
Original Assignee
BOC Group Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BOC Group Inc filed Critical BOC Group Inc
Publication of EP1069211A2 publication Critical patent/EP1069211A2/de
Publication of EP1069211A3 publication Critical patent/EP1069211A3/de
Withdrawn legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
EP00305941A 1999-07-15 2000-07-13 Elektroplattierungslösungen Withdrawn EP1069211A3 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US14415999P 1999-07-15 1999-07-15
US144159P 1999-07-15
US58359900A 2000-05-31 2000-05-31
US583599 2000-05-31

Publications (2)

Publication Number Publication Date
EP1069211A2 EP1069211A2 (de) 2001-01-17
EP1069211A3 true EP1069211A3 (de) 2003-12-17

Family

ID=26841728

Family Applications (1)

Application Number Title Priority Date Filing Date
EP00305941A Withdrawn EP1069211A3 (de) 1999-07-15 2000-07-13 Elektroplattierungslösungen

Country Status (4)

Country Link
US (1) US20040187731A1 (de)
EP (1) EP1069211A3 (de)
JP (1) JP2001073182A (de)
KR (1) KR20010015342A (de)

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JP4816901B2 (ja) * 2005-11-21 2011-11-16 上村工業株式会社 電気銅めっき浴
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JP5525762B2 (ja) * 2008-07-01 2014-06-18 上村工業株式会社 無電解めっき液及びそれを用いた無電解めっき方法、並びに配線基板の製造方法
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JP5568250B2 (ja) * 2009-05-18 2014-08-06 公立大学法人大阪府立大学 銅を充填する方法
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US9834677B2 (en) 2010-03-18 2017-12-05 Basf Se Composition for metal electroplating comprising leveling agent
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JP6474410B2 (ja) * 2013-12-09 2019-02-27 アヴニ 電気化学的に不活性なカチオンを含む銅電着浴
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US10932371B2 (en) 2014-11-05 2021-02-23 Corning Incorporated Bottom-up electrolytic via plating method
US9725816B2 (en) 2014-12-30 2017-08-08 Rohm And Haas Electronic Materials Llc Amino sulfonic acid based polymers for copper electroplating
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EP3135709B1 (de) 2015-08-31 2018-01-10 ATOTECH Deutschland GmbH Imidazoylharnstoffpolymere und deren verwendung in metall- oder metalllegierung-galvanisierungsbadzusammensetzungen
CN105239109A (zh) * 2015-10-28 2016-01-13 福州瑞华印制线路板有限公司 一种哈林槽镀铜方法
CN105200467B (zh) * 2015-11-02 2019-01-29 江苏梦得新材料科技有限公司 一种凹版硬铜添加剂及镀液
WO2017090161A1 (ja) * 2015-11-26 2017-06-01 近藤　和夫 酸性銅めっき液、酸性銅めっき物および半導体デバイスの製造方法
EP3360988B1 (de) 2017-02-09 2019-06-26 ATOTECH Deutschland GmbH Pyridiniumverbindungen, ein syntheseverfahren dafür, metall- oder metalllegierungsplattierungsbäder mit besagten pyridiniumverbindungen und verfahren zur verwendung besagter metall- oder metalllegierungsplattierungsbäder
PT3508620T (pt) 2018-01-09 2021-07-12 Atotech Deutschland Gmbh Aditivo de ureileno, a sua utilização e um método de preparação para esse fim
US10917966B2 (en) 2018-01-29 2021-02-09 Corning Incorporated Articles including metallized vias
CN112236548B (zh) * 2018-07-27 2022-03-04 三菱综合材料株式会社 锡合金镀液
JP6645609B2 (ja) 2018-07-27 2020-02-14 三菱マテリアル株式会社 錫合金めっき液
KR102662397B1 (ko) * 2018-10-23 2024-05-02 솔브레인 주식회사 전기도금 조성물 및 전기도금 방법
US11746433B2 (en) 2019-11-05 2023-09-05 Macdermid Enthone Inc. Single step electrolytic method of filling through holes in printed circuit boards and other substrates
CN110938848B (zh) * 2019-12-26 2021-05-11 江苏艾森半导体材料股份有限公司 一种用于电解沉积铜的组合物及酸铜电镀液
EP3933073B1 (de) 2020-06-29 2023-11-29 Atotech Deutschland GmbH & Co. KG Kupfergalvanisierbad
CN112144083B (zh) * 2020-09-22 2021-12-10 广州三孚新材料科技股份有限公司 一种太阳能电池用无氰镀铜电镀液及制备方法
KR20230121857A (ko) * 2021-01-20 2023-08-21 후지필름 가부시키가이샤 도금액, 및, 금속 충전 구조체의 제조 방법
EP4032930B1 (de) 2021-01-22 2023-08-30 Atotech Deutschland GmbH & Co. KG Biuretbasierte quaternisierte polymere und deren verwendung in metall- oder metalllegierungsbädern
CN113430598B (zh) * 2021-08-27 2021-11-16 深圳市板明科技股份有限公司 一种线路板盲孔填充电镀铜溶液及其应用
CN113956479B (zh) * 2021-11-26 2022-12-02 电子科技大学 电镀铜加速剂及合成方法和应用
CN116555848A (zh) * 2023-06-05 2023-08-08 厦门大学 一种用于硅通孔铜填充的酸性镀铜液添加剂、酸性镀铜液及硅通孔的铜金属填充方法
CN116751362B (zh) * 2023-08-21 2024-01-09 广东腐蚀科学与技术创新研究院 一种水溶性二胺基脲聚合物及其制备方法和应用

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Also Published As

Publication number Publication date
KR20010015342A (ko) 2001-02-26
US20040187731A1 (en) 2004-09-30
EP1069211A2 (de) 2001-01-17
JP2001073182A (ja) 2001-03-21

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